JP2004109979A

JP2004109979A - Method of manufacturing optical component

Info

Publication number: JP2004109979A
Application number: JP2003165416A
Authority: JP
Inventors: Shoichi Sugimoto; 杉本　正一; Shinji Kobayashi; 小林　真司; Koji Asaji; 浅地　康志; Kaneo Yachi; 矢地　兼雄
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2002-07-23
Filing date: 2003-06-10
Publication date: 2004-04-08

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing optical components which improves manufacturing efficiency and yield of the optical components. <P>SOLUTION: A plurality of optical component formation area parts H are set on a semiconductor mother substrate 20, and groove parts 8 for optical fiber alignment are formed across boundary faces L of adjacent optical component formation area parts H. Thereafter, a mother substrate junction body 24 of the semiconductor mother substrate 20, an upper mother substrate 21, and a lower mother substrate 22 is formed. Cutting grooves 25 formed in positions of boundary faces L of optical component formation area parts H are utilized to cut the mother substrate junction body 24, and then a plurality of laminated bodies 26 comprising a semiconductor substrate 2, an upper substrate 3, and a lower substrate 4 are formed. Front end parts of optical fibers 10 are inserted from opening parts 27 of groove parts 8 for optical fiber alignment in side faces of laminated bodies 26 and are fixed to complete optical components 1. Since fine working and substrate junction are performed in a state of large-sized mother substrates, manufacturing efficiency is improved. Since dicing is not utilized for separation and division of the mother substrate junction body 24, problems caused by dicing are prevented to improve yield. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、光ファイバを備えた光部品の製造方法に関するものである。
【０００２】
【背景技術】
光部品の一種である光スイッチの一例を図５（ａ）に示す模式的な分解図により説明する。光スイッチ１は、例えばシリコンの半導体基板２と、例えばガラスの上部基板３と、例えばガラスの下部基板４とから成る三層構造を備えている。
【０００３】
半導体基板２におけるほぼ中央部には、凹部５と、凹部５の内部空間にミラー６とが形成されている。なお、図５（ａ）では、分かり易くするために凹部５の上方側にミラー６が配置されているが、実際には、ミラー６は凹部５の内部に収容されている。
【０００４】
ミラー６は、後述するミラー駆動手段７によって変位制御可能に形成される。ミラー６は、半導体基板２をＭＥＭＳ（ＭｉｃｒｏＥｌｅｃｔｒｏＭｅｃｈａｎｉｃａｌ　Ｓｙｓｔｅｍｓ）技術等により微細加工して形成されたミラー基部の表面に、例えばＡｕ等の反射膜を設けることによって形成される。
【０００５】
半導体基板２の表面側には、半導体基板２の端縁部から凹部５に至る４本の光ファイバ配置用溝部８が、十文字形状に配置形成されている。各光ファイバ配置用溝部８には、それぞれ、光ファイバ１０の先端部が配置される。さらに、半導体基板２の表面側の光ファイバ配置用溝部８を避けた領域には、ミラー６を変位駆動させるためのミラー駆動手段７が形成される。
【０００６】
ミラー駆動手段７の一例を図６に示す。この例のミラー駆動手段７は、半導体基板２を微細加工して形成される。ミラー駆動手段７は、半導体基板２に固定された櫛歯形状の固定電極１２と、半導体基板２から浮いた状態に形成され固定電極１２と間隔を介して噛み合う櫛歯形状の可動電極１３と、半導体基板２の固定部１４に両端部が接続された梁１５ａ，１５ｂと、これら梁１５ａ，１５ｂと可動電極１３とミラー６を連結する梁１６とから構成されている。このミラー駆動手段７では、外部の電圧印加手段（図示せず）によって、固定電極１２と可動電極１３間に電圧を印加すると、その電圧印加によって、固定電極１２と可動電極１３間に静電引力が発生する。これにより、梁１５ａ，１５ｂが撓んで可動電極１３が固定電極１２側に引き寄せられ、梁１６が図のＡ方向に変位して、ミラー６が変位する。
【０００７】
なお、図５に示す光スイッチ１を構成する上部基板３において光ファイバ配置用溝部８に対向する部分には、凹部１８が形成されており、光ファイバ配置用溝部８から上側に食み出した光ファイバ１０の先端上部が凹部１８内に収容される。
【０００８】
光スイッチ１では、図５（ｂ）に示すように、４本の光ファイバ１０（１０_１〜１０_４）の十文字状配置の中心部にミラー６が位置する場合には、例えば、光ファイバ１０_１を伝搬してきた光は、光ファイバ１０_１の先端面から出射しミラー６によって反射する。そして、その反射光は、反射先の隣の光ファイバ１０_４の先端面に進入し、光ファイバ１０_４を通って外部に出射される。また同様に、光ファイバ１０_２を伝搬してきた光は、光ファイバ１０_２の先端面から出射しミラー６によって反射して、反射先の隣の光ファイバ１０_３の先端面に進入し、光ファイバ１０_３を通って外部に出射される。
【０００９】
また、図５（ｃ）に示すように、ミラー駆動手段７によってミラー６が４本の光ファイバ１０（１０_１〜１０_４）の十文字状配置の中心部から退避している場合には、例えば、光ファイバ１０_１を伝搬してきた光は、光ファイバ１０_１の先端面から出射し、当該光ファイバ１０_１の先端面と対向して配置された光ファイバ１０_３の先端面に進入し、光ファイバ１０_３を通って外部に出射される。また同様に、光ファイバ１０_２を伝搬してきた光は、光ファイバ１０_２の先端面から出射し、当該光ファイバ１０_２の先端面と対向して配置された光ファイバ１０_４の先端面に進入し、光ファイバ１０_４を通って外部に出射される。
【００１０】
このように、光スイッチ１では、ミラー駆動手段７によるミラー６の変位制御によって、４本の光ファイバ１０（１０_１〜１０_４）の光接続の組み合わせを切り換えることができる。
【００１１】
このような光スイッチ１は例えば次に示すように製造される。例えばシリコンの半導体親基板と、例えばガラスの下部親基板とを陽極接合する。その後、半導体親基板の表面にマトリックス状に複数の光スイッチ形成領域部を定め、各光スイッチ形成領域部にそれぞれ微細加工を利用して凹部５とミラー６とミラー駆動手段７と光ファイバ配置用溝部８を形成する。そして、半導体親基板と下部親基板から成る接合体を光スイッチ形成領域部の境界線の位置で切断し、各光スイッチ形成領域部毎に分離する。なお、接合体の切断には、ダイシング装置等が用いられる。
【００１２】
この後に、分離された各光スイッチ形成領域部の半導体基板２の光ファイバ配置用溝部８に、光ファイバ１０の先端部を配置する。その後、半導体基板２の上部に、凹部１８が予めエッチング形成された上部基板３が、接着剤を用いて固定される。
【００１３】
【特許文献１】
特開平１１−１１９１２３号公報
【００１４】
【発明が解決しようとする課題】
