JP2004046360A - Antenna coil configuration for ic card, manufacturing method therefor and ic card provided with the configuration - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna coil configuration for IC card, with which blocking is not caused, adhesive property with an outer layer can be improved and which does not have a problem on appearance, and to provide a manufacturing method of the configuration and an IC card provided with the configuration. <P>SOLUTION: The antenna coil configuration 10 for IC card is provided with a resin film base material 11 comprising a vinyl chloride resin and a circuit pattern layer 13 comprising metal foil formed by thermobonding on a surface of the base material 11 through an adhesive layer 12. The resin film base material 11 comprising the vinyl chloride resin is fixed on a surface of metal foil through the adhesive layer by thermobonding. At least a part of metal foil is etched by using a resist ink layer as a mask. Thus, the circuit pattern layer 13 is formed and the resist ink layer is removed. The IC card is provided with the outer layer formed to cover the IC chip loaded on the antenna coil configuration 10 for IC card. <P>COPYRIGHT: (C)2004,JPO

Description

【００６８】
表１から、本発明に従った実施例１と２の試料では、ブロッキング現象を防止することができ、外装フィルムとの接着性も良好であったが、比較例１の試料ではブロッキング現象が生じ、比較例２と３の試料では外装フィルムとの接着強度が不足していたことがわかる。
【００６９】
以上に開示された実施の形態や実施例はすべての点で例示的に示されるものであり、制限的なものではないと考慮されるべきである。本発明の範囲は、以上の実施の形態や実施例ではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての修正や変更を含むものである。
【００７０】
【発明の効果】
以上のように、この発明のＩＣカード用アンテナコイル構成体によれば、ドライラミネート用接着剤を使用していないので、ブロッキング現象を防止することができるとともに、外装層との接着性を改善することができる。
【００７１】
また、この発明のＩＣカードによれば、ＩＣカードを構成する積層体において各層間の接着力を向上させることができるので、改ざん防止、エンボス加工性、長期間の使用に対する耐久性等を改善することができる。
【００７２】
さらに、この発明のＩＣカード用アンテナコイル構成体の製造方法によれば、外装層を積層する際にホットメルト接着剤を必ずしも使用する必要がないので、製造工程と製造コストを削減することができる。
【図面の簡単な説明】
【図１】この発明の１つの実施の形態に従ったＩＣカード用アンテナコイル構成体を示す平面図である。
【図２】図１のＩＩ−ＩＩ線の方向から見たＩＣカード用アンテナコイル構成体の部分断面図である。
【図３】図１のＩＩ−ＩＩ線の方向から見たＩＣカードの部分断面図である。
【図４】この発明の１つの実施の形態に従ったＩＣカード用アンテナコイル構成体の第１の製造工程を示す部分断面図である。
【図５】この発明の１つの実施の形態に従ったＩＣカード用アンテナコイル構成体の第２の製造工程を示す部分断面図である。
【図６】この発明の１つの実施の形態に従ったＩＣカード用アンテナコイル構成体の第３の製造工程を示す部分断面図である。
【図７】この発明の１つの実施の形態に従ったＩＣカード用アンテナコイル構成体の第４の製造工程を示す部分断面図である。
【符号の説明】
１：ＩＣカード、１０：ＩＣカード用アンテナコイル構成体、１１：樹脂フィルム基材、１２：接着剤層、１３：回路パターン層、１４：レジストインク層、２０：ＩＣチップ、３０：外装層、１３０：金属箔。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an antenna coil structure for an IC card, a method of manufacturing the same, and an IC card having the same.
[0002]
[Prior Art and Problems to be Solved by the Invention]
In recent years, IC cards have made remarkable developments and have begun to be used for telephone cards, credit cards, prepaid cards, cash cards, ID cards, card keys, various membership cards, book tickets, consultation tickets, commuter passes, and the like. As a substrate of these conventional IC cards, a resin film such as a general-purpose polyethylene terephthalate (PET) film has been used. After adhering a metal foil to both surfaces of this resin film with an adhesive by a dry laminating method, the metal foil is subjected to an etching treatment, so that a circuit pattern layer is formed on the surface of the base material for an IC card. An antenna coil configuration was used.
