JP2005066805A - Drive device and optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small and highly yielding drive device and optical device. <P>SOLUTION: This drive device is arranged in a first layer and a second layer overlapped on a first layer through an intermediate and has a drive part having a fixed electrode and a movable electrode arranged in the first layer and meshing with each other, a movable plate arranged in the second layer and a flexible supporting part connected to the movable electrode and the movable plate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a driving apparatus and an optical device, and more particularly to a driving apparatus and an optical device using a microelectromechanical system.

  In recent years, optical devices such as an optical switch or an optical shutter using a driving device based on a micro-electro-mechanical system (MEMS) have been put into practical use.

  As shown in FIG. 7A, conventionally, fixed electrodes 51 a and 51 b fixed to a substrate 54, a movable electrode 52 disposed between the fixed electrodes 51 a and 51 b, and a support unit that supports the movable electrode 52. And a thin film type comb-tooth resonator having 53 (see, for example, Patent Document 1). The comb teeth of the fixed electrodes 51a and 51b and the movable electrode 52 are meshed with each other. By generating a potential difference between the two electrodes, the movable electrode 52 is driven while being supported by the flexible support portion 53.

As shown in FIG. 7B, conventionally, an optical switch formed in an active layer 57 disposed on a substrate 54 via an insulating film 56 is known (for example, see Patent Document 2). All members constituting the optical switch such as the optical fiber 55, the mirror, and the electrode pad are disposed on the substrate 54.
US Pat. No. 502,534 US Pat. No. 6,315,462

  In order to actually drive the thin film comb resonator and the optical switch, as shown in FIG. 7C, metal thin wires (bonding wires) 58a and 58b are provided between the other circuit board 59 and the electrode pads. It is necessary to connect and apply a voltage between the comb electrodes. However, the bonding wires 58a and 58b may be cut when the fiber 55 is attached, causing a decrease in yield. Further, in a multi-channel or matrix type optical device in which a large number of driving devices are arranged on one substrate 54, it is necessary to consider the electrode arrangement so that the bonding wires do not cross and contact each other, and the structure is complicated. Become. Furthermore, it takes a process time to bond the bonding wires one by one. Furthermore, since all the constituent members of the thin-film comb resonator and the optical switch are arranged on the same plane, there is a limit to downsizing and area reduction.

  The present invention has been made to solve the problems of the related art, and an object thereof is to provide a small-sized and high-yield driving apparatus and optical device.

  According to a first aspect of the present invention, there is provided a driving device disposed in a first layer and a second layer superimposed on the first layer via an intermediate layer, wherein the driving device is the first layer. A drive unit having a fixed electrode and a movable electrode that are meshed with each other, a movable plate disposed in the second layer, and a flexible support unit connected to the movable electrode and the movable plate. It is summarized as having.

  A second feature of the present invention is an optical device disposed in a first layer and a second layer superimposed on the first layer via an intermediate layer, the optical device comprising: A drive unit having a fixed electrode and a movable electrode that are meshed with each other, a movable plate disposed in the second layer, and a flexible support unit connected to the movable electrode and the movable plate. And a mirror disposed in the second layer and a pair of optical waveguides disposed in the second layer and intersecting each other in the vicinity of the mirror, and the mirror is optically driven by driving the drive unit. The gist is to switch the optical path of light propagating in the waveguide.

  According to the present invention, a small-sized and high-yield driving device and an optical device can be provided.

  Embodiments of the present invention will be described below with reference to the drawings. In the description of the drawings, the same or similar parts are denoted by the same or similar reference numerals.

  As shown in FIG. 1A, the optical switch according to the first embodiment of the present invention includes driving devices 1 to 3, a mirror 4 connected to a movable part of the driving devices 1 to 3, and a mirror 4 And optical waveguides (for example, optical fibers) 5a to 5d that intersect with each other. The driving device includes a driving unit 1 having a fixed electrode 7 and a movable electrode 6 disposed to face each other, a movable plate 2 connected to the movable electrode 6, and a flexible electrode connected to the movable electrode 6 and the movable plate 2. Support part 3. The mirror 4 is connected to one end of the movable plate 2. The movable plate 2 is disposed so as to overlap with a part of the drive unit 1 and the support unit 3. The fixed electrode 7 and the movable electrode 6 each have a plurality of comb teeth plates that mesh with each other. The surfaces of the comb teeth plates are arranged in parallel to the drive direction of the drive unit 1. That is, the drive unit 1 has an electrostatic comb structure.

