JP2004134575A - Assembly of layered ceramic capacitors and method for producing layered ceramic capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make break grooves appropriately without damaging a terminal. <P>SOLUTION: Break grooves 70 are made on the side of a first outer ceramic layer 52 where a plurality of terminals 62 and 66 are arranged on the surface, i.e. on the side of a multilayer body becoming the terminal side. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an area array type (via array type) monolithic ceramic capacitor, and more particularly to a monolithic ceramic capacitor aggregate capable of obtaining a plurality of such monolithic ceramic capacitors by being divided, or a multi-layer ceramic capacitor assembly thereof. The present invention relates to a multilayer ceramic capacitor manufacturing method for manufacturing such a multilayer ceramic capacitor.
[0002]
[Prior art]
As a conventional multilayer ceramic capacitor, for example, the one described in Patent Document 1 below is known.
[0003]
[Patent Document 1]
JP-A-5-347227
In such a proposed example, a pattern of an internal electrode is printed on a planar RC substrate, a ceramic green sheet is laminated thereon, a via hole is formed, and the via hole is filled with a conductive material. A pattern of the internal electrode is printed on the ceramic green sheet, and thereafter, this is repeated a desired number of times to form a laminate. At this time, a plurality of internal electrodes of the multilayer ceramic capacitor are printed at a time on the RC substrate or the ceramic green sheet as a pattern of the internal electrodes. Thereafter, the multilayer body is thermocompression-bonded, fired, and then cut along vertical and horizontal cut lines to manufacture a plurality of multilayer ceramic capacitors at once.
[0005]
In the multilayer ceramic capacitor manufactured in this manner, a plurality of internal electrodes are stacked between the RC substrate and the overcoat with the ceramic layer interposed therebetween, and each internal electrode is formed in two via holes. Alternately connected to one of the vertical via electrodes. The via electrode is connected to an external terminal, and the terminal is provided on the surface of the RC substrate.
[0006]
[Problems to be solved by the invention]
In the above-mentioned proposed example, the cut line used for cutting the fired laminate is provided on the overcoat side, that is, on the side opposite to the RC substrate having the terminals provided on the surface.
[0007]
Therefore, when placing the laminate on the work stage and adding a cut line to the laminate, the RC substrate provided with the terminals on the surface must face the work stage, and the laminate must be placed on the work stage. However, for this reason, there is a risk that the terminal may come into contact with the work stage and damage the terminal. In addition, the posture of the mounted laminate is not stable due to the presence of the terminals, so that the cut line may not be properly formed.
[0008]
Accordingly, it is an object of the present invention to solve the above-mentioned problems of the prior art and to provide a technique capable of properly forming a groove corresponding to a cut line without damaging a terminal. .
[0009]
[Means for Solving the Problems and Their Functions and Effects]
In order to achieve at least a part of the above-described object, a multilayer ceramic capacitor assembly of the present invention includes a step of firing a ceramic laminate including a plurality of capacitor forming portions and a boundary portion disposed between the capacitor forming portions. A multi-layer ceramic capacitor assembly capable of obtaining a plurality of multi-layer ceramic capacitors by being divided so as to include one capacitor forming portion,
The ceramic laminate,
In the capacitor forming unit, a plurality of first internal electrodes and a plurality of second internal electrodes are alternately provided between the first external ceramic layer and the second external ceramic layer via the internal ceramic layer. The first terminal and the first internal electrode among the first and second terminals stacked and arranged on the first external ceramic layer are a plurality of first and second terminals. A first via electrode that is electrically connected through the internal ceramic layer, and a second terminal and the second internal electrode that are electrically connected to each other through the first external ceramic layer and the internal ceramic layer. A plurality of second via electrodes to be connected,
In the boundary portion, a plurality of the internal ceramic layers are stacked between the first external ceramic layer and the second external ceramic layer,
The gist of the present invention is that the ceramic laminate further has a groove for division on a surface of the boundary portion on the side of the first external ceramic layer.
[0010]
In the multilayer ceramic capacitor assembly of the present invention, the grooves for division are provided on the surface on the first external ceramic layer side where a plurality of terminals are arranged. Can be placed on the work stage with the first external ceramic layer side on which a plurality of can be arranged facing upward. Therefore, since the contact with the work stage is on the side of the second external ceramic layer on which no pump to be a terminal is formed, no bump or the like to be a terminal may be damaged when a groove is formed. In addition, since the posture of the placed ceramic laminate is stable, the groove can be formed properly.