[0003]
However, the conventional IC coil antenna coil structure has the following problems in the manufacturing process and product characteristics.
[0004]
(1) After manufacturing an antenna coil structure for an IC card, the antenna coil structures are stacked on each other or wound up until an IC chip is mounted on the antenna coil structure. Transported and stored. At this time, a phenomenon in which the overlapped portions of the antenna coil components adhere to each other (called blocking) occurs. Since the adhered portion cannot be easily separated, there is a problem that the IC card production line stops when the antenna coil structure is supplied to the next step. In addition, there is a problem that a defective IC card is generated when the antenna coil components are supplied to the next step while being overlapped.
[0005]
In order to prevent this blocking phenomenon, the portion where the metal foil has been removed by etching, that is, the excess dry laminating adhesive remaining on the surface of the base material where the circuit pattern layer is not formed is removed. Alternatively, a measure of inserting a release paper into a portion where the antenna coil components overlap may be considered. However, with the former measure, it is extremely difficult to completely remove the adhesive. For the latter measure, a step of inserting a release paper and a step of removing it are required. Therefore, no matter which measure is taken, an extra step is required, and there is a problem that the manufacturing cost increases.
[0006]
(2) After the IC chip is mounted on the antenna coil structure for the IC card, a colored vinyl chloride resin (PVC) film or a polyethylene terephthalate (PET) film or the like is coated with a polyester-based or ethylene-vinyl acetate-based heat as an exterior layer. Thermal bonding using a hot (melt) adhesive. However, extra dry laminating adhesive remains on the surface of the base where the metal foil has been removed by etching, that is, where the circuit pattern layer is not formed, and between the base and the exterior layer. Because of the interposition, the thermal adhesive force of the exterior layer by the hot melt adhesive becomes insufficient. As a result, the conventional IC card has problems in terms of durability for long-term use and prevention of tampering.
[0007]
In order to solve this problem, the type of adhesive is changed. Between the adhesive layer for dry lamination and the hot melt adhesive layer, a polyester and ethylene vinyl acetate having good adhesion with the hot melt adhesive are used. It is necessary to take measures such as providing an intervening layer such as a polymer (EVA) or removing the adhesive layer for dry lamination by some method. However, there is a problem that both measures deteriorate workability and increase manufacturing costs.
[0008]
Accordingly, an object of the present invention is to provide an antenna coil structure for an IC card which can improve the adhesiveness to an exterior layer without blocking, and has no problem in appearance, a method for manufacturing the same, and a method for manufacturing the same. It is to provide an IC card.
[0009]
[Means for Solving the Problems]
An antenna coil structure for an IC card according to the present invention includes a base material including a vinyl chloride resin, and a circuit pattern including a metal foil formed on the surface of the base material by thermal bonding with an adhesive interposed therebetween. And a layer.
[0010]
In the antenna coil structure for an IC card according to the present invention, the circuit pattern layer is fixed by thermal bonding using a material containing a vinyl chloride resin as the base material, so that the blocking phenomenon can be prevented and the conventional IC The heat bonding strength of the outer layer can be higher than that of the card.
[0011]
In the antenna coil structure for an IC card according to the present invention, it is preferable to use a resin containing a copolymer of vinyl chloride, vinyl acetate and maleic acid as the adhesive between the base material and the circuit pattern layer.
[0012]
Preferably, in the antenna coil structure for an IC card according to the present invention, the circuit pattern layer is formed on the first circuit pattern layer formed on one surface of the base material and on the other surface of the base material. A second circuit pattern layer. In this case, it is preferable that at least a part of the first circuit pattern layer is in contact with at least a part of the second circuit pattern layer. Thus, electrical continuity between the first and second circuit pattern layers can be achieved. The contact between the first and second circuit pattern layers can be easily performed by crimping.