しかしながら、光スイッチ１の製造工程では、半導体親基板と下部親基板との接合体から分離した各光スイッチ形成領域部の半導体基板２の上側に１つずつ上部基板３を固定しなければならなかった。通常使用される光ファイバ１０の直径は１２５μｍと極めて細いことからも分かるように、分離された半導体基板２は微細なものであり、この微細な半導体基板２に上部基板３を固定することは時間と手間が掛かり、作業性が非常に悪いという問題がある。
【００１５】
また、半導体基板２と上部基板３を接着剤で固定するため、半導体基板２と上部基板３の接合強度は満足できるものではなかった。さらに、半導体基板２と上部基板３を接続するための接着剤が半導体基板２の凹部５内に入り込み、この接着剤が光の伝搬を妨げる等の問題を発生させる場合があった。
【００１６】
さらにまた、半導体親基板の上面が殆ど保護されていない状態で、半導体親基板と下部親基板の接合体をダイシングするため、半導体親基板にダイシングカッターの冷却用の水が被り、微細加工されたミラー駆動手段７等が破損してしまうという問題が発生する場合がある。また、半導体基板２の上面に切削くずが付着してしまい、半導体基板２と上部基板３の接合強度が不良となる等の問題が発生する。このような様々な問題が発生して光スイッチ１の歩留まりを低下させている。
【００１７】
この発明は上記課題を解決するために成されたものであり、その目的は、光部品の製造効率を高めると共に、光部品の歩留まりを向上させることができる光部品の製造方法を提供することにある。
【００１８】
【課題を解決するための手段】
上記目的を達成するために、この発明は次に示す構成をもって前記課題を解決するための手段としている。すなわち、この発明の一つの構成は、光ファイバ配置用溝部が形成された半導体基板の表面に上部基板が積層された積層体を少なくとも有し、該積層体の側面には前記光ファイバ配置用溝部に連通する開口部が設けられ、該開口部から光ファイバの先端部を光ファイバ配置用溝部に挿入して装着した光部品の製造方法であって、
半導体親基板に光部品形成領域部を複数設定し、隣接する光部品形成領域部の境界面を貫いて前記光ファイバ配置用溝部を形成する工程と、
前記半導体親基板の表面に上部親基板を接合して親基板接合体を形成する工程と、
光部品形成領域部の境界位置に合わせて、少なくとも上部親基板の厚み方向に切り込み溝を形成する工程と、
その切り込み溝を利用して上部親基板の切り残し部および半導体親基板を破断して親基板接合体を分離し、側面に光ファイバ配置用溝部の開口部が形成された前記半導体基板と上部基板の積層体を作製する工程と
を備えたことを特徴としている。
【００１９】
また、この発明の別の構成の一つは、光ファイバ配置用溝部が形成された半導体基板の表面に上部基板が積層された積層体を少なくとも有し、該積層体の側面には前記光ファイバ配置用溝部に連通する開口部が設けられ、該開口部から光ファイバの先端部を光ファイバ配置用溝部に挿入して装着した光部品の製造方法であって、
半導体親基板に光部品形成領域部を複数設定し、隣接する光部品形成領域部の境界面を貫いて前記光ファイバ配置用溝部を形成する工程と、
前記半導体親基板の表面に上部親基板を接合して親基板接合体を形成する工程と、
光部品形成領域部の境界位置と光ファイバ配置用溝部とが交差する部分に、親基板接合体の表面側から光ファイバ配置用溝部に達する孔部を形成するか、あるいは、親基板接合体の表面側から底面側に貫通する孔部を形成する工程と、
親基板接合体の前記孔部に封止部材を充填する工程と、
この後に、親基板接合体を光部品形成領域部の境界面に合わせて切断し、前記半導体基板と上部基板の積層体を作製する工程と、
その積層体から封止部材を除去して該積層体の光ファイバ配置用溝部の開口部を貫通する工程と
を備えたことを特徴としている。
【００２０】
さらにまた、この発明の別の構成の一つは、光ファイバ配置用溝部が形成された半導体基板の表面に上部基板が積層された積層体を少なくとも有し、該積層体の側面には前記光ファイバ配置用溝部に連通する開口部が設けられ、該開口部から光ファイバの先端部を光ファイバ配置用溝部に挿入して装着した光部品の製造方法であって、
半導体親基板に複数の光部品形成領域部を互いに緩衝帯を介して設定し、半導体親基板表面の各光部品形成領域部内にそれぞれ前記光ファイバ配置用溝部を形成する工程と、
半導体親基板表面の各光部品形成領域部間の緩衝帯の位置および各光部品形成領域部内の予め定めた接合位置で上部親基板と接合して、親基板接合体を形成する工程と、
各光部品形成領域部間の緩衝帯の両側の光部品形成領域部境界線の位置に、少なくとも上部親基板の厚み方向に切り込み溝を形成する工程と、
各光部品形成領域部間の緩衝帯の中央ラインに沿って親基板接合体を切断して前記半導体基板と上部基板の積層体毎に分離する工程と、
前記切り込み溝を利用して上部基板の切り残し部および半導体基板を破断して前記切り込み溝よりも外側の余剰部分を除去し、前記半導体基板と上部基板の積層体の側面に光ファイバ配置用溝部の開口部を形成する工程と
を備えたことを特徴としている。
【００２１】
【発明の実施の形態】
以下に、この発明に係る実施形態例を図面に基づいて説明する。
【００２２】
第１実施形態例では、図５に示した光スイッチ１を例にして光部品の製造工程例を説明する。なお、第１実施形態例の説明において、図５の光スイッチの構成の説明は前述したので、その重複説明は省略する。
【００２３】
まず、図１（ａ）に示すような例えばシリコンの半導体親基板２０を用意し、この半導体親基板２０の表面にマトリックス状に複数の光スイッチ形成領域部（光部品形成領域部）Ｈを定める。そして、各光スイッチ形成領域部Ｈにそれぞれ凹部５とミラー６とミラー駆動手段７と光ファイバ配置用溝部８をＭＥＭＳ技術等の微細加工技術を用いて形成する。なお、第１実施形態例では、各光スイッチ形成領域部Ｈの光ファイバ配置用溝部８は、光スイッチ形成領域部Ｈの境界面Ｌを貫いて隣の光スイッチ形成領域部Ｈの光ファイバ配置用溝部８に連通している。
【００２４】
次に、図１（ｂ）に示すように、微細加工後の半導体親基板２０の表面側には例えばガラスから成る上部親基板２１を、また、裏面側には例えばガラスから成る下部親基板２２をそれぞれ配置した後に陽極接合手法により半導体親基板２０と上部親基板２１と下部親基板２２を一体化し、親基板接合体２４を形成する。
【００２５】
なお、上部親基板２１には、半導体親基板２０の光ファイバ配置用溝部８の形成位置に対応させて凹部１８が予めエッチング形成されており、陽極接合時に、半導体親基板２０の光ファイバ配置用溝部８の形成位置と、上部親基板２１の凹部１８の形成位置との位置合わせが行われる。
【００２６】
その後、図１（ｃ）の親基板接合体２４の部分的な拡大断面図に示されるように、各光スイッチ形成領域部Ｈ間の境界面Ｌの位置に合わせて親基板接合体２４の表裏両面に切り込み溝（ハーフカット）２５を例えばダイシング装置を用いて形成する。
【００２７】
この後、切り込み溝２５を形成することで薄くなった親基板接合体２４の切り残し部分２８を手や専用治具を用いて破断し、各光スイッチ形成領域部Ｈ毎に分離する。このようにして、親基板接合体２４から、図１（ｄ）に示すような、光スイッチ１を構成する下部基板４と半導体基板２と上部基板３から成る積層体２６を複数形成することができる。その分離後の積層体２６の側面には光ファイバ配置用溝部８の開口部２７が開けられた状態となっている。この親基板接合体２４の分離分割工程では、ダイシングを用いていないので、ダイシングに起因した様々な問題（例えばダイシングの冷却用の水や切削くずが開口部２７から積層体２６の内部に入り込む問題）を回避することができる。
【００２８】
その後、積層体２６の側面に形成された光ファイバ配置用溝部８の開口部２７に光ファイバ１０の先端部を挿入、固定して、光スイッチ１が完成する。
【００２９】
以下に、第２実施形態例を説明する。なお、第２実施形態例の説明において、第１実施形態例と同一構成部分には同一符号を付し、その共通部分の重複説明は省略する。
【００３０】
第２実施形態例では、微細加工後の半導体親基板２０の表面に上部親基板２１を、裏面に下部親基板２２をそれぞれ配置し、それらを陽極接合して親基板接合体２４を形成した後の工程に特徴がある。
【００３１】
つまり、親基板接合体２４において、各光スイッチ形成領域部Ｈ間の境界面Ｌと光ファイバ配置用溝部８とが交差する部分（例えば、図２（ａ）の丸印Ｍを参照）に、図２（ｂ）の拡大断面図に示されるような、表面から光ファイバ配置用溝部８に達する孔部３０をＲＩＥ（Ｒｅａｃｔｉｖｅ　Ｉｏｎ　Ｅｔｃｈｉｎｇ）等の乾式エッチングにより形成する。
【００３２】
この後に、孔部３０に封止部材３１を充填する。封止部材３１は後述するように後工程で除去する必要があることから、封止部材３１の構成材料は、乾式方式で除去し易いことを考慮して選定される。例えば、封止部材３１の一例として、紫外線硬化性樹脂が挙げられる。紫外線硬化性樹脂を用いる場合には、例えば、ペースト状の紫外線硬化性樹脂を孔部３０の内部に充填し、その後に、紫外線を照射して、その紫外線硬化性樹脂を硬化させる。
【００３３】
