JP2004142031A - Polishing device for peripheral part of device wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing device for the peripheral part of a device wafer, for removing the peripheral part of the upper flat surface as well as the upper edge (a), the lower edge (c) and the outer peripheral surface (b) of the device wafer. <P>SOLUTION: A work W is centered, horizontally placed, and held on a chuck means 21. A driving motor is driven to rotate the work W. A feed motor 624 is driven to slowly reciprocate a polishing member 61 for a flat surface in the direction along the working surface. Simultaneously, a loading means 633 is driven to advance the polishing member 61 for a flat surface from the retreat position toward the work W. When the polishing member 61 for a flat surface is advanced to the working position and comes into contact with the work W, further advance is stopped. While the polishing member 61 for a flat surface is slowly reciprocated, the work W continues rotating so that polishing is making progress by action of supplied slurry and abrasive cloth. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an apparatus for polishing a peripheral portion of a device wafer for polishing an outer periphery of a disk-shaped work such as a semiconductor wafer.
[0002]
[Prior art]
The semiconductor wafer has a disk shape, and has flat surfaces on the front and back surfaces, a cylindrical outer peripheral surface, and inclined surfaces (edges) formed on the front and back surfaces with the outer peripheral surface interposed therebetween. In manufacturing a semiconductor, a process of removing a film such as a resist film or a metal film formed on the surface of a wafer is repeated. 8 and 9 are an overall sectional view and a partially enlarged sectional view of a semiconductor wafer (device wafer) W on which such a film is formed. The film R is formed over the entire wafer including not only the wiring pattern surface (the front surface) but also the outer peripheral surface b and the front and back edges a and c outside the pattern due to the film forming method. The film R formed on the outer side of the pattern does not itself form a semiconductor device, but is removed in advance in each step because peeling, dusting, or other factors may lower the yield.
[0003]
The inventor has previously developed a polishing apparatus as shown in Japanese Patent Application No. 2002-061011 that can simultaneously polish the upper and lower edges and the outer peripheral surface. The polishing apparatus includes a pair of upper edge polishing members for polishing the upper edge, a lower edge polishing member for polishing the lower edge, and an outer peripheral surface polishing for further polishing the outer peripheral surface. It has a member. Therefore, polishing can be performed simultaneously with one chuck without holding all the peripheral portions.
[0004]
[Patent Document 1]
JP 2001-308039 A
[Patent Document 2]
JP 2000-068273 A
[Patent Document 3]
Japanese Patent No. 3111928
[Patent Document 4]
JP-A-09-186234.
[0005]
[Problems to be solved by the invention]
Until now, it has been sufficient to polish the peripheral portion, that is, the upper edge a, the lower edge c, and the outer peripheral surface b. However, in order to further improve the yield of semiconductor production, the peripheral portion of the wafer is only polished by these surfaces. In addition, as shown in FIG. 10, it has been required to further polish the periphery d of the upper flat surface. The present invention not only polishes the upper edge a, the lower edge c, and the outer peripheral surface b as in the related art, but also polishes the peripheral portion d of the upper flat surface in response to the above-mentioned demands. An object of the present invention is to provide a polishing apparatus and thereby improve the productivity and yield of semiconductor production.
[0006]
[Means for Solving the Problems]
The above problem is solved by the following means. That is, the first aspect of the present invention is a chucking means for chucking a disk-shaped device wafer and rotating it around an axis, and a polishing means for polishing the outer peripheral surface of the device wafer. A polishing member for an outer peripheral surface having an arcuate working surface in contact therewith, an upper edge polishing member having a working surface in contact with the upper edge for polishing an inclined upper edge of the device wafer; A polishing member for a lower edge having a working surface in contact with the lower edge for polishing the inclined lower edge, and an arc-shaped flat surface for polishing a peripheral portion of an upper flat surface of the device wafer. A flat polishing member having a working surface, and for pressing the working surface of each of the polishing members toward each polished surface of the device wafer chucked by the chuck means, A load means for applying a load to each of the polishing members; and a polishing liquid supply means for supplying a slurry to the polishing section, wherein the outer peripheral surface polishing member, the upper edge polishing member, and the lower edge polishing member. The side edge polishing member and the planar polishing member are provided around the chuck means, and are a peripheral polishing apparatus for a device wafer.