[0013]
An IC card according to the present invention includes an IC chip mounted on an antenna coil structure for an IC card having any one of the above structures, and an IC chip mounted on the antenna coil structure for an IC card so as to cover the IC chip. And a formed exterior layer.
[0014]
A method of manufacturing an antenna coil structure for an IC card according to the present invention includes the following steps.
[0015]
(A) fixing a base material containing a vinyl chloride resin to the surface of the metal foil by thermal bonding with an adhesive interposed therebetween;
[0016]
(B) printing a resist ink layer having a pattern on the metal foil;
(C) forming a circuit pattern layer including the metal foil by etching at least a part of the metal foil using the resist ink layer as a mask;
[0017]
(D) removing the resist ink layer after forming the circuit pattern layer;
In the production method of the present invention, the adhesive is preferably a resin containing a copolymer of vinyl chloride, vinyl acetate and maleic acid.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a plan view of an IC coil antenna coil structure according to an embodiment of the present invention, and FIG. 2 is a partial cross section of the IC card antenna coil structure viewed from the direction of line II-II in FIG. FIG. 3 is a partial cross-sectional view of the IC card viewed from the direction of the line II-II in FIG.
[0019]
As shown in FIGS. 1 and 2, the antenna coil structure 10 for an IC card includes a resin film substrate 11, an adhesive layer 12 formed on both surfaces of the resin film substrate 11, and a surface of the adhesive layer 12. And a circuit pattern layer 13 made of a metal foil formed according to a predetermined pattern. The circuit pattern layer 13 is formed in a spiral pattern on the surface of the resin film substrate 11 as shown in FIG. An area for connecting wiring to the IC chip is formed at an end of the circuit pattern layer 13, and an area 13c for mounting the IC chip is formed near the end. In FIG. 1, a circuit pattern layer indicated by a dotted line indicates a circuit pattern layer formed on the back surface of the resin film substrate 11, and the front and back circuit pattern layers are electrically connected to each other at each of the crimping portions 13a and 13b. So that they are in contact. This contact is achieved by partially breaking the resin film substrate 11 and the adhesive layer 12 by crimping.
[0020]
As shown in FIG. 3, the IC card 1 includes an IC chip 20 mounted on the IC card antenna coil structure 10 shown in FIG. 2, and an IC card antenna coil structure so as to cover the IC chip 20. And an exterior layer 30 formed on the outer layer 10. The IC chip 20 is connected to an end of the circuit pattern layer 13 by a wiring 21.
[0021]
In the above embodiment, the metal foil constituting the circuit pattern layer 13 can be at least one selected from aluminum foil, copper foil, stainless steel foil, titanium foil, tin foil, and the like. Among these metal foils, it is most preferable to use an aluminum foil as a constituent material of the circuit pattern layer 13 in terms of economy and reliability. Here, the aluminum foil is not limited to a pure aluminum foil, but also includes an aluminum alloy foil.
[0022]
The metal foil preferably has a thickness of 7 μm to 60 μm and a purity of 97.5 mass% to 99.7 mass%, more preferably a thickness of 15 μm to 50 μm and a purity of 98.0 mass% or more. 99.5% by mass or less.
[0023]
If the thickness of the metal foil is less than 7 μm, many pinholes are generated and the metal foil may be broken during the manufacturing process. On the other hand, when the thickness of the metal foil exceeds 60 μm, it takes a long time for the etching process for forming the circuit pattern layer 13 and increases the material cost.
[0024]
When the purity of the metal foil is less than 97.5% by mass, impurities contained in the metal foil increase, the electric resistance of the circuit pattern layer 13 increases, the corrosion resistance extremely deteriorates, and even a small amount of moisture corrodes. May progress. On the other hand, when the purity of the metal foil exceeds 99.7% by mass, the corrosion resistance of the metal foil is excessively improved, so that the etching process takes time.
[0025]
Specifically, as a material of the circuit pattern layer 13, for example, a pure aluminum foil or an aluminum alloy foil such as 1030, 1N30, 1050, 1100, 8021, and 8079 in JIS (AA) symbol can be adopted.
