JP2004080394A - Solid-state image pickup device - Google Patents

Solid-state image pickup device Download PDF

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Publication number
JP2004080394A
JP2004080394A JP2002237999A JP2002237999A JP2004080394A JP 2004080394 A JP2004080394 A JP 2004080394A JP 2002237999 A JP2002237999 A JP 2002237999A JP 2002237999 A JP2002237999 A JP 2002237999A JP 2004080394 A JP2004080394 A JP 2004080394A
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JP
Japan
Prior art keywords
solid
fpc
imaging device
state imaging
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002237999A
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Japanese (ja)
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JP4187481B2 (en
Inventor
Kenichi Kudo
工藤　憲一
Satoshi Yamada
山田　聡
Koji Shinomiya
篠宮　巧治
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Renesas Technology Corp
Seiko Precision Inc
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Renesas Technology Corp
Seiko Precision Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin solid-state image pickup device by preventing the warping of an FPC at a mounting place of a lens assembly without using a reinforcement plate. <P>SOLUTION: The end face 3a of the lens assembly is arranged oppositely to one face of a flexible print board (FPC) 1. A solid-state image pickup element is mounted on the other face of the FPC 1. An opening 1a is provided on the FPC 1 between the solid-state image element and the lens assembly. A connecting bump electrode 6 to electrically connect both the solid-state image pickup element and the FPC 1 is provided between the solid-state image pickup element and the FPC by arranging it in the circumferential direction of the end face 3a so as to correspond to over the end face 3a and its whole periphery. And at the same time, a reinforcing bump electrode 7 only for the reinforcement to mechanically connect both of the solid-state image pickup element and the FPC is provided between the connecting bump electrodes 6 corresponding to the end face 3a. The solid-state image pickup element is fixed to the FPC 1 with both bump electrodes 6, 7. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、固体撮像素子を用いた固体撮像装置に関する。
【０００２】
【従来の技術】
