JP2004087143A - Transfer base, transferring apparatus, and transferring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer base for reducing the cost of an organic EL display. <P>SOLUTION: Three-color (R, G, B) organic emission coloring matter pattern layers 82 (82R, 82G and 82B) corresponding to three primary colors of light, and a marker 83 for alignment are arranged on one surface of a substrate body 81 for transmitting laser beams, thus composing the transfer base 80. By using the transfer base 80, the substrate body 81 is irradiated with laser beams from the outside, and heat based on laser beams through the substrate body 81 is utilized for sublimating the organic emission coloring matter pattern layer 82, thus transferring the organic emission coloring matter pattern layer 82 from the transfer base 80 to a wiring board. Since a heat source (in this case, a laser light source) required for transferring the organic emission coloring matter pattern layer 82 is not equipped, the transfer base 80 becomes less expensive by that amount since no heat source is equipped. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a transfer substrate used for patterning an organic luminescent dye layer on a transfer target substrate such as a wiring substrate, and a transfer device and a transfer method used for manufacturing a display device using the transfer substrate. .
[0002]
[Prior art]
2. Description of the Related Art In recent years, displays equipped with various display mechanisms have been known as displays for displaying images. Among them, a flat full-color organic EL display utilizing the light emission phenomenon of an organic EL (Electro Luminescent) element has been attracting attention because of its low driving voltage and high luminance.
[0003]
As a display method of the organic EL display, for example, three-color independent light emission in which three organic light-emitting dye layers corresponding to three primary colors of light (R (Red), G (Green), and B (Blue)) are arranged in a pattern. System, a color filter system using three-color (R, G, B) color filters, or a CCM (Color Changing Media) that performs color conversion on light obtained from a blue light source or a white light source using a color conversion filter. ) Method. Among these, the organic EL display employing the three-color independent light-emitting method includes a light-emitting panel in which pixels of three colors (R, G, B) are arranged in a pattern on a transparent wiring board. This light-emitting panel is manufactured by patterning organic light-emitting dye layers of three colors constituting pixels on a wiring board.
[0004]
As a method of pattern-forming an organic light-emitting dye layer of three colors on a wiring substrate, for example, three methods of a transfer method, a vapor deposition method, and an ink jet method are known.
[0005]
The transfer method is, for example, a method using a transfer substrate having a configuration in which three organic light-emitting dye pattern layers are arranged on a substrate provided with a heating mechanism, as disclosed in Japanese Patent No. 2918037. In this transfer method, in a state where the transfer substrate is in close contact with the wiring substrate, the organic light emitting dye pattern layer is heated using a heating mechanism, and the organic light emitting dye pattern layer is sublimated for each color and transferred to the wiring substrate. As a result, an organic luminescent dye layer is formed on the wiring substrate in a pattern. In the transfer method, for example, as disclosed in Japanese Patent Application Laid-Open No. 2001-196168, a film-shaped transfer substrate having flexibility may be used.
[0006]
For example, as disclosed in Japanese Patent No. 2850906, a vapor deposition method includes disposing a mask between a vapor deposition source and a wiring substrate, and performing a vapor deposition process for each color using the mask, so that a wiring substrate is formed. This is a technique for forming a pattern of an organic luminescent dye layer.
[0007]
In the ink-jet method, for example, as disclosed in Japanese Patent Application Laid-Open No. 2000-106278, an ink-jet device is scanned on a wiring substrate and an organic light-emitting This is a technique for patterning a layer.
[0008]
Among these three methods, the transfer method is superior to other vapor deposition methods and ink jet methods mainly in terms of workability in manufacturing a light emitting panel. This is because, for example, when a display manufacturer manufactures a light emitting panel, the vapor deposition method or the ink jet method has a trouble that an operator has to handle an organic light emitting dye by himself, but the transfer method requires an organic light emitting dye. This is because, if a transfer substrate having a pattern layer formed in advance is obtained, the operator does not have to handle the organic luminescent dye by himself.
[0009]
[Problems to be solved by the invention]
By the way, in order to widely spread the organic EL display in the market, it is necessary to make the cost of the transfer substrate used in the transfer method as low as possible, for example, in order to differentiate it from other competitive displays in terms of cost. There is.
[0010]
It is also desired to establish a transfer device and a manufacturing method capable of mass-producing an organic EL display using the transfer substrate after realizing the cost reduction of the transfer substrate.
[0011]
The present invention has been made in view of such a problem, and a first object of the present invention is to provide a transfer substrate that can reduce the cost of an organic EL display.
