JP2004111518A - Printed wiring board and printed wiring board management system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely discriminate a printed wiring board formed by laminating a plurality of resin films and to determine a suitable reusing method of the printed wiring board. <P>SOLUTION: An ID tag 2 in which a product type number, a serial number and an IP address are written is embedded in each printed wiring board 1. A management server 4 having IP addresses is connected to a database 5 for storing the sort information and history information of respective printed boards 1 to manage these pieces of information. In an inspection process after manufacturing the printed wiring boards 1, the information of the printed wiring boards 1 is registered in the management server 4 and history information such as the shipment, transport and integration into products is transmitted to the management server 4. A management server 6 manages products into which the printed wiring boards 1 are respectively integrated. In a reusing process, whether each printed wiring board 1 is to be reused or recycled is determined on the basis of the sort information, the manufacturing information and the history information obtained from the management server 4. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a printed wiring board formed by laminating a plurality of patterned thermoplastic resin films and a management system therefor.
[0002]
[Prior art]
A plurality of electronic components (including a communication interface and a connector for power supply) are arranged on a printed wiring board (hereinafter, referred to as a printed board) used for electronic products, and these electronic components are soldered. It is fixed by. In recent years, in order to facilitate hardware upgrades, especially in FA control equipment, higher performance has been achieved in units of printed circuit boards or in units of modules in which a CPU, memory, peripheral circuit LSI, etc. are integrally molded. Some are configured so that they can be replaced with high-performance ones.
[0003]
However, since the above-mentioned module is mounted in a limited space on a printed circuit board on which a large number of components are mounted, the package size of the CPU and peripheral circuit LSI becomes larger than that of the conventional one by adding a new circuit. If the shape becomes different or the shape becomes different, mounting becomes impossible. For this reason, even if the module can be replaced, at present, only the clock frequency and the memory size of the CPU and the peripheral circuit LSI can be slightly changed, and no significant function change can be performed.
[0004]
If a significant function change is to be performed, the CPU itself and the peripheral circuit LSI itself need to be redesigned, resulting in a large development cost. Further, when the function is improved, the package size of the IC, the pin arrangement of the electrodes, and the number of pins cannot be kept the same as the conventional one, so that the design of the module and eventually the design of the printed circuit board must be redone.
[0005]
[Patent Document 1]
Japanese Patent Publication No. 11-515094
[Patent Document 2]
JP 2000-357847 A
[Problems to be solved by the invention]
In contrast, the applicant of the present application has developed a printed circuit board formed by laminating a plurality of patterned thermoplastic resin films and integrally pressing them. Compared with a conventional substrate, that is, a printed circuit board manufactured by repeating lamination, curing, and patterning of wiring for each layer, a great improvement in quality and a reduction in the number of steps can be realized when the number of layers is increased. It enables delivery. Further, since a thermoplastic resin base material is used, a material cycle in which only the resin is separated and reused is enabled.
[0008]
If this new printed circuit board is used, even if it is a complicated wiring pattern, the design becomes easy by increasing the number of layers, and there is almost no increase in the manufacturing process due to the increase in the number of layers. It is easy to respond to major changes in functions.
[0009]
However, this printed circuit board often has elements embedded inside for mounting reasons, and unlike a conventional printed circuit board in which elements are arranged on a substrate, it is difficult to distinguish the printed circuit board from the appearance after manufacturing. Become. For this, an identification number may be printed on the surface of the substrate. However, since it is expected that the identification number will be lost or intentionally rewritten after long-term use, a more reliable determination method is required. Further, in order to make full use of the excellent reusability of the printed circuit boards, it is necessary to correctly classify the printed circuit boards and to determine an appropriate reuse form for each printed circuit board.
[0010]
Techniques using an ID tag to identify a printed circuit board are disclosed in Patent Documents 1 and 2 described above. The former discloses an art in which an ID tag is mounted on a substrate, and the antenna is embedded in the substrate to reduce the entire tag size. The ID tag includes an ID code, a manufacturing place, identification information of an owner, and the like.