[0011]
Further, when determining the position of the groove to be divided, the position of the groove can be determined based on the position of the terminal, so that the groove can be formed at an accurate position.
[0012]
In the multilayer ceramic capacitor assembly of the present invention, it is preferable that the depth of the groove is not less than 20% and not more than 70% of the thickness of the multilayer ceramic capacitor assembly.
[0013]
When the depth of the groove is set to 20% or more of the thickness of the multilayer ceramic capacitor assembly, it is possible to easily break along the groove when breaking the multilayer ceramic capacitor assembly. If the thickness is set to 70% or less of the thickness of the multilayer ceramic capacitor assembly, the multilayer ceramic capacitor assembly may be broken or chipped at the groove during the degreasing and firing processes after forming the groove or during transportation. Less likely to Also, since it can be handled not as individual multilayer ceramic capacitors but as a multilayer ceramic capacitor assembly with grooves, the work in the plating process and inspection process can be made more efficient, thereby reducing costs. Can be.
[0014]
In the multilayer ceramic capacitor assembly of the present invention, it is preferable that the first external ceramic layer is thicker than the second ceramic layer.
[0015]
With such a configuration, it is possible to obtain a multilayer ceramic capacitor assembly having less warpage as a whole after firing.
[0016]
That is, a plurality of terminals are arranged on the first external ceramic layer, and the first external ceramic layer serves as an external ceramic layer on the terminal side. There are many. For this reason, if the shrinkage rate of the via electrode during firing is set to be smaller than the shrinkage rate of the ceramic layer, the shrinkage amount of the first external ceramic layer during firing is reduced by the external ceramic layer on the back side. The amount of shrinkage of the second ceramic layer is smaller than that of the second ceramic layer. On the other hand, if the timing of contraction of the internal electrode during firing is set to be earlier than the timing of contraction of the ceramic layer, when firing the ceramic laminate, first, the internal electrode contracts due to firing. However, the internal electrode is restrained by the ceramic layer that is not yet shrunk, so that it cannot shrink in the stacking direction but shrinks in the stacking direction (thickness direction). Thereafter, when the internal electrode contracts to some extent, the ceramic layer starts to contract, but the contraction of the ceramic layer in the direction of the laminated surface is suppressed by the already contracted internal electrode. Therefore, in the ceramic laminated body, the amount of shrinkage in the direction of the lamination surface is larger in a portion having few internal electrodes than in a portion having many internal electrodes.
[0017]
Therefore, as described above, if the thickness of the first external ceramic layer, which is the external ceramic layer on the terminal side, is larger than the thickness of the second external ceramic layer, which is the external ceramic layer on the back side, the ceramic can be formed. In the laminate, the terminal-side portion has a smaller number of internal electrodes, and the back-side portion has a larger number of internal electrodes. Therefore, at the time of firing, the terminal-side portion has a lower laminated surface than the rear-side portion. Since the amount of shrinkage in the direction is large, a warp stress is generated so as to be convex on the back side as a whole, and the stress is offset by the stress warped to be convex on the terminal side described above. . As a result, it is possible to obtain a multilayer ceramic capacitor assembly having less warpage as a whole after firing.
[0018]
A multilayer ceramic capacitor manufacturing method according to the present invention is directed to a multilayer ceramic capacitor for manufacturing a plurality of multilayer ceramic capacitors from a ceramic multilayer body including a plurality of capacitor forming portions and a boundary portion disposed between the capacitor forming portions. A manufacturing method,
(A) As the ceramic laminate, in the capacitor forming portion, a first internal electrode and a second internal electrode are provided between a first external ceramic layer and a second external ceramic layer. The first terminal and the first internal electrode of the plurality of first and second terminals alternately stacked and arranged on the first external ceramic layer, A first via electrode that electrically connects through the first external ceramic layer and the internal ceramic layer, and a second terminal and the second internal electrode that are electrically connected to the first external ceramic layer and the inside; A plurality of second via electrodes that are electrically connected to each other through the ceramic layer, and at the boundary, the second external ceramic layer is provided between the first external ceramic layer and the second external ceramic layer. It is formed by laminating multiple internal ceramic layers only. A step of preparing a laminate,
(B) forming a groove for division on a surface of the ceramic laminate on the side of the first external ceramic layer at the boundary portion;
(C) firing the ceramic laminate;
(D) dividing the ceramic laminate along the groove to obtain a plurality of the multilayer ceramic capacitors;
The gist is to provide
[0019]
In this way, by forming the grooves for division on the surface of the ceramic laminate on the side of the first external ceramic layer, the ceramic laminate can be arranged with a plurality of terminals. 1 can be placed on a work stage with the external ceramic layer side facing upward. Therefore, when the groove is formed, the groove or the like which does not become a terminal is not damaged, and the mounted ceramic laminate has a stable posture, so that the groove can be formed properly.