[0007]
According to a second aspect of the present invention, there is provided a chucking means for chucking a disc-shaped device wafer and rotating it around an axis, and contacting the outer peripheral surface of the device wafer for polishing the outer peripheral surface of the device wafer. An outer peripheral polishing member having an arcuate working surface; and an upper edge polishing member having a working surface in contact with the upper edge for polishing the inclined upper edge of the device wafer; A polishing member for a lower edge having a working surface in contact with the lower edge for polishing the lower edge, and a flat working surface forming an arc-shaped flat surface for polishing a peripheral portion of an upper flat surface of the device wafer. A planar polishing member having a surface, and a work surface of each of the polishing members is pressed toward each surface to be polished of the device wafer chucked by the chuck means. Loading means for applying a load to the polishing member, polishing liquid supply means for supplying slurry to the polishing section, and vertically reciprocating the arc-shaped working surface of the outer peripheral polishing member along the outer peripheral surface. A reciprocating mechanism for an outer peripheral surface for moving, a reciprocating mechanism for an upper edge for vertically reciprocating a work surface of the polishing member for the upper edge along an inclination of the upper edge, and a lower edge for the lower edge A reciprocating mechanism for the lower edge for reciprocating the working surface of the polishing member for up and down along the inclination of the lower edge, and a device for moving the planar working surface of the planar polishing member along the upper plane. An upper plane reciprocating mechanism for reciprocating in the center direction of the wafer, the outer peripheral surface polishing member, the upper edge polishing member, the lower edge polishing member, and the plane polishing member. Is the above cha It is a peripheral portion polishing apparatus of the device wafer, wherein provided around the click means.
[0008]
According to a third aspect of the present invention, in the apparatus for polishing a peripheral portion of a device wafer according to the first or second aspect, the outer peripheral surface polishing member, the upper edge polishing member, and the lower edge are polished. And a polishing device for polishing a peripheral portion of a device wafer, wherein polishing of each surface to be polished by the polishing member for polishing and the planar polishing member is performed simultaneously.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, several preferred embodiments of a device wafer peripheral polishing apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a top view showing the relationship between a workpiece and a polishing member for explaining the outline of a peripheral polishing apparatus 1 according to an embodiment of the present invention. Hereinafter, the term “work” indicates a device wafer.
[0010]
In the frame 11 of the peripheral part polishing apparatus 1, a work spindle unit 2 and a polishing unit 3 for an outer peripheral surface, a polishing unit 4 for an upper edge, a polishing unit 5 for a lower edge, so as to surround the work spindle unit 2 in the center, Also, a polishing unit 6 for a flat surface is provided. The frame 11 has a box-like outer shape as a whole, and the upper portions of the units protrude from a substantially central portion thereof.
[0011]
The work spindle unit 2 is provided with chuck means 21 for chucking a disk-shaped work W (device wafer) and rotating it around an axis. In order to polish the outer peripheral surface of the work W, the outer peripheral surface polishing unit 3 is provided with an outer peripheral surface polishing member 31 having an arcuate work surface that comes into contact with the outer peripheral surface.
[0012]
The upper edge polishing unit 4 and the lower edge polishing unit 5 each have an upper edge having an arc-shaped work surface that comes into contact with each of the inclined upper and lower edges of the workpiece W in order to polish the upper edge and the lower edge. Polishing member 41 and a lower edge polishing member 51 are provided.
[0013]
Further, the flat-surface polishing unit 6 is provided with a flat-surface polishing member 61 having an arc-shaped flat work surface for polishing the periphery of the upper flat surface of the work W.
[0014]
As described below, each of the polishing members 31, 41, 51, and 61 has a load for applying a load to each of the polishing members in order to press these work surfaces toward each of the polished surfaces of the work W. Means are provided.
