JP2004146484A - Electronic component mounter - Google Patents

Electronic component mounter Download PDF

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Publication number
JP2004146484A
JP2004146484A JP2002307937A JP2002307937A JP2004146484A JP 2004146484 A JP2004146484 A JP 2004146484A JP 2002307937 A JP2002307937 A JP 2002307937A JP 2002307937 A JP2002307937 A JP 2002307937A JP 2004146484 A JP2004146484 A JP 2004146484A
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JP
Japan
Prior art keywords
component
information
channel
circuit board
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2002307937A
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Japanese (ja)
Inventor
Koji Takamatsu
高松 幸司
Isao Takahashi
高橋 功
Shinya Ueno
上野 信也
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Hitachi Ltd
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Hitachi Ltd
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Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2002307937A priority Critical patent/JP2004146484A/en
Publication of JP2004146484A publication Critical patent/JP2004146484A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounter that prevents electronic components from being improperly mounted onto a printed circuit board by the setting erros of components caused by an operator and lightens the supply work of the electronic components than before when manufacturing a printed circuit board. <P>SOLUTION: In the electronic component mounter for mounting the electronic components onto the printed circuit board, a sensor for reading the component information indicated on the electronic components is provided at each component channel for supplying the electronic components to the component supply section of the component mounter, comparison with component channel information in incorporation data received by an information processor is made based on the component information read by the sensor, and the component channel information in the incorporation data of the information processor is reedited according to the electronic components set to each component channel. Based on the reedited component channel information, a corresponding electronic component is taken out, a table is moved to a mounting position on the printed circuit board, and the components are mounted. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、プリント基板製作時このプリント基板に電子部品を搭載する部品搭載機に関する。
【0002】
【従来の技術】
従来、プリント基板への電子部品の搭載は、プリント基板設計段階時、部品搭載位置、部品取付角度等を予め決定してある搭載機使用条件を基に、上位計算機で部品搭載機データを作成し、その部品搭載機データに従い作業者は、該当する電子部品を部品搭載機の指定部品供給部にセットするようにしている。
