JP2004080006A5 - - Google Patents
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- JP2004080006A5 JP2004080006A5 JP2003170757A JP2003170757A JP2004080006A5 JP 2004080006 A5 JP2004080006 A5 JP 2004080006A5 JP 2003170757 A JP2003170757 A JP 2003170757A JP 2003170757 A JP2003170757 A JP 2003170757A JP 2004080006 A5 JP2004080006 A5 JP 2004080006A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003170757A JP4215571B2 (ja) | 2002-06-18 | 2003-06-16 | 半導体装置の製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002176775 | 2002-06-18 | ||
| JP2003170757A JP4215571B2 (ja) | 2002-06-18 | 2003-06-16 | 半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006088903A Division JP4286264B2 (ja) | 2002-06-18 | 2006-03-28 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004080006A JP2004080006A (ja) | 2004-03-11 |
| JP2004080006A5 true JP2004080006A5 (zh) | 2006-05-18 |
| JP4215571B2 JP4215571B2 (ja) | 2009-01-28 |
Family
ID=32032455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003170757A Expired - Fee Related JP4215571B2 (ja) | 2002-06-18 | 2003-06-16 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4215571B2 (zh) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101373747B (zh) * | 2004-03-16 | 2011-06-29 | 株式会社藤仓 | 具有通孔互连的装置及其制造方法 |
| JP4746847B2 (ja) * | 2004-04-27 | 2011-08-10 | 三洋電機株式会社 | 半導体装置の製造方法 |
| JP4936695B2 (ja) * | 2004-09-29 | 2012-05-23 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
| JP4522213B2 (ja) * | 2004-09-29 | 2010-08-11 | 三洋電機株式会社 | 半導体装置の製造方法 |
| TWI313914B (en) | 2005-01-31 | 2009-08-21 | Sanyo Electric Co | Semiconductor device and a method for manufacturing thereof |
| US20070090156A1 (en) * | 2005-10-25 | 2007-04-26 | Ramanathan Lakshmi N | Method for forming solder contacts on mounted substrates |
| US7901989B2 (en) | 2006-10-10 | 2011-03-08 | Tessera, Inc. | Reconstituted wafer level stacking |
| US8513789B2 (en) | 2006-10-10 | 2013-08-20 | Tessera, Inc. | Edge connect wafer level stacking with leads extending along edges |
| KR101458538B1 (ko) | 2007-07-27 | 2014-11-07 | 테세라, 인코포레이티드 | 적층형 마이크로 전자 유닛, 및 이의 제조방법 |
| CN102067310B (zh) * | 2008-06-16 | 2013-08-21 | 泰塞拉公司 | 带有边缘触头的晶片级芯片规模封装的堆叠及其制造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06326293A (ja) * | 1993-05-12 | 1994-11-25 | Hamamatsu Photonics Kk | 光検出装置 |
| IL123207A0 (en) * | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
| KR100315030B1 (ko) * | 1998-12-29 | 2002-04-24 | 박종섭 | 반도체패키지의제조방법 |
| JP3750468B2 (ja) * | 2000-03-01 | 2006-03-01 | セイコーエプソン株式会社 | 半導体ウエハーの製造方法及び半導体装置 |
| JP2001313350A (ja) * | 2000-04-28 | 2001-11-09 | Sony Corp | チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法 |
| JP4454805B2 (ja) * | 2000-07-04 | 2010-04-21 | 藤森工業株式会社 | 保護フィルム及び導体箔積層体 |
| JP2002093942A (ja) * | 2000-09-14 | 2002-03-29 | Nec Corp | 半導体装置およびその製造方法 |
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2003
- 2003-06-16 JP JP2003170757A patent/JP4215571B2/ja not_active Expired - Fee Related