JP2004078989A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card excellent in improving its warping. <P>SOLUTION: The IC card has a multi-layer (1, 5, 6, 7, 8) structure including a card base 1, and an IC chip 2 is embedded within the multi-layer (1, 5, 6, 7, 8) structure. The IC chip 2 is disposed unevenly with respect to a center axis in the cross-section of the multi-layer (1, 5, 6, 7, 8) structure. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to an IC card.

At present, cash cards, credit cards, and the like, which are widely used, have a magnetic stripe applied to a plastic card so that information recorded on the plastic stripe can be read. Such a magnetic recording method has disadvantages that information can be easily read by a third party and the amount of recordable information is small. Therefore, in recent years, a so-called IC card in which an IC having functions such as a memory and a CPU is mounted on a card-shaped base has been developed, and is already at a practical stage. Conventionally, as a method of manufacturing such an IC card, a method of mounting and mounting an IC chip on a printed board, inserting the IC chip into a casting resin, and forming the IC card into a card shape is generally employed. Since the materials of the mounting substrate and the casting resin are different, warpage occurs in the completed IC card due to a difference in thermal shrinkage during molding. As a result, the appearance may be poor and the device may not be usable. Until now, as a technique for correcting distortion of IC cards, it has been proposed to erase the distortion by locally heating the peripheral part of the distortion such as dents and recesses generated during molding with hot air above the softening point of the cover film. (See Patent Document 1).
JP-A-6-115285.

However, the prior art is intended to eliminate local distortion generated on the surface of the IC card, and has no effect on distortion in which the entire card is warped.

The present invention aims to provide an IC card excellent in warpage improvement.

In the IC card of the present invention, the spacer layer laminated on the IC card substrate on which a plurality of components are mounted and the skin layers laminated on both sides of the laminate are configured symmetrically with respect to the central axis of the cross section of the IC card. It is characterized by the following.

In the case of such an IC card, in the case of an IC card in which the spacer layer and the skin layer are asymmetrical with respect to the center axis of the cross section, a temperature difference, a peripheral speed difference, or a laminating film entering the sticking roll is formed between the upper and lower laminating rolls. It can be manufactured by laminating at an angle.

(4) The present inventors have conducted extensive experiments and researches in order to solve each problem found in the prior art, and as a result, have completed the present invention. That is, an IC card and a spacer layer in which a spacer layer laminated on an IC card substrate on which a plurality of components are mounted and skin layers laminated on both sides of the laminate are symmetrical with respect to the central axis of the cross section of the IC card. When the skin layer is asymmetric with respect to the center axis of the cross section, the upper and lower laminating rolls of the application roll are provided with a temperature difference, a peripheral speed difference, or an angle at which the laminate film enters the application roll.

In the manufacture of an IC card, it is necessary that the spacer layer and the skin layer be symmetrical with respect to the central axis of the cross section. The thickness of the spacer layer and the skin layer has any thickness of 3 to 500 μm, and an optimum thickness can be selected and laminated in consideration of the thickness of the mounted components and the total thickness of the IC card.

On the other hand, when the spacer layer and the skin layer are asymmetric with respect to the central axis of the cross section, the upper and lower laminating rolls of the attaching roll are provided with a temperature difference, a peripheral speed difference or an angle of entry of the laminated film into the attaching roll for the purpose of preventing warpage. It is necessary to configure an IC card.

そ The warpage can be corrected by any one or a combination of a temperature difference, a peripheral speed difference, and an angle at which the laminated film enters the sticking roll. It is preferable that the temperature difference between the upper and lower laminating rolls of the sticking rolls used for laminating the IC cards is set in the range of 0.5 to 2 by the ratio of the upper laminating roll temperature to the lower laminating roll temperature.

差 The peripheral speed difference between the upper and lower laminating layers of the application roll is preferably set in the range of 0.5 to 2 by the ratio between the peripheral speed of the upper laminating roll and the peripheral speed of the lower laminating roll. The angle of incidence (shown in FIG. 1) defined by the angle of incidence of the film to be laminated onto the roll from the horizontal plane in contact with the upper and lower laminating rolls of the affixing roll is 0 to 80 for both the upper and lower laminated film included angles. It is preferable that the angle is in the range of degrees, and it is necessary to provide a difference between the upper and lower angles. In addition, a smaller roll diameter is preferably used to increase the entering angle. When laminating two films, the temperature difference (to increase the roll temperature), the peripheral speed difference (to increase the roll speed), and the entering angle (the entering angle to the film on the opposite side from the original side). By increasing the value, a laminate with less warpage can be obtained.

