JP2004107374A - Flame-retardant resin composition - Google Patents
Flame-retardant resin composition Download PDFInfo
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- JP2004107374A JP2004107374A JP2002268113A JP2002268113A JP2004107374A JP 2004107374 A JP2004107374 A JP 2004107374A JP 2002268113 A JP2002268113 A JP 2002268113A JP 2002268113 A JP2002268113 A JP 2002268113A JP 2004107374 A JP2004107374 A JP 2004107374A
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- Prior art keywords
- flame
- resin
- resin composition
- composition according
- phosphazene compound
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 42
- 239000003063 flame retardant Substances 0.000 title claims abstract description 37
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 32
- -1 phosphazene compound Chemical class 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 claims description 23
- 125000001424 substituent group Chemical group 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 229920001955 polyphenylene ether Polymers 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000013638 trimer Substances 0.000 claims description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920005668 polycarbonate resin Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims 5
- 125000003118 aryl group Chemical group 0.000 claims 4
- 150000002366 halogen compounds Chemical class 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 10
- 238000001723 curing Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000004793 Polystyrene Substances 0.000 description 6
- 125000004104 aryloxy group Chemical group 0.000 description 6
- 230000008033 biological extinction Effects 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- 238000004898 kneading Methods 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 125000004122 cyclic group Chemical group 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920000742 Cotton Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920005669 high impact polystyrene Polymers 0.000 description 3
- 239000004797 high-impact polystyrene Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000000979 retarding effect Effects 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GBZVNKQWXLVYNG-UHFFFAOYSA-N (3-phosphonooxyphenyl) dihydrogen phosphate Chemical compound OP(O)(=O)OC1=CC=CC(OP(O)(O)=O)=C1 GBZVNKQWXLVYNG-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- FYADHXFMURLYQI-UHFFFAOYSA-N 1,2,4-triazine Chemical class C1=CN=NC=N1 FYADHXFMURLYQI-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- BIAWAXVRXKIUQB-UHFFFAOYSA-N 2-(2-phenylethenyl)pyridine Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=N1 BIAWAXVRXKIUQB-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- GVLZQVREHWQBJN-UHFFFAOYSA-N 3,5-dimethyl-7-oxabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound CC1=C(O2)C(C)=CC2=C1 GVLZQVREHWQBJN-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