[0026]
In the present invention, the purity when an aluminum foil is used as the metal foil means iron (Fe), silicon (Si), copper (Cu), manganese (Mn), magnesium (Mg), zinc (Zn), gallium (Ga). , Titanium (Ti), zirconium (Zr), nickel (Ni), and chromium (Cr) by subtracting the total mass% of the main impurity elements from 100 mass%. When an aluminum foil is used, the iron content is 0.2 to 1.5% by mass, the silicon content is 0.05 to 1.0% by mass, and the copper content is 0.3% by mass or less. Is preferred.
[0027]
From the viewpoint of the strength of the aluminum foil, the above composition range is preferable, and the tensile strength is preferably 70 to 120 MPa, and the elongation is preferably 5% or more. If the tensile strength of the metal foil is less than 70 MPa or the elongation is less than 5%, bending or wrinkling may occur during the manufacturing process, and the dimensional accuracy of the circuit pattern layer may be deteriorated. The metal foil is preferably a soft foil or a semi-hard foil, and is preferably annealed at a temperature of about 250 to 550 ° C. after rolling into a foil. If a hard foil having a tensile strength exceeding 120 MPa is used, there is a problem in terms of remaining rolling oil and flexibility (winding property), which is not preferable.
[0028]
In one embodiment described above, a resin constituting the resin film substrate 11 is a vinyl chloride resin (PVC). The thickness of the resin film substrate 11 is preferably 30 μm or more and 130 μm or less, more preferably 35 μm or more and 70 μm or less. When the thickness of the base material is less than 30 μm, the rigidity of the laminate with the metal foil forming the circuit pattern layer is insufficient, which causes a problem in workability in each manufacturing process. On the other hand, when the thickness of the base material exceeds 130 μm, there is a possibility that a crimping process described later cannot be reliably performed.
[0029]
In the above embodiment, the material of the adhesive layer 12 used for thermally bonding (also called heat lamination or thermal lamination) between the resin film substrate 11 and the circuit pattern layer 13 is vinyl chloride. A resin containing a copolymer of vinyl acetate and maleic acid is preferred. Here, the copolymer of vinyl chloride, vinyl acetate, and maleic acid is a copolymer of vinyl chloride and vinyl acetate that is maleated and modified, and its copolymerization ratio (vinyl chloride: vinyl acetate: maleic acid) ) Is preferably in the range of 70 to 90:10 to 30: 1 to 3. Specifically, VMCH (trade name) manufactured by Union Carbide (copolymerization ratio 86: 13: 1) or the like can be used as the resin. When the copolymerization ratio is out of the above range, the adhesive strength with the vinyl chloride resin constituting the base material or the metal foil constituting the circuit pattern layer is significantly reduced. For this reason, poor etching of the metal foil occurs when forming the circuit pattern layer due to insufficient adhesive force between the metal foil and the vinyl chloride resin, or the metal foil may peel off from the vinyl chloride resin in a later process. There is.
[0030]
As a material of the adhesive layer 12, a copolymer of vinyl chloride, vinyl acetate and maleic acid may be used alone, but a linear polyester resin and / or an epoxy resin may be used in order to improve heat resistance and adhesiveness. May contain 30% by mass or more of the above copolymer at a solid content ratio. In this case, when the solid content ratio of the above copolymer is less than 30% by mass, the adhesive strength with the vinyl chloride resin constituting the base material or the metal foil constituting the circuit pattern layer is significantly reduced. . For this reason, poor etching of the metal foil occurs when forming the circuit pattern layer due to insufficient adhesive force between the metal foil and the vinyl chloride resin, or the metal foil may peel off from the vinyl chloride resin in a later process. There is.