[0020]
Further, when determining the position of the groove to be divided, the position of the groove can be determined based on the position of the terminal, so that the groove can be formed at an accurate position.
[0021]
In the multilayer ceramic capacitor manufacturing method of the present invention, it is preferable that the depth of the groove formed in the step (d) is 20% or more and 70% or less of the thickness of the multilayer ceramic capacitor assembly.
[0022]
With such a depth, when the multilayer ceramic capacitor assembly is broken, it can be easily broken along the groove, and during the degreasing and firing processing after the groove is formed, during transportation, and the like. There is little possibility that the multilayer ceramic capacitor assembly is cracked or chipped at the groove. Also, since it can be handled not as individual multilayer ceramic capacitors but as a multilayer ceramic capacitor assembly with grooves, the work in the plating process and inspection process can be made more efficient, thereby reducing costs. Can be.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in the following order based on examples.
A. Composition of multilayer ceramic capacitor assembly:
B. B. Outline of manufacturing method of multilayer ceramic capacitor assembly Effects of the embodiment:
D. Modification:
[0024]
A. Composition of multilayer ceramic capacitor assembly:
FIG. 1 is a plan view of a multilayer ceramic capacitor assembly as one embodiment of the present invention when viewed from above, and FIG. 2 is a cross-sectional view of the cross section taken along line X-X in FIG. It is. In FIG. 1, the number of terminals is reduced in comparison with FIGS. 2 and subsequent figures to make the figure easier to see.
[0025]
The multilayer ceramic capacitor assembly 50 of this embodiment is an assembly for manufacturing an area array type multilayer ceramic capacitor, and as described later, is divided along break grooves 70 to form 16 multilayer ceramic capacitors. A ceramic capacitor can be obtained.
[0026]
The feature of the present embodiment is that, unlike the case of the above-mentioned proposed example, the break groove 70 is provided on the first external ceramic layer 52 side on which a plurality of terminals 62 and 66 are arranged. is there.
[0027]
Now, the configuration of the multilayer ceramic capacitor assembly 50 of the present embodiment will be described in detail.
[0028]
As shown in FIG. 1, the multilayer ceramic capacitor assembly 50 includes a capacitor forming portion a where a capacitor is substantially formed, a boundary portion b connecting between the capacitor forming portions a, and a multilayer ceramic capacitor assembly 50. And a peripheral portion c that forms the periphery of 50.
[0029]
Since one finally obtained multilayer ceramic capacitor has one capacitor forming portion a, the multilayer ceramic capacitor assembly 50 includes four vertically and four horizontally as shown in FIG. Sixteen capacitor forming portions a are arranged in a grid pattern. On the other hand, the boundary portions b are arranged in a lattice so as to partition these 16 capacitor forming portions a.
[0030]
Among these, in the capacitor forming portion a, as shown in FIG. 2, between the two external ceramic layers 52 and 54, the first and second internal electrodes 56 and 58 having different patterns are provided with the internal ceramic layer 60. Are interleaved with each other.
[0031]
FIG. 3 is an explanatory diagram showing the patterns of the first and second internal electrodes 56 and 58 used in the capacitor forming portion a in FIG. As shown in FIG. 3, as a pattern of the first and second internal electrodes 56 and 58, a plurality of circular windows 80 arranged in a staggered manner are opened in each of the internal electrodes 56 and 58. The arrangement of the circular windows 80 is different between the first internal electrode 56 and the second internal electrode 58.