【0003】
【発明が解決しようとする課題】
前記従来技術において、部品搭載機に対する電子部品の供給は、上位計算機で決められた部品供給部のみに該当部品をセットしなければならないため、作業者は、上位計算機により作成されたチャンネル別セット部品一覧表を見ながら電子部品の供給作業を実施していた。
【0004】
しかし、本作業方式では、作業者による電子部品のセットミスが全く無いとは云えないため、不良防止の観点から、次工程での搭載部品の検査作業を実施しなければならず、プリント基板を製作する上で多大な労力を要するという問題があった。
【0005】
前記の部品セット作業は、単なる部品の補充だけでなく、数が限られた部品搭載機の部品チャンネルを有効活用するために、プリント基板型式単位および搭載部品グループ単位で部品の入替え作業を生じることがある。そして、本作業においても、前記と同じく上位計算機により作成されたチャンネル別セット部品一覧表を見ながら電子部品の入替え作業を実施し、電子部品をセットする作業者においても、部品セットミス防止策として、二重、三重のセット部品再確認を行わなければならず、多大な労力と時間を要していた。
【0006】
なお、電子部品をプリント基板に搭載する部品搭載機に関する従来技術は、例えば特開平6−232595号公報、特開平11−220296号公報、特開2000−68690号公報、特開2001−127487号公報等に記載されている。
【0007】
特に、特開平11−220296号公報には、電子部品の部品IDを読み取り、この部品IDが所定のものでない場合には、不良部品として排出する技術が開示されている。
【0008】
本発明の目的は、プリント基板製作時、作業者の部品セットミスによるプリント基板への電子部品の搭載不良を無くすことは勿論、電子部品の供給作業を従来よりも軽減した部品搭載機を提供することにある。
【0009】
【課題を解決するための手段】
前記目的は、プリント基板に電子部品を搭載する部品搭載機において、前記部品搭載機の部品供給部に電子部品を供給する各部品チャンネルに、電子部品に表示してある部品情報を読み取るセンサを設け、このセンサにより読み取った部品情報を基に、情報処理装置より受け取った組込データ中の部品チャンネル情報との比較照合を行い、各部品チャンネルにセットされた電子部品に合わせて前記情報処理装置の組込データ中の部品チャンネル情報を再編集し、再編集された前記部品チャンネル情報に基づき、該当する電子部品を取り出して、プリント基板の搭載位置にテーブルを移動させ、部品を搭載することによって達成される。
【0010】
【発明の実施の形態】
以下、本発明の実施例を図1〜図8に基づき詳細に説明する。
【0011】
図1の(a),(b),(c)は、いずれもIDを取り付けた電子部品の荷姿を示すものであり、電子部品の荷姿には、リール型荷姿1とスティック型荷姿2とトレー型荷姿3の形態があり、電子部品4には、2次元バーコード等により高密度、超小型ラベルのID5が取り付けられている。ID5には、部品情報として部品型式、製造ロットNo等の情報が表示または記憶されている。
【0012】
前記1,2,3の荷姿形態の電子部品は、図2に示す部品搭載機6の部品供給部7にセットされる。セットの方法は、リール型荷姿1の形態を例にとると、図3に示すように、まずリール型荷姿1の電子部品を部品マガジン8にセットし、このマガジン8を部品供給部7に装着する。このとき、マガジン8にセットしてあるリール型荷姿1上の電子部品4に付けられているID5を、部品供給部7の各チャンネルに取り付けられているID読取センサ9が自動で読み取り、この情報を部品搭載機制御用計算機10に送ることにより、どのチャンネルに何の部品がセットされたかを認識できる。
【0013】
図4は部品搭載機組込データ作成の現状を説明する図、図5は本実施例による部品搭載機組込データ作成の説明図である。
【0014】
部品搭載機組込データの作成は、プリント基板の実装データから成るCAD情報と、搭載する部品の形状データと各搭載機適用部品データ(リール型、スティック型、トレー型の各荷姿の形態)から成る部品情報を編集し、CAM情報(後述する部品搭載機データ)を上位計算機で生成し、部品搭載機に送る。部品搭載機側では前記部品搭載機データを読み込み、該当する電子部品を取り出して、プリント基板の搭載位置にテーブルを移動させ、部品を搭載する。
【0015】
従来、部品チャンネル情報は、図4に示すように、固定情報となっているため、上位でのCAM作成と部品搭載機側の部品チャンネル位置は完全に一致しなければならない。このため、作業者は、上位計算機により作成されたチャンネル別セット部品一覧表を見ながら該当する型式の部品を指定チャンネルにセットしなければならず、本作業に多大な時間を要することになる。
【0016】
これに対し、図5に示すように、部品搭載機の部品供給部の各チャンネルに取り付けたID読取センサ9で部品情報を読み取ることにより、読み取った情報中の型式部品がどこのチャンネルにセットされたのかが判る。この情報を元に、上位計算機で既に作成されている部品チャンネルにセットされるべき型式部品が変わった場合、部品搭載機データの固定チャンネルNoを該当型式部品がセットされているチャンネルNoに変更することにより、作業者は、チャンネル別セット部品一覧表を見ることなく、使用部品を任意のチャンネルにセットするだけで作業完了となり、部品搭載機側では前記変更された部品搭載機データを読み込み、該当する電子部品を取り出して、プリント基板の搭載位置にテーブルを移動させ、部品を搭載する。すなわち、作業者は、使用部品を任意のチャンネルにセットした後、次工程での搭載部品の検査作業を省略でき、プリント基板の製作効率が従来に較べて飛躍的に向上する。