従来のこの種の装置では、硬質のカメラ用回路基板の表面に固体撮像素子を電気的に接続している。そして、その固体撮像素子に撮像可能な位置にレンズ等を保持するレンズ組立体を配置している。カメラ用回路基板の裏面には固体撮像素子の画像処理素子等の周辺回路素子を搭載している。カメラ用回路基板には固体撮像素子を駆動する駆動回路が形成されており、表面と裏面との回路パターンはスルーホールを介して電気的に接続されている。回路パターンを本体側の回路に電気的に接続するのにフレキシブルプリント基板（ＦＰＣ）が用いられ、カメラ用回路基板の端部の裏面にはＦＰＣを電気的に接続する接続端子が設けてある。ＦＰＣは屈曲して用いられるものであり、カメラ用回路基板とＦＰＣとの電気的接続部が屈曲により剥離したり、ＦＰＣの回路パターンが断線したりし易いので、硬質のカメラ用回路基板にＦＰＣを電気的に接続しなくてよいように、ＦＰＣ上に直接固体撮像素子等を搭載することが考えられていた。
【０００３】
その一例を図３及び図４に示しており、ＦＰＣ１０に開口１０ａを設け、ＦＰＣ１０の背面側に、撮像面２０ａとレンズ組立体３０との間に開口１０ａが配置されるように、固体撮像素子２０とＦＰＣ１０とを電気的に接続するバンプ電極２０ｂを介して固体撮像素子２０を搭載している。ＦＰＣ１０の表面側には、撮像面２０ａに被写体像が結像するようにレンズ組立体３０を配置している。ここで、ＦＰＣ１０は軟質材であり固体撮像素子２０を搭載した状態では撓んでしまうので、このままレンズ組立体３０をＦＰＣ１０に固定することができず、レンズ組立体３０を固定するＦＰＣ１０上の位置に、ＦＰＣ１０の剛性を向上するための硬質の補強板４０を介在させる必要があった。
【０００４】
【発明が解決しようとする課題】
このような従来の構成では、硬質の補強板４０をＦＰＣ１０上に設ける必要があるため、この補強板４０の厚み分、小型化に限界があった。また、補強板４０を用いるので部品点数が多くなり、製造工程数が多くなって製造作業が煩雑になるという問題点があった。
【０００５】
そこで本発明は、補強板を用いずにレンズ組立体の搭載部位でのＦＰＣの撓みを防止して、薄型の固体撮像装置を提供する。
【０００６】
【課題を解決するための手段】
本発明の固体撮像装置は、固体撮像素子と、当該固体撮像素子に被写体像を結像させるためのレンズを保持するレンズ組立体とが備わっている。前記レンズ組立体は、その端面を前記フレキシブルプリント基板の一方の面に対接させて配置されており、前記固体撮像素子は、当該固体撮像素子と前記レンズ組立体との間に前記フレキシブルプリント基板に設けられた開口が位置するように、前記フレキシブルプリント基板の他方の面に配置されている。前記固体撮像素子と前記フレキシブルプリント基板との間には、両者を機械的に接続する補強用バンプ電極が設けられていることを特徴としている。このような構成によれば、フレキシブルプリント基板の他方の面に、固体撮像素子とフレキシブルプリント基板とを機械的に接続する補強用バンプ電極を設けているので、従来のように補強板を用いずに、レンズ組立体の搭載部位でのフレキシブルプリント基板の撓みを防止でき、薄型の固体撮像装置が提供できる。
【０００７】
また、前記端面は矩形形状であり、前記補強用バンプ電極は前記端面の各角部に対応して設けられているので、補強用バンプ電極を各角部に対応する位置にのみ設けることによって、効率良く、レンズ組立体の搭載部位でのフレキシブルプリント基板の撓み防止が可能となる。
【０００８】
また、前記補強用バンプ電極は、前記端面とその全周に亘って対応するように当該端面の周方向に沿って配列して設けられているので、レンズ組立体の搭載部位でのフレキシブルプリント基板の撓みを確実かつ効率よく防止できる。
【０００９】
また、前記固体撮像素子と前記フレキシブルプリント基板との間には、両者を電気的に接続する接続用バンプ電極が、前記端面とその全周に亘って対応するように当該端面の周方向に沿って配列して設けられており、前記補強用バンプ電極は当該接続用バンプ電極間に設けられているので、補強用バンプ電極に加えて、固体撮像素子とフレキシブルプリント基板との電気的接続のための接続用バンプ電極により、レンズ組立体の搭載部位でのフレキシブルプリント基板の撓みをより確実に効率よく防止できる。
【００１０】
【発明の実施の形態】
本発明の実施の一形態について、図面を参照して説明する。
【００１１】
図１に示すように、カメラ用回路基板としてフレキシブルプリント基板１を使用している。フレキシブルプリント基板（以下ＦＰＣという。）１には開口１ａが形成してある。表面に撮像面２ａが形成してある固体撮像素子２は、撮像面２ａと後述するレンズ組立体３との間に開口１ａが配置されるようにＦＰＣ１の裏面側に搭載され、ＦＰＣ１の開口１ａを挟んだ表面側には、固体撮像素子２の撮像面２ａ上に被写体像を結像可能な位置に、レンズ組立体３が配置してある。
【００１２】
レンズ組立体３は、第１レンズ鏡筒３１を第２レンズ鏡筒３２に嵌合して形成されるもので、第１レンズ鏡筒３１内にレンズ４等の光学部材が保持してあり、また、第２レンズ鏡筒３２内にフィルタ５が取り付けられている。レンズ組立体３は、第２レンズ鏡筒３２の四角形状の端面３ａを開口１ａを中心にしてＦＰＣ１の表面に対接させて接着等によって固定されるものである。第１レンズ鏡筒３１は第２レンズ鏡筒３２に対して固体撮像素子２に向かって進退可能に設けられており、レンズ４と撮像面２ａとの距離を調整してレンズ４及びフィルタ５を通過した光により固体撮像素子２の撮像面２ａ上に被写体像を結像するように、ピントの合わせ込みを可能にしている。なお、端面３ａの形状は四角形に限らず、例えば多角形や円形でも良い。
【００１３】