[0012]
A second object of the present invention is to provide a transfer device and a transfer method capable of mass-producing an organic EL display using the above-described transfer substrate.
[0013]
[Means for Solving the Problems]
The transfer substrate of the present invention is used for pattern-forming an organic light emitting dye layer on a substrate to be transferred, and has a substrate main body having a light transmitting part capable of transmitting light, and is arranged in the light transmitting part of the substrate main body And an organic luminescent dye pattern layer that can be transferred to a transfer substrate using heat based on light.
[0014]
The transfer device of the present invention is used for manufacturing a display device that displays an image using an organic light-emitting dye layer, and a light transmission portion of a substrate main body having a light transmission portion capable of transmitting light, The transfer substrate with the organic light emitting dye pattern layer that can be transferred to the transfer substrate using light based heat, and the transfer substrate together with the transfer substrate so that the organic light emitting dye pattern layer faces the transfer substrate The light emitting device includes a holding mechanism for holding the light, and a light source that irradiates light to the light transmitting portion of the substrate body.
[0015]
The transfer method of the present invention is a method used for manufacturing a display device that displays an image using an organic light-emitting dye layer, and a light-transmitting portion of a substrate main body having a light-transmitting portion capable of transmitting light. Using a transfer substrate on which an organic luminescent dye pattern layer that can be transferred to a transferred substrate using heat based on is arranged, using a holding mechanism, such that the organic luminescent dye pattern layer faces the transferred substrate, After the transfer substrate is held together with the substrate to be transferred, by irradiating light from the light source toward the light transmitting portion of the substrate body, the organic light emitting dye pattern layer is transferred to the substrate to be transferred using heat based on light. It was made.
[0016]
In the transfer substrate of the present invention, when light is applied to the light transmitting portion of the substrate body, the organic light emitting dye pattern layer arranged in the light transmitting portion is formed by utilizing heat based on the light transmitted through the light transmitting portion. The image is transferred to the substrate to be transferred. As a result, an organic luminescent dye layer is pattern-formed on the transferred substrate.
[0017]
In the transfer device and the transfer method of the present invention, an organic luminescent dye pattern layer that can be transferred to a substrate to be transferred using heat based on light is arranged in a light transmitting portion of a substrate body having a light transmitting portion capable of transmitting light. After the transfer substrate is held together with the transfer substrate by the holding mechanism so that the organic light emitting dye pattern layer faces the transfer substrate, the light source is directed toward the light transmitting portion of the substrate body. By irradiating the light, the organic light emitting dye pattern layer is transferred to the transfer target substrate using heat based on the light. Thus, a display device that displays an image using the organic light emitting dye layer is manufactured.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0019]
First, a configuration of a transfer device according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 shows a schematic cross-sectional configuration of the transfer device. The “transfer method” of the present invention is embodied based on the functions and operations of the present transfer device, and the “transfer substrate” of the present invention is used in the present transfer device. In FIG. 1, the structures of the stage 42, the transfer substrate 80, and the wiring substrate 90 are simplified for convenience of illustration.
[0020]
This transfer device is mainly used for manufacturing an organic EL display, and is particularly for manufacturing a light-emitting panel by a transfer method. As shown in FIG. 1, the transfer device includes a transfer board port 20, a wiring board port 30, a positioning mechanism 40, a transfer mechanism 50, a blower 60, and a suction device 70 provided in a chamber 10. The configuration has been made.
[0021]
The chamber 10 can reduce the internal pressure until a desired low pressure state is achieved, for example.
[0022]
The transfer substrate port 20 is a storage room provided in the chamber 10 for storing the transfer substrate 80, and is provided with a partition wall 20W that can be opened and closed.
[0023]
The wiring board port 30 is a storage room provided in the chamber 10 for storing the wiring board 90, and is provided with a partition wall 30W that can be opened and closed.
[0024]
The positioning mechanism 40 is provided in the chamber 10 for positioning the transfer substrate 80 with respect to the wiring substrate 90, and is provided with a stage 42 disposed on the carrier 41 and attached to the stage 42. And a transport arm 43 and a marker detector 44.
[0025]
The transfer table 41 is for transferring the stage 42 between the alignment mechanism 40 and the transfer mechanism 50, and extends from the work space of the alignment mechanism 40 to the work space of the transfer mechanism 50. .
[0026]
The stage 42 is for holding the transfer substrate 80 and the wiring substrate 90, and is provided with a recess (housing space) 42S for housing the transfer substrate 80 and the wiring substrate 90. The detailed configuration of the stage 42 will be described later (see FIG. 2). Here, the stage 42 corresponds to a specific example of the “holding mechanism” in the present invention.
