JP2004128509A5 - - Google Patents

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Publication number
JP2004128509A5
JP2004128509A5 JP2003343146A JP2003343146A JP2004128509A5 JP 2004128509 A5 JP2004128509 A5 JP 2004128509A5 JP 2003343146 A JP2003343146 A JP 2003343146A JP 2003343146 A JP2003343146 A JP 2003343146A JP 2004128509 A5 JP2004128509 A5 JP 2004128509A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003343146A
Other languages
Japanese (ja)
Other versions
JP2004128509A (ja
JP4820534B2 (ja
Filing date
Publication date
Priority claimed from DE2002146282 external-priority patent/DE10246282B4/de
Application filed filed Critical
Publication of JP2004128509A publication Critical patent/JP2004128509A/ja
Publication of JP2004128509A5 publication Critical patent/JP2004128509A5/ja
Application granted granted Critical
Publication of JP4820534B2 publication Critical patent/JP4820534B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003343146A 2002-10-02 2003-10-01 低温時の基板を試験するプローバ Expired - Fee Related JP4820534B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002146282 DE10246282B4 (de) 2002-10-02 2002-10-02 Prober zum Testen von Substraten bei tiefen Temperaturen
DE10246282.8 2002-10-02

Publications (3)

Publication Number Publication Date
JP2004128509A JP2004128509A (ja) 2004-04-22
JP2004128509A5 true JP2004128509A5 (un) 2006-10-05
JP4820534B2 JP4820534B2 (ja) 2011-11-24

Family

ID=32010197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003343146A Expired - Fee Related JP4820534B2 (ja) 2002-10-02 2003-10-01 低温時の基板を試験するプローバ

Country Status (2)

Country Link
JP (1) JP4820534B2 (un)
DE (1) DE10246282B4 (un)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007201484A (ja) * 2004-11-30 2007-08-09 Sumitomo Electric Ind Ltd ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
JP3945527B2 (ja) 2004-11-30 2007-07-18 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
DE102005015334B4 (de) * 2005-04-01 2017-02-09 Cascade Microtech, Inc. Prober zum Testen von Substraten bei Temperaturen im Bereich der Siedetemperatur von Helium
JP4049172B2 (ja) 2005-07-13 2008-02-20 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
JP2007227250A (ja) * 2006-02-24 2007-09-06 Hitachi High-Technologies Corp 検査装置及び検査装置の予備排気室を真空排気する方法
DE102006038457B4 (de) 2006-08-16 2014-05-22 Cascade Microtech, Inc. Verfahren und Vorrichtung zum Temperieren elektronischer Bauelemente
DE102007058457B4 (de) 2006-12-08 2018-06-07 Cascade Microtech, Inc. Anordnung und Verfahren zur Testung von Halbleitersubstraten unter definierter Atmosphäre
JP2007235171A (ja) * 2007-05-17 2007-09-13 Sumitomo Electric Ind Ltd ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
WO2009050038A1 (de) * 2007-10-10 2009-04-23 Suss Microtec Test Systems Gmbh Verfahren zur prüfung eines testsubstrats unter definierten thermischen bedingungen und thermisch konditionierbarer prober
JP6161327B2 (ja) * 2013-02-28 2017-07-12 株式会社 エイブイシー 四端子抵抗測定装置および四端子測定用プローブ
DE102013215781A1 (de) * 2013-08-09 2015-02-12 Ers Electronic Gmbh Thermische Abschirmvorrichtung für eine Probecard und entsprechende Probecardanordnung
CN107389455B (zh) * 2017-09-05 2023-06-06 中国工程物理研究院流体物理研究所 用于磁驱动斜波压缩中样品初始温度的降温装置及方法
CN108918977B (zh) * 2018-05-02 2024-02-06 沈阳工业大学 一种低温条件下电介质气固界面闪络特性测量装置及方法
CN116165472B (zh) * 2023-04-22 2023-07-04 深圳市森美协尔科技有限公司 一种低温探针测试设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190737A (ja) * 1986-02-17 1987-08-20 Fujitsu Ltd 低温用オ−トプロ−バ−
JPH01278739A (ja) * 1988-04-30 1989-11-09 Nippon Denshi Zairyo Kk 半導体ウェハー低温試験装置
JPH0685020A (ja) * 1990-05-16 1994-03-25 Fujitsu Ltd 低温領域の気体吸着防止機構
DE4109908C2 (de) * 1991-03-26 1994-05-05 Erich Reitinger Anordnung zur Prüfung von Halbleiter-Wafern
US5345999A (en) * 1993-03-17 1994-09-13 Applied Materials, Inc. Method and apparatus for cooling semiconductor wafers
JPH06323955A (ja) * 1993-05-17 1994-11-25 Canon Inc 半導体試験装置
JPH0982785A (ja) * 1995-09-18 1997-03-28 Nec Corp 半導体ウェハ温度制御装置

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