[0015]
Further, each unit except the work spindle unit 2 is provided with a reciprocating mechanism for the outer peripheral surface, a reciprocating mechanism for the upper edge, a reciprocating mechanism for the lower edge, and a reciprocating mechanism for the upper plane. As described above, the work surface of each polishing member can be reciprocated along the polishing surface that bears the work surface. By pressing the polishing member against each surface to be polished while rotating the chuck means 21, each polishing is performed simultaneously in parallel. Note that a polishing liquid (slurry) is applied to a polishing portion from a nozzle polishing liquid supply means (not shown). Hereinafter, the structure of each unit will be described with reference to FIGS. 2 to 5.
[0016]
* Work spindle unit and outer surface polishing unit
FIG. 2 is a cross-sectional view for explaining the structures of the work spindle unit 2 and the outer peripheral surface polishing unit 3. The work spindle unit 2 has a work spindle 22 rotatably supported and a chuck means 21 fixed to one end of the work spindle 22. The chuck means 21 protrudes from the upper surface of the frame. Further, the work spindle unit 2 is provided with a drive motor 23 for rotationally driving the work spindle 22, and the other end of the work spindle 22 and the output shaft of the drive motor 23 are connected to any transmission mechanism, for example, a pulley and a belt. , Which is motively coupled by a wrapping transmission mechanism 24.
[0017]
The outer peripheral surface polishing unit 3 is provided with a reciprocating feed device 32 and a press feed device 33 so that the outer peripheral surface polishing member 31 can perform reciprocal feed and press feed.
[0018]
The pressing and feeding device 33 includes a guideway 331 fixed to the frame 11 in the direction in which the work spindle 22 is located, and a slider 332 guided by the guideway 331. It can be pressed in the forward direction toward the spindle 22. The load means 333 can also move the slider 332 to the retracted position.
[0019]
In this example (FIG.), A fluid feed comprising a piston, a piston rod and a cylinder is employed as the load means 333. The pressure sensor 334 detects the force applied to the slider 332 by the load means 333. By performing feedback control using the detected pressure, the outer peripheral surface polishing member 31 can stably work at the required polishing pressure. To be in contact with.
[0020]
As the load means 333, a gravity type load means including a weight, a wire for suspending the weight, and a pulley for changing the direction of force is used in place of the cylinder or the like, and a polishing pressure is obtained by gravity. be able to. In this case, since the polishing pressure is adjusted by the weight of the weight, the pressure sensor 334 does not need to be provided, but a driving unit for retreating to the retracted position is separately required.
[0021]
The reciprocating feeder 32 serving as the reciprocating mechanism for the outer peripheral surface includes a guideway 321 provided on the slider 332 and extending in a direction parallel to the work spindle 22, and a slider 322 guided by the guideway 321. The slider 322 has a feed nut 325, and a feed screw 324 screwed with the feed nut 325 and a feed motor 323 for rotating the feed screw 324 allow the slider 322 to reciprocate in a direction parallel to the work spindle 22. I have. The length, position and speed of this reciprocating stroke are controlled by controlling the feed motor 323. The feed motor 323 may be a stepping motor, which may be controlled by a numerical controller.
[0022]
Since the outer peripheral surface polishing member 31 is fixed to the slider 322, the outer peripheral surface polishing member 31 contacts the outer peripheral polishing surface (b shown in FIG. Thus, the position where the outer peripheral surface polishing member 31 comes into contact with the workpiece W can be constantly or periodically changed. Thus, the outer peripheral surface of the work W can be satisfactorily polished. As shown in FIG. 6, the polishing surface of the outer peripheral surface polishing member 31 has a curved surface along the outer peripheral surface of the work W, and a polishing cloth such as a nonwoven fabric is attached to the inside of the curved surface. is there.
[0023]
* Polishing unit for upper edge
FIG. 3 is a cross-sectional view for explaining the structure of the upper edge polishing unit 4. The upper edge polishing unit 4 is provided with a reciprocating feeder 42 and a press feeder 43 so that the upper edge polishing member 41 can perform reciprocating feed and press feed.