【0017】
また、プリント基板上に搭載した電子部品のロットNo等のトレーサビリティについては、図5のトレースデータファイルフォーマット例に示すように、部品搭載機にセットされた部品のID情報読取時点で、部品毎の部品搭載機データにセンサ9で読み込んだ部品型式、部品ロットNo等の部品情報を付加し、プリント基板単位に専用ファイルに記憶させることにより、使用した電子部品の全ての情報をトレースすることが可能となり、部品の一括管理を行うことができる。
【0018】
図6は、上位計算機よりの部品搭載機データの内容例を示す図である。
【0019】
部品搭載機データの形式は、一般的に、搭載順No11と搭載位置を示すX座標12とY座標13、部品取付角度14と部品供給チャンネルNo15から成っており、図7に示すように、CAM情報での固定化された部品供給チャンネルNo15を、実際に部品がセットされたチャンネルNoに搭載機データを置き換えることにより、チャンネル別セット部品一覧表に頼ることなく、任意のチャンネルに部品供給が可能となる。図7の例では、上位計算機で既に固定化された部品中のCH3とCH4の部品がセンサにより読み取ったチャンネル毎の部品でCH1とCH3に変わっているため、部品搭載機データの搭載順001のデータのチャンネルNoを003から001に、搭載順002のデータのチャンネルNoを004から003に自動変更している。
【0020】
図8は、実際の部品供給作業、特に数が限られた部品搭載機の部品チャンネルを有効活用するために、プリント基板型式単位および搭載部品グループ単位で実施する部品入替え作業内容を示す図である。
【0021】
本図はAグループとBグループの部品入替えを行った場合の作業方式を示した図であるが、従来の方式は、図8の下図に示す通り、チャンネル別セット部品一覧表で各チャンネルに対応した該当部品を探し出して該当チャンネルにセットし、全部品セット終了時点で作業実施した全チャンネルの部品を再度確認する方式であったが、本実施例によれば、Aグループの部品を任意のチャンネルにセットするのみで作業は終了となる。
【0022】
【発明の効果】
本発明によれば、プリント基板製作時、作業者の部品セットミスによるプリント基板への電子部品の搭載不良を無くすことは勿論、電子部品の供給作業を従来よりも軽減した部品搭載機を得ることができる。
【図面の簡単な説明】
【図1】(a),(b),(c)はいずれもIDを取り付けた電子部品の荷姿を示す図である。
【図2】部品供給部にID読取センサを取り付けた部品搭載機を示す図である。
【図3】図2の部分拡大図である。
【図4】部品搭載機組込データ作成の現状を説明する図である。
【図5】本発明の一実施例による部品搭載機組込データ作成の説明図である。
【図6】部品搭載機データの内容例を示す図である。
【図7】部品搭載機データの変換例を示す図である。
【図8】部品の入替え作業内容を説明する図である。
【符号の説明】
1…リール型荷姿、2…スティック型荷姿、3…トレー型荷姿、4…電子部品、5…ID、6…部品搭載機、7…部品供給部、8…部品マガジン、9…ID読取センサ、10…部品搭載機制御用計算機、11…データ順No、12…X座標、13…Y座標、14…部品取付角度、15…部品供給チャンネルNo、16…部品番号。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a component mounting machine that mounts electronic components on a printed circuit board when the printed circuit board is manufactured.
[0002]
[Prior art]
Conventionally, when mounting electronic components on a printed circuit board, at the design stage of the printed circuit board, component mounting machine data is created by a host computer based on the mounting machine use conditions for which the component mounting position, component mounting angle, etc. are determined in advance. In accordance with the data of the component mounting machine, the worker sets the corresponding electronic component in the designated component supply unit of the component mounting machine.
[0003]
[Problems to be solved by the invention]
In the above-described prior art, the supply of electronic components to the component mounting machine requires that the corresponding component be set only in the component supply unit determined by the higher-level computer. They were supplying electronic components while looking at the list.