ＦＰＣ１には、固体撮像素子２等の信号伝送用の回路パターン（図示せず）が形成してあり、固体撮像素子２はフリップチップ方式によってこの回路パターン上に搭載されている。ここで、図２に示すように、固体撮像素子２とＦＰＣ１との間には、両者を電気的に接続する接続用バンプ電極６が、レンズ組立体３の端面３ａの各辺に対応するように整列して設けられている。即ち、接続用バンプ電極６は、接続用バンプ電極６と端面３ａとでＦＰＣ１を挟むように端面３ａの周方向に沿って配列して設けられている。
【００１４】
さらに、固体撮像素子２とＦＰＣ１との間には、固体撮像素子２とＦＰＣ１との間には両者を機械的に接続する、即ち両者の固定を補強する専用の補強用バンプ電極７が、端面３ａの各角部に対応するように、接続用バンプ電極６、６の間の各角部に設けられている。つまり、補強用バンプ電極７は、補強用バンプ電極７と端面３ａとでＦＰＣ１を挟むように設けられている。
【００１５】
固体撮像装置の組み付けに際しては、ＦＰＣ１に開口１ａを形成し、開口１ａを中心にして、ＦＰＣ１の表面側にレンズ組立体３を、ＦＰＣ１の裏面に、レンズ組立体３の端面３ａと対向する位置に、接続用バンプ電極６と補強用バンプ電極７とを整列させて形成し、撮像面２ａが開口１ａに対向するように位置合わせした固体撮像素子２を、両バンプ電極６及び７を介してＦＰＣ１に搭載すれば、本発明の固体撮像装置が完成する。
【００１６】
このようにして組み付けられた固体撮像装置では、ＦＰＣ１の表面に対接させてあるレンズ組立体３の端面３ａに対応するように、ＦＰＣ１の裏面にＦＰＣ１と固体撮像素子２とを機械的に接続する補強用バンプ電極７を設けているので、補強用バンプ電極７と端面３ａによってＦＰＣ１が挟まれ、レンズ組立体３の搭載位置でＦＰＣ１が撓むことはない。したがって、この搭載位置で固体撮像素子２の剥離やＦＰＣ１の回路パターンの断線等を生じることがなく、固体撮像装置の品質が安定する。さらに、レンズ組立体３及び撮像素子２の傾斜を防止でき、また固体撮像素子とＦＰＣ１との機械的接続強度を向上できる。
【００１７】
また、補強用バンプ電極７は、接続用バンプ電極６の製造工程において接続用バンプ電極６と同時に設けることができ、製造工程が煩雑化することがない。
【００１８】
また、レンズ組立体３の端面３ａの形状が四角形であり、補強用バンプ電極７は端面３ａの各角部に対応して設けられているので、補強用バンプ電極７を角部に対応する位置にのみ設けることによって、効率の良くレンズ組立体３の搭載部位でのＦＰＣ１の撓み防止が可能となる。
【００１９】
また、補強用バンプ電極７に加えて、ＦＰＣ１の回路パターンと固体撮像素子２との電気的接続のための接続用バンプ電極６も端面３ａとその全周に亘って対応するように端面３ａの周方向に沿って配列して設けられているので、接続用バンプ電極６及び補強用バンプ電極７により、レンズ組立体３の搭載部位でのＦＰＣ１の撓みをより確実かつ効率よく防止できる。
【００２０】
なお、本実施例では、接続用バンプ電極６をレンズ組立体３の端面３ａの各辺に対応して設けたが、接続用バンプ電極６の配置位置はこれに限るものではなく、適宜変更可能である。
【００２１】
また、本実施例では、補強用バンプ電極７は、端面３ａの周方向に沿って縦横に配列している接続用バンプ電極６、６の間の角部に、端面３ａに対向して設けられているが、角部に限られるものでなく、個々の隣り合う接続用バンプ電極６、６の任意の間に設けることも可能である。
【００２２】
【発明の効果】
本発明は、レンズ組立体をその端面をＦＰＣの一方の面に対接させて配置し、ＦＰＣの他方の面に、ＦＰＣと固体撮像素子とを機械的に接続する補強用バンプ電極を設けているので、補強板を用いなくてもレンズ組立体の搭載部位でのＦＰＣの撓みを防止でき、薄型の固体撮像装置が提供できる。さらに、レンズ組立体の傾斜を防止できるとともに固体撮像素子とＦＰＣとの機械的接続強度を向上できる。
【図面の簡単な説明】
【図１】本発明の実施の一形態を示す断面図である。
【図２】図１のＡ−Ａ線断面図である。
【図３】従来の構成を示す断面図である。
【図４】図３の平面図である。
【符号の説明】
１　　フレキシブルプリント基板
１ａ　開口
２　　固体撮像素子
３　　レンズ組立体
３ａ　端面
６　　接続用バンプ電極
７　　補強用バンプ電極（補強部材）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a solid-state imaging device using a solid-state imaging device.
[0002]
[Prior art]
In this type of conventional device, a solid-state imaging device is electrically connected to the surface of a hard camera circuit board. Then, a lens assembly for holding a lens or the like is arranged at a position where an image can be captured by the solid-state imaging device. Peripheral circuit elements such as an image processing element of a solid-state imaging element are mounted on the