As a material of the spacer layer and the skin layer, polyethylene, polypropylene, a copolymer containing olefin as a main component such as ethylene-vinyl acetate copolymer, or a film made of a mixture thereof, polyvinyl alcohol, nylon, vinyl chloride Further, polyester, polyimide, polycarbonate, polystyrene, engineering plastic and the like are used. Depending on the application, a glass impregnated epoxy sheet, a metal plate, or the like is used. Examples of a method for attaching and fixing the plurality of spacer layers and skin layers include heat fusion, an adhesive (a thermoplastic type, a thermosetting type, and a photo-setting type). When attaching the spacer, it is necessary to punch out and use it in the form of a part in advance.

The technical points related to the production of the IC card of the present invention are the following two points:
(1) symmetrically stacking and configuring the spacer layer and the skin layer;
(2) In the case of asymmetric lamination / configuration, provision of a temperature difference, a peripheral speed difference, or an angle at which a laminate film enters a sticking roll,
When the IC card is formed by laminating different thicknesses and materials, the IC card is likely to be asymmetrical with respect to the central axis of the cross section of the IC card. Therefore, by giving a temperature difference, a peripheral speed difference, or an angle of entry of the laminate film to the application roll on the surface opposite to the sled side, the warpage can be effectively prevented.

The reasons are presumed to be as follows:
Assuming a case where two films (A, B) having different thicknesses are laminated with an adhesive roll via an adhesive (warpage occurs such that the surface B is convex),
By setting the roll temperature on the film B side higher than the film A, the film B contracts more and cancels the warp;
By setting the peripheral speed of the roll on the film A side higher than that of the film B, the film A stretches more and cancels the warp;
By setting the angle of entry of the film A into the roll higher than that of the film B, the film A is stretched by the roll to cancel the warpage.

In the IC card of the present invention, the spacer layer laminated on the IC card substrate on which a plurality of components are mounted and the skin layers laminated on both sides of the laminate are configured symmetrically with respect to the central axis of the cross section of the IC card. Even in the case of an asymmetric configuration, the warpage can be greatly suppressed by providing a temperature difference, a peripheral speed difference, and an angle of entry of the laminate film into the application roll, between the upper and lower laminate rolls of the application roll. As a result, the completed IC card becomes flat, and excellent appearance can be obtained.

Hereinafter, the present invention will be described based on examples of the present invention, but the scope of the present invention is not limited by these examples.

ＩＣ As shown in FIG. 2, an IC card in which films were laminated so as to be symmetrical with respect to the central axis of the cross section was prepared. A 75 μm thick polyethylene terephthalate film 1 is used as a card substrate, on which an IC chip 2 (220 μm thickness, 4 × 4 mm size), an antenna 3 (240 μm thickness, 10 mmφ) and a paper battery 4 (230 μm thickness, 15 × 10 mm size) are placed. equipped. A 250 μm-thick polyethylene terephthalate film 5 punched into three holes of 5 × 5 mm, 11 mmφ, and 16 × 11 mm (12 μm coated with a heat-sensitive adhesive on both sides) is attached to the film 1 as a spacer layer, and an IC chip 2 and an antenna 3, the same height as the paper battery 4. Next, a 250 μm-thick polyethylene terephthalate film 6 (12 μm of a heat-sensitive adhesive was applied to both sides) was attached to the lower surface of the film 1. Further, polyethylene terephthalate films 7 and 8 having a thickness of 50 μm (a heat-sensitive adhesive having a thickness of 12 μm applied to one surface) were adhered to the front and back of the laminate as a skin layer to obtain an IC card having a total thickness of 747 μm. The warpage was 0.6 mm in the long side direction and 0.3 mm in the short side direction.