[0004]
However, in this work method, it cannot be said that there is no mistake in setting the electronic components by the operator. There was a problem that a great deal of labor was required in manufacturing.
[0005]
The above-mentioned parts setting work involves not only the replenishment of parts, but also the replacement of parts in units of printed circuit board models and mounted parts groups in order to effectively utilize the part channels of the limited number of mounted parts mounting machines. There is. And in this work, as in the above, the replacement of the electronic parts is performed while looking at the list of the set parts for each channel created by the host computer. It was necessary to reconfirm double and triple set parts, which required a great deal of labor and time.
[0006]
The prior art relating to a component mounting machine for mounting an electronic component on a printed circuit board is disclosed in, for example, JP-A-6-232595, JP-A-11-220296, JP-A-2000-68690, and JP-A-2001-127487. And so on.
[0007]
In particular, Japanese Patent Application Laid-Open No. H11-220296 discloses a technique of reading a component ID of an electronic component and, when the component ID is not a predetermined one, discharging the component as a defective component.
[0008]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a component mounting machine in which, when manufacturing a printed circuit board, not only is it possible to eliminate mounting defects of the electronic component on the printed circuit board due to an incorrect component setting by the operator, but also reduces the supply work of the electronic components. It is in.
[0009]
[Means for Solving the Problems]
The object is to provide, in a component mounting machine for mounting electronic components on a printed circuit board, a sensor for reading component information displayed on an electronic component in each component channel for supplying an electronic component to a component supply unit of the component mounting machine. On the basis of the component information read by the sensor, comparison and comparison with component channel information in the embedded data received from the information processing device is performed, and the information processing device of the information processing device is matched with the electronic component set in each component channel. Achieved by re-editing the component channel information in the embedded data, taking out the relevant electronic component based on the re-edited component channel information, moving the table to the mounting position of the printed circuit board, and mounting the component Is done.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.
[0011]
1 (a), (b), and (c) all show the packaging of an electronic component to which an ID is attached, and the packaging of the electronic component includes a reel-type packaging 1 and a stick-type packaging. There are a form 2 and a tray-type packing form 3. The electronic component 4 has a high-density, ultra-small label ID 5 attached thereto using a two-dimensional bar code or the like. In the ID 5, information such as a part model and a production lot number is displayed or stored as part information.
[0012]
The electronic components in the form of 1, 2, and 3 are set in the component supply unit 7 of the component mounting machine 6 shown in FIG. As for the setting method, taking the form of the reel-type package 1 as an example, as shown in FIG. 3, first, the electronic components of the reel-type package 1 are set in the component magazine 8, and this magazine 8 is supplied to the component supply unit 7 Attach to. At this time, the ID reading sensor 9 attached to each channel of the component supply unit 7 automatically reads the ID 5 attached to the electronic component 4 on the reel type package 1 set in the magazine 8, and By transmitting the information to the component mounting machine control computer 10, it is possible to recognize which component has been set in which channel.
[0013]
FIG. 4 is a diagram for explaining the current state of the creation of the component mounting machine embedded data, and FIG. 5 is an explanatory diagram of the component mounting machine embedded data creation according to the present embodiment.
[0014]
The data for mounting on the component mounting machine is created from the CAD information consisting of the mounting data of the printed circuit board, the shape data of the component to be mounted, and the component data applicable to each mounting machine (reel type, stick type, tray type each form of packing). The CAM information (component mounting machine data described later) is generated by the host computer and sent to the component mounting machine. The component mounting machine reads the component mounting machine data, takes out the corresponding electronic component, moves the table to the mounting position of the printed circuit board, and mounts the component.
[0015]
Conventionally, the component channel information is fixed information as shown in FIG. 4, so that the CAM creation on the upper level and the component channel position on the component mounting machine side must completely match. For this reason, the operator has to set a part of the corresponding type in the designated channel while looking at the list of set parts for each channel created by the host computer, and this work requires a great deal of time.