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- 230000008025 crystallization Effects 0.000 description 1
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- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
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- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
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- 229910021331 inorganic silicon compound Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 235000014380 magnesium carbonate Nutrition 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
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- Fireproofing Substances (AREA)
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Abstract
Description
【0001】
【発明の属する技術分野】
本発明は、難燃性に優れ、且つ電気特性に優れた難燃性樹脂組成物に関する。
【0002】
【従来の技術】
近年、電気・電子機器分野において、使用される周波数帯が高周波数領域になるにつれて、樹脂組成物は高度な難燃性を有しながら、且つ、より優れた電気特性を有することが求められている。
これまで、易燃性合成樹脂の難燃化としては、一般には従来からハロゲン系化合物および三酸化アンチモンとを添加する等の難燃化手法が用いられてきたが(例えば、特許文献1参照。)、これらは環境保護の観点、毒性の面等からも好ましくなく、また、ハロゲン系難燃剤を使用することによりハロゲン系ガスが発生し、これが樹脂組成物の電気特性悪化の要因となるとも言われており、電子材料分野等においては優れた電気特性を得る観点から、電気特性の悪化をまねかない難燃化手法が望まれている。
【0003】
このようなハロゲン系難燃剤や金属酸化物を含有しない代替材として、リン系難燃剤を用いた難燃化が検討されており、例えば赤燐を用いる方法(例えば、特許文献2参照。)、リン酸エステルを用いる方法(例えば、特許文献3及び4参照。)などが開示されている。しかし、赤燐を用いる方法では少量の水分と反応して、有毒なホスフィンを発生する上に、腐食性のリン酸を発生するなど問題が多い。また、リン酸エステルは耐加水分解性の低下、可塑化による成形性の低下をまねくなど問題が多い。
【0004】
充填材の配合割合を高くする方法(例えば、特許文献5参照。)も提案されているが、充填材を多量に添加すると樹脂組成物が極端に脆くなる上に、表面性や成形性も極端に悪化するため好ましくない。
また、樹脂に対する難燃剤として、ホスファゼン系化合物が報告されており、例えば、ホスファゼン化合物をエポキシ樹脂に添加した難燃性エポキシ組成物(例えば特許文献6および7参照。)や、フェノキシホスファゼンをABS系樹脂に添加した樹脂組成物(例えば特許文献8参照。)、ポリカーボネート樹脂にホスファゼン化合物を添加した難燃性樹脂組成物(例えば、特許文献9参照。)等が報告されている。しかし、十分な難燃性を得るためには多量の難燃剤を添加する必要があり、耐熱性の低下等の問題もあった。
【0005】
電気・電子材料分野においては、エポキシ樹脂を含有する樹脂組成物が良好な電気特性を有し、扱いが容易く、安価なことから広く使用されている。しかし、プリント基板や、封止材用途等、低比誘電率、低誘電正接をを有することが必須の分野において使用に供されるものは、高価なビスマレイミドや、エポキシ樹脂に塩素や臭素等のハロゲン元素を含有するハロゲン化エポキシ樹脂又は、エポキシ樹脂に対して難燃剤としてハロゲン化合物を使用するもの、或いは熱硬化性ポリフェニレンエーテルが主である。熱硬化性ポリフェニレンエーテルは良好な電気特性を有するが、樹脂組成物の流動性が極めて悪く、加工性に劣る。この為、環境に悪影響を及ぼすハロゲンを含有せず、加工性の良い、電気特性の優れた安価な樹脂組成物が望まれている。
【0006】
優れた難燃効果が得られるとされる難燃剤としてホスファゼン化合物があるが、シクロフェノキシホスファゼントリマー又は、シクロ(o−クロロフェノキシ)ホスファゼントリマーを難燃剤として、エポキシ樹脂組成物に対して使用すると、1キロヘルツ(KHz)の低周波数領域において、難燃剤を使用しないものと比較して良好な電気特性を与えることが開示されている(例えば、特許文献10参照。)。しかし、1メガヘルツ(MHz)においては、シクロフェノキシホスファゼントリマー又は、シクロ(o−クロロフェノキシ)ホスファゼントリマーを添加することによる効果は僅かである。また、1GHz以上の高周波数領域に関する記載はない。
【0007】
【特許文献1】
特開昭60−255844号公報
【特許文献2】
特開平9−227765号公報
【特許文献3】
特開平9−235449号公報
【特許文献4】
特開平11−43536号公報
【特許文献5】
特開平7−82343号公報
【特許文献6】
特開平10−259292号公報
【特許文献7】
特公平6−53787号公報
【特許文献8】
特開2001−280950号公報
【特許文献9】
特開昭51−37149号公報
【特許文献10】
特開平8−225714
【特許文献11】
特公平3−73590号公報
【特許文献12】
特開平9−183864号公報
【特許文献13】
特開平11−181429号公報
【特許文献14】
特開2001−64292号公報
【非特許文献1】
James E. Mark, Harry R. Allcock, Robert West著、“Inorganic Polymers” Pretice−Hall、International、Inc.,1992, p.61−140
【0008】
【発明が解決しようとする課題】