  FIG. 1B shows a cross-sectional view of the optical switch shown in FIG. The optical switch includes a first layer (hereinafter referred to as “lower layer”) 11 and a second layer (hereinafter referred to as “upper layer”) superimposed on the lower layer 11 via an intermediate layer (for example, an oxide film) 12. ) 13 in a silicon-on-insulator substrate (SOI substrate). Specifically, the drive unit 1 is disposed in the lower layer 11. The movable plate 2 is disposed in the upper layer 13. The support part 3 is disposed in the lower layer 11. The movable plate 2 is connected to the drive unit 1 and the support unit 3 through the intermediate layer 12. Further, the fixed electrode 7 disposed in the lower layer 11 is electrically connected to the circuit pattern 15 on the printed circuit board 14 via the solder bump 16a. A voltage is applied to the fixed electrode 7 through the solder bump 16a. Similarly, a part of the support part 3 is electrically connected to the circuit pattern 15 on the printed circuit board 14 via the solder bumps 16b. A voltage is applied to the movable electrode 6 via the solder bump 16b and the support portion 3.

  In the case of the optical device shown in FIG. 1B, the upper layer 13 has a thickness of several tens of μm to several hundreds of μm, and the lower layer 11 has a thickness of 100 to 300 μm. However, the lower layer 11 in the region where the driving unit 1 is formed may be thinned in advance by wet etching and then thinned by dry reactive ion etching (DRIE). Here, the above thickness was realized by etching both surfaces of the SOI substrate. However, an SOI substrate may be formed by bonding each of two different substrates after etching. In applications other than optical devices, the thickness of the upper layer 13 may be about several μm to 10 μm. Moreover, you may create a board | substrate using the polymer, metal, etc. which were created by LIGA etc.

  FIG. 2 is a perspective view showing the optical switch shown in FIG. In FIG. 2, the movable plate 2, the mirror 4, and the latch-type movable plate 17 disposed in the upper layer 13, and the fixed electrode 7, the movable electrode 6, and the support portion 3 disposed in the lower layer 11 are vertically separated. Shown in the state. The movable plate 2 is disposed above the support portion 3 and connected to the support portion 3 via the intermediate layer 12a. The latch-type movable plate 17 is disposed above the movable electrode 6 and the fixed electrode 7, and is connected to the movable electrode 6 through the intermediate layer 12b. In the lower layer 11, the fixed electrode 7 is electrically insulated from the support portion 3 and the movable electrode 6. Of course, the latching movable plate 17 is disposed above the fixed electrode 7, but is not connected. Therefore, electrical insulation between the fixed electrode 7 and the movable electrode 6 is ensured.

  The operation of the optical switch shown in FIG. A predetermined potential difference is applied between the fixed electrode 7 and the movable electrode 6 from the outside via the circuit pattern 15 and the solder bumps 16a and 16b. Then, electrostatic attractive force acts on the fixed electrode 7 and the movable electrode 6 in the direction attracting each other. Since the fixed electrode 7 is fixed to the printed circuit board 14, the support portion 3 is bent and the movable electrode 6 is driven to the fixed electrode 7 side. Thereby, the movable plate 2 and the mirror 4 connected to the movable electrode 6 are also driven to the fixed electrode 7 side, and the light propagating in the optical waveguides 5a to 5d is not reflected by the mirror 4 but opposed to the optical waveguide. Proceed to 5a-5d. For example, when no potential difference is applied, the light incident from the optical waveguide 5a is reflected by the mirror 4 and proceeds to the optical waveguide 5b. When a potential difference is applied, the light incident from the optical waveguide 5a goes straight to the optical waveguide 5c without being reflected by the mirror 4.

  A method for manufacturing the optical switch shown in FIG. An SOI substrate including a lower layer 11, an intermediate layer 12, and an upper layer 13 is prepared. Using the photolithography method and DRIE, the upper layer 13 is selectively etched to form the grooves of the movable plate 2, the mirror 4, and the optical waveguides 5a to 5d. Similarly, the lower layer 11 is selectively etched using the photolithography method and DRIE to form the drive unit 1 and the support unit 3. Then, the intermediate layer 12 disposed between the lower layer 11 and the upper layer 13 is selectively removed by wet etching. By arranging the optical fiber in the groove, the optical switch shown in FIG. 1A is completed.

