JP2004063995A5 - - Google Patents
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- Publication number
- JP2004063995A5 JP2004063995A5 JP2002223475A JP2002223475A JP2004063995A5 JP 2004063995 A5 JP2004063995 A5 JP 2004063995A5 JP 2002223475 A JP2002223475 A JP 2002223475A JP 2002223475 A JP2002223475 A JP 2002223475A JP 2004063995 A5 JP2004063995 A5 JP 2004063995A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- wiring
- insulating film
- trench
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 34
- 238000004519 manufacturing process Methods 0.000 claims 10
- 239000004020 conductor Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- 238000005498 polishing Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- -1 tungsten nitride Chemical class 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002223475A JP2004063995A (ja) | 2002-07-31 | 2002-07-31 | 半導体装置及び半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002223475A JP2004063995A (ja) | 2002-07-31 | 2002-07-31 | 半導体装置及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004063995A JP2004063995A (ja) | 2004-02-26 |
| JP2004063995A5 true JP2004063995A5 (cg-RX-API-DMAC10.html) | 2005-10-20 |
Family
ID=31943218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002223475A Pending JP2004063995A (ja) | 2002-07-31 | 2002-07-31 | 半導体装置及び半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004063995A (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9837354B2 (en) * | 2014-07-02 | 2017-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Hybrid copper structure for advance interconnect usage |
| JP2018207110A (ja) * | 2017-06-06 | 2018-12-27 | 東京エレクトロン株式会社 | 二重金属電力レールを有する集積回路の製造方法 |
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2002
- 2002-07-31 JP JP2002223475A patent/JP2004063995A/ja active Pending