[0024]
The reciprocating feed device 42 serving as a reciprocating mechanism for the upper edge includes a guideway 421 having a guide direction inclined toward the work spindle 22 and fixed to the frame 11, and a slider 422 guided by the guideway 421. Have. Note that the above inclination is an inclination along the upper edge of the work W. The slider 422 has a feed nut 425, and the slider 422 is inclined in the direction toward the work spindle 22 (and the opposite direction) by a feed screw 424 screwed with the feed nut 425 and a feed motor 423 for rotating the feed screw 424. And can reciprocate. The length, position, and speed of this reciprocating stroke are controlled by controlling the feed motor 423. The feed motor 423 may be a stepping motor, which may be controlled by a numerical controller.
[0025]
The pressing and feeding device 43 includes a guideway 431 on the slider 422 and directed in a vertical direction orthogonal to the guideway 421, and a slider 432 guided by the guideway 431. The slider 432 and the work spindle 22 are slightly different from each other. It is possible to apply a pressing force by the weight of the load means 433 and the slider 432 and the like in a downward direction inclined toward the bottom. The load means 433 can also retreat the slider 432 to the upper retreat position.
[0026]
In this example (FIG.), A fluid feed comprising a piston, a piston rod and a cylinder is employed as the load means 433. The pressure sensor 434 detects the force given to the upper edge polishing member 41 by the load means 433 and the dead weight. By performing feedback control using the detected pressure, the upper edge polishing member 41 needs polishing. The workpiece W is stably contacted with the pressure.
[0027]
Instead of a cylinder or the like, a weight and a wire for suspending the weight are used as the load means 433, and a gravity type load means including a pulley for changing the direction of force is used to obtain a polishing pressure by gravity. be able to. In this case, since the polishing pressure is adjusted by the weight of the weight, it is not necessary to provide the pressure sensor 434, but a driving unit for retreating to the retracted position is separately required.
[0028]
Since the upper edge polishing member 41 is fixed to the slider 432, the upper edge polishing member 41 comes into contact with the upper edge (a shown in FIG. 6-8) of the work W with a necessary polishing pressure by the load means 433 and its own weight, and the reciprocating feed device. The position at which the upper edge polishing member 41 comes into contact with the workpiece W can be constantly or periodically changed by the use of the reference numeral 42. Thereby, the upper edge of the work W can be polished well. As shown in FIG. 6, the polishing surface of the upper edge polishing member 41 has a curved surface along the upper edge of the work W, and a polishing cloth such as a nonwoven fabric is adhered to the inside of the curved surface. is there.
[0029]
* Polishing unit for lower edge
FIG. 4 is a cross-sectional view for explaining the structure of the lower edge polishing unit 5. The lower edge polishing unit 5 is provided with a reciprocating feeder 52 and a pressing feeder 53, so that the lower edge polishing member 51 can perform reciprocating feed and pressing feed.
[0030]
The reciprocating feed device 52 serving as a reciprocating mechanism for the lower edge has a guide direction 521 fixed to the frame 11 having a guide direction inclined toward the work spindle 22, and a slider 522 guided by the guide way 521. It has. The above-mentioned inclination is an inclination along the lower edge of the work W. The slider 522 has a feed nut 525, and the slider 522 is inclined in the direction toward the work spindle 22 (and in the opposite direction) by a feed screw 524 screwed with the feed nut 525 and a feed motor 523 for driving the feed screw 524 to rotate. And can reciprocate. The length, position, and speed of this reciprocating stroke are controlled by controlling the feed motor 523. The feed motor 523 may be a stepping motor, which may be controlled by a numerical controller.
[0031]
The pressing and feeding device 53 includes a guideway 531 that is on the slider 522 and extends in a vertical direction orthogonal to the guideway 521, and a slider 532 guided by the guideway 531. The slider 532 includes a load unit 533 and By the weight of the slider 532 or the like, it is possible to apply a pressing force to the work spindle 22 in a slightly inclined downward direction. The load means 533 can also retreat the slider 532 to the upper retreat position.