孔部３０に封止部材３１を充填した後、例えばダイシング装置を用いて親基板接合体２４を各光スイッチ形成領域部Ｈ間の境界面Ｌの位置に合わせて切断し、各積層体２６毎に分離する。このとき、各積層体２６の光ファイバ配置用溝部８の開口部２７は封止部材３１によって塞がれているので、光スイッチ１の積層体２６の内部にダイシングに起因した水や切削くず等が入り込むことが防止される。
【００３４】
その後、酸素プラズマエッチング等の乾式エッチングによって封止部材３１をアッシュ化（灰化）して、各積層体２６から封止部材３１を除去する。これにより、各積層体２６における光ファイバ配置用溝部８の開口部２７が貫通する。そして、第１実施形態例と同様に、光ファイバ１０の先端部を開口部２７から積層体２６の内部に挿入し、光ファイバ配置用溝部８に配置固定する。このようにして、光スイッチ１を製造することができる。
【００３５】
以下に、第３実施形態例を説明する。なお、この第３実施形態例の説明において、第１や第２の各実施形態例と同一構成部分には同一符号を付し、その共通部分の重複説明は省略する。
【００３６】
この第３実施形態例では、まず、図３（ａ）に示されるような半導体親基板２０を用意し、この半導体親基板２０の表面にマトリックス状に複数の光スイッチ形成領域部Ｈを設定する。このとき、各光スイッチ形成領域部Ｈ間には緩衝帯である間隙Ｓを設ける。
【００３７】
そして、各光スイッチ形成領域部Ｈ内にそれぞれ凹部５とミラー６とミラー駆動手段７と光ファイバ配置用溝部８をＭＥＭＳ技術等の微細加工技術を用いて形成する。この第３実施形態例では、光ファイバ配置用溝部８は、各光スイッチ形成領域部Ｈの端縁（境界線）から各光スイッチ形成領域部Ｈの中央部に向けて伸長形成されており、光スイッチ形成領域部Ｈよりも外側の間隙Ｓに食み出さないように形成されている。
【００３８】
次に、半導体親基板２０と上部親基板２１と下部親基板２２を陽極接合手法により一体化して親基板接合体２４を形成する。このとき、半導体親基板２０の表面において、各光スイッチ形成領域部Ｈ間の間隙Ｓの位置と、各光スイッチ形成領域部Ｈ内の予め定めた接合位置とが上部親基板２１に陽極接合する。
【００３９】
その後、図３（ｂ）の親基板接合体２４の部分的な拡大断面図に示されるように、各光スイッチ形成領域部Ｈ間の間隙Ｓの両側の光スイッチ形成領域部境界線Ｌに沿って親基板接合体２４の表裏両面に切り込み溝（ハーフカット）２５を例えばダイシング装置を利用して形成する。
【００４０】
然る後に、各光スイッチ形成領域部Ｈ間の間隙Ｓの中央ラインＴに沿って親基板接合体２４をダイシング装置等により切断して、各光スイッチ形成領域部Ｈ毎に分離する。これにより、図３（ｃ）の断面図に示されるような半導体基板２と上部基板３と下部基板４から成る積層体２６が複数個切り出される。このダイシング工程では、各光スイッチ形成領域部Ｈ間の間隙Ｓに位置する半導体親基板部分Ｑにより光ファイバ配置用溝部８の開口部が塞がれている状態であるので、積層体２６の内部にダイシングに起因した冷却用の水や切削くず等が入り込むことが防止される。
【００４１】
その後に、各積層体２６のそれぞれにおいて、切り込み溝２５を利用して積層体２６の切り残し部２８を手や専用治具を用いて破断して切り込み溝２５よりも外側の余剰部分３３を除去する。これにより、図３（ｄ）に示されるように、積層体２６の側面に光ファイバ配置用溝部８の開口部２７が形成される。この開口部２７の形成工程では、ダイシングを用いていないので、ダイシングに起因した問題発生を回避できる。
【００４２】
開口部２７の形成工程の後に、積層体２６の側面の開口部２７から光ファイバ１０の先端部を光ファイバ配置用溝部８内に挿入し、固定して、光スイッチ１が完成する。
【００４３】
なお、この発明は第１〜第３の各実施形態例に限定されるものではなく、様々な実施の形態を採り得る。例えば、光ファイバ配置用溝部８の断面形状は、第１〜第３の各実施形態例ではＶ字形状であったが、光ファイバ１０の先端部を配置して位置決めすることが可能な形態であればよく、例えば、半円形状であってもよいし、Ｕ字形状であってもよい。
【００４４】
また、第１〜第３の各実施形態例で例示した光スイッチ１では、４本の光ファイバ１０を配置するため、半導体基板２には、４本の光ファイバ配置用溝部８が形成されていた。しかしながら、例えば、図４（ａ）に示されるように、半導体基板２に３本の光ファイバ配置用溝部８を設けて、光ファイバ１０Ａ，１０Ｂ，１０Ｃを配置する構成としてもよい。この場合、光ファイバ１０Ａ，１０Ｂ，１０Ｃの中心部にミラー６が配置されている場合には、例えば、光ファイバ１０Ａを伝搬してきた光は、光ファイバ１０Ａの先端面から出射しミラー６によって反射して、反射先の光ファイバ１０Ｂに入射し、光ファイバ１０Ｂを通って外部に出射される。また、図４（ｂ）に示されるように、光ファイバ１０Ａ，１０Ｂ，１０Ｃの中心部からミラー駆動手段７によってミラー６が退避しているときには、光ファイバ１０Ａを伝搬してきた光は、光ファイバ１０Ａの先端面から出射し、当該光ファイバ１０Ａと先端面同士が対向している光ファイバ１０Ｃに入射し、光ファイバ１０Ｃを通って外部に出射される。
【００４５】
このような構成の光スイッチ１を第１実施形態例又は第２実施形態例の製造工程でもって製造する場合には、半導体親基板２０には、例えば、図４（ｃ）に示されるように、隣り合う光スイッチ形成領域部Ｈの境界面Ｌを貫いて光ファイバ配置用溝部８を形成する。
【００４６】
さらに、第１と第３の各実施形態例では、親基板接合体２４の表面と裏面の両方に切り込み溝２５を形成したが、例えば、親基板接合体２４の薄さによっては、親基板接合体２４の表面と裏面の一方側だけに切り込み溝２５を設けてもよい。
【００４７】
さらに、第１と第３の各実施形態例では、切り込み溝２５の断面形状はＶ字形状であったが、切り込み溝２５に基づいて親基板接合体２４を破断することが可能であれば、その断面形状は円弧状でもよいし、Ｕ字形状であってもよいし、また、四角形状でもよい。
【００４８】
さらに、第１と第３の各実施形態例では、半導体親基板２０と上部親基板２１と下部親基板２２の親基板接合体２４を形成してから、親基板接合体２４に切り込み溝２５を形成していたが、上部親基板２１および下部親基板２２を半導体親基板２０に接合する前に、上部親基板２１と下部親基板２２の一方又は両方に予め切り込み溝２５を形成しておいてもよい。なお、この場合には、半導体親基板２０と、上部親基板２１および下部親基板２２との位置合わせを精度良く行う必要がある。
【００４９】
さらに、第２実施形態例では、封止部材３１を充填するための孔部３０は、親基板接合体２４の表面側から光ファイバ配置用溝部８に至る孔部であったが、例えば、図２（ｂ）の点線に示されるように、親基板接合体２４の表面側から裏面側に至る貫通孔を設けてもよい。
【００５０】
さらに、第２実施形態例では、親基板接合体２４を形成した後に、光スイッチ形成領域部Ｈの境界面Ｌと光ファイバ配置用溝部８とが交差する部分に孔部３０を形成していたが、親基板接合体２４を形成する前に、予め上部親基板２１に孔部３０を形成しておいてもよい。
【００５１】
さらに、第１〜第３の各実施形態例では、上部親基板２１、下部親基板２２として、ガラスを例示したが、ガラス以外の絶縁材料あるいはシリコンを用いてもよい。シリコンを用いる場合には、半導体親基板２０と、上部親基板２１および下部親基板２２とを接合する際に、接着層としてのガラス層を介設することにより、陽極接合が可能となる。これにより、シリコン基板である半導体親基板２０と上部親基板２１と下部親基板２２を強固に接合することができる。また、ガラス以外の絶縁材料を上部親基板２１、下部親基板２２の材料として用いる場合には、接合強度を考慮して他の接合手法が適宜選択される。
【００５２】
さらに、半導体基板２としてシリコン基板を例示したが、ゲルマニウム等の他の半導体材料を用いてもよい。
【００５３】
さらに、第１〜第３の各実施形態例では、光スイッチ１は、半導体基板と上部基板と下部基板の三層構造の積層体を備えていたが、半導体基板の厚みが厚くて強度が十分である場合には下部基板を省略してもよいし、また、四層以上の多層構造としてもよい。さらに、第１〜第３の各実施形態例では、光スイッチ１を例にして説明したが、この発明の製造方法は、光ファイバ配置用溝部が形成された半導体基板の表面に上部基板が積層された積層体を少なくとも有し、この積層体の側面に形成された開口部から光ファイバの先端部が光ファイバ配置用溝部に挿入されて装着される構成を備えた光部品であれば、その光部品の製造工程に適用することができる。
【００５４】
【発明の効果】
従来では、半導体親基板を各光部品形成領域部毎に分離して光部品の半導体基板を切り出した後に、その微細な各光部品の半導体基板上にそれぞれ上部基板を固定していた。これに対して、この発明の製造方法では、半導体親基板と上部親基板を接合して親基板接合体を形成してから、その親基板接合体を各光部品形成領域部毎に分離することとした。その半導体親基板と上部親基板は、光部品の半導体基板や上部基板よりもサイズが大きいので、従来よりも作業性を向上させることができる。また、この発明では、上記のように光部品の半導体基板と上部基板をそれぞれ親基板の状態で接合している。換言すれば、複数の光部品の半導体基板に上部基板を一括的に接合させている。これにより、製造効率を高めることができる。このことと上記作業性向上とが相俟って、光部品の製造効率を大幅に高めることができる。
