JP2004128509A5 - - Google Patents
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- Publication number
- JP2004128509A5 JP2004128509A5 JP2003343146A JP2003343146A JP2004128509A5 JP 2004128509 A5 JP2004128509 A5 JP 2004128509A5 JP 2003343146 A JP2003343146 A JP 2003343146A JP 2003343146 A JP2003343146 A JP 2003343146A JP 2004128509 A5 JP2004128509 A5 JP 2004128509A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002146282 DE10246282B4 (en) | 2002-10-02 | 2002-10-02 | Prober for testing substrates at low temperatures |
| DE10246282.8 | 2002-10-02 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004128509A JP2004128509A (en) | 2004-04-22 |
| JP2004128509A5 true JP2004128509A5 (en) | 2006-10-05 |
| JP4820534B2 JP4820534B2 (en) | 2011-11-24 |
Family
ID=32010197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003343146A Expired - Fee Related JP4820534B2 (en) | 2002-10-02 | 2003-10-01 | A prober for testing substrates at low temperatures |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4820534B2 (en) |
| DE (1) | DE10246282B4 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007201484A (en) * | 2004-11-30 | 2007-08-09 | Sumitomo Electric Ind Ltd | Wafer holder for wafer prober, and wafer prober mounted with the same |
| JP3945527B2 (en) | 2004-11-30 | 2007-07-18 | 住友電気工業株式会社 | Wafer holder for wafer prober and wafer prober equipped with the same |
| DE102005015334B4 (en) * | 2005-04-01 | 2017-02-09 | Cascade Microtech, Inc. | Prober for testing substrates at temperatures in the range of the boiling point of helium |
| JP4049172B2 (en) * | 2005-07-13 | 2008-02-20 | 住友電気工業株式会社 | Wafer holder for wafer prober and wafer prober equipped with the same |
| JP2007227250A (en) * | 2006-02-24 | 2007-09-06 | Hitachi High-Technologies Corp | Inspection device and method of vacuum pumping auxiliary exhaust room of inspection device |
| DE102006038457B4 (en) * | 2006-08-16 | 2014-05-22 | Cascade Microtech, Inc. | Method and device for tempering electronic components |
| DE102007058457B4 (en) | 2006-12-08 | 2018-06-07 | Cascade Microtech, Inc. | Arrangement and method for testing semiconductor substrates under a defined atmosphere |
| JP2007235171A (en) * | 2007-05-17 | 2007-09-13 | Sumitomo Electric Ind Ltd | Wafer holder for wafer prober and wafer prober mounting the same |
| DE112008002615B4 (en) * | 2007-10-10 | 2015-02-19 | Cascade Microtech, Inc. | Method for testing a test substrate under defined thermal conditions and thermally conditionable prober |
| JP6161327B2 (en) * | 2013-02-28 | 2017-07-12 | 株式会社 エイブイシー | Four-terminal resistance measuring device and four-terminal measuring probe |
| DE102013215781A1 (en) * | 2013-08-09 | 2015-02-12 | Ers Electronic Gmbh | Thermal shielding device for a probe card and corresponding probe card assembly |
| CN107389455B (en) * | 2017-09-05 | 2023-06-06 | 中国工程物理研究院流体物理研究所 | Cooling device and method for initial temperature of sample in magnetic drive oblique wave compression |
| CN108918977B (en) * | 2018-05-02 | 2024-02-06 | 沈阳工业大学 | Device and method for measuring dielectric gas-solid interface flashover characteristic under low temperature condition |
| CN116165472B (en) * | 2023-04-22 | 2023-07-04 | 深圳市森美协尔科技有限公司 | Low-temperature probe test equipment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62190737A (en) * | 1986-02-17 | 1987-08-20 | Fujitsu Ltd | Low temperature auto-prober |
| JPH01278739A (en) * | 1988-04-30 | 1989-11-09 | Nippon Denshi Zairyo Kk | Low temperature testing device for semiconductor wafer |
| JPH0685020A (en) * | 1990-05-16 | 1994-03-25 | Fujitsu Ltd | Preventive mechanism for gas adsorption in low-temperature area |
| DE4109908C2 (en) * | 1991-03-26 | 1994-05-05 | Erich Reitinger | Arrangement for testing semiconductor wafers |
| US5345999A (en) * | 1993-03-17 | 1994-09-13 | Applied Materials, Inc. | Method and apparatus for cooling semiconductor wafers |
| JPH06323955A (en) * | 1993-05-17 | 1994-11-25 | Canon Inc | Semiconductor tester |
| JPH0982785A (en) * | 1995-09-18 | 1997-03-28 | Nec Corp | Semiconductor wafer temperature controller |
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2002
- 2002-10-02 DE DE2002146282 patent/DE10246282B4/en not_active Expired - Fee Related
-
2003
- 2003-10-01 JP JP2003343146A patent/JP4820534B2/en not_active Expired - Fee Related