[0032]
FIG. 4 is a cross-sectional view showing a cross section when the capacitor forming portion a in FIG. 1 is cut along the electrode surface. 4A shows a case where the semiconductor device is cut along the surface of the first internal electrode 56, and FIG. 4B shows a case where the semiconductor device is cut along the surface of the second internal electrode 58.
[0033]
As described above, the first and second internal electrodes 56 and 58 forming a pattern as shown in FIG. 3 are alternately stacked to form a cut surface along those electrode surfaces when viewed from above. As shown in FIG. 4, the circular windows 80 opened in the lower internal electrode are respectively arranged at intermediate points between the circular windows 80 opened in the upper internal electrode. Will be.
[0034]
In the capacitor forming portion a, a plurality of first and second via electrodes 64 and 68 are further formed so as to penetrate the respective ceramic layers in the laminating direction, as shown in FIG. The via electrode 64 is electrically connected to the terminal 62, and the second via electrode 68 is electrically connected to the terminal 66.
[0035]
As shown in FIG. 4, the first and second via electrodes 64 and 68 are arranged so as to pass through the center portions of the circular windows 80 opened in the first and second internal electrodes 56 and 58, respectively. Have been. As a result, as shown in FIG. 4A, the first via electrode 64 penetrates through the first internal electrode 56, so that it is electrically connected to the first internal electrode 56. As shown in FIG. 4B, the second internal electrode 58 is electrically insulated from the first via electrode 64 because the circular window 80 opened in the second internal electrode 58 comes around the first via electrode 64. Will be. Conversely, the second via electrode 68 penetrates through the second internal electrode 58 as shown in FIG. 4B, so that it is electrically connected to the second internal electrode 58. As shown in FIG. 4B, the first internal electrode 56 is electrically insulated from the second via electrode 68 because the circular window 80 opened in the first internal electrode 56 comes around the second via electrode 68. Will be.
[0036]
Therefore, as shown in FIG. 2, the first via electrode 64 electrically connects the terminal 62 on the outside and the plurality of first internal electrodes 56 inside, but the plurality of second via electrodes 64 Is electrically insulated from the internal electrode 58 of the first embodiment. Conversely, the second via electrode 68 electrically connects the external terminal 66 to the internal second internal electrodes 58, respectively. 56 is electrically insulated.
[0037]
Further, as shown in FIG. 2, the terminals 62 and 66 are arranged only on the side of the external ceramic layer 52 of the two external ceramic layers 52 and 54 in the capacitor forming portion a. Accordingly, in the external ceramic layer 52 on the terminal side, the first and second via electrodes 64 and 68 penetrate to connect the terminals 62 and 66 and the internal electrodes 56 and 58, respectively. None of the via electrodes penetrate the outer ceramic layer 54 on the back side.
[0038]
In the present embodiment, as shown in FIG. 2, the external ceramic layer 52 on the terminal side has a thickness t1 greater than the thickness t2 of the external ceramic layer 54 on the rear side (t1> t2). It is configured.
[0039]
On the other hand, at the boundary part b and the peripheral part c, as shown in FIG. 2, only a plurality of internal ceramic layers 60 are laminated between the two external ceramic layers 52 and 54.
[0040]
Among them, as described above, at the boundary portion b, a break groove 70 for dividing the multilayer ceramic capacitor assembly 50 to obtain individual multilayer ceramic capacitors, and a plurality of terminals 62 and 66 on the surface are arranged. One external ceramic layer 52 is formed on the surface thereof.
[0041]
In the present embodiment, the break groove 70 is formed substantially at the center of the boundary part b as shown in FIG. 1, and the depth thereof is the thickness of the multilayer ceramic capacitor assembly 50 as shown in FIG. On the other hand, it is formed so as to be 20% or more and 70% or less.
[0042]
B. Outline of Manufacturing Method of Multilayer Ceramic Capacitor Assembly The multilayer ceramic capacitor assembly 50 as described above is manufactured by the following procedure.