[0027]
The transfer arm 43 has a function similar to a gripping mechanism such as vacuum tweezers, for example, and grips the transfer substrate 80 and carries it in and out of the transfer substrate port 20 and detaches the transfer substrate 80 from the stage 42. It is. The transfer arm 43 can also carry in / out or attach / detach the wiring board 90 similarly to the transfer board 80.
[0028]
The marker detector 44 is used for aligning the transfer substrate 80 with the wiring substrate 90, and includes an observation device such as an optical microscope.
[0029]
The transfer mechanism 50 is provided outside the chamber 10 for performing a transfer process from the transfer substrate 80 to the wiring substrate 90, and corresponds to the laser light source 51 and the optical window 10M provided in the chamber 10. A mirror 52 and a lens 53 are arranged, and an XY stage 54 that supports the lens 53 is configured.
[0030]
The laser light source 51 emits a laser beam for heating, for example, an excimer laser such as argon fluoride (ArF), krypton fluoride (KrF), xenon chloride (XeF), or a third or third YAG laser. It is constituted by an ultraviolet laser of four harmonics or the like. Here, the laser light source 51 corresponds to a specific example of “light source” in the present invention.
[0031]
The mirror 52 is for reflecting the laser light emitted from the laser light source 51 toward the lens 53, and the lens 53 is for condensing the laser light reflected on the mirror 52.
[0032]
The XY stage 54 is movable in the X-axis direction and the Y-axis direction in the figure. When the lens 53 moves in accordance with the moving operation of the XY stage 54, the laser light condensed by the lens 53 scans on the optical window 10M.
[0033]
The blower 60 is mainly for supplying clean air into the chamber 10 and includes, for example, a fan (not shown) for blowing and a filter 60F for removing foreign matter.
[0034]
The suction device 70 is for discharging clean air supplied into the chamber 10 by the blower 60, and includes, for example, a suction pump (not shown). By operating the blower 60 and the suction device 70, the clean air can be made to flow down in the chamber 10.
[0035]
Next, a detailed configuration of the stage 42 will be described with reference to FIG. FIG. 2 shows an enlarged cross-sectional configuration of the stage 42.
[0036]
As shown in FIG. 2, the accommodation space 42 </ b> S provided in the stage 42 has a two-stage configuration having different space widths (dimensions in the left-right direction in the figure), and is one stage for accommodating the wiring board 90. It includes an eye lower space 42SA and a second upper space 42SB for accommodating the transfer substrate 80. In the storage space 42S, for example, the space width of the upper layer space 42SB substantially matches the width of the transfer substrate 80, whereas the space width of the lower layer space 42SA is slightly larger than the width of the wiring substrate 90. .
[0037]
Discharge pipes 42H1 and 42H2 and supply pipes 42D1 and 42D2 for supplying and exhausting an inert gas such as dry air are provided on the bottom surface of the storage space 42S. The discharge pipe 42H1 is for fixing the wiring board 90 to the stage 42 using suction force based on air exhaust, and the discharge pipe 42H2 is for transferring the transfer substrate 80 to the stage 42 using similar suction force. It is for fixing. The introduction pipe 42D1 is for detaching (floating) the wiring board 90 from the stage 42 using a pressure based on air supply, and the discharge pipe 42H2 is for using the same pressure as the stage 42. This is for detaching the transfer substrate 80 from the substrate. In addition, as shown in FIG. 7 described later, the introduction pipe 42D2 and the discharge pipe 42H2 are connected to the lower space 42SA so that the transfer substrate 80 can be fixed or detached in a state where the wiring board 90 is housed in the lower space 42SA. Are provided corresponding to the gaps G generated when the wiring board 90 is accommodated in the housing. The arrangement positions of the exhaust pipes 42H1 and 42H2 and the introduction pipes 42D1 and 42D2 are not necessarily limited to the above-described cases, and can be freely set according to, for example, the shape, size, or accommodation state of the transfer substrate 80 or the wiring substrate 90. It is. Here, the discharge pipes 42H1 and 42H2 correspond to a specific example of the “suction mechanism” in the present invention.
[0038]
Next, a detailed configuration of the transfer substrate 80 will be described with reference to FIG. FIG. 3 shows an enlarged cross-sectional configuration of the transfer substrate 80.