本発明は、ハロゲン化合物を含まず、耐熱性、機械特性に優れ、環境上好ましい、高度の難燃性、及び優れた電気特性を有する安価な樹脂組成物を提供するものである。
【0009】
【課題を解決するための手段】
本発明者は上記課題を解決するために鋭意検討した結果、難燃剤として樹脂組成物中に、少なくとも一つのアリールオキシ基を有する環状ホスファゼン化合物を含有することにより、優れた難燃性及び電気特性を与えることを見出し、本発明に到達した。
以下、本発明を詳細に説明する。
【0010】
本発明において用いられる(a)成分である樹脂は特に規定されるものではないが、使用に共されるものとして、例えば、ポリフェニレンエーテル、ポリスチレン変性ポリフェニレンエーテル、ポリアミド、ポリスチレン、ハイインパクトポリスチレン(HIPS)、ABS樹脂、ポリエチレン、メタクリル樹脂、ポリエチレンテレフタラート、ポリアセタール、ポリブタジエン、ポリプロピレン、ポリブチレンテレフタレート、ポリカーボネート、ポリカーボネートとABS樹脂からなるアロイ等の熱可塑性樹脂、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、グアナミン樹脂、アルキド樹脂、不飽和ポリエステル樹脂、ビニルエステル、ジアリルフタレート、シリコーン樹脂、ウレタン樹脂、フラン樹脂、ケトン樹脂、キシレン樹脂、スチリルピリジン系樹脂、トリアジン系樹脂等の熱硬化性樹脂、ポリサルホン、ポリエーテルサルホン、ポリフェニレンサルファイド、ポリアリレート、ポリイミド系樹脂、ポリエーテルエーテルケトン、液晶ポリマー、シンジオタクテックポリスチレン等の特殊エンジニアリング樹脂等が挙げられ、それぞれを単独又は二種以上のアロイとして用いても良い。
【0011】
良好な電気特性を得る為には、ポリフェニレンエーテル、ポリプロピレン、ポリスチレン、ポリカーボネート、ポリイミド、ポリスルホン、エポキシ樹脂、ポリフェニレンサルファイド、ポリエーテルスルホン、シンジオタクチックポリスチレン、液晶ポリマー等や、これらを組み合わせて成るアロイが好適に用いられる。
本発明で用いられる(b)ホスファゼン化合物は公知の化合物であり(例えば非特許文献1参照。)、一般式(1)(式中のnは1〜8の整数)で示される環状ホスファゼン化合物及び、一般式(3)で示される鎖状の構造を有する鎖状ホスファゼンが使用に供される。その中でも、一般式(1)(式中のnは1〜8の整数)で示される環状ホスファゼン化合物が好ましく、特にn=3、4の6員環及び8員環を全ホスファゼン化合物中に80重量%以上含有する環状ホスファゼン化合物が好ましい。また、置換基Xのうち少なくとも一つが一般式(2)で示されるアリールオキシ基(式中のR1、R2、R3、R4及びR5は水素原子、炭素数が1〜5のアルキル基またはアルコキシ基、又はフェニル基を表し、R1〜R5すべてが水素原子であることはない)であるものが好ましく、置換基Xすべてがアリールオキシ基であってもよい。また、置換基Xのアリールオキシ基は分子内において、同一のものであっても、異なるものであってもよい。
【0012】
アリールオキシ基上の置換基R1、R2、R3、R4及びR5は特に制限はないが、一例としてメチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、tert−ブチル基、n−アミル基、イソアミル基、メトキシ基、エトキシ基等の直鎖又は分岐したアルキル基又はアルコキシ基又はフェニル基が好ましく、これらのホスファゼン化合物は一種単独で用いても、二種以上の混合物として用いても良いし、鎖状ホスファゼン化合物と環状ホスファゼン化合物の混合物として用いても良い。本発明で使用されるホスファゼン化合物は、一般式(2)のアリールオキシ基上の置換基R1〜R5のうち少なくとも一つがアルキル基、アルコキシ基又はフェニル基であれば良く、 R1〜R5すべてがアルキル基、アルコキシ基又はフェニル基であればよい。製造コストを考慮すると、一般式(2)に示される置換基Xは、R1、R2又はR3のいずれかがメチル基であるクレゾオキシ基、 R1〜R5のうちの二つがメチル基であるキシレノオキシ基が好適である。
【0013】
また、n=3の六員環ホスファゼン単独で用いても、n=4以上の多員環ホスファゼンとの混合物として用いても良い。これらホスファゼン化合物を得るための参考文献および合成例が開示されている(例えば特許文献11〜14参照。)。
本発明において、樹脂とホスファゼン化合物の両者の比率は、特に規定されるものではないが、本発明の効果を損ねることない範囲であれば良い。具体的にはホスファゼン化合物添加量は1〜35重量%の範囲が好適であり、さらには3〜30重量%の範囲で用いるのが好適である。ホスファゼン化合物添加量が1重量%より少ない場合は、十分な難燃性を得ることができず、好ましくない。一方でホスファゼン化合物添加量を35重量%以上としなければ難燃性を付与できない場合は,樹脂組成物中の難燃剤組成物比率が大きくなりすぎ、樹脂組成物の耐熱性を大幅に低下させるなど、組成物の物性に悪影響を与えるため好ましくない。
【0014】
また、本発明においては、本発明の効果が達成できる範囲で、(b)成分のホスファゼン化合物以外に、従来公知のノンハロゲン、ノンアンチモンの難燃剤を併用することができる。例示すると、トリフェニルホスフェート、トリクレジルホスフェート、トリキシレニルホスフェート、クレジルジフェニルホスフェート、キシレニルジフェニルホスフェート、ジキシレニルフェニルホスフェート、ヒドロキシノンビスフェノール、レゾルシノールビスホスフェート、ビスフェノールAビスホスフェート等の燐酸エステル類、水酸化マグネシウム、水酸化アルミニウム、アルミン酸カルシウム等の金属水酸化物、トリアジン化合物、メラミン、メラミンシアヌレート、メラミン樹脂、グアニジン化合物等の含窒素化合物等が挙げられる。
【0015】
本発明の樹脂組成物においては、さらに樹脂組成物の剛性や寸法安定性を向上させる必要のあるときには、無機充填材を添加することができる。充填材種は目的によって任意に選べるが、ガラス繊維、ガラスフレーク、マイカ、タルク、シリカ、ジルコン、アルミナ、石膏、石英、マグネサイト、カオリン、炭化珪素、炭酸カルシウム、鉄粉、銅粉等が一般的に用いられる。
本発明の樹脂組成物には、更に他の特性を付与するため、本発明の効果を損なわない範囲で他の添加剤、例えば可塑剤、酸化防止剤、及び紫外線吸収剤などの安定剤、硬化剤、効果促進剤、帯電防止剤、応力緩和剤、離型剤、流動調整剤、染料、増感材、着色用顔料、ゴム質重合体等を添加することができる。また、従来から知られた各種難燃剤および難燃助剤、例えば結晶水を含有する水酸化マグネシウムや水酸化アルミニウム等のアルカリ金属水酸化物またはアルカリ土類金属水酸化物、ホウ酸亜鉛化合物、スズ酸亜鉛化合物、さらにはシリカ、カオリンクレー、タルクなどの無機ケイ素化合物を添加して更なる難燃性の向上も可能である。