[0031]
In order to heat-bond a metal foil for forming a circuit pattern layer on a vinyl chloride resin film as a base material, the thickness of the heat laminating adhesive is 2 to 20 g / m2 after heat bonding. ² About 3 to 6 g / m. ² It is about. This coating amount is 2 g / m ² If it is less than 20 g / m, the adhesive strength is not sufficient. ² Exceeding not only causes a problem in crimping but also increases the material cost, which is not preferable.
[0032]
In the present invention, the vinyl chloride resin film constituting the base material and the metal foil constituting the circuit pattern layer are laminated by thermal bonding. For this reason, the substrate and the circuit pattern layer can be fixed without using an adhesive for dry lamination. Therefore, since a strong adhesive force can be exhibited and maintained between the base material and the circuit pattern layer, it is possible to overcome the problems of the related art.
[0033]
The heat bonding step is usually performed by bonding the base resin film while heating the metal foil using a heating roll. The temperature of the thermal bonding is preferably about 100 to 160 ° C.
[0034]
The metal foil can be laminated on one side or both sides of the vinyl chloride resin film, and can be appropriately used depending on the use, design, purpose of use, and the like.
[0035]
Next, one embodiment of a method of manufacturing an antenna coil structure for an IC card according to the present invention will be described. 4 to 7 are partial cross-sectional views showing the steps of manufacturing the antenna coil structure for an IC card according to the present invention. 4 to 7 show partial cross sections as viewed from the direction of the line II-II in FIG.
[0036]
As shown in FIG. 4, an adhesive layer 12 is formed on one surface of each of the metal foils 130, and the resin film substrate 11 is fixed to the metal foil 130 by thermal bonding with the adhesive layers 12 interposed therebetween. In this way, a laminate of the metal foil 130 and the resin film substrate 11 is prepared.
[0037]
As shown in FIG. 5, the resist ink layer 14 is printed on the surface of the metal foil 130 so as to have a predetermined spiral pattern according to the specifications of the antenna coil. After printing, the resist ink layer 14 is cured.
[0038]
As shown in FIG. 6, the circuit pattern layer 13 is formed by etching the metal foil 130 using the resist ink layer 14 as a mask.
[0039]
Thereafter, as shown in FIG. 7, the resist ink layer 14 is peeled off.
Finally, a predetermined portion of the circuit pattern layer 13 is subjected to crimping using a metal plate having irregularities and metal projections, thereby forming a contact portion or a crimp portion 13a of the circuit pattern layer as shown in FIG. Thus, the antenna coil structure 10 for an IC card of the present invention is completed.
[0040]
The resist ink used in the production method of the present invention is not particularly limited, but it is preferable to use an ultraviolet-curable resist ink containing an acrylic monomer having at least one carboxyl group in a molecule and an alkali-soluble resin as main components. This resist ink is suitable for continuous mass production because it can be subjected to gravure printing, has acid resistance, and can be easily peeled off with an alkali. After performing gravure printing on the metal foil in a predetermined circuit pattern using the resist ink and irradiating with ultraviolet light to cure the metal foil, acid etching of the metal foil with, for example, an aqueous solution of ferric chloride or the like, hydroxylation according to a usual method. The circuit pattern layer can be formed by removing and removing the resist ink layer with an alkali such as a sodium aqueous solution.
[0041]
Examples of the acrylic monomer having at least one carboxyl group in the molecule include 2-acryloyloxyethyl phthalic acid, 2-acryloyloxyethyl succinic acid, 2-acryloyloxyethyl hexahydrophthalic acid, and 2-acryloyloxypropyl phthalate Acid, 2-acryloyloxypropyltetrahydrophthalic acid, 2-acryloyloxypropylhexahydrophthalic acid, and the like. Among these, a single acrylic monomer or a mixture of several acrylic monomers can be used. . Examples of the alkali-soluble resin include a styrene-maleic acid resin, a styrene-acrylic resin, and a rosin-maleic acid resin.