[0043]
First, a ceramic green sheet on which 16 patterns of the first internal electrodes 56 are printed is laminated on a ceramic green sheet on which nothing is printed, and a pattern of the second internal electrodes 58 is formed on the ceramic green sheet. The ceramic green sheets printed with 16 patterns of the first internal electrodes 56 and the ceramic green sheets printed with 16 patterns of the second internal electrodes 58 are alternately stacked. In a desired number. In this way, by sequentially laminating the ceramic green sheets from the side to be the terminal side to the side to be the back side, a laminated body as a basis of the laminated ceramic capacitor assembly 50 is generated.
[0044]
Here, the ceramic green sheet is formed by uniformly applying a ceramic slurry made of barium titanate (BaTiO ₃ ) on a carrier film such as a PET (polyethylene terephthalate) film and drying the ceramic slurry. Further, 16 patterns of internal electrodes are formed at a time by printing silver (Ag) or the like on the surface of the ceramic green sheet by screen printing or the like.
[0045]
Next, a plurality of through-holes are opened in the laminated body by a laser so as to penetrate through the center of the circular window 80 opened in each of the internal electrodes 56 and 58. The first and second via electrodes 64 and 68 are formed by filling an electrode paste containing the same.
[0046]
In this embodiment, the distance (via pitch) between the via electrodes closest to each other is set to 100 μm or more and 1000 μm or less.
[0047]
Next, the laminated body is further laminated on the side to be the back side based on the ceramic green sheet on which nothing is printed, and then the entire laminated body is pressed by pressing. Then, on the side to be the terminal side, peel off the carrier film that has been attached (that is, the carrier film attached to the first laminated, unprinted ceramic green sheet). As a result, a part of the electrode paste filled with the through holes for forming the first and second via electrodes 64 and 68 is exposed as a projection on the surface to be the terminal side, and the pump to be the terminals 62 and 66 is formed. To form Alternatively, the external electrodes may be separately formed by surface printing or the like.
[0048]
Next, a break groove 70, which is a feature of this embodiment, is formed on the laminate. That is, first, the laminate is placed and positioned on the work stage with the side on which the pump is formed (that is, the side to be the terminal) facing upward. Then, a notch is sequentially cut by a cutter in a direction parallel to a predetermined side of the stacked body and at a position which is the center of the boundary portion b to the above-described desired depth. Then, after making cuts in all the boundary portions b in the above direction, the work stage on which the laminate is placed is rotated by 90 degrees, and a direction perpendicular to the above-mentioned direction and the boundary portion b Are sequentially cut to the center position of the above to the desired depth described above. In this way, when the cuts are made in all the boundary portions b in the orthogonal direction, the process is terminated. As a result, the break grooves 70 can be formed in a lattice pattern on the surface of the laminate that is to be the terminal side.
[0049]
Subsequently, the laminated body is degreased in order to remove the resin contained in the ceramic green sheet, and then the laminated body is fired to obtain a laminated ceramic capacitor assembly 50.
[0050]
The multilayer ceramic capacitor assembly 50 thus obtained is then broken along the break groove 70 and divided, whereby 16 multilayer ceramic capacitors can be obtained. Usually, the obtained laminated ceramic capacitor is a product of about 3 to 10 mm square.
In the present embodiment, after firing, the external ceramic layer 52 is formed such that the thickness t1 of the external ceramic layer 52 on the terminal side is larger than the thickness t2 of the external ceramic layer 54 on the back side (t1> t2). The thickness of the ceramic green sheet constituting the layers 52 and 54 is adjusted in advance.
[0052]
C. Effects of the embodiment:
In the present embodiment, the break groove 70 used for the division is formed on the first external ceramic layer 52 side where a plurality of terminals 62 and 66 are arranged on the surface (that is, the side to be the terminal side in the above-mentioned laminated body). As described above, when forming the break groove 70, the laminated body can be placed on the work stage with the side to be the terminal side facing upward. Therefore, since the contact with the work stage is on the side to be the back side where no pump to be the terminal is formed, the bump to be the terminal when the break groove 70 is formed may be damaged. Also, since the posture of the mounted laminate is stable, the break groove 70 can be appropriately formed.
[0053]
Further, when determining the position of the groove to be divided, the position of the groove can be determined based on the position of the terminal, so that the groove can be formed at an accurate position.