[0039]
The transfer substrate 80 is used to pattern an organic light emitting dye layer on the wiring substrate 90. As shown in FIG. 3, an organic light emitting dye pattern layer 82 and a marker 83 are formed on one surface of a substrate body 81. Are provided.
[0040]
The substrate main body 81 is made of, for example, a transparent material such as glass so as to transmit laser light when the organic light emitting dye pattern layer 82 is transferred to the wiring substrate 90. The thickness of the substrate body 81 is about 1 mm to 5 mm in consideration of mechanical strength in handling and transparency of laser light.
[0041]
The organic light emitting dye pattern layer 82 is capable of emitting light by the EL phenomenon and capable of sublimating by using heat based on laser light, and has three colors (R, G, B) corresponding to the three primary colors of light. The luminescent dye pattern layers 82R, 82G, and 82B are included. These organic light-emitting dye pattern layers 82R, 82G, and 82B are formed on the substrate main body 81 by using a known vapor deposition method or an ink-jet method. I have. The dimensions of the organic light-emitting dye pattern layers 82R, 82G, and 82B are, for example, about 10 nm to 100 nm in thickness (vertical dimension in the figure) and about 0.3 mm or less in width (horizontal dimension in the figure). The pattern interval is about 0.1 mm.
[0042]
Specific examples of the organic light emitting dye pattern layers 82R, 82G, 82B are as follows. The organic luminescent dye pattern layer 82R is formed by combining a host aluminoquinoline complex with 4-dicyanomethylene-2-methyl-6- (p-dimethylaminostyryl) -4H-pyran (doping concentration = about 5% by weight) as a dopant. It is deposited and has a thickness of about 25 nm. The organic light emitting dye pattern layer 82G is formed by co-evaporating quinacridone (doping concentration = about 5% by weight) as a dopant on tris (8-quinolinol) aluminum host, and has a thickness of about 25 nm. The organic light emitting dye pattern layer 82B is formed by depositing perylene, and has a thickness of about 25 nm. The configuration of the organic light-emitting dye pattern layers 82R, 82G, and 82B described above is merely an example, and the dimensions and pattern intervals may be further reduced in consideration of the trend toward higher definition of images in the display field.
[0043]
The marker 83 is a mark component used when positioning the transfer substrate 80 with respect to the wiring substrate 90. The marker 83 is made of an optically opaque material, for example, a metal such as aluminum, and is formed on the substrate body 81 by using, for example, an evaporation method. For example, two markers 83 are provided at the end of the substrate main body 81 so as to sandwich the organic light emitting dye pattern layer 82 (about 1 mm wide), and two in the organic light emitting dye pattern layer 82 (less than about 1 mm wide). Are provided in total. The thickness of these markers 83 is about 0.5 μm to 10 μm, and is preferably larger than the depth of a transfer space 90V of a wiring board 90 (see FIG. 4) described later. Here, the marker corresponds to a specific example of the “positioning pattern” in the present invention.
[0044]
Next, a detailed configuration of the wiring board 90 will be described with reference to FIG. FIG. 4 shows an enlarged cross-sectional configuration of the wiring board 90.
[0045]
The wiring substrate 90 is a major component of the light emitting panel, and has a plurality of depressions (transfer spaces) 90V formed between wiring patterns (not shown) as shown in FIG. The transfer space 90V is a space where the organic light emitting dye pattern layer 82 (82R, 82G, 82B) is transferred from the transfer substrate 80. Here, the wiring substrate 90 corresponds to a specific example of the “substrate to be transferred” in the present invention.
[0046]
Next, a manufacturing process of a light emitting panel using the transfer device will be described with reference to FIGS. 5 and 6 are for explaining the operation of the transfer device in the manufacturing process of the light emitting panel, and both correspond to FIG. 7 and 8 are for explaining the manufacturing procedure of the light emitting panel, and both correspond to FIG.
[0047]
In this transfer device, in a state before the light emitting panel is manufactured, as shown in FIG. 1, for example, the stage 42 (see FIG. 2) is located in the work space of the alignment mechanism 40, and the organic light emitting dye pattern layer 82 A plurality of transfer substrates 80 (see FIG. 3) are stored in the transfer substrate port 20 so that they face downward, and a plurality of wiring substrates 90 (see FIG. 4) are connected so that the transfer space 90V faces upward. 30. In this state, after the inside of the chamber 10 is cleaned by operating the blower 60 and the suction device 70 to downflow the clean air, the pressure in the chamber 10 is reduced to a desired low pressure state.