back surface of the camera circuit board. A drive circuit for driving the solid-state imaging device is formed on the camera circuit board, and the circuit patterns on the front and back surfaces are electrically connected through through holes. A flexible printed circuit board (FPC) is used to electrically connect the circuit pattern to the circuit on the main body side, and connection terminals for electrically connecting the FPC are provided on the back surface at the end of the camera circuit board. The FPC is used by bending, and the electrical connection between the camera circuit board and the FPC is easily peeled off by bending, and the circuit pattern of the FPC is easily broken. It has been considered that a solid-state imaging device or the like is directly mounted on the FPC so that the FPC need not be electrically connected.
[0003]
An example thereof is shown in FIGS. 3 and 4, in which an opening 10 a is provided in the FPC 10, and the solid-state imaging device is arranged such that the opening 10 a is arranged between the imaging surface 20 a and the lens assembly 30 on the back side of the FPC 10. The solid-state imaging device 20 is mounted via a bump electrode 20b that electrically connects the FPC 20 to the FPC 10. A lens assembly 30 is arranged on the front side of the FPC 10 so that a subject image is formed on the imaging surface 20a. Here, since the FPC 10 is a soft material and bends when the solid-state imaging device 20 is mounted, the lens assembly 30 cannot be fixed to the FPC 10 as it is, and is located at a position on the FPC 10 where the lens assembly 30 is fixed. In addition, it is necessary to interpose a hard reinforcing plate 40 for improving the rigidity of the FPC 10.
[0004]
[Problems to be solved by the invention]
In such a conventional configuration, since the hard reinforcing plate 40 needs to be provided on the FPC 10, there is a limit in reducing the size of the reinforcing plate 40 by the thickness of the reinforcing plate 40. Further, since the reinforcing plate 40 is used, the number of components increases, the number of manufacturing steps increases, and the manufacturing operation becomes complicated.
[0005]
Accordingly, the present invention provides a thin solid-state imaging device that prevents the FPC from bending at the mounting portion of the lens assembly without using a reinforcing plate.