【００５５】
また、半導体親基板に微細加工を施した後に、その半導体親基板の上側に上部親基板を接合してから、各光部品毎に分離するので、その分離工程では、半導体親基板の加工部分は上部親基板により保護されている状態となっている。これにより、分離工程での半導体基板の加工部分の破損を殆ど無くすことができる。
【００５６】
さらに、親基板接合体に形成した切り込み溝を利用して、親基板接合体を分離する構成のものにあっては、ダイシングを用いずに親基板接合体を分離するので、ダイシングに起因した問題（つまり、水や切削くず等が光部品の積層体の内部に入り込む問題）を防止することができる。
【００５７】
また、ダイシングを利用して親基板接合体を分離する場合であっても、各光部品形成領域部の境界位置と光ファイバ配置用溝部との交差部分に形成した孔部に封止部材を充填してからダイシングを行うこととする。これにより、ダイシング時には、各光部品の光ファイバ配置用溝部の開口部は封止部材により塞がれている状態となっているので、ダイシングに起因した問題の発生を回避することができる。
【００５８】
また、複数の光部品形成領域部を半導体親基板に設定する際に、各光部品形成領域部間に緩衝帯を設け、半導体親基板と上部親基板を有する親基板接合体を例えばダイシングを利用して分離する工程では、各光部品形成領域部間の緩衝帯の中央ラインに沿って親基板接合体を切断することとする。これにより、ダイシング工程では、各光部品の光ファイバ配置用溝部の開口部は、緩衝帯として設定された半導体親基板部分で塞がれている状態となっているので、ダイシングに起因した問題の発生を防止することができる。
【００５９】
上記のような分離工程での半導体基板の加工部分の破損防止効果と、ダイシングに起因した問題の発生防止効果とによって、光部品の製造の歩留まりを大幅に向上させることが可能となる。
【００６０】
ところで、切り込み溝を介して光部品形成領域部が隣接している場合に、その切り込み溝を利用して破断により親基板接合体を分離分割する場合には、切り込み溝の両側又は一方側の光部品形成領域部内にひび割れが生じ、これに起因して光部品の歩留まり低下が懸念される場合がある。
【００６１】
これに対して、複数の光部品形成領域部を半導体親基板に設定する際に、各光部品形成領域部間に緩衝帯を設けるものにあっては、各光部品形成領域部間の緩衝帯の両側の光部品形成領域部境界線の位置に、少なくとも上部親基板の厚み方向に切り込み溝を形成し、然る後に、その切り込み溝よりも外側の各光部品形成領域部間の緩衝帯の中央ラインに沿って親基板接合体を例えばダイシング等により切断して半導体基板と上部基板の積層体毎に分離することとしている。このため、切り込み溝を利用した破断による親基板接合体の分離分割に起因した問題を防止することができる。
【００６２】
また、その分離分割の後工程で、切り込み溝を利用し当該切り込み溝よりも外側の余剰部分を破断により除去することとしているが、切り込み溝よりも外側の余剰部分にひび割れが生じても構わないことを考慮すると、切り込み溝よりも内側の光部品形成領域部内にひび割れが生じないように切り込み溝に基づいた破断除去により余剰部分を取り除くことは可能である。このことから、切り込み溝を利用して余剰部分を破断除去しても、光部品形成領域部内にひび割れが発生することを回避できる。よって、光部品の歩留まりをより一層向上させることができる。
【００６３】
光部品が光スイッチと成している場合には、半導体基板には例えばミラー等の非常に微細な加工部分を有する。この場合、従来のようにダイシング工程でその微細な加工部分が水を被ったり、該加工部分に切削くずが入り込むと、その微細な加工部分の破損の確率が高くなった。これに対して、この発明では、上記のように加工部分の破損を大幅に低減することができるため、光スイッチの製造の歩留まりを格段に向上させることができる。
【００６４】
半導体基板と上部基板を陽極接合するものにあっては、半導体基板と上部基板の接合強度を高めることができて、光部品の強度が高めることができる。これにより、光部品の耐久性の信頼性を向上させることができる。さらに、半導体基板の底面側に下部基板を接合することにより、より一層光部品の強度を高めることができる。
【００６５】
また、半導体基板と上部基板を接着剤を利用せずに接合することにより、接着剤に起因した問題（例えば、光スイッチの内部のミラーの配置空間に接着剤が入り込み、光の伝搬を妨げる等の問題）を防止することができる。
【図面の簡単な説明】
【図１】本発明に係る光部品の製造工程の第１実施形態例を説明するための図である。
【図２】第２実施形態例を説明するための図である。
【図３】第３実施形態例を説明するための図である。
【図４】その他の実施形態例を説明するための図である。
【図５】光部品である光スイッチの一例を説明するための図である。
【図６】光スイッチを構成するミラー駆動手段の一構成例を示すモデル図である。
【符号の説明】
１　光スイッチ
２　半導体基板
３　上部基板
４　下部基板
６　ミラー
８　光ファイバ配置用溝部
１０　光ファイバ
２０　半導体親基板
２１　上部親基板
２２　下部親基板
２４　親基板接合体
２５　切り込み溝
２８　切り残し部
３０　孔部
３１　封止部材
３３　余剰部分[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an optical component having an optical fiber.
[0002]
[Background Art]
An example of an optical switch which is a kind of optical component will be described with reference to a schematic exploded view shown in FIG. The optical switch 1 has a three-layer structure including a semiconductor substrate 2 made of, for example, silicon, an upper substrate 3 made of, for example, glass, and a lower substrate 4 made of, for example, glass.
[0003]
At a substantially central portion of the semiconductor substrate 2, a concave portion 5 and a mirror 6 are formed in the internal space of the concave portion 5. In FIG. 5A, the mirror 6 is disposed above the recess 5 for easy understanding, but the mirror 6 is actually housed inside the recess 5.
[0004]
The mirror 6 is formed so that its displacement can be controlled by mirror driving means 7 described later. The mirror 6 is formed by providing a reflecting film such as Au on the surface of a mirror base formed by finely processing the semiconductor substrate 2 by MEMS (Micro Electro Mechanical Systems) technology or the like.
[0005]
On the front surface side of the semiconductor substrate 2, four optical fiber arrangement grooves 8 are formed in a cross shape from the edge of the semiconductor substrate 2 to the concave portion 5. The tip of the optical fiber 10 is arranged in each of the optical fiber arrangement grooves 8. Further, a mirror driving means 7 for driving the mirror 6 to be displaced is formed in an area on the front surface side of the semiconductor substrate 2 other than the optical fiber arrangement groove 8.