[0011]
On the other hand, the latter discloses a technology in which an ID tag is embedded in an inner layer portion of a printed circuit board, and an ID code indicating a distribution process is recorded in a variable ID portion of the ID tag by an external command at a distribution stage. . This is to comprehensively manage the history of the printed circuit board and the mounted electronic components, including the distribution route after manufacture. However, since the distribution route cannot be predicted in advance, the memory of the variable ID section including the memory cells is controlled. There is a problem in that the capacity must be set to be large and the cost is high, and expandability is lacking due to the limitation of the memory capacity.
[0012]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a printed wiring board having excellent recyclability formed by laminating a plurality of patterned thermoplastic resin films. An object of the present invention is to provide a printed wiring board and a management system for the printed wiring board, which can be surely determined and an appropriate reuse form can be selected for each.
[0013]
[Means for Solving the Problems]
According to the means described in claim 1, on a surface or inside of a printed wiring board formed by laminating a plurality of patterned thermoplastic resin films, the printed wiring board is uniquely (uniquely) provided to the printed wiring board. Since a read-only electronic tag in which the assigned IP address is written is provided, it is difficult to determine the appearance by accessing the board management server specified by the IP address and obtaining the type information. The type and manufacturing information can be obtained for each of the present printed wiring boards.
[0014]
Since the board management server having the IP address written in the electronic tag manages the history information of the printed wiring board, the printed wiring board is reused based on the management information and the type information. / Recycle), and a material cycle utilizing the excellent reusability of the printed wiring board can be easily constructed.
[0015]
The electronic tag used in this means is read-only. This means that in this means, the history information is managed by the board management server, and once the printed wiring board is placed in the secondary market, the subsequent history cannot be predicted, and if the history information is written to the electronic tag, This is because the information storage area must be sufficiently secured and the cost increases.
[0016]
According to the means described in claim 2, the type number indicating the product type and the shipping number assigned so that the same type of product is not duplicated are written in the electronic tag. Even if there is no accessible network environment, it is possible to obtain basic identification information such as the type of printed wiring board and manufacturing information under a local environment.
[0017]
According to the means described in claim 3, since all the components are embedded inside, the components do not protrude from the surface of the printed wiring board, and the mountability to equipment is improved. In this configuration, the discrimination in appearance is further reduced, but the discrimination can be ensured by the presence of the electronic tag described above.
[0018]
According to the fourth aspect, when a printed wiring board is handled, an IP address written on an electronic tag attached thereto is read, and a board management server having the IP address is accessed via a computer network. Then, the type information and the history information of the printed wiring board can be extracted from the board management database via the board management server. When shipping, transportation, mounting on a product, failure, repair, reuse, or the like occurs, the newly generated history information is written in the board management database. As a result, a printed wiring board management system suitable for reuse can be constructed.
[0019]
According to the means described in claim 5, based on the type information and the history information managed by the board management server, the printed wiring board in which a plurality of types are mixed can be efficiently classified, and each of the printed wiring boards can be individually referred to by referring to the history information. The most suitable form of reuse for the printed wiring board can be determined.
[0020]
According to the means described in claim 6, a dedicated IP address is assigned to the product on which the printed wiring board is mounted, and the IP address of the product is used for the history information of the printed wiring board. The location of the wiring board, that is, which product is mounted on the printed wiring board becomes clear, and it becomes easy to upgrade the printed wiring board once it has entered the distribution market (for example, rewrite software stored in a flash memory). Further, since the IP address of the printed wiring board mounted on the product is written into the product management database via the product management server having the IP address of the product, the product and the entire printed wiring board as its component parts are written. Can build a management system.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a schematic overall configuration of a printed wiring board management system. In the figure, a portion surrounded by a two-dot chain line indicates manufacturing, distribution, and reuse of a printed wiring board 1 (hereinafter, referred to as printed board 1). 2 shows the flow according to FIG. As described later, an ID tag 2 (corresponding to an electronic tag) is embedded in the printed wiring board 1 (see FIGS. 2 and 3), and the ID tag 2 has a product model number (type) indicating the type of the printed circuit board 1. A serial number (corresponding to a shipping number) assigned to the printed circuit board 1 of the same type in a manufacturing order so as not to be duplicated, and an IP address uniquely assigned to each printed circuit board 1 (uniquely). ing. The IP address uses the IP protocol of IPv6.
