JP2004095710A - Wafer treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus in which a treatment liquid is uniformly fed to a wafer when feeding the treatment liquid to the wafer by spraying the treatment liquid out of a plurality of spray holes of a treatment liquid feeding means within a treatment chamber. <P>SOLUTION: The apparatus is equipped with a treatment liquid feeding nozzle 14 which is arranged within a treatment chamber 10, has a plurality of spray holes 16 for spraying the treatment liquid, and feeds the treatment liquid to a wafer W. In the apparatus, groove-like or stripe-like projections each having a spiral form turning around an axial center line of each spray hole 16 are formed on an inner peripheral surface of the spray hole 16. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display, and an electronic component using a processing liquid.
[0002]
[Prior art]
For example, in a semiconductor device manufacturing process, when a plurality of substrates are simultaneously cleaned with a processing solution such as a chemical solution or pure water, a processing tank for storing the processing liquid is provided, and a plurality of ejection tanks are provided inside the processing tank. A batch-type cleaning apparatus having a processing liquid supply nozzle having an opening is used. Then, the plurality of substrates are arranged in one direction in parallel with each other, held in the holder, the plurality of substrates held in the holder are loaded into the processing tank, and the plurality of substrates formed in a line in the processing liquid supply nozzle are processed. The processing liquid is ejected from the ejection holes, and the processing liquid is supplied to the plurality of substrates held by the holder in the processing tank, thereby cleaning the substrates.
[0003]
In this case, for example, in a processing tank in a batch-type cleaning apparatus for cleaning 50 substrates, a cross-sectional view cut in a direction orthogonal to the axial direction is shown in FIG. As shown in the respective cutaway partial cross-sectional views, a tubular processing liquid supply nozzle 1 in which a plurality of, for example, 54 ejection holes 2 are formed in parallel in one direction is provided. The ejection hole 2 of the processing liquid supply nozzle 1 has a diameter of, for example, 0.7 mm to 1.1 mm, and is formed so as to penetrate the pipe wall surface in a straight line. Then, the processing liquid supply nozzle 1 is oriented so as to be parallel to the arrangement direction of the plurality of substrates W held by the holder (not shown), and so that the ejection holes 2 are oriented in the direction along the surface of the substrate W. The processing liquid is ejected from each ejection hole 2 so that the processing liquid is supplied to all the substrates W.
[0004]
[Problems to be solved by the invention]
In the above-described conventional cleaning apparatus, even if the ejection holes 2 are formed linearly on the pipe wall surface of the treatment liquid supply nozzle 1, the direction of the treatment liquid ejected from each ejection hole 2 of the treatment liquid supply nozzle 1 is as follows. It is not always constant. For this reason, as shown by arrows in FIG. 8, the direction in which the processing liquid is jetted out, there is a region between the substrates W where the processing liquid from the processing liquid supply nozzle 1 is excessively supplied. There are regions between the substrates W to which the processing liquid is not supplied. As a result, there is a problem that the supply of the processing liquid between the respective substrates W becomes uneven, and the uniformity of the cleaning processing of the substrates W cannot be obtained.
[0005]
The present invention has been made in view of the above circumstances, and when a processing liquid is supplied to a substrate by ejecting the processing liquid from a plurality of ejection holes of a processing liquid supply unit in a processing tank, It is an object of the present invention to provide a substrate processing apparatus capable of making the supply of the processing liquid uniform to the substrate and making the substrate processing uniform.
[0006]
[Means for Solving the Problems]
The invention according to claim 1 is a substrate processing apparatus for performing a predetermined processing on a substrate with a processing liquid, a processing tank storing the processing liquid, holding means for holding the substrate in the processing tank, A plurality of ejection holes for ejecting the treatment liquid, and a treatment liquid supply means for supplying the treatment liquid to the substrate held by the holding means; and an inner peripheral surface of each of the ejection holes. And a groove having a helical shape revolving around the axis of the ejection hole.
[0007]
According to a second aspect of the present invention, in a substrate processing apparatus for performing a predetermined process on a substrate with a processing liquid, a processing tank for storing the processing liquid, holding means for holding the substrate in the processing tank, A plurality of ejection holes for ejecting the treatment liquid, and a treatment liquid supply means for supplying the treatment liquid to the substrate held by the holding means; and an inner peripheral surface of each of the ejection holes. And a streak-like convex portion having a spiral shape that turns around the axis of the ejection hole.