[0054]
In the present embodiment, as described above, the depth of the break groove 70 is formed so as to be 20% or more and 70% or less with respect to the thickness of the multilayer ceramic capacitor assembly 50. . Therefore, since the thickness is not less than 20% of the thickness of the multilayer ceramic capacitor assembly 50, when the multilayer ceramic capacitor assembly 50 breaks, it can be easily broken along the break groove 70. Since the thickness of the multilayer ceramic capacitor assembly 50 is 70% or less of the thickness of the multilayer ceramic capacitor assembly 50, the multilayer ceramic capacitor assembly 50 is formed at the break groove 70 during the degreasing and firing processes after the formation of the break groove and during transportation. There is little risk of cracking or chipping. In addition, since it can be handled not as an individual multilayer ceramic capacitor but as a multilayer ceramic capacitor assembly with grooves, the work in the plating process and inspection process can be made more efficient, thereby reducing costs. Can be.
[0055]
Further, in the present embodiment, as described above, the configuration is such that the thickness t1 of the external ceramic layer 52 on the terminal side is larger than the thickness t2 of the external ceramic layer 54 on the back side (t1> t2). are doing.
[0056]
In general, at the connection between the via electrode and the internal electrode, in order to obtain sufficient connectivity, it is necessary to set the contraction rate of the via electrode during firing to be smaller than the contraction rate of the ceramic layer. desirable. Therefore, since the terminal-side external ceramic layer 52 has a large number of penetrating via electrodes, the contraction rate of the via electrodes 62 and 66 during firing is set to be smaller than the contraction rate of the ceramic layers 52, 54 and 60. If set, the amount of shrinkage of the external ceramic layer 52 on the terminal side during firing becomes smaller than the amount of shrinkage of the external ceramic layer 54 on the back side, so that the entire surface is convex so as to project toward the terminal side. Stress occurs. On the other hand, if the contraction timing of the internal electrodes 56, 58 during firing is set to be earlier than the timing of contraction of the ceramic layers 52, 54, 60, when firing the laminated body, First, the internal electrodes 56 and 58 start to contract, but the internal electrodes 56 and 58 are restrained by the ceramic layers 52, 54 and 60 which are not yet contracting. It does not shrink in the left-right direction but shrinks in the laminating direction (vertical direction in FIG. 2). Thereafter, when the internal electrodes 56, 58 shrink to some extent, the ceramic layers 52, 54, 60 begin to shrink, but the ceramic layers 52, 54, 60 are shrunk in the laminating plane direction by the already shrunk internal electrodes 56, 58. Shrinkage is suppressed. Therefore, in the laminated body, the amount of shrinkage in the direction of the lamination surface is larger in a portion having less internal electrodes 56 and 58 than in a portion having more internal electrodes 56 and 58.
[0057]
Therefore, as described above, if the thickness of the external ceramic layer 52 on the terminal side is configured to be thicker than the thickness of the external ceramic layer 54 on the back side, the terminal side portion of the laminate becomes a portion with less internal electrodes. On the other hand, the rear side has a large number of internal electrodes, and therefore, during firing, the terminal side has a larger amount of shrinkage in the stacking surface direction than the rear side, so that the whole is convex to the rear side. Is generated, and the stress is offset by the above-described stress warped so as to protrude toward the terminal. As a result, it is possible to obtain a multilayer ceramic capacitor assembly having less warpage as a whole after firing.
[0058]
In the present embodiment, the depth of the break groove 70 is formed so as to be not less than 20% and not more than 70% with respect to the thickness of the multilayer ceramic capacitor assembly 50. In order to further enhance the effect related to the above, it is preferable that the thickness is not less than 30% and not more than 50%.
[0059]
D. Modification:
The present invention is not limited to the above-described examples and embodiments, and can be implemented in various modes without departing from the gist thereof.
[0060]
In the above embodiment, the ceramic green sheet, that is, the high dielectric ceramic containing BaTiO ₃ as a main component was used as the ceramic material constituting the ceramic layer. However, the present invention is not limited to this. _{, PbTiO 3, PbZrO 3, TiO} 2, SrTiO 3, CaTiO 3, MgTiO 3, KNbO 3, NaTiO 3, KTaO 3, RbTaO 3, (Na 1/2 Bi 1/2) TiO 3, Pb (Mg 1/2 A ceramic containing any of W _1/2 ) O ₃ and (K _1/2 Bi _1/2 ) TiO ₃ may be used. Which one to use may be appropriately determined according to the required capacitance of the capacitor and the like.