[0032]
In this example (FIG.), A fluid feed including a piston, a piston rod, and a cylinder is employed as the load means 533. The pressure sensor 534 detects the force applied to the lower edge polishing member 51 by the load means 433 and the own weight, and the lower edge polishing member 51 is required by performing feedback control using the detected pressure. The workpiece W is stably brought into contact with the workpiece W with a suitable polishing pressure.
[0033]
As the load means 533, a weight and a wire for suspending the weight, a wire for hanging the wire, and a gravity type load means including a pulley for changing the direction of force are used as the load means 533, and the polishing pressure is obtained by gravity. be able to. In this case, since the polishing pressure is adjusted by the weight of the weight, it is not necessary to provide the pressure sensor 434, but a driving unit for retreating to the retracted position is separately required.
[0034]
Since the lower edge polishing member 51 is fixed to the slider 532, the lower edge polishing member 51 is brought into contact with the work W by a required polishing pressure by the load means 533 and its own weight, and the lower edge polishing member 51 is moved by the reciprocating feed device 52. The position of contact with W can be changed constantly or periodically. Thereby, the upper edge of the work W can be polished well. As shown in FIG. 6, the polishing surface of the lower edge polishing member 51 has a curved surface along the lower edge of the work W, and a polishing cloth such as a nonwoven fabric is adhered to the inside of the curved surface. Things.
[0035]
* Flat surface polishing unit
FIG. 5 is a cross-section for explaining the structure of the planar polishing unit 6. The flat-surface polishing unit 6 is provided with a reciprocating feed device 62 and a press-feed device 63 so that the flat-surface polishing member 61 can perform reciprocating feed and press-feed.
[0036]
The reciprocating feeder 62 serving as an upper plane reciprocating mechanism includes a guideway 621 having a horizontal guide direction toward the work spindle 22 and fixed to the frame 11, and a slider 622 guided by the guideway 621. Have. The slider 622 has a feed nut 625, and the feed screw 624 screwed with the feed nut 625 and the feed motor 623 for rotating the feed screw 624 cause the slider 622 to reciprocate in the direction toward the work spindle 22 (and the opposite direction). It can move. The length, position, and speed of this reciprocating stroke are controlled by controlling the feed motor 623. The feed motor 623 may be a stepping motor, which may be controlled by a numerical controller.
[0037]
The pressing and feeding device 63 includes a guide way 631 that is on the slider 622 and is directed in a vertical direction orthogonal to the guide way 621, and a slider 632 guided by the guide way 631. By the weight of the slider 632 or the like, it is possible to apply a pressing force in a downward direction parallel to the work spindle 22. The load means 633 can also retreat the slider 632 to the upper retreat position.
[0038]
In this example (FIG.), A fluid feed including a piston, a piston rod, and a cylinder is adopted as the load means 633. The pressure sensor 634 detects a force applied to the planar polishing member 61 by the load means 633 and the own weight, and performs feedback control using the detected pressure so that the planar polishing member 61 has a required polishing pressure. The workpiece W is stably contacted.
[0039]
As the load means 633, a weight and a wire for suspending the weight, a wire for hanging the wire, and a gravity type load means including a pulley for changing the direction of force are used as the load means 633, and the polishing pressure is obtained by gravity. be able to. In this case, since the polishing pressure is adjusted by the weight of the weight, it is not necessary to provide the pressure sensor 634, but a driving unit for retreating to the retracted position is separately required.
[0040]
Since the flat polishing member 61 is fixed to the slider 632, the flat polishing member 61 comes into contact with the work W by the reciprocating feed device 62 while the load means 633 and its own weight contact the work W with a necessary polishing pressure. The position can be changed constantly or periodically. Thereby, the peripheral portion of the flat surface of the work W can be polished well. As shown in FIG. 7, the polishing surface of the planar polishing member 61 has an arc-shaped and planar work surface so that the peripheral portion of the planar surface of the work W can be polished. It is attached.