[0042]
To the resist ink, in addition to the above components, ordinary monofunctional acrylic monomers, polyfunctional acrylic monomers, and prepolymers can be added to the extent that the alkali releasability is not impaired. Photopolymerization initiators, pigments, additives , A solvent or the like may be appropriately added. Examples of the photopolymerization initiator include benzophenone and its derivatives, benzyl and benzoin, and their alkyl ethers, thioxanthone and its derivatives, lucilin PTO, Irgacure manufactured by Ciba Specialty Chemicals, and Esacure manufactured by Frattelli Lamberti. As the pigment, an extender such as silica, talc, clay, barium sulfate, or calcium carbonate can be used in addition to a color pigment so that the pattern can be easily seen. In particular, silica is effective in preventing blocking when a metal foil is wound up with the ultraviolet-curable resist ink attached. Examples of the additives include a polymerization inhibitor such as 2-tert-butylhydroquinone, an antifoaming agent such as silicon, a fluorine compound, and an acrylic polymer, and a leveling agent. These are added as needed. Examples of the solvent include ethyl acetate, ethanol, denatured alcohol, isopropyl alcohol, toluene, MEK and the like, and these solvents can be used alone or as a mixture. After the gravure printing, the solvent is preferably evaporated from the resist ink layer by hot air drying or the like.
[0043]
After the formation of the circuit pattern layer, crimping processing is performed at a predetermined position at normal temperature, and a part of the metal foil on the front side and the back side is electrically contacted to form an antenna coil. Here, the crimping process refers to, for example, breaking a resin film substrate and an adhesive layer by a drill, a file, an ultrasonic wave, or the like, and bringing a part of the metal foil forming the circuit pattern layer into physical contact with each other. Say. Specifically, the resin film substrate and the adhesive layer are partially destroyed by bringing the laminate composed of the resin film substrate and the metal foil into contact with the metal plate having irregularities and pressing the metal projections. Then, the surfaces of the metal foils can come into contact with each other, and electrical continuity can be obtained.
[0044]
Although the configuration and manufacturing method of the antenna coil structure for an IC card according to the present invention have been described, the following steps are further performed to commercialize the IC card as an IC card. In the antenna coil assembly 10 for an IC card shown in FIG. 1, the IC chip 20 is mounted on the area 13c of the circuit pattern layer 13 as shown in FIG. 3, and wiring is provided between the IC chip 20 and the end of the circuit pattern layer 13. 21 is connected. Further, an outer layer (concealing layer) 30 such as white PVC or white PET is coated and laminated on the front and back surfaces of the laminate of the circuit pattern layer 13 and the resin film substrate 11. The lamination may be performed by thermal bonding via an EVA or polyester hot melt agent. The exterior layer (concealing layer) 30 is not limited to white, and may be a known color pigment, an extender, a metal pigment such as aluminum flake, a known resin, a varnish, a vehicle, or the like. In addition, components used in known IC cards, such as a printing layer, a magnetic recording layer, a magnetic shielding layer, an overcoat layer, and a vapor deposition layer, may be laminated as necessary. Needless to say, a capacitor, a coil, a resistor, a wiring, various memories, a diode, and the like may be provided as necessary in addition to the IC chip.
[0045]
【Example】
Hereinafter, examples of the present invention and comparative examples will be described.
[0046]
(Example 1)
On one surface of each of aluminum foils having a thickness of 30 μm and 20 μm (JIS (AA) 1N30-O), a copolymer of vinyl chloride, vinyl acetate and maleic acid (copolymerization ratio 86:13: 1 g) of 3 g / m of VMCH (trade name) manufactured by Union Carbide Co. ² Then, a 50 μm-thick vinyl chloride resin film as a substrate is continuously laminated with an aluminum foil having a thickness of 30 μm on one surface and a thickness of 20 μm on the other surface at a heat bonding temperature of 160 ° C. To produce a laminate. 5 g / m of Dicure-RE-97 (trade name) manufactured by Dainippon Ink and Chemicals, Inc. as a resist ink on both surfaces of the laminate. ² , A resist ink layer having a pattern as shown in FIG. 1 was continuously printed. Using this resist ink layer as a mask, excess aluminum foil was etched with an aqueous ferric chloride solution to form a circuit pattern layer. Thereafter, the resist ink layer was peeled off with an aqueous solution of sodium hydroxide. At a predetermined position of the formed circuit pattern layer, a part of the laminate was subjected to crimping processing for obtaining front and back electrical continuity, thereby producing an IC card antenna coil structure as shown in FIG. . The antenna coil structure for an IC card was wound into a coil at a tension of 0.2 kg / cm.