[0008]
According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the holding unit holds a plurality of substrates arranged in a predetermined direction, and the processing liquid supply unit includes: The plurality of substrates are arranged in parallel with the arrangement direction of the plurality of substrates by the holding unit, and each of the ejection holes is formed in the processing liquid supply unit corresponding to a position between the substrates held by the substrate holding unit. It is characterized by the following.
[0009]
According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, the processing liquid supply unit includes a plurality of processing liquid supply nozzles having ejection holes formed therein, and the processing liquid supply means is formed in the processing liquid supply nozzle. An axial direction of the ejection hole is orthogonal to an arrangement direction of the plurality of substrates held by the holding means and is different for each processing liquid supply nozzle.
[0010]
According to a fifth aspect of the present invention, in the substrate processing apparatus according to the third aspect, the processing liquid supply unit rotates about an axis parallel to an arrangement direction of the plurality of substrates held by the holding unit. Preferably, the direction in which the processing liquid is ejected from the ejection hole varies.
[0011]
In the substrate processing apparatus according to the first aspect of the present invention, since the spiral groove is formed on the inner peripheral surface of the ejection hole of the processing liquid supply means, the action of the groove when the processing liquid passes through the ejection hole is formed. As a result, the processing liquid is swirled around the axis of the ejection hole, and the processing liquid is ejected from the ejection hole in a swirling state. By forming the swirling flow, the processing liquid is given straightness, and the processing liquid is jetted straight out in a direction parallel to each other from each ejection hole of the processing liquid supply means. Therefore, the supply of the processing liquid from the processing liquid supply unit to the substrate can be made uniform. In addition, since the processing liquid forms a swirling flow, the momentum of the jet flow from the jet holes increases, and the processing liquid reaches farther.
[0012]
In the substrate processing apparatus according to the second aspect of the present invention, since a spiral streak is formed on the inner peripheral surface of the ejection hole of the processing liquid supply means, when the processing liquid passes through the ejection hole. The processing liquid is swirled around the axis of the ejection hole by the action of the streak-like projection, and the processing liquid is ejected from the ejection hole in a swirling flow state. By forming the swirling flow, the processing liquid is given straightness, and the processing liquid is jetted straight out in a direction parallel to each other from each ejection hole of the processing liquid supply means. Therefore, the supply of the processing liquid from the processing liquid supply unit to the substrate can be made uniform. In addition, since the processing liquid forms a swirling flow, the momentum of the jet flow from the jet holes increases, and the processing liquid reaches farther.
[0013]
In the substrate processing apparatus according to the third aspect of the present invention, the respective ejection holes are formed in the processing liquid supply means in correspondence with the positions between the respective substrates arranged and held in the substrate holding means in a predetermined direction. Therefore, the processing liquid spouted straight from each jetting hole of the processing liquid supply means in a direction parallel to each other is uniformly supplied to the region between the substrates.
[0014]
In the substrate processing apparatus according to the fourth aspect of the present invention, the processing liquid is supplied from the ejection holes of the processing liquid supply nozzles in a direction orthogonal to the arrangement direction of the plurality of substrates held by the holding means, and The processing liquid can be uniformly supplied to the entire surface of the substrate by ejecting the processing liquid in different directions.
[0015]
In the substrate processing apparatus according to the fifth aspect of the present invention, the processing liquid supply unit rotates about an axis parallel to the arrangement direction of the plurality of substrates held by the holding unit as a center of rotation, so that the processing liquid is supplied from the ejection hole. It is possible to supply the processing liquid evenly to the entire surface of the substrate by changing the ejection direction of the substrate.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described with reference to FIGS.
[0017]
FIG. 1 shows an example of an embodiment of the present invention, and is a schematic cross-sectional view showing a schematic configuration of a main part of a cleaning apparatus which is a substrate processing apparatus, showing a left half of a processing tank.
[0018]
This cleaning apparatus includes a processing tank 10 in which a substrate W is loaded and accommodated. An overflow liquid receiving portion 12 is provided on the upper portion of the processing tank 10, and the processing liquid that overflows from the upper portion of the processing tank 10 flows into the overflow liquid receiving portion 12, Is discharged through a drain pipe (not shown). Although not shown, a plurality of substrates W are arranged in parallel with one another at equal intervals in one direction, held by a holder, and carried into the processing tank 10 in that state for cleaning. Note that the basic configuration of the cleaning apparatus is not particularly different from that of the conventional apparatus, and a detailed description thereof will be omitted.