[0006]
FIG. 6 shows an example of the mirror driving means 7. The mirror driving means 7 of this example is formed by finely processing the semiconductor substrate 2. The mirror driving means 7 includes a comb-shaped fixed electrode 12 fixed to the semiconductor substrate 2, a comb-shaped movable electrode 13 formed in a state of being floated from the semiconductor substrate 2 and meshing with the fixed electrode 12 via an interval, It is composed of beams 15 a and 15 b having both ends connected to the fixed portion 14 of the semiconductor substrate 2, and beams 16 connecting the beams 15 a and 15 b, the movable electrode 13 and the mirror 6. In the mirror driving means 7, when a voltage is applied between the fixed electrode 12 and the movable electrode 13 by an external voltage applying means (not shown), an electrostatic attractive force is applied between the fixed electrode 12 and the movable electrode 13 by the voltage application. Occurs. As a result, the beams 15a and 15b bend, the movable electrode 13 is drawn toward the fixed electrode 12, the beam 16 is displaced in the direction A in the drawing, and the mirror 6 is displaced.
[0007]
A concave portion 18 is formed in a portion of the upper substrate 3 of the optical switch 1 shown in FIG. 5 which faces the optical fiber arranging groove 8 and protrudes upward from the optical fiber arranging groove 8. The upper end of the optical fiber 10 is accommodated in the recess 18.
[0008]
In the optical switch 1, as shown in FIG. 5B, four optical fibers 10 (10 ₁ -10 ₄ In the case where the mirror 6 is located at the center of the cross-shaped arrangement of ₁ Light propagating through the optical fiber 10 ₁ And is reflected by the mirror 6. Then, the reflected light is transmitted to the optical fiber 10 adjacent to the reflection destination. ₄ Of the optical fiber 10 ₄ And is emitted to the outside. Similarly, the optical fiber 10 ₂ Light propagating through the optical fiber 10 ₂ Of the optical fiber 10 adjacent to the reflection destination ₃ Of the optical fiber 10 ₃ And is emitted to the outside.
[0009]
Also, as shown in FIG. 5C, the mirror 6 is turned into four optical fibers 10 (10 ₁ -10 ₄ If the optical fiber 10 is retracted from the center of the cross-shaped arrangement, for example, the optical fiber 10 ₁ Light propagating through the optical fiber 10 ₁ Of the optical fiber 10 ₁ Optical fiber 10 arranged opposite to the tip face of ₃ Of the optical fiber 10 ₃ And is emitted to the outside. Similarly, the optical fiber 10 ₂ Light propagating through the optical fiber 10 ₂ Of the optical fiber 10 ₂ Optical fiber 10 arranged opposite to the tip face of ₄ Of the optical fiber 10 ₄ And is emitted to the outside.
[0010]
As described above, in the optical switch 1, the four optical fibers 10 (10 ₁ -10 ₄ ) Can be switched.
[0011]
Such an optical switch 1 is manufactured, for example, as follows. The semiconductor parent substrate of, for example, silicon and the lower parent substrate of, for example, glass are anodically bonded. Thereafter, a plurality of optical switch forming regions are defined in a matrix on the surface of the semiconductor mother substrate, and the concave portion 5, the mirror 6, the mirror driving means 7, and the optical fiber arranging portion are formed in each of the optical switch forming regions by using fine processing. A groove 8 is formed. Then, the joined body composed of the semiconductor parent substrate and the lower parent substrate is cut at the position of the boundary line of the optical switch formation region, and separated for each optical switch formation region. Note that a dicing device or the like is used for cutting the joined body.
[0012]
Thereafter, the distal end of the optical fiber 10 is arranged in the optical fiber arrangement groove 8 of the semiconductor substrate 2 in each of the separated optical switch formation regions. Thereafter, the upper substrate 3 in which the concave portion 18 is formed in advance by etching is fixed to the upper portion of the semiconductor substrate 2 using an adhesive.
[0013]
[Patent Document 1]
JP-A-11-119123
[0014]
[Problems to be solved by the invention]
However, in the manufacturing process of the optical switch 1, it is necessary to fix the upper substrate 3 one by one on the upper side of the semiconductor substrate 2 in each optical switch forming region portion separated from the joined body of the semiconductor parent substrate and the lower parent substrate. Was. As can be seen from the fact that the diameter of the optical fiber 10 that is usually used is as fine as 125 μm, the separated semiconductor substrate 2 is fine, and fixing the upper substrate 3 to this fine semiconductor substrate 2 takes time. It takes time and trouble, and the workability is very poor.
[0015]
Further, since the semiconductor substrate 2 and the upper substrate 3 are fixed with an adhesive, the bonding strength between the semiconductor substrate 2 and the upper substrate 3 is not satisfactory. Further, an adhesive for connecting the semiconductor substrate 2 and the upper substrate 3 may enter the recess 5 of the semiconductor substrate 2 and cause a problem that the adhesive hinders the propagation of light.
[0016]
Furthermore, in order to dice the joined body of the semiconductor parent substrate and the lower parent substrate in a state where the upper surface of the semiconductor parent substrate is almost unprotected, the semiconductor parent substrate was covered with water for cooling of a dicing cutter and finely processed. There is a case where a problem that the mirror driving means 7 or the like is damaged may occur. Further, cutting debris adheres to the upper surface of the semiconductor substrate 2, which causes a problem that the bonding strength between the semiconductor substrate 2 and the upper substrate 3 becomes poor. Such various problems occur, and reduce the yield of the optical switch 1.
[0017]
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing an optical component capable of improving the manufacturing efficiency of the optical component and improving the yield of the optical component. is there.
[0018]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides means for solving the above problems with the following configuration. That is, one configuration of the present invention has at least a laminate in which an upper substrate is laminated on a surface of a semiconductor substrate in which an optical fiber arrangement groove is formed, and the optical fiber arrangement groove is provided on a side surface of the laminate. An opening communicating with the optical component is provided, a method for manufacturing an optical component mounted by inserting the tip of the optical fiber from the opening into the optical fiber disposing groove,
A step of setting a plurality of optical component forming region portions on a semiconductor parent substrate and forming the optical fiber arrangement groove portion through a boundary surface of an adjacent optical component forming region portion,
A step of joining an upper mother board to the surface of the semiconductor mother board to form a mother board joined body,
Forming a notch in at least the thickness direction of the upper parent substrate in accordance with the boundary position of the optical component forming region,
The semiconductor substrate and the upper substrate, in which the uncut portion of the upper parent substrate and the semiconductor parent substrate are broken using the cut grooves to separate the mother substrate bonded body and the openings of the optical fiber arrangement grooves are formed on the side surfaces. A step of producing a laminate of
It is characterized by having.
[0019]
Further, another configuration of the present invention includes at least a laminate in which an upper substrate is laminated on a surface of a semiconductor substrate in which an optical fiber arrangement groove is formed, and the optical fiber is provided on a side surface of the laminate. An opening communicating with the arrangement groove is provided, and a method for manufacturing an optical component in which the tip of the optical fiber is inserted into the optical fiber arrangement groove and mounted from the opening.
A step of setting a plurality of optical component forming region portions on a semiconductor parent substrate and forming the optical fiber arrangement groove portion through a boundary surface of an adjacent optical component forming region portion,
A step of joining an upper mother board to the surface of the semiconductor mother board to form a mother board joined body,
At a portion where the boundary position of the optical component formation region and the optical fiber arrangement groove intersect, a hole reaching the optical fiber arrangement groove from the surface side of the parent substrate joint is formed, or the parent substrate joint is formed. Forming a hole penetrating from the front side to the bottom side,
A step of filling a sealing member in the hole portion of the mother substrate joint,
Thereafter, cutting the joined mother substrate along the boundary surface of the optical component forming region to produce a laminate of the semiconductor substrate and the upper substrate,
Removing the sealing member from the laminate and penetrating the opening of the optical fiber arrangement groove of the laminate;
It is characterized by having.