[0022]
A management server 4 (corresponding to a board management server) having an IP address assigned to each of the printed circuit boards 1 is connected to the Internet 3 which is a computer network. The type information and the history information are managed. The management server 4 is connected to a database 5 (corresponding to a board management database) in which type information and history information of the printed circuit board 1 are stored in association with each IP address.
[0023]
The printed circuit board 1 is used, for example, for an electronic control unit mounted on a vehicle (automobile), and a unique IP address is assigned to the vehicle and the electronic control unit as its products. A management server 6 (corresponding to a product management server) having an IP address assigned to each vehicle is connected to the Internet 3, and manages components of each vehicle. The management server 6 stores a database 7 (products) in which product model numbers, serial numbers, and IP addresses uniquely assigned to the components in a hierarchical structure are stored in association with the IP addresses of the respective vehicles. (Corresponds to the management database).
[0024]
2 and 3 are an external view and an exploded perspective view, respectively, of the printed circuit board 1 to be managed in the present management system. The external view shown in FIG. 2 is drawn in a state where each layer is separated in order to clearly show that it has a laminated structure.
[0025]
The printed board 1 has a configuration in which a semiconductor chip and other elements (parts) are embedded between a plurality of thermoplastic resin films having one surface patterned. The electrical connection between these elements or between the elements and the connector 8 is made by a wiring pattern provided on one side of the resin film and a conductive material filled in through holes provided in the resin film. It has become. The chip may be a bare chip or a packaged chip. According to this configuration, for example, it is also possible to flexibly configure only the connecting portion to the connector 8.
[0026]
The printed circuit board 1 shown in FIGS. 2 and 3 has, from the bottom side, a CPU layer 9 in which a CPU is embedded, peripheral circuit layers 10 and 11 in which ICs constituting peripheral circuits are embedded, a wiring layer 12 in which a wiring pattern is formed, Although shown as a six-layer structure of the electrode protection layers 13 and 14, in practice, a wiring layer is often provided between each layer. In addition, it is better not to dispose the element on the surface, taking advantage of the advantage that the element can be easily embedded. As a result, the components do not protrude from the surface of the printed circuit board 1 and the mountability to the electronic control device is improved, and the elements cannot be easily separated from the printed circuit board 1 except during the recycling process. Further, for example, when the CPU generates a large amount of heat, it is preferable to provide a heat radiating plate 15 made of a material having high thermal conductivity such as aluminum adjacent to the CPU layer 9.
[0027]
The ID tag 2 and the antenna 16 are embedded between the electrode protection layers 13 and 14. The ID tag 2 contains an IC chip storing data (tag data) of a product model number, a serial number, and an IP address and a coil for reading the data by electromagnetic coupling, and is formed in a coin shape as a whole. ing. To read data from the ID tag 2, a reader (not shown) is required. The ID tag 2 is preferably supplied with power by electromagnetic coupling with a reader, but may be configured to include a battery in the printed circuit board 1.
[0028]
The antenna 16 is preferably provided near the surface to avoid the influence of the wiring pattern in the inner layer. Further, in order for the reader to reliably read data from the ID tag 2 irrespective of the positional relationship between the reader and the printed board 1, the antenna 16 may be provided not only on the upper surface but also on the lower surface.
