JP2004047843A5 - - Google Patents

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Publication number
JP2004047843A5
JP2004047843A5 JP2002204978A JP2002204978A JP2004047843A5 JP 2004047843 A5 JP2004047843 A5 JP 2004047843A5 JP 2002204978 A JP2002204978 A JP 2002204978A JP 2002204978 A JP2002204978 A JP 2002204978A JP 2004047843 A5 JP2004047843 A5 JP 2004047843A5
Authority
JP
Japan
Prior art keywords
housing
heat
tank
pipe
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002204978A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004047843A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002204978A priority Critical patent/JP2004047843A/ja
Priority claimed from JP2002204978A external-priority patent/JP2004047843A/ja
Priority to TW092100539A priority patent/TWI221399B/zh
Priority to CNB031225136A priority patent/CN1195253C/zh
Priority to US10/615,831 priority patent/US20040008485A1/en
Publication of JP2004047843A publication Critical patent/JP2004047843A/ja
Publication of JP2004047843A5 publication Critical patent/JP2004047843A5/ja
Pending legal-status Critical Current

Links

JP2002204978A 2002-07-15 2002-07-15 電子装置 Pending JP2004047843A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002204978A JP2004047843A (ja) 2002-07-15 2002-07-15 電子装置
TW092100539A TWI221399B (en) 2002-07-15 2003-01-10 Electronic apparatus
CNB031225136A CN1195253C (zh) 2002-07-15 2003-04-16 电子装置
US10/615,831 US20040008485A1 (en) 2002-07-15 2003-07-10 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002204978A JP2004047843A (ja) 2002-07-15 2002-07-15 電子装置

Publications (2)

Publication Number Publication Date
JP2004047843A JP2004047843A (ja) 2004-02-12
JP2004047843A5 true JP2004047843A5 (https=) 2005-10-20

Family

ID=29997154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002204978A Pending JP2004047843A (ja) 2002-07-15 2002-07-15 電子装置

Country Status (4)

Country Link
US (1) US20040008485A1 (https=)
JP (1) JP2004047843A (https=)
CN (1) CN1195253C (https=)
TW (1) TWI221399B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3629257B2 (ja) * 2002-08-30 2005-03-16 株式会社東芝 電子機器
JP2004139185A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
JP2004139186A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
JP2005190091A (ja) * 2003-12-25 2005-07-14 Matsushita Electric Ind Co Ltd 冷却装置およびこれを備えた電子機器
JP4234621B2 (ja) * 2004-02-16 2009-03-04 株式会社日立製作所 液冷システムおよび電子装置
JP2006039663A (ja) * 2004-07-22 2006-02-09 Hitachi Ltd 液循環システム及びこれを用いる液冷システム
JP2006057920A (ja) * 2004-08-20 2006-03-02 Hitachi Ltd 電子機器の液冷システム、及び、これを用いた電子機器
JP2006065940A (ja) * 2004-08-26 2006-03-09 Ricoh Co Ltd 電装冷却装置、画像形成装置
JP2007009787A (ja) * 2005-06-30 2007-01-18 Hitachi Ltd モータ一体型内接歯車式ポンプ及び電子機器
JP2007095902A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 冷却装置および冷却装置を有する電子機器
US20080285226A1 (en) * 2006-01-26 2008-11-20 Fujitsu Limited Electronic device
KR20120135771A (ko) * 2011-06-07 2012-12-17 엘지전자 주식회사 공기 조화기의 실외기 및 그 제어방법
KR102412060B1 (ko) 2017-04-26 2022-06-23 엘지전자 주식회사 냉장고
CN109673128B (zh) * 2017-10-13 2021-02-12 神讯电脑(昆山)有限公司 导热模块及其显示装置和可携式电子装置
CN112714582A (zh) * 2019-10-25 2021-04-27 研能科技股份有限公司 液体散热模块
EP4660746A2 (en) * 2023-02-27 2025-12-10 Samsung Electronics Co., Ltd. Electronic device including thermal hinge assembly

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566048A (en) * 1994-06-02 1996-10-15 Hewlett-Packard Company Hinge assembly for a device having a display
US5646822A (en) * 1995-08-30 1997-07-08 Intel Corporation Heat pipe exchanger system for cooling a hinged computing device
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer
US5757615A (en) * 1996-07-01 1998-05-26 Compaq Computer Corporation Liquid cooled computer apparatus and associated methods
JP3518242B2 (ja) * 1997-04-14 2004-04-12 株式会社日立製作所 電子装置
US6069791A (en) * 1997-08-14 2000-05-30 Fujikura Ltd. Cooling device for notebook personal computer
US5953206A (en) * 1997-10-15 1999-09-14 Hewlett-Packard Company Thermal dissipation and EMI shielding structure for notebook computers
US6031716A (en) * 1998-09-08 2000-02-29 International Business Machines Corporation Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity
JP3973362B2 (ja) * 1999-03-11 2007-09-12 富士通株式会社 電子機器及び電気部品
US6507488B1 (en) * 1999-04-30 2003-01-14 International Business Machines Corporation Formed hinges with heat pipes
JP2002099356A (ja) * 2000-09-21 2002-04-05 Toshiba Corp 電子機器用冷却装置および電子機器
JP3607608B2 (ja) * 2000-12-19 2005-01-05 株式会社日立製作所 ノート型パソコンの液冷システム
JP2002188876A (ja) * 2000-12-20 2002-07-05 Hitachi Ltd 液冷システムおよびこれを用いたパーソナルコンピュータ
JP2002189535A (ja) * 2000-12-20 2002-07-05 Hitachi Ltd 液冷システムおよびこれを用いたパーソナルコンピュータ
JP2002232174A (ja) * 2001-02-06 2002-08-16 Hitachi Ltd 電子装置
US6587336B2 (en) * 2001-06-27 2003-07-01 International Business Machines Corporation Cooling system for portable electronic and computer devices
JP4512296B2 (ja) * 2001-08-22 2010-07-28 株式会社日立製作所 可搬型情報処理装置の液冷システム

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