[0020]
Further, another configuration of the present invention has at least a laminated body in which an upper substrate is laminated on a surface of a semiconductor substrate in which an optical fiber arranging groove is formed, and the side surface of the laminated body has the optical fiber. An opening communicating with the fiber arrangement groove is provided, and a method for manufacturing an optical component in which the tip of the optical fiber is inserted into the optical fiber arrangement groove from the opening and mounted,
A step of setting a plurality of optical component forming regions on the semiconductor parent substrate with a buffer band therebetween, and forming the optical fiber arrangement grooves in each optical component forming region on the surface of the semiconductor parent substrate,
Bonding the upper parent substrate at the position of the buffer band between each optical component forming region on the surface of the semiconductor parent substrate and at a predetermined bonding position in each optical component forming region to form a parent substrate bonded body;
A step of forming a notch groove at least in the thickness direction of the upper parent substrate at the positions of the optical component forming region part boundary lines on both sides of the buffer band between each optical component forming region part,
A step of cutting the parent substrate joined body along the central line of the buffer band between the respective optical component forming regions to separate the semiconductor substrate and the upper substrate into stacked bodies,
Utilizing the cut groove, the uncut portion of the upper substrate and the semiconductor substrate are broken to remove a surplus portion outside the cut groove, and an optical fiber arrangement groove portion is formed on a side surface of the stacked body of the semiconductor substrate and the upper substrate. Forming an opening of
It is characterized by having.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
In the first embodiment, an example of an optical component manufacturing process will be described using the optical switch 1 shown in FIG. 5 as an example. In the description of the first embodiment, the description of the configuration of the optical switch shown in FIG. 5 has been described above, and a duplicate description thereof will be omitted.
[0023]
First, a semiconductor parent substrate 20 of, for example, silicon as shown in FIG. 1A is prepared, and a plurality of optical switch formation region portions (optical component formation region portions) H are defined in a matrix on the surface of the semiconductor parent substrate 20. . Then, a concave portion 5, a mirror 6, a mirror driving means 7, and an optical fiber arranging groove 8 are formed in each optical switch forming region H by using a fine processing technique such as a MEMS technique. In the first embodiment, the optical fiber arranging groove 8 of each optical switch forming region H is formed so that the optical fiber arranging groove 8 of the adjacent optical switch forming region H passes through the boundary surface L of the optical switch forming region H. Communication groove 8.
[0024]
Next, as shown in FIG. 1B, an upper parent substrate 21 made of, for example, glass is provided on the front surface side of the semiconductor parent substrate 20 after the fine processing, and a lower parent substrate 22 made of, for example, glass is provided on the rear surface side. Are arranged, the semiconductor parent substrate 20, the upper parent substrate 21, and the lower parent substrate 22 are integrated by an anodic bonding method to form a parent substrate joined body 24.
[0025]
A concave portion 18 is formed in the upper parent substrate 21 in advance in correspondence with the formation position of the optical fiber arranging groove 8 of the semiconductor parent substrate 20. The position where the groove 8 is formed and the position where the concave portion 18 of the upper mother substrate 21 is formed are aligned.
[0026]
Thereafter, as shown in a partially enlarged cross-sectional view of the parent-substrate joined body 24 in FIG. Cut grooves (half cuts) 25 are formed on both sides using, for example, a dicing apparatus.
[0027]
Thereafter, the uncut portion 28 of the mother-substrate assembly 24 thinned by forming the cut groove 25 is broken using a hand or a dedicated jig, and separated into each optical switch formation region H. In this way, a plurality of laminates 26 composed of the lower substrate 4, the semiconductor substrate 2, and the upper substrate 3 constituting the optical switch 1 as shown in FIG. it can. The opening 27 of the optical fiber arrangement groove 8 is opened on the side surface of the laminated body 26 after the separation. Since dicing is not used in the separation and division process of the mother substrate bonded body 24, various problems caused by dicing (for example, a problem that water for cooling dicing or cutting waste enters the inside of the stacked body 26 from the opening 27). ) Can be avoided.
[0028]
Thereafter, the tip of the optical fiber 10 is inserted and fixed in the opening 27 of the optical fiber arrangement groove 8 formed on the side surface of the laminate 26, and the optical switch 1 is completed.
[0029]
Hereinafter, a second embodiment will be described. In the description of the second embodiment, the same components as those of the first embodiment are denoted by the same reference numerals, and the description of the common portions will not be repeated.
[0030]
In the second embodiment, the upper parent substrate 21 is disposed on the front surface of the semiconductor parent substrate 20 after the microfabrication, and the lower parent substrate 22 is disposed on the rear surface. The process is characterized by:
[0031]
In other words, in the parent substrate bonded body 24, at a portion where the boundary surface L between the optical switch forming regions H and the optical fiber arrangement groove 8 intersect (for example, see a circle M in FIG. 2A), As shown in the enlarged cross-sectional view of FIG. 2B, a hole 30 reaching the optical fiber arrangement groove 8 from the surface is formed by dry etching such as RIE (Reactive Ion Etching).
[0032]
Thereafter, the sealing member 31 is filled in the hole 30. Since the sealing member 31 needs to be removed in a later step as described later, the constituent material of the sealing member 31 is selected in consideration of easy removal by a dry method. For example, an example of the sealing member 31 is an ultraviolet curable resin. In the case of using an ultraviolet-curable resin, for example, the paste-like ultraviolet-curable resin is filled in the inside of the hole 30, and then the ultraviolet-ray is irradiated to cure the ultraviolet-curable resin.
[0033]
After filling the hole 30 with the sealing member 31, for example, using a dicing device, the mother board joined body 24 is cut at the position of the boundary surface L between the respective optical switch forming area parts H, and cut. To separate. At this time, since the opening 27 of the optical fiber arrangement groove 8 of each laminated body 26 is closed by the sealing member 31, water, cutting waste, etc. caused by the dicing are formed inside the laminated body 26 of the optical switch 1. Is prevented from entering.
[0034]
Thereafter, the sealing member 31 is ashed (ashed) by dry etching such as oxygen plasma etching, and the sealing member 31 is removed from each of the stacked bodies 26. As a result, the openings 27 of the optical fiber arranging grooves 8 in each of the laminates 26 penetrate. Then, similarly to the first embodiment, the distal end of the optical fiber 10 is inserted into the inside of the laminated body 26 from the opening 27 and is fixed in the groove 8 for arranging the optical fiber. Thus, the optical switch 1 can be manufactured.
[0035]
Hereinafter, a third embodiment will be described. In the description of the third embodiment, the same components as those of the first and second embodiments are denoted by the same reference numerals, and the description of the common portions will not be repeated.
[0036]
In the third embodiment, first, a semiconductor parent substrate 20 as shown in FIG. 3A is prepared, and a plurality of optical switch forming region portions H are set in a matrix on the surface of the semiconductor parent substrate 20. . At this time, a gap S, which is a buffer band, is provided between the optical switch forming region portions H.
[0037]
Then, the concave portion 5, the mirror 6, the mirror driving means 7, and the optical fiber arranging groove 8 are formed in each optical switch forming region H by using a fine processing technology such as the MEMS technology. In the third embodiment, the optical fiber arranging groove 8 extends from the edge (boundary line) of each optical switch forming region H toward the center of each optical switch forming region H. It is formed so as not to protrude into the gap S outside the optical switch forming region H.
[0038]
Next, the semiconductor mother board 20, the upper mother board 21, and the lower mother board 22 are integrated by an anodic bonding method to form a mother board joined body 24. At this time, on the surface of the semiconductor parent substrate 20, the position of the gap S between the optical switch formation regions H and the predetermined bonding position in each optical switch formation region H are anodically bonded to the upper parent substrate 21. .
[0039]
Thereafter, as shown in a partially enlarged cross-sectional view of the parent-substrate assembly 24 in FIG. 3B, along the optical switch forming region boundary lines L on both sides of the gap S between the optical switch forming regions H. Then, cut grooves (half cuts) 25 are formed on both the front and back surfaces of the mother-board bonded body 24 using, for example, a dicing apparatus.
[0040]
Thereafter, the bonded mother substrate assembly 24 is cut by a dicing device or the like along the center line T of the gap S between the optical switch formation region portions H, and separated into each optical switch formation region portion H. As a result, a plurality of stacked bodies 26 each including the semiconductor substrate 2, the upper substrate 3, and the lower substrate 4 as shown in the cross-sectional view of FIG. In this dicing step, the opening of the optical fiber arranging groove 8 is closed by the semiconductor mother substrate portion Q located in the gap S between the optical switch forming regions H. It is possible to prevent cooling water, cutting waste, and the like caused by dicing from entering the dies.