[0029]
The manufacturing process of the printed board 1 includes a design process, a manufacturing process, and an inspection process. In the design process, the number, size, number of pins, and the like of the CPU, the peripheral circuit IC, the memory, and the like are input, and the CPU layer 9, the peripheral circuit layers 10, 11, the wiring layer 12, and the memory layer (the memory layers are shown in FIGS. (Not shown) is automatically designed. Here, electrode sizes and take-out forms of chips such as a CPU, a peripheral circuit IC, and a memory are standardized. Further, the shape of the connector 8 and the number of electrodes are considered so as to have a marginal design so as to withstand a change up to several generations predicted from a road map of the CPU or the like.
[0030]
FIG. 4 shows a manufacturing process of the printed circuit board 1. In the manufacture, first, a conductor foil adhered to one surface of a thermoplastic resin film as an insulating base material, for example, a copper foil having a thickness of 18 μm (aluminum foil may be used) is patterned by etching according to the above-designed wiring pattern ( Step P1). When the patterning of each layer is completed, a protective film is attached to a surface on which no pattern is formed.
[0031]
After adhering the protective film, a carbon dioxide gas laser or an excimer laser is irradiated from the protective film side to form a bottomed via hole having a conductive pattern (copper foil) as a bottom surface at a predetermined position (step P2). In this step, mechanical processing such as drilling is also possible, but it is necessary to make a fine hole, so that laser processing is preferable in order to ensure high accuracy.
[0032]
After forming a via hole for each layer, the via hole is filled with a conductive paste (conductive material) as an interlayer connecting material (step P3). The conductive paste is obtained by adding a binder resin or an organic solvent to metal particles such as copper, silver, and tin and kneading the mixture to form a paste.
The conductive paste is printed and filled in the via hole with the conductive pattern side of the one-sided conductive film facing down by a screen printing machine using a metal mask. After filling, the protective film is peeled off (Step P4).
[0033]
After peeling off the protective film, the respective layers are laminated with the conductor pattern side of the single-sided conductor film facing down (step P5). At that time, electrodes formed on each element (bare chip) such as a CPU, a peripheral circuit IC, and a memory are connected to contact points of conductors, and are thermally bonded and temporarily fixed. In order to embed the chip, it is necessary to previously form a hole serving as a guide at the embedding position of the number of resin films corresponding to the thickness of the chip. And no shavings. For this reason, workability is remarkably improved as compared with a conventional process of processing an epoxy substrate and embedding a chip.
[0034]
A cover layer is laminated on the lowermost layer so as to cover the conductor pattern. After lamination, pressure molding is performed by a vacuum pressure press at 200 ° C. to 350 ° C. at a pressure of 0.1 MPa to 10 MPa (step P6). FIG. 5 shows the pressurizing temperature condition at this time.
Thereby, the integral formation of the resin film and the three-dimensional wiring can be performed simultaneously. In the inspection process performed subsequent to the manufacturing process described above, electrical and mechanical inspections are performed, and registration with the management server 4 is performed as described later.
[0035]
Next, a method for managing the printed circuit board 1 will be described.
In FIG. 1, in an inspection process after the printed circuit board 1 is manufactured, tag data including a product model number, a serial number, and an IP address is read from an ID tag 2 embedded in the printed circuit board 1 by a reader. The read product information, such as the product model number and serial number, and the manufacturing date and location, is sent via the Internet 3 to the management server 4 having the read IP address.
[0036]
The management server 4 performs the registration processing of the printed circuit board 1 by storing the data in the database 5 in association with the IP address. Since the IP address is managed so as to be uniquely assigned to all the printed circuit boards 1 without duplication, even if each manufacturer uses the same product model number and serial number, the management server 4 Individual printed circuit boards 1 can be correctly identified based on the IP address.