[0006]
[Means for Solving the Problems]
The solid-state imaging device of the present invention includes a solid-state imaging device and a lens assembly that holds a lens for forming a subject image on the solid-state imaging device. The lens assembly is disposed such that an end surface thereof is in contact with one surface of the flexible printed board, and the solid-state imaging device is provided between the solid-state imaging device and the lens assembly. Are arranged on the other surface of the flexible printed circuit board so that the opening provided in the flexible printed circuit board is located. A reinforcing bump electrode for mechanically connecting the solid-state imaging device and the flexible printed circuit board is provided between the solid-state imaging device and the flexible printed circuit board. According to such a configuration, since the reinforcing bump electrodes for mechanically connecting the solid-state imaging device and the flexible printed board are provided on the other surface of the flexible printed board, the reinforcing plate is not used as in the related art. In addition, it is possible to prevent the flexible printed board from being bent at the mounting portion of the lens assembly, and to provide a thin solid-state imaging device.
[0007]
Further, since the end face is rectangular, and the reinforcing bump electrodes are provided corresponding to the respective corners of the end face, by providing the reinforcing bump electrodes only at positions corresponding to the respective corners, Efficiently preventing bending of the flexible printed circuit board at the site where the lens assembly is mounted.
[0008]
Further, since the reinforcing bump electrodes are provided along the circumferential direction of the end face so as to correspond to the end face and the entire circumference thereof, the flexible printed circuit board is provided at the mounting portion of the lens assembly. Can be reliably and efficiently prevented.
[0009]
Further, between the solid-state imaging device and the flexible printed circuit board, connection bump electrodes for electrically connecting the both are provided along the circumferential direction of the end face so as to correspond to the end face and the entire circumference thereof. Since the reinforcing bump electrodes are provided between the connecting bump electrodes, in addition to the reinforcing bump electrodes, the reinforcing bump electrodes are used for electrical connection between the solid-state imaging device and the flexible printed circuit board. By using the connection bump electrodes described above, it is possible to more reliably and efficiently prevent the flexible printed board from being bent at the site where the lens assembly is mounted.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings.
[0011]
As shown in FIG. 1, a flexible printed circuit board 1 is used as a camera circuit board. An opening 1a is formed in a flexible printed circuit board (hereinafter, referred to as FPC) 1. The solid-state imaging device 2 having the imaging surface 2a formed on the front surface is mounted on the back side of the FPC 1 so that the opening 1a is disposed between the imaging surface 2a and a lens assembly 3 described later. The lens assembly 3 is disposed on the front side of the lens assembly 3 at a position where a subject image can be formed on the imaging surface 2a of the solid-state imaging device 2.
[0012]
The lens assembly 3 is formed by fitting the first lens barrel 31 to the second lens barrel 32, and optical members such as the lens 4 are held in the first lens barrel 31. Further, the filter 5 is mounted in the second lens barrel 32. The lens assembly 3 is fixed by bonding or the like with the square end face 3a of the second lens barrel 32 in contact with the surface of the FPC 1 around the opening 1a. The first lens barrel 31 is provided so as to advance and retreat toward the solid-state imaging device 2 with respect to the second lens barrel 32, and adjusts the distance between the lens 4 and the imaging surface 2a to move the lens 4 and filter 5 Focusing is enabled so that a subject image is formed on the imaging surface 2a of the solid-state imaging device 2 by the transmitted light. Note that the shape of the end face 3a is not limited to a square, but may be, for example, a polygon or a circle.
[0013]
A circuit pattern (not shown) for signal transmission of the solid-state imaging device 2 and the like is formed on the FPC 1, and the solid-state imaging device 2 is mounted on the circuit pattern by a flip-chip method. Here, as shown in FIG. 2, between the solid-state imaging device 2 and the FPC 1, connection bump electrodes 6 for electrically connecting the two correspond to each side of the end surface 3 a of the lens assembly 3. Are arranged in line. That is, the connection bump electrodes 6 are arranged along the circumferential direction of the end face 3a so as to sandwich the FPC 1 between the connection bump electrode 6 and the end face 3a.