[0041]
Thereafter, in each of the stacked bodies 26, the uncut portion 28 of the stacked body 26 is cut using the cut groove 25 using a hand or a special jig to remove the excess portion 33 outside the cut groove 25. I do. As a result, as shown in FIG. 3D, an opening 27 of the optical fiber arrangement groove 8 is formed on the side surface of the laminate 26. Since dicing is not used in the step of forming the opening 27, it is possible to avoid problems caused by dicing.
[0042]
After the step of forming the opening 27, the distal end of the optical fiber 10 is inserted into the groove 8 for arranging the optical fiber from the opening 27 on the side surface of the laminated body 26 and fixed, whereby the optical switch 1 is completed.
[0043]
Note that the present invention is not limited to the first to third embodiments, but can adopt various embodiments. For example, the cross-sectional shape of the optical fiber disposing groove 8 is V-shaped in each of the first to third embodiments, but in a form in which the distal end of the optical fiber 10 can be disposed and positioned. For example, the shape may be a semicircle or a U-shape.
[0044]
In the optical switch 1 illustrated in each of the first to third embodiments, four optical fibers 10 are arranged. Therefore, four optical fiber arrangement grooves 8 are formed in the semiconductor substrate 2. Was. However, for example, as shown in FIG. 4A, a configuration may be adopted in which three optical fiber arranging grooves 8 are provided in the semiconductor substrate 2 and the optical fibers 10A, 10B, and 10C are arranged. In this case, when the mirror 6 is disposed at the center of the optical fibers 10A, 10B, and 10C, for example, light that has propagated through the optical fiber 10A is emitted from the distal end surface of the optical fiber 10A and reflected by the mirror 6. Then, the light enters the optical fiber 10B of the reflection destination, and is emitted outside through the optical fiber 10B. Also, as shown in FIG. 4B, when the mirror 6 is retracted from the center of the optical fibers 10A, 10B, 10C by the mirror driving means 7, the light propagating through the optical fiber 10A is The light exits from the distal end surface of 10A, enters the optical fiber 10C whose distal end surface faces the optical fiber 10A, and exits through the optical fiber 10C.
[0045]
When the optical switch 1 having such a configuration is manufactured by the manufacturing process of the first embodiment or the second embodiment, for example, as shown in FIG. The optical fiber arranging groove 8 is formed so as to penetrate the boundary L between the adjacent optical switch forming regions H.
[0046]
Furthermore, in each of the first and third embodiments, the cut grooves 25 are formed on both the front surface and the back surface of the mother substrate joint 24. However, for example, depending on the thickness of the mother substrate joint 24, the mother substrate joint may be formed. The cut groove 25 may be provided on only one of the front surface and the back surface of the body 24.
[0047]
Furthermore, in each of the first and third embodiments, the cross-sectional shape of the cut groove 25 is V-shaped. However, if the mother board assembly 24 can be broken based on the cut groove 25, The cross-sectional shape may be an arc shape, a U shape, or a square shape.
[0048]
Furthermore, in each of the first and third embodiments, after forming the parent substrate joined body 24 of the semiconductor parent substrate 20, the upper parent substrate 21, and the lower parent substrate 22, the cut groove 25 is formed in the parent substrate joined body 24. However, before joining the upper parent substrate 21 and the lower parent substrate 22 to the semiconductor parent substrate 20, the notch groove 25 is formed in one or both of the upper parent substrate 21 and the lower parent substrate 22 in advance. Is also good. In this case, it is necessary to accurately position the semiconductor parent substrate 20 with the upper parent substrate 21 and the lower parent substrate 22.
[0049]
Furthermore, in the second embodiment, the hole 30 for filling the sealing member 31 is a hole extending from the surface side of the mother board joint body 24 to the optical fiber arrangement groove 8. As shown by the dotted line in FIG. 2B, a through-hole may be provided from the front surface side to the rear surface side of the mother substrate joined body 24.
[0050]
Further, in the second embodiment, the hole 30 is formed at a portion where the boundary surface L of the optical switch forming region H intersects with the groove 8 for arranging optical fibers after forming the mother board joined body 24. However, the holes 30 may be formed in the upper mother substrate 21 in advance before forming the mother board assembly 24.
[0051]
Further, in each of the first to third embodiments, glass is exemplified as the upper parent substrate 21 and the lower parent substrate 22, but an insulating material other than glass or silicon may be used. In the case where silicon is used, anodic bonding can be achieved by interposing a glass layer as an adhesive layer when the semiconductor parent substrate 20 is bonded to the upper parent substrate 21 and the lower parent substrate 22. Thereby, the semiconductor parent substrate 20, which is a silicon substrate, the upper parent substrate 21, and the lower parent substrate 22 can be firmly joined. When an insulating material other than glass is used as the material of the upper parent substrate 21 and the lower parent substrate 22, another bonding method is appropriately selected in consideration of the bonding strength.
[0052]
Furthermore, although a silicon substrate is illustrated as the semiconductor substrate 2, another semiconductor material such as germanium may be used.
[0053]
Further, in each of the first to third embodiments, the optical switch 1 has the three-layer structure of the semiconductor substrate, the upper substrate, and the lower substrate, but the semiconductor substrate is thick and has sufficient strength. In this case, the lower substrate may be omitted, or a multilayer structure having four or more layers may be used. Further, in each of the first to third embodiments, the optical switch 1 has been described as an example. However, in the manufacturing method of the present invention, the upper substrate is laminated on the surface of the semiconductor substrate in which the optical fiber arrangement groove is formed. An optical component having at least a laminated body, and having a configuration in which the tip of the optical fiber is inserted into the groove for optical fiber placement and mounted from the opening formed in the side surface of the laminated body. The present invention can be applied to an optical component manufacturing process.
[0054]
【The invention's effect】
Conventionally, after separating a semiconductor parent substrate for each optical component forming region and cutting out a semiconductor substrate of the optical component, an upper substrate is fixed on the fine semiconductor substrate of each optical component. On the other hand, in the manufacturing method of the present invention, the semiconductor mother board and the upper mother board are joined to form a mother board joint, and then the mother board joint is separated for each optical component forming region. And Since the semiconductor parent substrate and the upper parent substrate are larger in size than the semiconductor substrate and the upper substrate of the optical component, the workability can be improved as compared with the related art. Further, in the present invention, as described above, the semiconductor substrate and the upper substrate of the optical component are joined in the state of the parent substrate. In other words, the upper substrate is collectively joined to the semiconductor substrates of the plurality of optical components. Thereby, manufacturing efficiency can be improved. This, combined with the above-described improvement in workability, can greatly increase the manufacturing efficiency of optical components.
[0055]
Further, after performing fine processing on the semiconductor parent substrate, the upper parent substrate is joined to the upper side of the semiconductor parent substrate, and then separated into individual optical components. It is in a state of being protected by the upper parent board. This makes it possible to almost eliminate damage to the processed portion of the semiconductor substrate in the separation step.
[0056]
Furthermore, in the configuration in which the cut-groove formed in the bonded mother substrate is used to separate the bonded mother substrate, the bonded mother substrate is separated without using dicing. (That is, the problem that water, cutting waste, and the like enter the inside of the laminate of optical components) can be prevented.
[0057]
Also, even in the case of separating the bonded mother board using dicing, the sealing member is filled into the hole formed at the intersection between the boundary position of each optical component forming region and the groove for placing the optical fiber. After that, dicing is performed. Thereby, at the time of dicing, the opening of the optical fiber arrangement groove of each optical component is in a state of being closed by the sealing member, so that it is possible to avoid the problem caused by dicing.
[0058]
Further, when setting a plurality of optical component forming region portions to the semiconductor parent substrate, a buffer band is provided between each optical component forming region portion, and a parent substrate joined body having a semiconductor parent substrate and an upper parent substrate is used by, for example, dicing. In the separating step, the bonded mother board is cut along the center line of the buffer band between the optical component forming regions. Accordingly, in the dicing step, the opening of the optical fiber arranging groove of each optical component is in a state of being closed by the semiconductor parent substrate portion set as a buffer band, so that the problem caused by dicing is reduced. Occurrence can be prevented.
[0059]
The effect of preventing damage to the processed portion of the semiconductor substrate in the above-described separation step and the effect of preventing the occurrence of problems due to dicing can greatly improve the production yield of optical components.
[0060]
By the way, when the optical component forming region portion is adjacent via the cut groove, and when the parent-substrate assembly is separated and divided by breaking using the cut groove, the light on both sides or one side of the cut groove is used. Cracks are generated in the component forming region, and there is a possibility that the yield of optical components may be reduced due to the cracks.