[0019]
A processing liquid supply nozzle 14 is provided below the processing tank 10. Although only the left half of the processing tank 10 is shown in FIG. 1, a processing liquid supply nozzle 14 is also provided on the right side of the processing tank 10. The processing liquid supply nozzle 14 is formed in a tubular shape, and is disposed in parallel with the arrangement direction of the plurality of substrates W held by the holder. A plurality of ejection holes 16 are formed in the processing liquid supply nozzle 14 so as to penetrate the pipe wall surface in a straight line and open into the processing tank 10, and the plurality of ejection holes 16 are arranged in one direction. They are provided in parallel. These ejection holes 16 are formed in the processing liquid supply nozzle 14 such that their respective axes are parallel to each other. Further, each ejection hole 16 is formed along a direction orthogonal to the length direction of the processing liquid supply nozzle 14, that is, a direction orthogonal to the arrangement direction of the plurality of substrates W held by the holder. Further, as shown schematically in a partial cross-sectional view in FIG. 2, each ejection hole 16 is arranged corresponding to a position between each substrate W held by the holder, and one ejection hole 16 is provided. Are provided so as to be directed to a region between one substrate W.
[0020]
The diameter of the ejection hole 16 is, for example, 0.7 mm to 1.1 mm. FIG. 3A is an enlarged cross-sectional view of a part of the wall surface of the processing liquid supply nozzle 14, and FIG. As shown in (a) in the direction indicated by the arrow in FIG. 1), on the inner peripheral surface of each ejection hole 16, a groove 18 having a helical shape that turns around the axis C of the ejection hole 16 is provided. Is formed. 4A shows an enlarged cross-sectional view of a part of the pipe wall surface of the processing liquid supply nozzle 14 in place of the groove 18, and FIG. As shown in FIG. 4 (a view in the direction indicated by the arrow in FIG. 4A), a spiral shape that turns around the axis C of the ejection hole 16 is formed on the inner peripheral surface of each ejection hole 16. The streaky projections 20 may be formed.
[0021]
As shown in FIG. 3, a spiral groove 18 is formed on the inner peripheral surface of the ejection hole 16 of the processing liquid supply nozzle 14, or, as shown in FIG. The spiral streaks 20 are formed on the inner peripheral surface of the nozzle, so that when the processing liquid passes through the ejection holes 16, the processing liquid is discharged by the action of the grooves 18 and the streaks 20. Is turned around the axis C. Then, the processing liquid is ejected from the ejection holes 16 in a swirling flow state, whereby the processing liquid is given a straight-forward property, and the processing liquid is straightened in a direction parallel to each other from each ejection hole 16 of the treatment liquid supply nozzle 14. It is gushing. Therefore, the supply of the processing liquid from the processing liquid supply nozzle 14 to the substrate W can be made uniform. Further, the momentum of the liquid flow ejected from the ejection hole 16 of the treatment liquid ejection nozzle 14 increases, and the treatment liquid reaches farther.
[0022]
Next, FIG. 5 is a schematic diagram showing a schematic configuration of the cleaning device. As shown in FIG. 5, a plurality of processing liquid supply nozzles 14 each having a plurality of ejection holes 16 in which the grooves 18 or the streaks 20 are formed on the inner peripheral surface as described above, You may make it arrange | position in parallel and close mutually by three. In this case, the three processing liquid supply nozzles 14 are arranged such that the axial direction of the ejection holes 16 is different for each processing liquid supply nozzle 14. An on-off valve 24 is inserted in each processing liquid supply pipe 22 connected to each processing liquid supply nozzle 14.
[0023]
In the cleaning apparatus having the configuration shown in FIG. 5, the processing liquid is ejected from the ejection holes 16 of each processing liquid supply nozzle 14 by arrows in a direction orthogonal to the arrangement direction of the plurality of substrates W held by the holder 26. As shown in the drawing, each processing liquid supply nozzle 14 is ejected in a different direction. Thus, the processing liquid can be uniformly supplied to the entire surface of the substrate W. Further, by individually opening and closing the respective on-off valves 24 inserted in the respective processing liquid supply pipes 22, the processing liquid supply nozzles 14 for ejecting the processing liquid from the ejection holes 16 can be selectively switched.
[0024]
FIG. 6 is a schematic diagram showing another schematic configuration of the cleaning apparatus. As shown in FIG. 6, a plurality of grooves 18 or streaks 20 are formed on the inner peripheral surface as described above. The processing liquid supply nozzle 14 provided with the ejection holes 16 of FIG. And a rotation mechanism (not shown) for rotating the processing liquid supply nozzle 14 may be provided. In the cleaning apparatus having such a configuration, as the processing liquid supply nozzle 14 rotates, the direction in which the processing liquid is ejected from the ejection holes 16 changes as indicated by arrows. With this operation, the processing liquid can be uniformly supplied to the entire surface of the substrate W.