【0016】
本発明の樹脂組成物の製造方法は、本発明の効果が達成できる方法であれば特に規定するものではない。例えば、押出機、加熱ロール、ニーダー、バンバリーミキサー等の混練機を用いて混練製造することができる。その中でも押出機による混練りが、生産性の面で好ましい。混練り温度は、ベース樹脂の好ましい加工温度に従えばよく、目安としては200〜360℃の範囲、好ましくは240〜320℃の範囲である。
【0017】
また、熱硬化性樹脂の場合には、樹脂組成物を製造するための成分を、均一に混合できる溶媒を用いて、又は無溶媒で混合し、金型内へ注形し硬化させた後冷却し、型から取り出すことにより成型品を得る方法でも良い。また、加熱ロール、ニーダー、バンバリーミキサー、押出機等の混練機を用いて混練製造した後、冷却、粉砕し、さらにトランスファー成形、射出成形、圧縮成形等により成形を行う方法も一例として挙げることができる。また、硬化方法は使用する硬化剤により異なるが、特に限定はされない。例としては、熱硬化、光硬化、圧力による硬化、湿気による硬化等が挙げられるが、本発明の効果が達成できる硬化方法であれば規定されるものではない。各成分を混合させる順序は、本発明の効果が達成できる方法であれば特に規定するものではない。樹脂組成物の製造方法は、それぞれの樹脂の適性に応じて、好ましい方法を用いることができる。
【0018】
【発明の実施の形態】
以下、実施例によって本発明を具体的に説明するが、本発明は以下の例に限定されるものではない。以下の実施例及び比較例における「%」とは「重量%」を意味する。
実施例および比較例で用いた各成分は以下のものである。
(a)樹脂
PPE:ポリフェニレンエーテル
30℃のクロロホルム溶液で測定したηsp/cが0.52のポリ−2,6−ジメチル−1,4−フェニレンエーテル。
ゴム補強ポリスチレン(HIPS):ゴム含量9%、30℃、トルエン溶液で測定したマトリックスポリスチレンのηsp/cが0.70、体積平均ゴム粒子径が1.5μmのゴム補強ポリスチレン。
GP685:ポリスチレン685(A&Mスチレン(株)社製)
(b)ホスファゼン:
FR1:式(4)で表されるヘキサ(o−クレゾキシ)ホスファゼンで、31PNMRにおいて式(4)で表されるヘキサ(o−クレゾオキシ)ホスファゼン以外のピークが観測されないもの。
【0019】
【化5】
【0020】
FR2:式(5)で表される環状ホスファゼン三量体であり、31P NMRにおいて式(5)で表されるホスファゼン以外のピークが観測されないもの。
【0021】
【化6】
【0022】
FR3:式(6)で表される環状ホスファゼン三量体であり、31P NMRにおいて式(6)で表されるホスファゼン以外のピークが観測されないもの。
【0023】
【化7】
【0024】
FR4:式(7)で表される環状ホスファゼン三量体であり、31P NMRにおいて式(7)で表されるホスファゼン以外のピークが観測されないもの。
【0025】
【化8】
【0026】
FR5:式(8)で表される環状ヘキサフェノキシホスファゼン三量体で、31P NMRにおいて式(8)で表される環状ヘキサフェノキシホスファゼン以外のピークが観測されないもの。
【0027】
【化9】
【0028】
FR6:トリフェニルホスフェート
実施例および比較例の樹脂組成物物性評価は以下の方法で行った。
(1)難燃性:UL−94垂直燃焼試験に基づき、長さ128mm×幅12.8mm×厚さ1.6mmの成形試験片を用いて行い、10回接炎時の合計燃焼時間と燃焼時の滴下物による綿着火の有無により、V−0、V−1、V−2、規格外の四段階に分類した。評価基準を以下に示し、消炎時間は短いほど難燃性が優れていることを示す。
【0029】
V−0:下記の条件を全て満たす。
(A)試験片5本を1本につき二回ずつ、合計10回の接炎後からの消炎時間の合計が50秒以内。
(B)試験片5本を一本につき二回ずつ接炎を行い、それぞれの接炎後からの消炎時間が5秒以内。
(C)すべての試験片で滴下物による、300mm下の脱脂綿への着火がない。
(D)すべての試験片で、二回目の接炎後のグローイングは30秒以内。
(E)すべての試験片で、クランプまでフレーミングしない。
【0030】
V−1:下記の条件を全て満たす。
(A)試験片5本を1本につき二回ずつ、合計10回の接炎後からの消炎時間の合計が250秒以内。
(B)試験片5本を一本につき二回ずつ接炎を行い、それぞれの接炎後からの消炎時間が30秒以内。
(C)すべての試験片で滴下物による、300mm下の脱脂綿への着火がない。
(D)すべての試験片で、二回目の接炎後のグローイングは60秒以内。
(E)すべての試験片で、クランプまでフレーミングしない。
【0031】
V−2:下記の条件を全て満たす。
(A)試験片5本を1本につき二回ずつ、合計10回の接炎後からの消炎時間の合計が250秒以内。
(B)試験片5本を一本につき二回ずつ接炎を行い、それぞれの接炎後からの消炎時間が30秒以内。
(C)試験片5本のうち、少なくとも一本、滴下物による、300mm下の脱脂綿への着火がある。
(D)すべての試験片で、二回目の接炎後のグローイングは60秒以内。
(E)すべての試験片で、クランプまでフレーミングしない。
【0032】
(2)誘電特性
厚さ約2mmの150×150mmの成形片を用いて、比誘電率及び誘電正接をトリプレート法により、周波数1ギガヘルツ(GHz)、5GHz及び10GHzにて測定した。
【0033】
【実施例1〜4、比較例1〜2】
各成分を表1に示す割合で混合し、加熱シリンダーの最高温度を300℃に設定したスクリュー直径25mmの二軸押出機に供給して、スクリュー回転数300rpmで溶融混練りし、ストランドを冷却裁断して樹脂組成物ペレットを得た。
次に、得られた樹脂組成物ペレットを、射出成形により240〜290℃にて物性試験片を成形し、上記試験法により物性試験を行い、表1の結果を得た。
【0034】
【表1】
【0035】
【発明の効果】
本発明は、ハロゲン化合物を含まず、電気特性に優れ、環境上好ましい、高度の難燃性を有する樹脂組成物を提供する。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a flame-retardant resin composition having excellent flame retardancy and excellent electrical properties.