  As described above, according to the optical switch according to the first embodiment of the present invention, by using the solder bumps 16a and 16b instead of the bonding wire, it is possible to prevent the yield from being lowered due to the cutting of the bonding wire. Can do.

  Further, the drive unit 1, the movable plate 2, and the support unit 3 are divided into the lower layer 11 and the upper layer 13, and are superposed on each other, whereby the entire optical switch can be reduced in size.

  Furthermore, by using the solder bumps 16a and 16b, the degree of freedom of electrode arrangement of the drive unit 1 can be increased.

  Furthermore, by reducing the number of contact portions between the upper layer 13 and the lower layer 11, sticking (adhering) of the movable part can be prevented.

  Furthermore, since the fixed electrode 7 and the movable electrode 6 penetrate vertically, it is possible to prevent the shape defect at the lower part of the electrode (part close to the boundary surface) normally seen during dry etching.

  Note that gold bumps may be used instead of the solder bumps 16a and 16b.

(First modification of the first embodiment)
In FIG. 1A, the support portion 3 is disposed in the lower layer 11, but may be disposed in the upper layer 13.

  FIG. 3 shows a drive device according to a first modification of the first embodiment. In FIG. 3, the upper layer 13 and the lower layer 11 are shown in a vertically separated state. The drive device includes a drive unit having a fixed electrode 7 and a movable electrode 6 that mesh with each other, a movable plate 2 connected to the movable electrode 6, and a flexible support unit 3 connected to the movable electrode 6 and the movable plate 2. Have An optical switch is obtained by adding a mirror connected to one end of the movable plate 2 and an optical waveguide intersecting each other in the vicinity of the mirror.

  The fixed electrode 7 and the movable electrode 6 are disposed in the lower layer 11. The movable plate 2 and the support portion 3 are disposed in the upper layer 13. The movable plate 2 and the support portion 3 are connected to the movable electrode 6 via a conductive film (metal or the like) 12c. Although not shown, the fixed electrode 7 disposed in the lower layer 11 is electrically connected to a circuit pattern on the printed circuit board via a solder bump. A voltage is applied to the fixed electrode 7 through the solder bump. The movable electrode 6 is electrically connected to a circuit pattern on the printed board via a bonding wire.

Although not shown, oxide films (SiO ₂ films) 12d and 12e are disposed on the lower layer 11 in the fixed region excluding the upper and lower movable coupling regions. The fixed portion in the upper layer 13 is fixed to the lower layer 11 via the SiO ₂ films 12d and 12e. The upper and lower movable coupling regions are electrically connected via the conductive film 12c. Here, only the movable coupling region is vertically coupled by the conductive film 12c. However, after securing insulation between the movable electrode 6 and the fixed electrode 7, a part of the fixed region is vertically coupled by the conductive film. It doesn't matter.

  According to the first modification of the first embodiment, since the movable electrode 6 is electrically connected by the bonding wire, the solder bump and the bonding wire can be used together, and the degree of freedom of electrode arrangement is further increased. Get higher.

  Needless to say, the same effect as the optical switch shown in FIG.

(Second modification of the first embodiment)
When the support portion 3 is disposed in the upper layer 13, the support portion 3 can be disposed above the movable electrode 6 and the fixed electrode 7 so as to be overlapped while separating the upper and lower layers.

  FIG. 4 shows a drive device according to a second modification of the first embodiment. In FIG. 4, the upper layer 13 and the lower layer 11 are shown in a vertically separated state. The drive device includes a drive unit having a fixed electrode 7 and a movable electrode 6 that mesh with each other, a movable plate 2 connected to the movable electrode 6, and a flexible support unit 3 connected to the movable electrode 6 and the movable plate 2. Have Although not shown, an optical switch is obtained by adding a mirror connected to one end of the movable plate 2 and an optical waveguide intersecting each other in the vicinity of the mirror to the driving device.