[0037]
The distribution history is also transmitted to the management server 4 in the subsequent shipping stage and transportation stage. Thereafter, when the electronic control device incorporating the printed circuit board 1 is manufactured, the IP address assigned to the electronic control device is transmitted from the manufacturing factory to the management server 4. The management server 4 stores the IP address of the electronic control device in the database 5. In addition, the IP address assigned to the embedded printed circuit board 1 is sent to the management server 6 having the IP address assigned to the electronic control device. The management server 6 stores the IP address of the printed circuit board 1 in the database 7 as one component of the electronic control device.
[0038]
Further, even when the electronic control device is mounted on the vehicle, the IP address allocated to the mounted electronic control device is sent to the management server 6 having the IP address similarly allocated to the vehicle, and the database 7 is stored in the database 7. Is stored in As a result, the management server 6 accumulates, in a hierarchical structure, the product model number, the serial number of the component, and the IP address uniquely assigned to the component in association with the IP address of each vehicle. It becomes.
[0039]
Since the printed circuit board 1 uses a thermoplastic resin base material, it is suitable for separating and reusing the resin and the element. In the reuse step of determining the reuse mode of the printed circuit board 1 recovered from the product, the reader reads the IP address from the ID tag 2 embedded in the printed circuit board 1 and accesses the management server 4 having the IP address. The type information, manufacturing information, and history information of the printed circuit board 1 are obtained. Then, based on the information and the function test result, it is determined whether the printed circuit board 1 is to be reused or recycled.
[0040]
FIG. 6 shows processing contents in the reuse step. FIG. 6A shows a case of reuse, in which each printed circuit board 1 is classified based on information obtained from the management server 4 (step A1), and a program or a program stored in the flash memory in response to a request from a new user. Data is rewritten (step A2). Thereafter, a function test is performed (step A3), and the product is shipped to a new user (step A4). When the reuse process is completed, the history of the reuse is transmitted to the management server 4 having the IP address of the printed circuit board 1. The data content of the product model number, serial number, and IP address held by the ID tag 2 embedded in the printed circuit board 1 does not change from the time of manufacturing the printed circuit board 1 to the time of recycling and disassembly.
[0041]
FIG. 6B shows a case of recycling, in which each printed circuit board 1 is classified based on information obtained from the management server 4 (step B1), and the resin and the element are separated and collected by heating. (Step B2). These resins and elements are used when manufacturing a new printed circuit board (step B3). As a result, the material cycle shown in FIG. 1 is constructed. If the used component list is included in the type information of the printed circuit board 1, the components obtained by recycling can be known in advance.
[0042]
As described above, the ID tag 2 in which the IP address uniquely assigned to the printed circuit board 1 is written is embedded in the printed circuit board 1 to be managed by the management system of the present embodiment. Since the management server 4 having the IP address manages the type information and the history information of the printed circuit board 1, the type and manufacturing of the printed circuit board 1 having a feature that it is difficult to determine the appearance based on the type information is performed. Information can be obtained.
[0043]
In particular, when all the elements are embedded inside the printed circuit board 1 so as to prevent the elements from protruding from the surface of the printed circuit board 1 in order to enhance the mountability to the device as in the present embodiment, the discriminability in appearance is further reduced. However, if the type information of the management server 4 is used, the determination can be made reliably. Thus, it is possible to prevent the printed circuit board 1 from being mixed when incorporated into the electronic control device.
[0044]
Further, based on the type information and the history information obtained from the management server 4, a reuse mode (reuse / recycle) suitable for each printed circuit board 1 can be determined, and the excellent reusability of the printed circuit board 1 is utilized. Material cycle can be easily constructed. Also, in the reuse process, a printed circuit board in which a plurality of types are mixed can be efficiently classified based on the type information and the history information.
[0045]
Since the product model number and the serial number are also written in the ID tag 2 in addition to the IP address, even if there is no network environment accessible to the management server 4, the type and manufacturing information of the printed circuit board 1 can be obtained under a local environment. Can be obtained.