[0002]
[Prior art]
In recent years, in the field of electric and electronic devices, as the frequency band used becomes a higher frequency region, it is required that the resin composition has high flame retardancy and has more excellent electric characteristics. I have.
Heretofore, flame retarding techniques such as addition of a halogen compound and antimony trioxide have been conventionally used as flame retarding of a flammable synthetic resin (for example, see Patent Document 1). These are not preferred from the viewpoint of environmental protection and toxicity, and the use of halogen-based flame retardants generates halogen-based gas, which may be a factor in deteriorating the electrical properties of the resin composition. In the field of electronic materials and the like, from the viewpoint of obtaining excellent electrical characteristics, there is a demand for a flame-retardant method that does not cause deterioration of the electrical characteristics.
[0003]
As an alternative material that does not contain such a halogen-based flame retardant or metal oxide, flame retardation using a phosphorus-based flame retardant has been studied. For example, a method using red phosphorus (for example, see Patent Document 2), A method using a phosphate ester (for example, see Patent Documents 3 and 4) and the like are disclosed. However, the method using red phosphorus has many problems such that it reacts with a small amount of water to generate toxic phosphine and also generates corrosive phosphoric acid. Further, phosphate esters have many problems such as a decrease in hydrolysis resistance and a decrease in moldability due to plasticization.
[0004]
Although a method of increasing the blending ratio of the filler (for example, see Patent Document 5) has been proposed, addition of a large amount of the filler makes the resin composition extremely brittle, and also has an extreme surface property and moldability. It is not preferable because it deteriorates.
In addition, phosphazene-based compounds have been reported as flame retardants for resins. For example, flame-retardant epoxy compositions in which a phosphazene compound is added to an epoxy resin (for example, see Patent Documents 6 and 7) and phenoxy phosphazene are ABS-based. A resin composition added to a resin (for example, see Patent Document 8), a flame-retardant resin composition obtained by adding a phosphazene compound to a polycarbonate resin (for example, see Patent Document 9), and the like are reported. However, in order to obtain sufficient flame retardancy, it is necessary to add a large amount of a flame retardant, and there is a problem such as a decrease in heat resistance.
[0005]
In the field of electric and electronic materials, a resin composition containing an epoxy resin is widely used because it has good electric properties, is easy to handle, and is inexpensive. However, those that are used in fields where it is essential to have a low dielectric constant and a low dielectric loss tangent, such as printed circuit boards and sealing materials, are expensive bismaleimides and epoxy resins such as chlorine and bromine. Halogenated epoxy resins containing the halogen element (1), those using a halogen compound as a flame retardant for the epoxy resin, and thermosetting polyphenylene ethers are mainly used. Although thermosetting polyphenylene ether has good electrical properties, the fluidity of the resin composition is extremely poor, and the processability is poor. Therefore, an inexpensive resin composition that does not contain a halogen that adversely affects the environment, has good processability, and has excellent electrical characteristics is desired.
[0006]
Phosphazene compounds are known as flame retardants that are said to provide an excellent flame retardant effect, but when cyclophenoxy phosphazene trimer or cyclo (o-chlorophenoxy) phosphazene trimer is used as a flame retardant for an epoxy resin composition, It is disclosed that in a low frequency region of 1 kilohertz (KHz), better electrical characteristics are provided as compared with those without using a flame retardant (for example, see Patent Document 10). However, at 1 megahertz (MHz), the effect of adding cyclophenoxy phosphazene trimer or cyclo (o-chlorophenoxy) phosphazene trimer is small. There is no description about a high frequency region of 1 GHz or more.