[0048]
When manufacturing the light emitting panel, first, as shown in FIG. 5, when the partition walls 20W and 30W are opened, the transfer arm 43 grips the wiring board 90 and takes it out of the wiring board port 30 in the alignment mechanism 40. After being accommodated in the accommodation space 42S of the stage 42, the transfer substrate 80 is successively grasped and taken out from the transfer substrate port 20, and is accommodated in the accommodation space 42S. At this time, the marker 83 of the transfer substrate 80 is detected using the marker detector 44, and the transfer substrate 80 is aligned with the wiring substrate 90 based on the detected position of the marker 83.
[0049]
In the stage 42, as shown in FIG. 7, the wiring substrate 90 is accommodated in a substantially central portion of the lower space 42SA of the accommodation space 42S, and the transfer substrate 80 is accommodated in the upper space 42SB. Thus, the organic light emitting dye pattern layer 82 (82R, 82G, 82B) provided on the transfer substrate 80 is arranged to face the transfer space 90V provided on the wiring substrate 90. At this time, the air R is exhausted through the exhaust pipe 42H1 provided on the stage 42, and the wiring board 90 is fixed to the stage 42 by using the suction force based on the exhaust, and the air R is similarly exhausted through the exhaust pipe 42H2. The transfer substrate 80 is fixed to the stage 42 by using the suction force at the time of exhaust. In FIG. 7 (the same applies to FIGS. 8 and 14 described later), the space between the transfer substrate 80 and the wiring substrate 90 is shown large for the sake of convenience of illustration. In practice, 90 is closely attached to each other.
[0050]
Subsequently, as shown in FIG. 6, the stage 42 accommodating the transfer substrate 80 and the wiring substrate 90 is moved from the work space of the positioning mechanism 40 to the work space of the transfer mechanism 50 by using the transfer mechanism of the transfer table 41. After sliding, stop.
[0051]
Subsequently, in the transfer mechanism 50, when the laser light source 51 emits the laser light L, the laser light L is reflected by the mirror 52, further condensed by the lens 53, and then transmitted through the optical window 10M to be transferred to the transfer substrate 80. Is irradiated. The irradiation energy density of the laser beam L is, for example, 0.3 J / cm ² It is about. In this state, the transfer substrate 80 is scanned by the laser light L by moving the XY stage 54 supporting the lens 53 in the X-axis direction and the Y-axis direction in the drawing.
[0052]
In the transfer substrate 80, as shown in FIG. 8, when the laser light L transmitted through the substrate main body 81 reaches the organic light emitting dye pattern layer 82, the organic light emitting dye pattern layer 82 is It is sublimated and transferred to the transfer space 90V of the wiring board 90. When the laser light L scans the substrate main body 81, the organic light emitting dye pattern layers 82R, 82G, 82B are sequentially transferred to the transfer space 90V according to the scanning of the laser light L. As a result, the organic light-emitting dye layers 91 (91R, 91G, 91B) are pattern-formed on the wiring board 90, and the light-emitting panel 100 is manufactured.
[0053]
Thereafter, when the laser light source 51 stops, the stage 42 slides from the working space of the transfer mechanism 50 to the working space of the positioning mechanism 40. Then, in the stage 42, the exhaust using the discharge pipes 42H1 and 42H2 is stopped, and instead, the transfer substrate 80 and the wiring substrate 90 are moved to the stage 42 using the pressure when the air R is supplied through the introduction pipes 42D1 and 42D2. When the transfer arm 43 is released from the stage, the transfer arm 80 grips the transfer substrate 80 from the stage 42 and stores it in the transfer substrate port 20, and then grips the wiring substrate 90 and stores it in the wiring substrate port 30.
[0054]
By repeating the above series of operations, the light emitting panels are sequentially mass-produced using the plurality of transfer boards 80 stored in the transfer board ports 20 and the plurality of wiring boards 90 stored in the wiring board ports 30. You.
[0055]
As described above, the transfer substrate 80 according to the present embodiment has a simple structure in which the organic light emitting dye pattern layer 82 and the marker 83 are provided on the substrate main body 81, and particularly, the organic light emitting dye pattern layer 82 is transferred. Since the heat source (the laser light source 51 in this case) required for the heat transfer is not provided, the cost is reduced as compared with a conventional transfer substrate provided with a heat source (heating mechanism) by the absence of the heat source. Therefore, in the present embodiment, the cost of the light emitting panel 100 is reduced based on the cost reduction of the transfer substrate 80, so that the cost of the organic EL display can be reduced.
[0056]
Moreover, in the present embodiment, the weight of the transfer substrate 80 is reduced by the absence of the heat source. Therefore, it is possible to reduce the weight of the transfer substrate 80 and improve the workability when using the transfer substrate 80. it can.