[0025]
【The invention's effect】
When the substrate processing apparatus according to the first and second aspects of the present invention is used, the processing liquid is ejected from the plurality of ejection holes of the processing liquid supply means in the processing tank to supply the processing liquid to the substrate. The supply of the processing liquid to the substrate can be made uniform, so that uniformity of the substrate processing can be obtained. Further, since the processing liquid spouted from the spouting holes of the processing liquid supply means reaches farther, the amount of spouting of the processing liquid can be reduced.
[0026]
In the substrate processing apparatus according to the third aspect of the present invention, the processing liquid ejected from each ejection hole of the processing liquid supply means can be uniformly supplied to the region between the substrates.
[0027]
In the substrate processing apparatus according to the fourth and fifth aspects of the present invention, the processing liquid can be uniformly supplied to the entire surface of the substrate.
[Brief description of the drawings]
FIG. 1 shows an example of an embodiment of the present invention, and is a schematic cross-sectional view illustrating a schematic configuration of a main part of a cleaning apparatus, which is a substrate processing apparatus, illustrating a left half of a processing tank.
FIG. 2 is a partial sectional view schematically showing a part of the cleaning device shown in FIG.
3 shows an example of a configuration of a processing liquid discharge nozzle which is a component of the cleaning apparatus shown in FIG. 1, and FIG. 3 (a) is a cross-sectional view in which a part of a pipe wall surface of the processing liquid supply nozzle is enlarged. (B) is an enlarged view as seen in the direction indicated by the arrow in (a).
4A and 4B show another configuration example of the processing liquid discharge nozzle, in which FIG. 4A is a cross-sectional view in which a part of a pipe wall surface of the processing liquid supply nozzle is enlarged, and FIG. It is the enlarged view seen in the direction shown by the arrow.
FIG. 5 is a schematic view showing another embodiment of the present invention and showing a schematic configuration of a cleaning apparatus.
FIG. 6 is a schematic view showing still another embodiment of the present invention and schematically illustrating a configuration of a cleaning apparatus.
FIG. 7 is a vertical sectional view of a processing liquid supply nozzle which is a component of a conventional cleaning apparatus.
FIG. 8 is a view for explaining a problem in the conventional cleaning apparatus, and is a partial cross-sectional view schematically showing a part of the apparatus.
[Explanation of symbols]
REFERENCE SIGNS LIST 10 processing tank 12 overflow liquid receiving section 14 processing liquid supply nozzle 16 ejection hole 18 groove 20 streak-shaped convex portion W substrate

Claims (5)

In a substrate processing apparatus that performs predetermined processing on a substrate with a processing liquid,
A processing tank for storing a processing liquid,
Holding means for holding a substrate in the processing bath,
A processing liquid supply unit that is disposed in the processing tank and has a plurality of ejection holes for ejecting the processing liquid, and supplies the processing liquid to the substrate held by the holding unit;
A substrate processing apparatus, wherein a groove having a spiral shape that turns around an axis of the ejection hole is formed on an inner peripheral surface of each ejection hole. In a substrate processing apparatus that performs predetermined processing on a substrate with a processing liquid,
A processing tank for storing a processing liquid,
Holding means for holding a substrate in the processing bath,
A processing liquid supply unit that is disposed in the processing tank and has a plurality of ejection holes for ejecting the processing liquid, and supplies the processing liquid to the substrate held by the holding unit;
A substrate processing apparatus, wherein a streak-like convex portion having a spiral shape that turns around an axis of the ejection hole is formed on an inner peripheral surface of each ejection hole. In the substrate processing apparatus according to claim 1 or 2,
The holding means holds a plurality of substrates arranged in a predetermined direction,
The processing liquid supply means is arranged in parallel with the direction of arrangement of the plurality of substrates by the holding means,
The substrate processing apparatus according to claim 1, wherein each of the ejection holes is formed in the processing liquid supply unit so as to correspond to a position between the substrates held by the substrate holding unit. The substrate processing apparatus according to claim 3,
The treatment liquid supply means includes a plurality of treatment liquid supply nozzles having ejection holes formed therein, and the axial direction of the ejection holes formed in the treatment liquid supply nozzles corresponds to a plurality of substrates held by the holding means. A substrate processing apparatus orthogonal to the arrangement direction and different for each processing liquid supply nozzle. The substrate processing apparatus according to claim 3,
The processing liquid supply unit is rotatable around an axis parallel to an arrangement direction of the plurality of substrates held by the holding unit, and a direction in which the processing liquid is ejected from the ejection hole is changed. Substrate processing apparatus.

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