[0046]
Since the printed circuit board 1 is centrally managed by the management server 4 having the IP address assigned to the printed circuit board 1, it is not necessary to add data to the ID tag 2, and the ID tag 2 is read-only element (IC chip). ). As a result, the cost can be reduced as compared with the conventional configuration in which the history data is added to the ID tag 2.
[0047]
A unique IP address is assigned to a product (electronic control device, vehicle) in which the printed circuit board 1 is incorporated, and the IP address of the product is used for the history information of the printed circuit board 1. The location, that is, which product is incorporated, becomes clear, and it is easy to upgrade the printed circuit board 1 once it has entered the distribution market (for example, rewrite software stored in a flash memory). Further, the management (location, history of replacement, repair, and the like) of the printed circuit board 1 and products in which the printed circuit board 1 is incorporated in sub-assemblies becomes easy.
[0048]
The printed circuit board 1 can be easily designed by increasing the number of layers even if it has a complicated wiring pattern, and there is almost no increase in the number of manufacturing steps due to the increase in the number of layers. Further, since the chips are also configured according to the standard specifications, it is easy to replace the chips and to change the design of a module in which a plurality of chips are molded.
[0049]
The present invention is not limited to the embodiment described above and shown in the drawings. For example, the present invention can be modified or expanded as follows.
The product in which the above-described printed circuit board 1 is incorporated is not limited to the electronic control device of the vehicle. If applied to products in fields where environmental measures are required in the future, such as car electronics, home appliances, and IT-related equipment, it is easy to build a material cycle that makes full use of the excellent reusability of the printed circuit board 1. can do.
[0050]
In the present embodiment, all the elements are embedded in the printed board 1 in consideration of the mountability, but a configuration in which the elements are provided on the surface of the printed board 1 is also conceivable.
The ID tag 2 only needs to hold at least the IP address uniquely assigned to the printed circuit board 1.
[Brief description of the drawings]
FIG. 1 is a schematic overall configuration diagram of a printed wiring board management system showing an embodiment of the present invention. FIG. 2 is an external view of a printed board. FIG. 3 is an exploded perspective view of the printed board. Manufacturing process diagram [FIG. 5] Diagram showing pressurized temperature conditions when manufacturing a printed circuit board [FIG. 6] Diagram showing processing contents in a reuse process [Description of reference numerals]
1 is a printed board (printed wiring board), 2 is an ID tag (electronic tag), 3 is the Internet (computer network), 4 is a management server (board management server), 5 is a database (board management database), and 6 is a management server (Product management server), 7 is a database (product management database).

Claims (6)

A printed wiring board formed by laminating a plurality of patterned thermoplastic resin films, and having an IP address uniquely assigned to the printed wiring board written on the surface or inside thereof. A printed circuit board provided with a dedicated electronic tag and configured to manage type information and history information in a board management server having the IP address. 2. The printed wiring board according to claim 1, wherein a type number indicating a product type and a shipping number assigned so as not to be duplicated for the same type of product are written in the electronic tag. 3. The printed wiring board according to claim 1, wherein all of the components provided are embedded therein. A read-only electronic tag in which an IP address uniquely assigned to the printed wiring board is written on or in the surface of a printed wiring board formed by laminating a plurality of patterned thermoplastic resin films. And
When handling the printed wiring board, the IP address written on the electronic tag is read, a board management server having the IP address is accessed via a computer network, and the board management database is accessed via the board management server. A printed wiring board management system configured to read type information and history information of a printed wiring board, or write newly generated history information to the board management database via the board management server. The printed wiring board management system according to claim 4, wherein a reuse mode of the printed wiring board is determined based on type information and history information managed by the board management server. Assigning a unique IP address to a product in which the printed wiring board is incorporated, using the IP address of the product for history information managed by the board management server,
6. The product management database connected to a product management server having an IP address of the product, wherein an IP address of a printed circuit board incorporated in the product is written. The printed wiring board management system as described.

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