[0057]
Further, in the present embodiment, since the transfer substrate 80 is configured to include the glass substrate main body 81 that is hardly bent and hardly expands and contracts, the transfer substrate on the film exemplified in the section of the above “Conventional Technology” is used. Unlike this, the possibility that the pattern interval between the organic light emitting dye pattern layers 82R, 82G, and 82B changes is reduced. Therefore, in the present embodiment, when the organic light emitting dye pattern layer 82 is transferred from the transfer substrate 80 to the wiring substrate 90, the pattern arrangement accuracy of each of the organic light emitting dye pattern layers 82R, 82G, and 82B is almost unchanged. Since the pattern formation accuracy of 91R, 91G, and 91B is reproduced, the organic luminescent dye layer 91 can be formed on the wiring substrate 90 with high accuracy. A typical pixel size for the light emitting panel 100 is about 0.3 × 0.3 mm ² In view of the fact that the pixel pitch is about 0.1 mm and the pixel conditions are high definition, it can be said that the higher precision in forming the organic luminescent dye layer 91 is a great advantage.
[0058]
In particular, in the transfer device according to the present embodiment and the transfer method using the transfer device, the alignment mechanism 40 and the transfer mechanism 50 automatically and continuously manufacture the light emitting panel 100 using the transfer substrate 80. Since it is possible, organic EL displays can be mass-produced while reducing costs.
[0059]
Further, in the present embodiment, the operation of aligning the transfer substrate 80 and the wiring substrate 90 by the alignment mechanism 40 and the operation of transferring the organic light emitting dye pattern layer 82 by the transfer mechanism 50 are both reduced in pressure and cleaned. Unlike the case where these operations are performed in an open system under the atmospheric pressure, foreign matters such as dust and dirt in the atmosphere are unlikely to be mixed, and foreign matters such as the transfer substrate 80 and the wiring substrate 90 are not formed. There is no risk of adhesion. Moreover, since the transfer substrate 80 and the wiring substrate 90 are stationary without moving when the organic light emitting dye pattern layer 82 is transferred, there is no possibility that foreign matters such as dust and dirt are scattered. The XY stage 54 moves during transfer, but since the XY stage 54 moves outside the chamber 10, the movement of the XY stage 54 at this time does not affect the inside of the chamber 10. Therefore, in the present embodiment, the rate of occurrence of defects due to the incorporation or attachment of foreign matter is reduced, and the yield of the organic EL display can be improved. This advantage can be said not only when the transfer method is used under the atmospheric pressure, but also when compared with the case where another vapor deposition method or the ink jet method is used. In other words, there is a high possibility that foreign matter will be scattered or adhered during the movement of the mask in the vapor deposition method and during the ejection operation of the ink jet device in the ink jet method.
[0060]
Further, in the present embodiment, since the transfer method is employed, the organic luminescent dye layer 91 can be formed with higher precision than when the vapor deposition method is employed. This is because, in the evaporation method, a mask is arranged between the evaporation source and the wiring substrate 90, so that the evaporation source is separated from the wiring substrate 90 by an arrangement space of the mask. In this case, if the deposition direction of the deposition source is inclined with respect to the mask, the deposition process is hindered due to the presence of the mask, so that the transfer efficiency of the organic light emitting dye pattern layer 82 may be reduced. On the other hand, in the transfer method, since there is no obstacle (mask) between the transfer substrate 80 and the wiring substrate 90, the organic light emitting dye pattern layer 82 is This allows efficient transfer.
[0061]
As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the above embodiment, and can be variously modified.
[0062]
Specifically, for example, in the above-described embodiment, as shown in FIG. 9, for example, a separator 84 having the same function as the marker 83 is provided between the organic light-emitting dye pattern layers 82R, 82G, and 82B. You may do so. In this case, since the organic light-emitting dye pattern layers 82R, 82G, and 82B are partitioned by the separator 84, the dye molecules sublimated in an arbitrary organic light-emitting dye pattern layer can be separated from other organic light-emitting dye pattern layers adjacent to the dye. The likelihood of reaching the layer or being confused with sublimated dye molecules in other organic luminescent dye pattern layers is reduced. Therefore, also from this viewpoint, it is possible to contribute to higher precision in forming the organic light emitting dye layer 91. Note that the configuration of the transfer substrate 80 shown in FIG.