[0047]
The blocking phenomenon of the obtained IC coil antenna coil assembly was evaluated as follows. After storing the IC coil antenna coil assembly in a coiled state in the air at a temperature of 40 ° C. or 60 ° C. for 48 hours, the end of the coil was unwound by hand and evaluated. The evaluation criteria were as follows.
[0048]
Evaluation 5: When the winding coil is rewound, the ends are separated without any pulling without being pulled.
[0049]
Evaluation 4: A noise is made when unwinding the winding coil, but the end is separated without applying a particularly strong force.
[0050]
Evaluation 3: The end part does not separate unless a force is applied when rewinding the winding coil, but the end part separates when pulled with a certain amount of force.
[0051]
Evaluation 2: When a force is applied when rewinding the winding coil, the ends are separated, but the material is partially damaged.
[0052]
Evaluation 1: Attempting to rewind the winding coil completely adheres, and the end does not separate even if force is applied.
[0053]
In addition, the conduction resistance values on the front and back of the crimped portion of the obtained IC coil antenna coil assembly were measured.
[0054]
Further, the appearance of the circuit pattern layer formed by etching in the obtained antenna coil structure for IC card was evaluated. Etching defects such as disconnection, thinning and peeling of the circuit pattern due to the etching were visually observed, and those having no etching defect were evaluated as good, and those having a possibility of causing a problem in characteristics as a product were evaluated as defective.
[0055]
A hard vinyl chloride film having a thickness of 100 μm (manufactured by Mitsubishi Plastics Co., Ltd., trade name: C-419) was placed on both sides of the obtained IC coil antenna coil structure without a hot melt adhesive at a temperature of 120 ° C. , Pressure 10kg / cm ² And hot-pressing for 5 minutes to evaluate the adhesion to the exterior film. This evaluation was performed by measuring the lamination strength between the exterior film and the antenna coil structure for an IC card according to a T-type peeling test (based on JIS K 6854 T-type peeling, with a width of 15 mm).
[0056]
(Example 2)
As an adhesive for heat lamination, a copolymer of vinyl chloride, vinyl acetate and maleic acid (copolymerization ratio of 86:13) was formed on one surface of each of aluminum foils having a thickness of 30 μm and 20 μm (JIS (AA) 1N30-O). 1) 50 parts by weight of VMCH (trade name) manufactured by Union Carbide Co., Ltd. and 50 parts by weight of phthalkid SP211 manufactured by Hitachi Chemical Co., Ltd. made of a linear polyester resin are mixed at a ratio of 5 g / m. ² An antenna coil assembly for an IC card was produced in the same process as in Example 1 except that the thickness was applied.
[0057]
In the same manner as in Example 1, the obtained antenna coil structure for an IC card was evaluated for the blocking phenomenon, the conduction resistance on the front and back of the crimped portion, and the appearance of the circuit pattern layer formed by etching.
[0058]
Also, a 30 μm-thick Alonmelt EEF111 (trade name) manufactured by Toagosei Co., Ltd. was interposed as a hot melt adhesive for EVA on both sides of the obtained IC coil antenna coil structure, and the thickness was 100 μm. A low heat shrinkable white PET film (manufactured by Teijin Limited, trade name: Teijin U2) was prepared at a temperature of 120 ° C. and a pressure of 3 kg / cm. ² And hot-pressing for 5 minutes to evaluate the adhesion to the exterior film. This evaluation was performed in the same manner as in Example 1.