[0014]
Further, between the solid-state imaging device 2 and the FPC 1, between the solid-state imaging device 2 and the FPC 1, both are mechanically connected, that is, a dedicated reinforcing bump electrode 7 for reinforcing the fixation of both is provided with an end face. Corresponding to each corner of 3a, it is provided at each corner between the connection bump electrodes 6, 6. That is, the reinforcing bump electrode 7 is provided such that the FPC 1 is sandwiched between the reinforcing bump electrode 7 and the end face 3a.
[0015]
At the time of assembling the solid-state imaging device, an opening 1a is formed in the FPC 1, and the lens assembly 3 is provided on the front side of the FPC 1 with the opening 1a as a center, and the rear surface of the FPC 1 is opposed to the end surface 3a of the lens assembly 3. Then, the solid-state imaging device 2 in which the connection bump electrode 6 and the reinforcement bump electrode 7 are aligned and formed so that the imaging surface 2a faces the opening 1a is interposed between the solid-state imaging device 2 and the bump electrodes 6 and 7. When mounted on the FPC 1, the solid-state imaging device of the present invention is completed.
[0016]
In the solid-state imaging device assembled in this manner, the FPC 1 and the solid-state imaging device 2 are mechanically connected to the back surface of the FPC 1 so as to correspond to the end surface 3a of the lens assembly 3 that is in contact with the front surface of the FPC 1. Since the reinforcing bump electrode 7 is provided, the FPC 1 is sandwiched between the reinforcing bump electrode 7 and the end face 3 a, and the FPC 1 does not bend at the mounting position of the lens assembly 3. Accordingly, the solid-state imaging device 2 does not peel off or the circuit pattern of the FPC 1 is disconnected at the mounting position, and the quality of the solid-state imaging device is stabilized. Further, the lens assembly 3 and the imaging device 2 can be prevented from tilting, and the mechanical connection strength between the solid-state imaging device and the FPC 1 can be improved.
[0017]
Further, the reinforcing bump electrode 7 can be provided simultaneously with the connection bump electrode 6 in the manufacturing process of the connection bump electrode 6, and the manufacturing process is not complicated.
[0018]
Further, since the shape of the end face 3a of the lens assembly 3 is quadrangular and the reinforcing bump electrodes 7 are provided corresponding to the respective corners of the end face 3a, the reinforcing bump electrodes 7 are positioned at positions corresponding to the corners. , The bending of the FPC 1 at the mounting portion of the lens assembly 3 can be efficiently prevented.
[0019]
In addition to the reinforcing bump electrodes 7, the connecting bump electrodes 6 for electrical connection between the circuit pattern of the FPC 1 and the solid-state imaging device 2 are also formed on the end face 3 a so as to correspond to the end face 3 a over the entire circumference. Since they are arranged along the circumferential direction, the bending of the FPC 1 at the mounting position of the lens assembly 3 can be more reliably and efficiently prevented by the connection bump electrodes 6 and the reinforcing bump electrodes 7.
[0020]
In the present embodiment, the connection bump electrode 6 is provided corresponding to each side of the end face 3a of the lens assembly 3, but the arrangement position of the connection bump electrode 6 is not limited to this and can be changed as appropriate. It is.
[0021]
In this embodiment, the reinforcing bump electrodes 7 are provided at the corners between the connecting bump electrodes 6, which are arranged vertically and horizontally along the circumferential direction of the end face 3a, facing the end face 3a. However, the present invention is not limited to the corners, and may be provided between arbitrary adjacent ones of the connection bump electrodes 6.
[0022]
【The invention's effect】
According to the present invention, a lens assembly is disposed such that an end surface thereof is in contact with one surface of an FPC, and a reinforcing bump electrode for mechanically connecting the FPC and the solid-state imaging device is provided on the other surface of the FPC. Therefore, the FPC can be prevented from bending at the mounting portion of the lens assembly without using a reinforcing plate, and a thin solid-state imaging device can be provided. Furthermore, the inclination of the lens assembly can be prevented, and the mechanical connection strength between the solid-state imaging device and the FPC can be improved.