[0063]
Further, in the above embodiment, as shown in FIG. 3, the entire substrate main body 81 is made of a transparent material such as glass. However, the present invention is not limited to this. For example, as shown in FIG. As described above, the substrate body 81 may have a configuration in which the optical window 81P made of glass is fitted into the outer frame 81F made of plastic or metal. Also in the transfer substrate 80 including the substrate body 81, the same function as the transfer substrate 80 described in the above embodiment is secured by providing the optical window 81P corresponding to the scanning range of the laser light L. can do. Here, the optical window 81P corresponds to a specific example of the “light transmitting portion” in the present invention. As described in the above embodiment, when the entire substrate main body 81 is made of a transparent material, the entire substrate main body 81 corresponds to a specific example of a “light transmitting portion”.
[0064]
Further, in the above-described embodiment, the laser beam L is scanned by using the movement of the XY stage 54 in a state where the stage 42 accommodating the transfer substrate 80 and the wiring substrate 90 is stationary in the transfer mechanism 50. However, the present invention is not necessarily limited to this. For example, as shown in FIG. 11, in a state where the lens 53 is supported by an immovable fixed support arm 55, the stage 42 is It may be moved in the direction or the Y-axis direction. Also in this case, it is possible to relatively scan the transfer substrate 80 with the laser light L, so that it is possible to obtain the same effect as in the above-described embodiment. can do. The configuration of the transfer apparatus shown in FIG. 11 other than the above-described features is the same as that of the above-described embodiment.
[0065]
Further, in the above embodiment, as shown in FIG. 1, the transfer mechanism 50 is arranged in parallel beside the positioning mechanism 40, but the transfer mechanism 50 is not necessarily limited to this. For example, as shown in FIG. As described above, the transfer mechanism 50 may be stacked below the alignment mechanism 40.
[0066]
In this case, unlike the above embodiment in which the laser light L is applied to the stage 42 from above, the laser light L is applied to the stage 42 from below. , The configuration of the stage 42 needs to be changed. Specifically, for example, as shown in FIG. 13, the stage 42 is configured such that the accommodation space 42 includes a lower layer space 42SE for accommodating the transfer substrate 80 and an upper layer space 42SF for accommodating the wiring substrate 90. In this configuration, an optical window 43 is provided corresponding to the storage space 42. In this stage 42, for example, discharge pipes 42H1 and 42H2 and introduction pipes 42D1 and 42D2 are provided on the side surface of the accommodation space 42S, and an exhaust mechanism through the discharge pipes 42H1 and 42H2 is used as in the above embodiment. It is possible to fix the transfer substrate 80 and the wiring substrate 90 to the stage 42 by using an air supply mechanism through the introduction pipes 42D1 and 42D2, or to release the transfer substrate 80 and the wiring substrate 90 from the stage 42.
[0067]
When this stage 42 is used, for example, as shown in FIG. 14, in a state where the transfer substrate 80 is accommodated in the lower space 42SE and the wiring substrate 90 is accommodated in the upper space 42SF, the optical window 43 is inserted from below. Since the laser beam L can be incident, the organic light emitting dye pattern layer 82 can be transferred from the transfer substrate 80 to the wiring substrate 90 as in the above embodiment.
[0068]
When the transfer mechanism 50 is stacked below the alignment mechanism 40, the installation space of the entire transfer apparatus is smaller than that in the above-described embodiment in which the transfer mechanism 50 is arranged in parallel beside the alignment mechanism 40. Since the size of the transfer device is reduced by 50 spaces, the size of the transfer device can be reduced. The configuration of the transfer device (including the stage 42) shown in FIGS. 12 to 14 other than the above-described features is the same as that of the above-described embodiment.
[0069]
【The invention's effect】
As described above, according to the transfer substrate according to any one of claims 1 to 3, it is possible to transfer the light to the transfer substrate by using heat based on light in the light transmitting portion of the substrate body. Since the organic light emitting dye pattern layer is arranged, the structure is simple. In addition, since a heating mechanism necessary for transferring the organic light emitting dye pattern layer is not provided, the cost is reduced by the heating mechanism as compared with a conventional transfer substrate having a heating mechanism. Therefore, the cost of the organic EL display can be reduced based on the cost reduction of the transfer substrate.
[0070]
According to the transfer device of any one of claims 4 to 7 or the transfer method of claim 8, the transfer substrate of the present invention can be automatically used by using the transfer substrate of the present invention together with the holding mechanism and the light source. Since the organic light emitting dye pattern layer can be transferred from the transfer substrate to the transfer target substrate continuously and continuously, the organic EL display can be mass-produced.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a cross-sectional configuration of a transfer device according to an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view illustrating a cross-sectional configuration of a stage.