[0061]
Further, in the above-described embodiment, Ag or the like is used as the conductive material forming the internal electrodes 56 and 58 and the via electrodes 64 and 68. However, the present invention is not limited to this. For example, Pt, Pd , Ag-Pt, Ag-Pd, Cu, Au, Ni, etc. may be used. Which material is used may be determined in consideration of compatibility with the material of the ceramic layer and the like.
[Brief description of the drawings]
FIG. 1 is a plan view of a multilayer ceramic capacitor assembly as one embodiment of the present invention when viewed from above.
FIG. 2 is a cross-sectional view showing a cross section in the XX direction in FIG.
FIG. 3 is an explanatory diagram showing patterns of first and second internal electrodes 56 and 58 used in a capacitor forming part a in FIG.
FIG. 4 is a cross-sectional view showing a cross section when the capacitor forming portion a in FIG. 1 is cut along an electrode surface.
[Explanation of symbols]
50 multilayer ceramic capacitor assembly 52 first external ceramic layer 54 second external ceramic layer 56 first internal electrode 58 second internal electrode 60 internal ceramic layers 62 and 66 terminals 64 1 via electrode 68 2nd via electrode 70 break groove 80 circular window a capacitor forming section b boundary section c peripheral section

Claims (5)

A ceramic laminate including a plurality of capacitor forming portions and a boundary portion disposed between the capacitor forming portions is fired, and each of the plurality of capacitor forming portions is divided so as to include one capacitor forming portion. A multilayer ceramic capacitor assembly capable of obtaining a multilayer ceramic capacitor,
The ceramic laminate,
In the capacitor forming unit, a plurality of first internal electrodes and a plurality of second internal electrodes are alternately provided between the first external ceramic layer and the second external ceramic layer via the internal ceramic layer. The first terminal and the first internal electrode among the first and second terminals stacked and arranged on the first external ceramic layer are a plurality of first and second terminals. A first via electrode that is electrically connected through the internal ceramic layer, and a second terminal and the second internal electrode that are electrically connected to each other through the first external ceramic layer and the internal ceramic layer. A plurality of second via electrodes to be connected,
In the boundary portion, a plurality of the internal ceramic layers are stacked between the first external ceramic layer and the second external ceramic layer,
The multilayer ceramic capacitor assembly according to claim 1, wherein the ceramic multilayer body further has a groove for division on a surface of the boundary portion on the side of the first external ceramic layer. The multilayer ceramic capacitor assembly according to claim 1,
The depth of the groove is 20% or more and 70% or less of the thickness of the multilayer ceramic capacitor assembly. The multilayer ceramic capacitor assembly according to claim 1 or 2,
The multilayer ceramic capacitor assembly according to claim 1, wherein the first external ceramic layer is thicker than the second ceramic layer. A multilayer ceramic capacitor manufacturing method for manufacturing a plurality of multilayer ceramic capacitors from a ceramic laminate including a plurality of capacitor forming portions and a boundary portion disposed between the capacitor forming portions,
(A) As the ceramic laminate, in the capacitor forming portion, a first internal electrode and a second internal electrode are provided between a first external ceramic layer and a second external ceramic layer. The first terminal and the first internal electrode of the plurality of first and second terminals alternately stacked and arranged on the first external ceramic layer, A first via electrode that electrically connects through the first external ceramic layer and the internal ceramic layer, and a second terminal and the second internal electrode that are electrically connected to the first external ceramic layer and the inside; A plurality of second via electrodes that are electrically connected to each other through the ceramic layer, and at the boundary, the second external ceramic layer is provided between the first external ceramic layer and the second external ceramic layer. It is formed by laminating multiple internal ceramic layers only. A step of preparing a laminate,
(B) forming a groove for division on a surface of the ceramic laminate on the side of the first external ceramic layer at the boundary portion;
(C) firing the ceramic laminate;
(D) dividing the ceramic laminate along the groove to obtain a plurality of the multilayer ceramic capacitors;
A method for manufacturing a multilayer ceramic capacitor comprising: The method for manufacturing a multilayer ceramic capacitor according to claim 4,
The depth of the groove formed in the step (d) is 20% or more and 70% or less of the thickness of the multilayer ceramic capacitor assembly.

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