  The fixed electrode 7 and the movable electrode 6 are disposed in the lower layer 11. The movable plate 2 and the support portion 3 are disposed in the upper layer 13. The movable electrode 6 is connected to the movable plate 2 via the intermediate layer 12f. The support part 3 is arranged above the fixed electrode 7 and the movable electrode 6 and overlapped therewith.

Although not shown, an oxide film (SiO ₂ film) 12j is disposed on the lower layer 11 in the fixed region excluding the upper and lower movable coupling regions. The fixed portion in the upper layer 13 is fixed to the lower layer 11 through the SiO ₂ film 12j. The upper and lower movable coupling regions are electrically connected via conductive films 12g and 12h. Here, only the movable coupling region is vertically coupled by the conductive films 12g and 12h. However, after securing insulation between the movable electrode 6 and the fixed electrode 7, a part of the fixed region is vertically coupled by the conductive film. You may combine them.

  According to the second modification of the first embodiment, the optical switch can be further reduced in size by arranging the fixed electrode 7 and the movable electrode 6 and the support portion 3 so as to overlap each other.

  Needless to say, the same effects as those of the optical switch shown in FIGS. 1A and 3 can be obtained.

(Second Embodiment)
As shown in FIG. 5, the optical switch according to the second embodiment of the present invention includes a drive unit 20 having a fixed electrode 27 and a movable electrode 28 that mesh with each other, and a movable plate 2 connected to the movable electrode 28. And a flexible support 3 connected to the movable electrode 28 and the movable plate 2, a mirror connected to one end of the movable plate 2, and an optical waveguide intersecting each other in the vicinity of the mirror. The movable plate 2 is disposed so as to overlap with a part of the drive unit 20 and the support unit 3. On the other end of the movable plate 2, a cam structure (latch portion) 30 for a latch function is disposed. The fixed electrode 27 and the movable electrode 28 each have a plurality of comb teeth plates that mesh with each other. The surface of each comb tooth plate is disposed perpendicular to the drive direction 29 of the drive unit 20. That is, the drive unit 20 is an electrostatic gap closing type. Although a multi-stage electrostatic gap closing type is shown here, a single-stage electrostatic gap closing type may be used.

  The drive unit 20 and the support unit 3 are disposed in the lower layer 11. The movable plate 2 is disposed in the upper layer 13. The movable plate 2 is connected to the drive unit 1 and the support unit 3 through the intermediate layer 12p. Although not shown, the fixed electrode 27 disposed in the lower layer 11 is electrically connected to a circuit pattern on the printed circuit board via a solder bump. A voltage is applied to the fixed electrode 7 through the solder bump. Similarly, a part of the support part 3 is electrically connected to a circuit pattern on the printed circuit board via a solder bump. A voltage is applied to the movable electrode 28 via the solder bump and the support portion 3.

  In FIG. 5, the movable plate 2 disposed in the upper layer 13, the fixed electrode 27, the movable electrode 28, and the support portion 3 disposed in the lower layer 11 are illustrated in a vertically separated state. In the lower layer 11, the fixed electrode 27 is electrically insulated from the support portion 3 and the movable electrode 28. The movable plate 2 is disposed above the fixed electrode 27 but is not connected. Therefore, electrical insulation between the fixed electrode 27 and the movable electrode 28 is ensured.

  The operation of the optical switch shown in FIG. 5 will be described. A predetermined potential difference is applied between the fixed electrode 27 and the movable electrode 28 from the outside via the circuit pattern and the solder bump. Then, an electrostatic attractive force acts between the fixed electrode 27 and the movable electrode 28 in a direction perpendicular to the surface of the opposing comb tooth plate. Since the fixed electrode 27 is fixed to the printed circuit board, the support portion 3 bends and the movable electrode 28 is driven to the fixed electrode 27 side. Thereby, the movable plate 2 connected to the movable electrode 28 is also driven to the fixed electrode 27 side. If no potential difference is applied, the electrostatic attractive force between the fixed electrode 27 and the movable electrode 28 disappears, and the support portion 3 returns to the original stable state.

  The manufacturing method of the optical switch shown in FIG. 5 is the same as that of the optical switch shown in FIG.

  As described above, according to the optical switch according to the second embodiment of the present invention, by using solder bumps instead of the bonding wires, it is possible to prevent a decrease in yield due to the cutting of the bonding wires.