FIG. 3 is an enlarged cross-sectional view illustrating a cross-sectional configuration of a transfer substrate.
FIG. 4 is an enlarged cross-sectional view illustrating a cross-sectional configuration of a wiring board.
FIG. 5 is a cross-sectional view for explaining an operation of the transfer device in a manufacturing process of the light emitting panel.
6 is a cross-sectional view for explaining an operation subsequent to the operation shown in FIG.
FIG. 7 is a cross-sectional view for explaining the procedure for manufacturing the light-emitting panel.
8 is a cross-sectional view for explaining a manufacturing procedure following the manufacturing procedure shown in FIG.
FIG. 9 is a cross-sectional view illustrating a modification of the configuration of the transfer substrate.
FIG. 10 is a cross-sectional view illustrating another modification of the configuration of the transfer substrate.
FIG. 11 is a cross-sectional view illustrating a modification of the configuration of the transfer device.
FIG. 12 is a cross-sectional view illustrating another modification example of the configuration of the transfer device.
13 is a cross-sectional view illustrating an enlarged cross-sectional configuration of a stage of the transfer apparatus illustrated in FIG.
FIG. 14 is a cross-sectional view for explaining a manufacturing procedure of the light-emitting panel in the transfer device shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Chamber, 10M, 43, 81P ... Optical window, 20 ... Transfer board port, 20W, 30W ... Partition wall, 30 ... Wiring board port, 40 ... Alignment mechanism, 41 ... Carrier, 42 ... Stage, 42S ... Housing space , 42SA, 42E: lower space, 42SB, 42SF: upper space, 42D1, 42D2: inlet tube, 42H1, 42H2: outlet tube, 43: transport arm, 44: marker detector, 50: transfer mechanism, 51: laser light source, 52: mirror, 53: lens, 54: XY stage, 55: support arm, 60: blower, 60F: filter, 70: suction machine, 80: transfer substrate, 81: substrate body, 81F: outer frame, 82: organic light emission Dye pattern layer (82R, 82G, 82B), 83 marker, 84 separator, 90 wiring board, 90V transfer space , 91 (91R, 91G, 91B) ... organic light emitting dye layer, 100 ... light-emitting panel, G ... gap, L ... laser light, R ... air.

Claims (8)

A transfer substrate used to pattern the organic luminescent dye layer on the transfer target substrate,
A substrate body having a light transmitting portion capable of transmitting light,
An organic light emitting dye pattern layer arranged on a light transmitting portion of the substrate main body and transferable to the transfer target substrate using heat based on the light. The transfer substrate according to claim 1, wherein the organic light emitting dye pattern layer includes three color dyes corresponding to three primary colors of light. further,
2. The transfer substrate according to claim 1, wherein an alignment pattern is provided on the substrate main body for aligning the organic light emitting dye pattern layer with respect to the substrate to be transferred. A transfer device used for manufacturing a display device that displays an image using an organic luminescent dye layer,
A light-transmitting portion of the substrate body having a light-transmitting portion capable of transmitting light, a transfer substrate on which an organic light-emitting dye pattern layer that can be transferred to a transfer-receiving substrate using heat based on the light is arranged,
A holding mechanism that holds the transfer substrate together with the transfer substrate, such that the organic light emitting dye pattern layer faces the transfer substrate,
A light source for irradiating the light toward the light transmitting portion of the substrate body. 5. The transfer apparatus according to claim 4, wherein the holding mechanism includes a suction mechanism for sucking and fixing the transfer substrate and the transfer target substrate. 5. The transfer device according to claim 4, wherein the light transmitting portion of the transfer substrate is scanned by the light emitted from the light source. The holding mechanism is housed inside a chamber provided with an optical window,
5. The transfer apparatus according to claim 4, wherein the light source irradiates the light inside the chamber through the optical window. A transfer method used to manufacture a display device that displays an image using an organic luminescent dye layer,
A light-transmitting portion of the substrate body having a light-transmitting portion capable of transmitting light, using a transfer substrate on which an organic light-emitting dye pattern layer that can be transferred to a transfer-receiving substrate using heat based on the light is used,
Using a holding mechanism, after holding the transfer substrate together with the transfer substrate so that the organic light emitting dye pattern layer faces the transfer substrate,
Irradiating the light from a light source toward a light transmitting portion of the substrate main body to transfer the organic light emitting dye pattern layer to the substrate to be transferred using heat based on the light. .

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