ＩＣ As shown in FIG. 3, an IC card in which films were laminated so as to be asymmetric with respect to the central axis of the cross section was prepared. 4 shows a cross-sectional configuration of a spacer when the height of a component group mounted on the card substrate 9 is different. A 125 μm thick polyethylene terephthalate film 9 is used as a card substrate, on which an IC chip 10 (220 μm thickness, 4 × 4 mm size), an antenna 11 (500 μm thickness, 10 mmφ) and a paper battery 12 (100 μm thickness, 15 × 10 mm size) are placed. equipped. A 75 μm-thick polyethylene terephthalate film 13 punched into three holes of 5 × 5 mm, 11 mmφ, and 16 × 11 mm (a heat-sensitive adhesive having 12 μm applied on both sides) was attached to the film 1 as a first spacer 13, and a paper battery 12 was formed. And the same height. Next, a 100 μm-thick polyethylene terephthalate film 14 punched into two holes of 5 × 5 mm and 11 mmφ (a heat-sensitive adhesive of 10 μm is coated on both sides) is pasted as a second spacer 14 on the first spacer 13, The height was the same as the tip 10. Further, a 250 μm thick polyethylene terephthalate film 15 (15 μm coated with a heat-sensitive adhesive applied to both sides) punched into a hole of 11 mmφ on the second spacer 14 was attached as a third spacer, and the height was the same as that of the antenna 11. Polyethylene terephthalate films 16 and 17 each having a thickness of 50 μm (a heat-sensitive adhesive having a thickness of 10 μm applied to one surface) were adhered to the upper surface of the third spacer 15 and the lower surface of the film 9 as a skin layer to obtain an IC card having a total thickness of 754 μm. Here, the skin layers 16 and 17 were attached as follows. In the skin layer 16, the temperature of the upper laminating roll is 140 ° C. and the temperature of the lower laminating roll is 100 ° C. (the ratio of the upper laminating roll temperature to the lower laminating roll temperature is 1.4). It was attached so that it might become. Similarly, the skin layer 17 was attached so that the skin layer 17 was on the upper side with a temperature difference of 1.4. The warpage was 0.8 mm in the long side direction and 0.5 mm in the short side direction.

積 層 A laminate of an IC card was produced in the same manner as in Example 2. Here, the skin layers 16 and 17 were attached as follows. In the skin layer 16, the peripheral speed of the upper laminating roll is 0.8 m / min and the peripheral speed of the lower laminating roll is 0.5 m / min (the ratio of the peripheral speed of the upper laminating roll to the lower laminating roll is 1. 6) and attached so that the skin layer 16 is on the upper side. Similarly, the skin layer 17 was attached so that the skin layer 17 was on the lower side with a peripheral speed difference of 1.6. The warpage was 0.9 mm in the long side direction and 0.6 mm in the short side direction.

積 層 A laminate of an IC card was produced in the same manner as in Example 2. Here, the skin layers 16 and 17 were attached as follows. In the skin layer 16, the skin layer 16 was applied at an angle of 45 degrees upward from the horizontal plane in contact with the laminating roll on the application roll. The skin layer 17 was applied to the skin layer 17 so that the above-mentioned laminate (the one to which the skin layer 16 was attached) had an angle of 45 degrees. The warpage was 0.8 mm in the long side direction and 0.5 mm in the short side direction. In addition, the amount of warpage was measured by the following method. (JISX-6311) The IC card laminate was placed on a horizontal plate with the (85.6 × 54 mm) warped side convex downward. The distance from the horizontal plate to the top of the card was measured with a caliper. The warpage specification amount of the card is 1.8 mm or less in the long side direction and 1.3 mm or less in the short side direction.

It is a side view for explaining one Example of the present invention. It is sectional drawing which shows one Example of this invention. FIG. 6 is a cross-sectional view illustrating another embodiment of the present invention.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 ... Card board 2 ... IC chip 2,3,4 ... Parts 3 ... Antenna 4 ... Paper battery 5 ... Spacer layer 6 ... Film 7 ... First skin layer 8 ... Second skin layer 9 ... Card board 10 ... IC chip 11 ... Antenna 12 ... Paper battery 13 ... First spacer (polyethylene terephthalate film)
14 Second spacer (polyethylene terephthalate film)
15: Third spacer (polyethylene terephthalate film)
16: first skin layer 17: second skin layer

Claims (1)

An IC card having a multilayer structure including a card substrate, wherein an IC chip is embedded in the multilayer structure, wherein an arrangement position of the components is unevenly distributed with respect to a central axis of a cross section of the multilayer structure. card.

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