[0007]
[Patent Document 1]
JP-A-60-255844 [Patent Document 2]
JP-A-9-227765 [Patent Document 3]
Japanese Patent Application Laid-Open No. 9-235449 [Patent Document 4]
JP-A-11-43536 [Patent Document 5]
Japanese Patent Application Laid-Open No. 7-82343 [Patent Document 6]
JP-A-10-259292 [Patent Document 7]
Japanese Patent Publication No. 6-53787 [Patent Document 8]
JP 2001-280950 A [Patent Document 9]
JP-A-51-37149 [Patent Document 10]
JP-A-8-225714
[Patent Document 11]
Japanese Patent Publication No. Hei 3-73590 [Patent Document 12]
JP-A-9-183864 [Patent Document 13]
JP-A-11-181429 [Patent Document 14]
Japanese Patent Application Laid-Open No. 2001-64292 [Non-Patent Document 1]
James E. Mark, Harry R. Allcock, Robert West, "Inorganic Polymers," Precision-Hall, International, Inc. , 1992, p. 61-140
[0008]
[Problems to be solved by the invention]
The present invention provides an inexpensive resin composition which does not contain a halogen compound, has excellent heat resistance and mechanical properties, is environmentally preferable, has high flame retardancy, and has excellent electrical properties.
[0009]
[Means for Solving the Problems]
The present inventors have conducted intensive studies to solve the above problems, and as a result, by including a cyclic phosphazene compound having at least one aryloxy group in a resin composition as a flame retardant, excellent flame retardancy and electrical properties. And reached the present invention.
Hereinafter, the present invention will be described in detail.
[0010]
The resin as the component (a) used in the present invention is not particularly limited, but may be used together with, for example, polyphenylene ether, polystyrene-modified polyphenylene ether, polyamide, polystyrene, high-impact polystyrene (HIPS). , ABS resin, polyethylene, methacrylic resin, polyethylene terephthalate, polyacetal, polybutadiene, polypropylene, polybutylene terephthalate, polycarbonate, thermoplastic resin such as alloy composed of polycarbonate and ABS resin, epoxy resin, phenolic resin, urea resin, melamine resin, Guanamine resin, alkyd resin, unsaturated polyester resin, vinyl ester, diallyl phthalate, silicone resin, urethane resin, furan resin, ketone resin, Thermosetting resins such as styrene resin, styrylpyridine resin, and triazine resin, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, polyimide resin, polyetheretherketone, liquid crystal polymer, and syndiotactic polystyrene An engineering resin may be used, and each may be used alone or as two or more alloys.
[0011]
In order to obtain good electrical properties, polyphenylene ether, polypropylene, polystyrene, polycarbonate, polyimide, polysulfone, epoxy resin, polyphenylene sulfide, polyethersulfone, syndiotactic polystyrene, liquid crystal polymer, etc. It is preferably used.
The phosphazene compound (b) used in the present invention is a known compound (for example, see Non-Patent Document 1), and a cyclic phosphazene compound represented by the general formula (1) (where n is an integer of 1 to 8): A chain phosphazene having a chain structure represented by the general formula (3) is used. Among them, a cyclic phosphazene compound represented by the general formula (1) (where n is an integer of 1 to 8) is preferable, and particularly, a 6-membered ring and an 8-membered ring in which n = 3, 4 are contained in all phosphazene compounds. A cyclic phosphazene compound containing at least% by weight is preferred. Further, at least one of the substituents X is an aryloxy group represented by the general formula (2) (wherein R 1 , R 2 , R 3 , R 4 and R 5 are a hydrogen atom and a carbon atom having 1 to 5 carbon atoms. It represents an alkyl group or an alkoxy group, or a phenyl group, and all of R 1 to R 5 are not hydrogen atoms), and all the substituents X may be aryloxy groups. Further, the aryloxy groups of the substituent X may be the same or different in the molecule.
[0012]
Although the substituents R 1 , R 2 , R 3 , R 4 and R 5 on the aryloxy group are not particularly limited, examples thereof include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group and an isobutyl group. Group, a tert-butyl group, an n-amyl group, an isoamyl group, a methoxy group, a linear or branched alkyl group or an alkoxy group such as an ethoxy group or a phenyl group, and these phosphazene compounds may be used alone. It may be used as a mixture of two or more kinds, or as a mixture of a chain phosphazene compound and a cyclic phosphazene compound. Phosphazene compounds used in the present invention, at least one alkyl group of the substituents R 1 to R 5 on the aryloxy group of the general formula (2) may be any alkoxy group or a phenyl group, R 1 to R All 5 may be an alkyl group, an alkoxy group or a phenyl group. Considering the production cost, the substituent X represented by the general formula (2) is a crezooxy group in which any of R 1 , R 2 or R 3 is a methyl group, and two of R 1 to R 5 are methyl groups. The xylenoxy group of is preferred.
[0013]
Moreover, the 6-membered phosphazene with n = 3 may be used alone or as a mixture with a multi-membered phosphazene with n = 4 or more. References and synthesis examples for obtaining these phosphazene compounds are disclosed (for example, see Patent Documents 11 to 14).
In the present invention, the ratio between the resin and the phosphazene compound is not particularly limited, but may be within a range that does not impair the effects of the present invention. Specifically, the addition amount of the phosphazene compound is preferably in the range of 1 to 35% by weight, and more preferably in the range of 3 to 30% by weight. If the amount of the phosphazene compound is less than 1% by weight, sufficient flame retardancy cannot be obtained, which is not preferable. On the other hand, when the flame retardancy cannot be imparted unless the amount of the phosphazene compound is 35% by weight or more, the ratio of the flame retardant composition in the resin composition becomes too large, and the heat resistance of the resin composition is greatly reduced. This is not preferred because it adversely affects the physical properties of the composition.