[0041]
* Action and operation
First, a work W whose peripheral portion is not polished is placed horizontally with its center aligned, and is gripped on the chuck means 21. At this time, all the polishing members have been retracted to the retracted position so as not to hinder the work transfer by the transfer device (not shown). The drive motor 23 is driven to rotate the work W via the work spindle 22 and the chuck means 21. By driving the feed motors 323, 423, 523, 623, the polishing members 31, 41, 51, 61 are slowly reciprocated in a direction along the work surface. At the same time, by driving the load means 333, 433, 533, 633, each of the polishing members 31, 41, 51, 61 is advanced from the retracted position toward the work W. Each polishing member advances to the work position, and contacts the work W to stop further advancement. At this time, the slurry has already been discharged from the slurry supply means for slurry supply. After this, the pressing force is continuously applied to each load means, and the reciprocating movement of the polishing member and the rotation of the chuck means 21 are continued.
[0042]
Since the work W continues to rotate while each polishing member slowly reciprocates, the polishing proceeds simultaneously at the respective contact portions by the action of the supplied slurry and the polishing member (polishing cloth). After polishing is performed for a time sufficient for removing the film, each polishing member is retracted to the retracted position, and the supply of the slurry, the reciprocation of the polishing member, and the rotation of the chuck means 21 are stopped. Note that the reciprocating motion of each of the polishing members and the supply of the slurry may be continued as long as the transfer of the work is not hindered.
[0043]
The polished work W is carried out by a transfer device (not shown), a new work W is carried in to the chuck means, and the above operation is repeated.
[0044]
According to this peripheral portion polishing apparatus, even the portion of the plane (peripheral portion of the upper plane) existing between the pattern forming portion of the work W (device wafer) and the upper edge is simultaneously formed with the upper edge, the lower edge and the outer peripheral surface. Since the polishing is performed, an improvement in the yield of semiconductor production can be expected. In addition, since each polishing member reciprocates during polishing, there is little unevenness in polishing action and wear of the polishing member, so that uniform polishing can be performed. Furthermore, since these polishing operations are performed on a single polishing apparatus, not only a small installation area is required as compared with the case where each step is performed in a dispersed manner, but also a small number of work transfer facilities are required. Therefore, there is less problem of work positioning.
[0045]
【The invention's effect】
According to the present invention, by using a polishing member for the outer peripheral surface having an arc-shaped work surface, a polishing member for the upper edge, a planar polishing member having a planar work surface that forms an arc-shaped plane together with the polishing member for the lower edge, The film formed on the peripheral flat surface of the putter forming surface is removed together with the upper and lower edges and the outer peripheral surface of the device wafer, and this film is removed at the same time, which can be expected to improve the productivity and yield of semiconductor production. It works. Furthermore, since these polishing operations are performed on a single polishing apparatus without being changed by a single chuck, not only a small installation area is required as compared with performing each process in a distributed manner, but also work transfer of the work is performed. The effect is that the number of facilities is small and the problem of the positioning of the work accompanying the conveyance is small.
[Brief description of the drawings]
FIG. 1 is a top view illustrating a relationship between a workpiece and a polishing member for explaining an outline of a peripheral polishing apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a structure of a work spindle unit and an outer peripheral surface polishing unit in the peripheral polishing apparatus according to the embodiment of the present invention.
FIG. 3 is a cross-sectional view illustrating a structure of an upper edge polishing unit in the peripheral polishing apparatus according to the embodiment of the present invention.
FIG. 4 is a cross-sectional view for explaining a structure of a lower edge polishing unit in the peripheral polishing apparatus according to the embodiment of the present invention.
FIG. 5 is a cross-sectional view for explaining the structure of a planar polishing unit in the peripheral polishing apparatus according to the embodiment of the present invention.
FIG. 6 is a perspective view schematically showing a polishing member for an outer peripheral surface, a polishing member for an upper edge, and a polishing member for a lower edge in which a polishing cloth such as a nonwoven fabric is adhered to the inside of a curved surface;
FIG. 7 is a perspective view showing an outline of a polishing member for a flat surface to which a polishing cloth such as a nonwoven fabric having an arc-shaped flat work surface is attached.
FIG. 8 is an overall sectional view of a semiconductor wafer (device wafer) on which a film is formed.
FIG. 9 is a partially enlarged cross-sectional view of a semiconductor wafer (device wafer) on which a film is formed.