[Brief description of the drawings]
FIG. 1 is a sectional view showing an embodiment of the present invention.
FIG. 2 is a sectional view taken along line AA of FIG.
FIG. 3 is a sectional view showing a conventional configuration.
FIG. 4 is a plan view of FIG. 3;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Flexible printed board 1a Opening 2 Solid-state image sensor 3 Lens assembly 3a End face 6 Connection bump electrode 7 Reinforcement bump electrode (reinforcement member)

Claims (4)

固体撮像素子と、当該固体撮像素子に被写体像を結像させるためのレンズを保持するレンズ組立体とが備わっており、
前記レンズ組立体は、その端面を前記フレキシブルプリント基板の一方の面に対接させて配置されており、
前記固体撮像素子は、当該固体撮像素子と前記レンズ組立体との間に前記フレキシブルプリント基板に設けられた開口が位置するように、前記フレキシブルプリント基板の他方の面に配置されており、
前記固体撮像素子と前記フレキシブルプリント基板との間には、両者を機械的に接続する補強用バンプ電極が設けられている
ことを特徴とする固体撮像装置。A solid-state imaging device and a lens assembly that holds a lens for forming a subject image on the solid-state imaging device;
The lens assembly is disposed with its end face in contact with one surface of the flexible printed circuit board,
The solid-state imaging device is arranged on the other surface of the flexible printed circuit board such that an opening provided in the flexible printed circuit is located between the solid-state imaging device and the lens assembly.
A solid-state imaging device, wherein a reinforcing bump electrode for mechanically connecting the solid-state imaging device and the flexible printed circuit board is provided. 請求項１において、前記端面は矩形形状であり、前記補強用バンプ電極は前記端面の各角部に対応して設けられていることを特徴とする固体撮像装置。2. The solid-state imaging device according to claim 1, wherein the end surface has a rectangular shape, and the reinforcing bump electrode is provided corresponding to each corner of the end surface. 請求項１において、前記補強用バンプ電極は、前記端面とその全周に亘って対応するように当該端面の周方向に沿って配列して設けられていることを特徴とする固体撮像装置。The solid-state imaging device according to claim 1, wherein the reinforcing bump electrodes are arranged along the circumferential direction of the end face so as to correspond to the end face and the entire circumference thereof. 請求項１乃至３のいずれかにおいて、前記固体撮像素子と前記フレキシブルプリント基板との間には、両者を電気的に接続する接続用バンプ電極が、前記端面とその全周に亘って対応するように当該端面の周方向に沿って配列して設けられており、前記補強用バンプ電極は、当該接続用バンプ電極間に設けられていることを特徴とする固体撮像装置。In any one of claims 1 to 3, between the solid-state imaging device and the flexible printed circuit board, a connection bump electrode for electrically connecting the two corresponds to the end face and the entire periphery thereof. , And the reinforcing bump electrodes are provided between the connection bump electrodes.
JP2002237999A 2002-08-19 2002-08-19 Solid-state image device Expired - Fee Related JP4187481B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100568769B1 (en) 2004-04-23 2006-04-07 앰코 테크놀로지 코리아 주식회사 Mount for Camera Module
JP2020184694A (en) * 2019-05-08 2020-11-12 株式会社日立製作所 Ultrasonic probe and ultrasonic transmitter/receiver using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100568769B1 (en) 2004-04-23 2006-04-07 앰코 테크놀로지 코리아 주식회사 Mount for Camera Module
JP2020184694A (en) * 2019-05-08 2020-11-12 株式会社日立製作所 Ultrasonic probe and ultrasonic transmitter/receiver using the same
JP7236320B2 (en) 2019-05-08 2023-03-09 富士フイルムヘルスケア株式会社 Ultrasonic probe and ultrasonic transmitter/receiver using the same

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