[0061]
On the other hand, when a plurality of optical component forming regions are provided on the semiconductor parent substrate, a buffer band is provided between the optical component forming regions. A cut groove is formed at least in the thickness direction of the upper parent substrate at the positions of the optical component forming region portion boundary lines on both sides of the optical component forming region portion, and thereafter, a buffer band between each optical component forming region portion outside the cut groove is formed. The bonded mother substrate is cut along the center line by, for example, dicing or the like to separate the stacked body of the semiconductor substrate and the upper substrate. For this reason, it is possible to prevent a problem caused by separation and division of the mother-substrate joined body due to breakage using the cut grooves.
[0062]
Further, in the post-process of the separation and division, a surplus portion outside the notch groove is to be removed by breaking using the notch groove, but a crack may occur in a surplus portion outside the notch groove. Taking this into consideration, it is possible to remove the surplus portion by removing the cut based on the cut groove so as not to cause cracks in the optical component forming region inside the cut groove. For this reason, even if the surplus portion is broken and removed by using the cut groove, it is possible to avoid the occurrence of cracks in the optical component forming region. Therefore, the yield of optical components can be further improved.
[0063]
When the optical component is an optical switch, the semiconductor substrate has a very fine processed portion such as a mirror. In this case, as in the conventional case, if the finely processed portion is covered with water in the dicing process, or if cutting waste enters the processed portion, the probability of damage to the finely processed portion increases. On the other hand, according to the present invention, as described above, breakage of the processed portion can be significantly reduced, and thus the yield of optical switch production can be significantly improved.
[0064]
In the anodic bonding of the semiconductor substrate and the upper substrate, the bonding strength between the semiconductor substrate and the upper substrate can be increased, and the strength of the optical component can be increased. Thereby, the reliability of the durability of the optical component can be improved. Further, by bonding the lower substrate to the bottom surface side of the semiconductor substrate, the strength of the optical component can be further increased.
[0065]
In addition, by bonding the semiconductor substrate and the upper substrate without using an adhesive, a problem caused by the adhesive (for example, the adhesive may enter a space where a mirror is arranged inside the optical switch and hinder light propagation, etc.). Problem) can be prevented.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining a first embodiment of an optical component manufacturing process according to the present invention.
FIG. 2 is a diagram for explaining a second embodiment.
FIG. 3 is a diagram for explaining a third embodiment.
FIG. 4 is a diagram for explaining another embodiment.
FIG. 5 is a diagram illustrating an example of an optical switch that is an optical component.
FIG. 6 is a model diagram illustrating a configuration example of a mirror driving unit that forms the optical switch.
[Explanation of symbols]
1 Optical switch
2 Semiconductor substrate
3 Upper substrate
4 Lower substrate
6 mirror
8 Optical fiber groove
10 Optical fiber
20 Semiconductor mother board
21 Upper parent board
22 Lower parent board
24 Mother board bonded body
25 Cut groove
28 Uncut part
30 holes
31 Sealing member
33 Surplus part

Claims

An optical fiber arranging groove is formed on the surface of the semiconductor substrate, and the upper substrate is laminated at least on a surface of the semiconductor substrate, and an opening communicating with the optical fiber arranging groove is provided on a side surface of the laminated body. A method for manufacturing an optical component in which the tip of an optical fiber is inserted into an optical fiber arrangement groove from an opening and mounted,
A step of setting a plurality of optical component forming region portions in the semiconductor parent substrate, and forming the optical fiber arrangement groove portion in the semiconductor parent substrate through a boundary surface of the adjacent optical component forming region portion,
A step of joining an upper mother board to the surface of the semiconductor mother board to form a mother board joined body,
Forming a notch in at least the thickness direction of the upper parent substrate in accordance with the boundary position of the optical component forming region,
The semiconductor substrate and the upper substrate, in which the uncut portion of the upper parent substrate and the semiconductor parent substrate are broken using the cut grooves to separate the mother substrate bonded body and the openings of the optical fiber arrangement grooves are formed on the side surfaces. A method of manufacturing an optical component.

An optical fiber arranging groove is formed on the surface of the semiconductor substrate, and the upper substrate is laminated at least on a surface of the semiconductor substrate, and an opening communicating with the optical fiber arranging groove is provided on a side surface of the laminated body. A method for manufacturing an optical component in which the tip of an optical fiber is inserted into an optical fiber arrangement groove from an opening and mounted,
A step of setting a plurality of optical component forming region portions in the semiconductor parent substrate, and forming the optical fiber arrangement groove portion in the semiconductor parent substrate through a boundary surface of the adjacent optical component forming region portion,
A step of joining an upper mother board to the surface of the semiconductor mother board to form a mother board joined body,
At a portion where the boundary position of the optical component formation region and the optical fiber arrangement groove intersect, a hole reaching the optical fiber arrangement groove from the surface side of the parent substrate joint is formed, or the parent substrate joint is formed. Forming a hole penetrating from the front side to the bottom side,
A step of filling a sealing member in the hole portion of the mother substrate joint,
Thereafter, cutting the joined mother substrate along the boundary surface of the optical component forming region to produce a laminate of the semiconductor substrate and the upper substrate,
Removing the sealing member from the laminate and penetrating the opening of the optical fiber arrangement groove of the laminate.

Instead of providing the step of forming the hole filled with the sealing member after the step of forming the mother board joint, before forming the mother board joint, at least the upper mother board has an optical component forming area. 3. The method of manufacturing an optical component according to claim 2, wherein a hole penetrating from the front surface side to the bottom surface side is formed at a portion where the boundary position of the portion intersects the optical fiber arrangement groove.

An optical fiber arranging groove is formed on the surface of the semiconductor substrate, and the upper substrate is laminated at least on a surface of the semiconductor substrate, and an opening communicating with the optical fiber arranging groove is provided on a side surface of the laminated body. A method for manufacturing an optical component in which the tip of an optical fiber is inserted into an optical fiber arrangement groove from an opening and mounted,
A step of setting a plurality of optical component forming regions on the semiconductor parent substrate with a buffer band therebetween, and forming the optical fiber arrangement grooves in each optical component forming region on the surface of the semiconductor parent substrate,
Bonding the upper parent substrate at the position of the buffer band between each optical component forming region on the surface of the semiconductor parent substrate and at a predetermined bonding position in each optical component forming region to form a parent substrate bonded body;
A step of forming a notch groove at least in the thickness direction of the upper parent substrate at the positions of the optical component forming region part boundary lines on both sides of the buffer band between each optical component forming region part,
A step of cutting the parent substrate joined body along the central line of the buffer band between the respective optical component forming regions to separate the semiconductor substrate and the upper substrate into stacked bodies,
Utilizing the cut groove, the uncut portion of the upper substrate and the semiconductor substrate are broken to remove a surplus portion outside the cut groove, and an optical fiber arrangement groove portion is formed on a side surface of the stacked body of the semiconductor substrate and the upper substrate. Forming an opening of the optical component.

The optical component comprises an optical switch, and at least three grooves for arranging optical fibers are formed on a semiconductor substrate of the optical switch, and optical fibers respectively arranged in the grooves for arranging optical fibers are formed on the semiconductor substrate. 5. The method for manufacturing an optical component according to claim 1, wherein the mirror for switching the optical connection is arranged so as to be displaceable.

On the semiconductor substrate, four optical fiber arranging grooves are arranged and formed in a cross shape around the mirror arranging region, and an optical switch as an optical component is manufactured. When the mirror is retracted from the center of the four optical fiber arranging grooves, the optical fibers arranged in each of the optical fiber arranging grooves have optical fibers whose tip surfaces face each other. The optical fiber is optically connected to an optical fiber adjacent to a mirror to which light is reflected by the mirror when the mirror enters the center of the four optical fiber arrangement grooves. Item 6. The method for manufacturing an optical component according to Item 5.

7. The semiconductor device according to claim 1, wherein the semiconductor substrate is formed of a silicon substrate, the upper substrate is formed of a glass substrate, and the silicon substrate and the glass substrate are bonded by an anodic bonding method. 3. The method for producing an optical component according to claim 1.

The method according to any one of claims 1 to 7, wherein a lower substrate is bonded to a bottom surface of the semiconductor substrate.