FIG. 10 is a partially enlarged cross-sectional view of a semiconductor wafer (device wafer) from which a film on a peripheral portion of an upper flat surface has been removed.
[Explanation of symbols]
1 Peripheral polishing device
11 frames
2 Work spindle unit
21 Chuck means
22 Work spindle
23 Drive motor
24 Winding transmission mechanism
3 Polishing unit for outer peripheral surface
31 Polishing member for outer peripheral surface
4 Upper edge polishing unit
41 Polishing member for upper edge
5 Polishing unit for lower edge
51 Polishing member for lower edge
6 Polishing unit for flat surface
61 Polishing member for flat surface
32, 42, 52, 62 reciprocating feeder
33, 43, 53, 63 Press feed device
323, 423, 523, 623 feed motor
324, 424, 524, 624 Lead screw
325, 425, 525, 625 Feed nut
321,331,421,431,521,531,621,631 Guideway
322, 332, 422, 432, 522, 532, 622, 632 slider
333, 433, 533, 633 Loading means
334, 434, 534, 634 Pressure sensor
R membrane
W Work
a Upper edge
b Outer surface
c Lower edge
d Peripheral part of upper plane

Claims (3)

Chuck means for chucking a disk-shaped device wafer and rotating it around an axis;
In order to polish the outer peripheral surface of the device wafer, an outer peripheral surface polishing member having an arcuate working surface in contact with the outer peripheral surface,
An upper edge polishing member having a working surface in contact with the upper edge, for polishing the inclined upper edge of the device wafer;
In order to polish the inclined lower edge of the device wafer, a lower edge polishing member having a working surface in contact with the lower edge,
For polishing the peripheral portion of the upper flat surface of the device wafer, a planar polishing member having a planar working surface that is flat in an arc shape,
Load means for applying a load to each polishing member, in order to press the work surface of each polishing member toward each surface to be polished of the device wafer chucked by the chuck means,
A polishing liquid supply means for supplying slurry to the polishing section,
The periphery of the device wafer, wherein the outer peripheral surface polishing member, the upper edge polishing member, the lower edge polishing member, and the flat surface polishing member are provided around the chuck means. Part polishing device. Chuck means for chucking a disk-shaped device wafer and rotating it around an axis;
In order to polish the outer peripheral surface of the device wafer, an outer peripheral surface polishing member having an arcuate working surface in contact with the outer peripheral surface,
An upper edge polishing member having a working surface in contact with the upper edge, for polishing the inclined upper edge of the device wafer;
In order to polish the inclined lower edge of the device wafer, a lower edge polishing member having a working surface in contact with the lower edge,
For polishing the peripheral portion of the upper flat surface of the device wafer, a planar polishing member having a planar working surface that is flat in an arc shape,
Load means for applying a load to each polishing member, in order to press the work surface of each polishing member toward each surface to be polished of the device wafer chucked by the chuck means,
Polishing liquid supply means for supplying slurry to the polishing section,
An outer peripheral surface reciprocating mechanism for vertically reciprocating the arc-shaped working surface of the outer peripheral surface polishing member along the outer peripheral surface,
An upper edge reciprocating mechanism for vertically reciprocating the working surface of the upper edge polishing member along the inclination of the upper edge,
A lower edge reciprocating mechanism for reciprocating the working surface of the lower edge polishing member in the vertical direction along the inclination of the lower edge,
An upper plane reciprocating mechanism for reciprocating the plane working surface of the planar polishing member toward the center of the device wafer along the upper plane,
With
The periphery of the device wafer, wherein the outer peripheral surface polishing member, the upper edge polishing member, the lower edge polishing member, and the flat surface polishing member are provided around the chuck means. Part polishing device. A peripheral polishing apparatus for a device wafer according to any one of claims 1 and 2,
The device wherein the polishing member for the outer peripheral surface, the polishing member for the upper edge, the polishing member for the lower edge, and the polishing of each surface to be polished by the polishing member for a flat surface are simultaneously performed. Wafer peripheral polishing device.

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