[0016]
On the other hand, as shown in FIG. 5, by reading the component information by the ID reading sensor 9 attached to each channel of the component supply unit of the component mounting machine, the type component in the read information is set to which channel. You can tell if it's warm. Based on this information, when the type component to be set in the component channel already created in the host computer changes, the fixed channel No. of the component mounting machine data is changed to the channel No. in which the corresponding type component is set. By doing so, the operator can complete the work only by setting the used parts to an arbitrary channel without looking at the list of set parts for each channel, and the component mounting machine reads the changed component mounting machine data, and The electronic component to be removed is taken out, the table is moved to the mounting position of the printed circuit board, and the component is mounted. That is, the operator can omit the work of inspecting the mounted components in the next process after setting the used component to an arbitrary channel, and the production efficiency of the printed circuit board is improved remarkably as compared with the related art.
[0017]
As for the traceability of the lot number and the like of the electronic component mounted on the printed circuit board, as shown in the example of the trace data file format in FIG. By adding component information such as component type and component lot number read by the sensor 9 to the component mounting machine data and storing them in a dedicated file for each printed circuit board, it is possible to trace all information on the used electronic components. Thus, the parts can be managed collectively.
[0018]
FIG. 6 is a diagram illustrating an example of the content of component mounting machine data from a host computer.
[0019]
The format of the component mounting machine data generally includes a mounting order No. 11, an X coordinate 12 and a Y coordinate 13 indicating a mounting position, a component mounting angle 14, and a component supply channel No. 15, and as shown in FIG. By replacing the component supply channel No. 15 fixed in the information with the mounting machine data to the channel No. where the components are actually set, it is possible to supply components to any channel without relying on the set component list by channel. It becomes. In the example of FIG. 7, the parts CH3 and CH4 among the parts already fixed by the host computer are changed to CH1 and CH3 for each channel read by the sensor. The channel number of the data is automatically changed from 003 to 001, and the channel number of the data in the mounting order 002 is automatically changed from 004 to 003.
[0020]
FIG. 8 is a diagram showing the contents of an actual component supply operation, in particular, a component replacement operation performed in units of a printed circuit board type and in units of mounted components in order to effectively utilize the component channels of a limited number of component mounting machines. .
[0021]
This figure is a diagram showing the work method when the parts are exchanged between the A group and the B group. In the conventional method, as shown in the lower diagram of FIG. In this method, the corresponding parts are searched for and set in the corresponding channel, and the parts of all the channels that have been operated are checked again at the end of the setting of all parts. The work is completed only by setting to.
[0022]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, when manufacturing a printed circuit board, not only the mounting failure of an electronic component to a printed circuit board due to an incorrect component setting by the operator is eliminated, but also a component mounting machine in which the supply operation of the electronic components is reduced as compared with the related art. Can be.
[Brief description of the drawings]
FIGS. 1A, 1B, and 1C are diagrams showing a package of an electronic component to which an ID is attached.
FIG. 2 is a diagram illustrating a component mounting machine in which an ID reading sensor is attached to a component supply unit.
FIG. 3 is a partially enlarged view of FIG. 2;
FIG. 4 is a diagram for explaining the current state of creation of data for mounting a component mounting machine.
FIG. 5 is an explanatory diagram of creation of the component mounting machine embedded data according to one embodiment of the present invention.
FIG. 6 is a diagram showing an example of contents of component mounting machine data.
FIG. 7 is a diagram illustrating an example of conversion of component mounting machine data.
FIG. 8 is a diagram illustrating the contents of a part replacement operation.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Reel type packaging, 2 ... Stick type packaging, 3 ... Tray type packaging, 4 ... Electronic components, 5 ... ID, 6 ... Component mounting machine, 7 ... Component supply part, 8 ... Component magazine, 9 ... ID Read sensor, 10: computer for controlling component mounting machine, 11: data order No., 12: X coordinate, 13: Y coordinate, 14: component mounting angle, 15: component supply channel No., 16: component number.