  Further, the entire optical switch can be reduced in size by arranging the drive unit 20, the movable plate 2, and the support unit 3 separately in the lower layer 11 and the upper layer 13 and superimposing them vertically.

  Furthermore, the freedom degree of electrode arrangement | positioning of the drive part 20 can be raised by using a solder bump.

  Furthermore, by reducing the number of contact portions between the upper layer 13 and the lower layer 11, sticking (adhering) of the movable part can be prevented.

  Further, since the fixed electrode 27 and the movable electrode 28 penetrate vertically, it is possible to prevent the shape defect of the lower part of the electrode (part close to the boundary surface) normally observed during dry etching.

  A gold bump may be used instead of the solder bump.

(Third embodiment)
As shown to Fig.6 (a), the optical switch which concerns on the 3rd Embodiment of this invention is the driving device 1-3, the mirror 4 connected to the movable part of the driving devices 1-3, and the mirror 4 And optical waveguides intersecting with each other in the vicinity. The driving device includes a driving unit 1 having a fixed electrode 7 and a movable electrode 6 arranged to face each other, a movable plate 2 connected to the movable electrode 6, and a flexible electrode connected to the movable electrode 6 and the movable plate 2. Support part 3. The mirror 4 is connected to one end of the movable plate 2. A latch portion 30 is disposed at the other end of the movable plate 2. The movable plate 2 is disposed so as to overlap with a part of the drive unit 1 and the support unit 3. The fixed electrode 7 and the movable electrode 6 each have a plurality of comb teeth plates that mesh with each other. The surface of each comb-tooth plate is arranged in parallel to the drive direction of the drive unit 1. That is, the drive unit 1 has an electrostatic comb structure.

  The drive unit 1 is disposed in the lower layer 11. The movable plate 2 is disposed in the upper layer 13. The support part 3 is disposed in the lower layer 11. The movable plate 2 is connected to the drive unit 1 and the support unit 3 through the intermediate layer 12k. Although not shown, the fixed electrode 7 disposed in the lower layer 11 is electrically connected to a circuit pattern on the printed circuit board via a solder bump. A voltage is applied to the fixed electrode 7 through the solder bump. Similarly, a part of the support part 3 is electrically connected to a circuit pattern on the printed circuit board via a solder bump. A voltage is applied to the movable electrode 6 through the solder bump and the support portion 3. Further, in the upper layer 13, a groove for arranging the optical waveguide is formed, and the upper layer part for forming the groove is connected to the lower layer part by intermediate layers 121 to 12n.

  In FIG. 6A, the movable plate 2 disposed in the upper layer 13, the fixed electrode 7, the movable electrode 6, and the support portion 3 disposed in the lower layer 11 are illustrated in a vertically separated state. In the lower layer 11, the fixed electrode 7 is electrically insulated from the support portion 3 and the movable electrode 6. The movable plate 2 is disposed above the fixed electrode 7 but is not connected. Therefore, electrical insulation between the fixed electrode 7 and the movable electrode 6 is ensured. FIG. 6B shows a state in which the upper layer 13 and the lower layer 11 are overlapped.

  The operation of the optical switch shown in FIG. A predetermined potential difference is applied between the fixed electrode 7 and the movable electrode 6 via a circuit pattern and a solder bump from the outside. Then, an electrostatic attractive force acts between the fixed electrode 7 and the movable electrode 6 in a direction attracting each other. Since the fixed electrode 7 is fixed to the printed circuit board, the support portion 3 bends and the movable electrode 6 is driven to the fixed electrode 7 side. Thereby, the movable plate 2 and the mirror 4 connected to the movable electrode 6 are also driven to the fixed electrode 7 side.

  A method for manufacturing the optical switch shown in FIG. An SOI substrate including a lower layer 11, an intermediate layer 12, and an upper layer 13 is prepared. Using the photolithography method and DRIE, the upper layer 13 is selectively etched to form the movable plate 2 and the mirror 4. Similarly, using the photolithography method and DRIE, the lower layer 11 is selectively etched to form the drive unit 1, the support unit 3, and the optical waveguide groove (optical fiber guide). Then, the intermediate layer 12 disposed between the lower layer 11 and the upper layer 13 is selectively removed by wet etching. The optical switch shown in FIG. 6A is completed by arranging an optical fiber with a lens, a GRIN lens, a ball lens, or the like in the groove.

