JP2004091735A5 - - Google Patents
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- Publication number
- JP2004091735A5 JP2004091735A5 JP2002257935A JP2002257935A JP2004091735A5 JP 2004091735 A5 JP2004091735 A5 JP 2004091735A5 JP 2002257935 A JP2002257935 A JP 2002257935A JP 2002257935 A JP2002257935 A JP 2002257935A JP 2004091735 A5 JP2004091735 A5 JP 2004091735A5
- Authority
- JP
- Japan
- Prior art keywords
- bis
- benzene
- aminophenyl
- diamine residue
- aromatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- -1 phenolic aromatic diamine Chemical group 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 150000004984 aromatic diamines Chemical group 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 0 **(*)*NC(*C(N*(*)*)=O)=O Chemical compound **(*)*NC(*C(N*(*)*)=O)=O 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- GOJFAKBEASOYNM-UHFFFAOYSA-N 2-(2-aminophenoxy)aniline Chemical class NC1=CC=CC=C1OC1=CC=CC=C1N GOJFAKBEASOYNM-UHFFFAOYSA-N 0.000 description 1
- QHDSBTKCTUXBEG-UHFFFAOYSA-N 2-[2-(2-aminophenoxy)phenoxy]aniline Chemical class NC1=CC=CC=C1OC1=CC=CC=C1OC1=CC=CC=C1N QHDSBTKCTUXBEG-UHFFFAOYSA-N 0.000 description 1
- ULPWATNJVBJKGM-UHFFFAOYSA-N 3-[2-(3-amino-2-phenoxyphenyl)propan-2-yl]-2-phenoxyaniline Chemical compound C=1C=CC(N)=C(OC=2C=CC=CC=2)C=1C(C)(C)C1=CC=CC(N)=C1OC1=CC=CC=C1 ULPWATNJVBJKGM-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- CRQOXQHXNMQFBU-UHFFFAOYSA-N 4-[3-(4-aminophenyl)sulfonylphenyl]sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(S(=O)(=O)C=2C=CC(N)=CC=2)=C1 CRQOXQHXNMQFBU-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- FPVZSJGTRGMMCI-UHFFFAOYSA-N 4-[4-(4-aminophenyl)sulfanylphenyl]sulfanylaniline Chemical compound C1=CC(N)=CC=C1SC(C=C1)=CC=C1SC1=CC=C(N)C=C1 FPVZSJGTRGMMCI-UHFFFAOYSA-N 0.000 description 1
- FALSKAFGDLHVDW-UHFFFAOYSA-N 4-[4-(4-aminophenyl)sulfonylphenyl]sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(S(=O)(=O)C=2C=CC(N)=CC=2)C=C1 FALSKAFGDLHVDW-UHFFFAOYSA-N 0.000 description 1
- SCPMRYRMHUNXQD-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)-3,5-dimethylphenyl]propan-2-yl]-2,6-dimethylphenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=C(C)C(OC=3C=CC(N)=CC=3)=C(C)C=2)=CC(C)=C1OC1=CC=C(N)C=C1 SCPMRYRMHUNXQD-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- ICIBAWVEVXJTCZ-UHFFFAOYSA-N 4-[[3-[(4-aminophenyl)methyl]phenyl]methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(CC=2C=CC(N)=CC=2)=C1 ICIBAWVEVXJTCZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002257935A JP4095381B2 (ja) | 2002-09-03 | 2002-09-03 | 芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002257935A JP4095381B2 (ja) | 2002-09-03 | 2002-09-03 | 芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004091735A JP2004091735A (ja) | 2004-03-25 |
| JP2004091735A5 true JP2004091735A5 (enExample) | 2006-08-31 |
| JP4095381B2 JP4095381B2 (ja) | 2008-06-04 |
Family
ID=32062728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002257935A Expired - Fee Related JP4095381B2 (ja) | 2002-09-03 | 2002-09-03 | 芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4095381B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007018838A (ja) * | 2005-07-07 | 2007-01-25 | Totoku Electric Co Ltd | 超耐熱自己融着線 |
| JP4654135B2 (ja) * | 2006-02-13 | 2011-03-16 | 日東シンコー株式会社 | 接着剤 |
| JP2008045036A (ja) * | 2006-08-17 | 2008-02-28 | Toyobo Co Ltd | ポリアミド樹脂およびそれを用いた組成物、接着剤、接着剤シートおよびプリント回路基板 |
| JP2008243831A (ja) * | 2007-03-23 | 2008-10-09 | Nippon Denki Kagaku Co Ltd | 薄膜素子の転写方法及び転写体 |
| KR20100057777A (ko) * | 2007-08-27 | 2010-06-01 | 니폰 가야꾸 가부시끼가이샤 | 열경화성 수지 조성물 및 그 경화물 |
| JP5453037B2 (ja) * | 2009-10-06 | 2014-03-26 | 東レ・ダウコーニング株式会社 | アラミドシリコーンポリマーの架橋方法及び熱硬化性組成物 |
| FR2974102B1 (fr) * | 2011-04-13 | 2014-08-22 | Rhodia Operations | Composition polyamide stabilisee |
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2002
- 2002-09-03 JP JP2002257935A patent/JP4095381B2/ja not_active Expired - Fee Related