[0014]
In the present invention, conventionally known non-halogen and non-antimony flame retardants can be used in addition to the phosphazene compound as the component (b) as long as the effects of the present invention can be achieved. For example, phosphate esters such as triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xyenyl diphenyl phosphate, dixylenyl phenyl phosphate, hydroxynon bisphenol, resorcinol bisphosphate, bisphenol A bisphosphate, etc. And metal hydroxides such as magnesium hydroxide, aluminum hydroxide and calcium aluminate, and nitrogen-containing compounds such as triazine compounds, melamine, melamine cyanurate, melamine resins and guanidine compounds.
[0015]
In the resin composition of the present invention, when it is necessary to further improve the rigidity and dimensional stability of the resin composition, an inorganic filler can be added. The filler type can be arbitrarily selected according to the purpose, but glass fiber, glass flake, mica, talc, silica, zircon, alumina, gypsum, quartz, magnesite, kaolin, silicon carbide, calcium carbonate, iron powder, copper powder, etc. are generally used. It is commonly used.
To the resin composition of the present invention, in order to impart still other properties, other additives such as a plasticizer, an antioxidant, and a stabilizer such as an ultraviolet absorber, curing are not impaired so long as the effects of the present invention are not impaired. Agents, effect promoters, antistatic agents, stress relievers, release agents, flow regulators, dyes, sensitizers, coloring pigments, rubbery polymers and the like can be added. Further, conventionally known various flame retardants and flame retardant assistants, for example, alkali metal hydroxides or alkaline earth metal hydroxides such as magnesium hydroxide and aluminum hydroxide containing water of crystallization, zinc borate compounds, Addition of a zinc stannate compound and further an inorganic silicon compound such as silica, kaolin clay, and talc can further improve flame retardancy.
[0016]
The method for producing the resin composition of the present invention is not particularly limited as long as the effects of the present invention can be achieved. For example, kneading can be performed using a kneading machine such as an extruder, a heating roll, a kneader, and a Banbury mixer. Among them, kneading with an extruder is preferable in terms of productivity. The kneading temperature may be in accordance with the preferred processing temperature of the base resin, and is in the range of 200 to 360 ° C, preferably in the range of 240 to 320 ° C.
[0017]
In the case of a thermosetting resin, the components for producing the resin composition are mixed using a solvent that can be uniformly mixed, or mixed without a solvent, cast into a mold, cured, and then cooled. Then, a method of obtaining a molded product by taking out from the mold may be used. Further, a method of kneading and manufacturing using a kneading machine such as a heating roll, a kneader, a Banbury mixer, an extruder, cooling, pulverizing, and further performing molding by transfer molding, injection molding, compression molding, or the like may be mentioned as an example. it can. The curing method varies depending on the curing agent used, but is not particularly limited. Examples include thermal curing, light curing, curing by pressure, curing by moisture, and the like, but are not limited as long as the curing method can achieve the effects of the present invention. The order of mixing the components is not particularly limited as long as the effects of the present invention can be achieved. As a method for producing the resin composition, a preferable method can be used depending on the suitability of each resin.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited to the following Examples. “%” In the following Examples and Comparative Examples means “% by weight”.
The components used in the examples and comparative examples are as follows.
(A) Resin PPE: polyphenylene ether Poly-2,6-dimethyl-1,4-phenylene ether having an ηsp / c of 0.52 measured with a chloroform solution at 30 ° C.
Rubber-reinforced polystyrene (HIPS): rubber-reinforced polystyrene having a rubber content of 9%, ηsp / c of matrix polystyrene measured at 30 ° C. and a toluene solution of 0.70, and a volume average rubber particle diameter of 1.5 μm.
GP685: polystyrene 685 (manufactured by A & M Styrene Co., Ltd.)
(B) Phosphazene:
FR1: hexa (o-crezoxy) phosphazene represented by the formula (4), in which no peak other than hexa (o-crezooxy) phosphazene represented by the formula (4) is observed in 31 PNMR.
[0019]
Embedded image
[0020]
FR2: a cyclic phosphazene trimer represented by the formula (5), in which a peak other than the phosphazene represented by the formula (5) is not observed in 31 P NMR.
[0021]
Embedded image
[0022]
FR3: a cyclic phosphazene trimer represented by the formula (6), in which a peak other than the phosphazene represented by the formula (6) is not observed in 31 P NMR.
[0023]
Embedded image
[0024]
FR4: a cyclic phosphazene trimer represented by the formula (7), in which a peak other than the phosphazene represented by the formula (7) is not observed in 31 P NMR.
[0025]
Embedded image
[0026]
FR5: a cyclic hexaphenoxyphosphazene trimer represented by the formula (8), in which a peak other than the cyclic hexaphenoxyphosphazene represented by the formula (8) is not observed in 31 P NMR.