Claims (3)

情報処理装置から部品組込データを受け取り、この組込データに従って、複数の部品番号の中から、組込データ中の部品チャンネル情報に従った電子部品を取り出す部品供給部と、前記取り出した電子部品をプリント基板に搭載する部品搭載部とを有する部品搭載機において、
前記部品供給部の各部品チャンネルに、電子部品に表示してある部品情報を読み取るセンサを設け、このセンサにより読み取った部品情報を基に、前記情報処理装置より受け取った組込データ中の部品チャンネル情報との比較照合を行い、各部品チャンネルにセットされた電子部品に合わせて前記情報処理装置の組込データ中の部品チャンネル情報を再編集し、再編集された前記部品チャンネル情報に基づき、該当する電子部品を取り出して、プリント基板の搭載位置にテーブルを移動させ、部品を搭載することを特徴とする部品搭載機。
A component supply unit that receives component-embedded data from the information processing device, and extracts an electronic component in accordance with the component channel information in the embedded data from a plurality of component numbers in accordance with the embedded data; In a component mounting machine having a component mounting portion for mounting a
A sensor for reading the component information displayed on the electronic component is provided in each component channel of the component supply unit. Based on the component information read by the sensor, a component channel in the embedded data received from the information processing device is provided. Performs comparison and comparison with the information, re-edits the component channel information in the embedded data of the information processing device according to the electronic component set in each component channel, and, based on the re-edited component channel information, A component mounting machine which takes out electronic components to be moved, moves a table to a mounting position of a printed circuit board, and mounts the components.
請求項1において、情報処理装置から受け取った部品組込データに、センサで読み込んだ部品情報を付加し、プリント基板単位に専用ファイルに記憶させることにより、部品データのトレーサビリティ管理機能を有することを特徴とする部品搭載機。2. A component data traceability management function according to claim 1, wherein the component information read by the sensor is added to the component embedded data received from the information processing apparatus, and the data is stored in a dedicated file for each printed circuit board. Component mounting machine. 請求項1または2に記載の部品搭載機にセットされ、プリント基板に実装される電子部品であって、前記電子部品に、部品搭載機の部品チャンネルに取り付けたセンサに部品情報を読み取らせる情報伝達手段を設けたことを特徴とするID付部品。An electronic component set in the component mounting machine according to claim 1 or 2 and mounted on a printed circuit board, wherein the electronic component causes a sensor attached to a component channel of the component mounting machine to read component information. An ID-equipped part, characterized by comprising means.
JP2002307937A 2002-10-23 2002-10-23 Electronic component mounter Pending JP2004146484A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106358437A (en) * 2015-07-15 2017-01-25 松下知识产权经营株式会社 Component supply device, component mounting system, and component mounting method
WO2020157971A1 (en) * 2019-02-01 2020-08-06 株式会社Fuji Work machine

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106358437A (en) * 2015-07-15 2017-01-25 松下知识产权经营株式会社 Component supply device, component mounting system, and component mounting method
JP2017022330A (en) * 2015-07-15 2017-01-26 パナソニックIpマネジメント株式会社 Component supply device, component mounting system, and component mounting method
US10420270B2 (en) 2015-07-15 2019-09-17 Panasonic Intellectual Property Management Co., Ltd. Component supply device, component mounting system, and component mounting method
CN106358437B (en) * 2015-07-15 2020-06-26 松下知识产权经营株式会社 Component supply device, component mounting system, and component mounting method
WO2020157971A1 (en) * 2019-02-01 2020-08-06 株式会社Fuji Work machine
CN113348739A (en) * 2019-02-01 2021-09-03 株式会社富士 Working machine
JPWO2020157971A1 (en) * 2019-02-01 2021-09-09 株式会社Fuji Work machine
CN113348739B (en) * 2019-02-01 2023-02-10 株式会社富士 Working machine
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