  In the case of the optical device shown in FIG. 6A, the thickness of the upper layer 13 is 80 μm, and the thickness of the lower layer 11 is 300 μm. However, the lower layer 11 in the region where the driving unit 1 is formed may be thinned in advance by wet etching and then thinned by dry reactive ion etching (DRIE). Here, the above thickness was realized by etching both surfaces of the SOI substrate. However, an SOI substrate may be formed by bonding each of two different substrates after etching.

  As described above, according to the optical switch of the third embodiment of the present invention, mounting is facilitated by using solder bumps instead of bonding wires, and the yield is reduced by cutting the bonding wires. Can be prevented.

  Further, the drive unit 1, the movable plate 2, and the support unit 3 are divided into the lower layer 11 and the upper layer 13, and are superposed on each other, whereby the entire optical switch can be reduced in size.

  Furthermore, the degree of freedom of electrode arrangement of the drive unit 1 can be increased by using solder bumps.

  Furthermore, by reducing the number of contact portions between the upper layer 13 and the lower layer 11, sticking (adhering) of the movable part can be prevented.

  Furthermore, since the fixed electrode 7 and the movable electrode 6 penetrate vertically, it is possible to prevent the shape defect at the lower part of the electrode (part close to the boundary surface) normally seen during dry etching.

  A gold bump may be used instead of the solder bump.

  As described above, the present invention has been described according to the first to third embodiments. However, it should not be understood that the description and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art. That is, it should be understood that the present invention includes various embodiments not described herein. Therefore, the present invention is limited only by the invention specifying matters according to the scope of claims reasonable from this disclosure.

FIG. 1A is a plan view showing an optical switch according to the first embodiment of the present invention. FIG. 1B is a cross-sectional view showing the optical switch of FIG. It is a perspective view which shows the optical switch of Fig.1 (a). It is a perspective view which shows the drive device which concerns on the 1st modification of 1st Embodiment. It is a perspective view which shows the drive device which concerns on the 2nd modification of 1st Embodiment. It is a perspective view which shows a part of optical switch concerning the 2nd Embodiment of this invention. FIG. 6A is a perspective view showing an optical switch according to the third embodiment of the present invention (upper and lower layers are separated). FIG.6 (b) is a perspective view which shows the optical switch which concerns on the 3rd Embodiment of this invention (upper and lower layer connection state). FIG. 7A is a plan view showing a thin-film comb resonator according to the related art. FIG. 7B is a cross-sectional view showing an optical switch according to the related art. FIG.7 (c) is sectional drawing which shows the state which mounted the optical switch of FIG.7 (b).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,20 Drive part 2 Movable plate 3 Support part 4 Mirror 5a-5d Optical waveguide 6, 28 Movable electrode 7, 27 Fixed electrode 11 Lower layer 12, 12a-12p Intermediate layer 13 Upper layer 14 Printed circuit board 15 Circuit pattern 16a, 16b Solder bump 17 Latch type movable plate 30 Latch part

Claims (7)

A drive unit disposed in the first layer and having a fixed electrode and a movable electrode meshing with each other;
A movable plate disposed in a second layer superimposed on the first layer via an intermediate layer;
A drive device comprising: the movable electrode; and a flexible support portion connected to the movable plate.   The drive device according to claim 1, wherein the support portion is disposed in the first layer.   The drive device according to claim 2, wherein the movable plate is connected to the movable electrode through the intermediate layer.   The drive device according to claim 1, wherein the support portion is disposed in the second layer.   The driving device according to claim 4, wherein the driving unit is overlapped with at least one of the support unit and the movable plate.   The driving device according to claim 5, wherein the driving unit is overlapped with the support unit and the movable plate. A drive unit disposed in the first layer and having a fixed electrode and a movable electrode meshing with each other;
A movable plate disposed in a second layer superimposed on the first layer via an intermediate layer;
A flexible support connected to the movable electrode and the movable plate;
A mirror disposed in the second layer;
A pair of optical waveguides disposed in the second layer and intersecting each other in the vicinity of the mirror;
An optical device characterized by switching the optical path of light propagating in the optical waveguide by driving the driving unit.

Images