[0027]
Embedded image
[0028]
FR6: triphenyl phosphate The physical properties of the resin compositions of Examples and Comparative Examples were evaluated by the following methods.
(1) Flame retardancy: Based on the UL-94 vertical combustion test, a molded test piece having a length of 128 mm, a width of 12.8 mm, and a thickness of 1.6 mm was used. V-0, V-1, V-2 and four levels out of the standard were classified according to the presence or absence of cotton ignition by the dripping material at the time. The evaluation criteria are shown below, and the shorter the quenching time, the better the flame retardancy.
[0029]
V-0: All of the following conditions are satisfied.
(A) The total of the flame extinction time after the 10 times of flame contact, 5 test pieces twice each, within 50 seconds.
(B) Five test pieces were subjected to flame contact twice each, and the flame extinction time after each flame contact was within 5 seconds.
(C) There is no ignition of absorbent cotton 300 mm below by the dripping material in all the test pieces.
(D) For all test pieces, glowing after the second flame contact was within 30 seconds.
(E) For all test pieces, do not frame until the clamp.
[0030]
V-1: All the following conditions are satisfied.
(A) The total flame extinction time after the flame contact of 10 times, 5 times each for 2 test pieces, is 250 seconds or less.
(B) Five test pieces were subjected to flame contact twice each, and the extinction time after each flame contact was within 30 seconds.
(C) There is no ignition of absorbent cotton 300 mm below by the dripping material in all the test pieces.
(D) For all test pieces, glowing after the second flame contact was within 60 seconds.
(E) For all test pieces, do not frame until the clamp.
[0031]
V-2: All the following conditions are satisfied.
(A) The total flame extinction time after the flame contact of 10 times, 5 times each for 2 test pieces, is 250 seconds or less.
(B) Five test pieces were subjected to flame contact twice each, and the extinction time after each flame contact was within 30 seconds.
(C) At least one of the five test pieces ignited the absorbent cotton 300 mm below by the dripping material.
(D) For all test pieces, glowing after the second flame contact was within 60 seconds.
(E) For all test pieces, do not frame until the clamp.
[0032]
(2) Dielectric Characteristics The relative permittivity and the dielectric loss tangent were measured at a frequency of 1 GHz, 5 GHz, and 10 GHz by a triplate method using a 150 × 150 mm molded piece having a thickness of about 2 mm.
[0033]
Examples 1-4, Comparative Examples 1-2
Each component was mixed at the ratio shown in Table 1, supplied to a twin-screw extruder with a screw diameter of 25 mm and the maximum temperature of the heating cylinder was set to 300 ° C, melt-kneaded at a screw rotation speed of 300 rpm, and cooled and cut the strand. Thus, resin composition pellets were obtained.
Next, physical properties test pieces were formed from the obtained resin composition pellets at 240 to 290 ° C. by injection molding, and physical properties tests were performed by the above-described test methods.
[0034]
[Table 1]
[0035]
【The invention's effect】
The present invention provides a resin composition which does not contain a halogen compound, has excellent electrical properties, is environmentally preferable, and has high flame retardancy.
Claims (16)
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006043460A1 (en) * | 2004-10-18 | 2006-04-27 | Asahi Kasei Chemicals Corporation | Flame retardant composition |
JP2007262191A (en) * | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | Flame-retardant curable resin composition |
JP2008247800A (en) * | 2007-03-30 | 2008-10-16 | Fushimi Pharm Co Ltd | Cyclic phosphazene compound containing reactive group and method for producing the same |
JP2013087203A (en) * | 2011-10-19 | 2013-05-13 | Shin-Etsu Chemical Co Ltd | Liquid silicone rubber coating composition, curtain airbag, and method for manufacturing the curtain airbag |
JP2013209517A (en) * | 2012-03-30 | 2013-10-10 | Shin-Etsu Chemical Co Ltd | Liquid silicone rubber coating agent composition for curtain airbag and method for producing the same |
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2002
- 2002-09-13 JP JP2002268113A patent/JP2004107374A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006043460A1 (en) * | 2004-10-18 | 2006-04-27 | Asahi Kasei Chemicals Corporation | Flame retardant composition |
US7759418B2 (en) | 2004-10-18 | 2010-07-20 | Asahi Kasei Chemicals Corporation | Flame retardant resin composition |
JP2007262191A (en) * | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | Flame-retardant curable resin composition |
JP2008247800A (en) * | 2007-03-30 | 2008-10-16 | Fushimi Pharm Co Ltd | Cyclic phosphazene compound containing reactive group and method for producing the same |
JP2013087203A (en) * | 2011-10-19 | 2013-05-13 | Shin-Etsu Chemical Co Ltd | Liquid silicone rubber coating composition, curtain airbag, and method for manufacturing the curtain airbag |
JP2013209517A (en) * | 2012-03-30 | 2013-10-10 | Shin-Etsu Chemical Co Ltd | Liquid silicone rubber coating agent composition for curtain airbag and method for producing the same |
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