[0059]
(Comparative Example 1)
On one surface of each of aluminum foils having a thickness of 30 μm and 20 μm (JIS (AA) 1N30-O), 3 g / m of a polyester urethane adhesive was used as an adhesive for dry lamination. ² Then, an aluminum foil having a thickness of 30 μm on one surface of a polyethylene naphthalate resin (PEN) film having a thickness of 38 μm as a substrate and a thickness of 20 μm on the other surface are continuously bonded by a dry lamination method. A laminate was produced. 5 g / m of Dicure-RE-97 (trade name) manufactured by Dainippon Ink and Chemicals, Inc. as a resist ink on both surfaces of the laminate. ² , A resist ink layer having a pattern as shown in FIG. 1 was continuously printed. Using this resist ink layer as a mask, excess aluminum foil was etched with an aqueous ferric chloride solution to form a circuit pattern layer. Thereafter, the resist ink layer was peeled off with an aqueous solution of sodium hydroxide. At a predetermined position of the formed circuit pattern layer, a part of the laminate was subjected to crimping processing for obtaining front and back electrical continuity, thereby producing an IC card antenna coil structure as shown in FIG. . The antenna coil structure for an IC card was wound into a coil at a tension of 0.2 kg / cm.
[0060]
In the same manner as in Example 1, the obtained antenna coil structure for an IC card was evaluated for the blocking phenomenon, the conduction resistance on the front and back of the crimped portion, and the appearance of the circuit pattern layer formed by etching.
[0061]
Also, a 30 μm-thick Alonmelt EEF111 (trade name) manufactured by Toagosei Co., Ltd. was interposed as a hot melt adhesive for EVA on both sides of the obtained IC coil antenna coil structure, and the thickness was 100 μm. A low heat shrinkable white PET film (manufactured by Teijin Limited, trade name: Teijin U2) was prepared at a temperature of 120 ° C. and a pressure of 3 kg / cm. ² And hot-pressing for 5 minutes to evaluate the adhesion to the exterior film. This evaluation was performed in the same manner as in Example 1.
[0062]
(Comparative Example 2)
An epoxy-containing polyester polyurethane adhesive as an adhesive for dry lamination is 3 g / m on one surface of each of aluminum foils having a thickness of 30 μm and 20 μm (JIS (AA) 1N30-O). ² Then, a 30 μm thick aluminum foil having a thickness of 30 μm on one surface of a vinyl chloride resin film having a thickness of 50 μm as a substrate and a 20 μm thick aluminum foil on the other surface are continuously bonded by a dry lamination method to form a laminate. Produced. 5 g / m of Dicure-RE-97 (trade name) manufactured by Dainippon Ink and Chemicals, Inc. as a resist ink on both surfaces of the laminate. ² , A resist ink layer having a pattern as shown in FIG. 1 was continuously printed. Using this resist ink layer as a mask, the aluminum foil was etched with a ferric chloride aqueous solution to form a circuit pattern layer. Thereafter, the resist ink layer was peeled off with an aqueous solution of sodium hydroxide. At a predetermined position of the formed circuit pattern layer, a part of the laminate was subjected to crimping processing for obtaining front and back electrical continuity, thereby producing an IC card antenna coil structure as shown in FIG. . The antenna coil structure for an IC card was wound into a coil at a tension of 0.2 kg / cm.
[0063]
In the same manner as in Example 1, the obtained antenna coil structure for IC card had a blocking phenomenon, conduction resistance values on the front and back of the crimped portion, the appearance of the circuit pattern layer formed by etching, and the appearance of the exterior film. The adhesion was evaluated.
[0064]
(Comparative Example 3)
An antenna coil structure for an IC card was manufactured in the same process as in Comparative Example 2, except that a vinyl chloride resin film having a thickness of 150 μm was used as a substrate.
[0065]
About the obtained antenna coil structure for IC cards, in the same manner as in Comparative Example 2, the blocking phenomenon, the conduction resistance value of the front and back of the crimped portion, the appearance of the circuit pattern layer formed by etching, and the appearance film The adhesion was evaluated.
[0066]
Table 1 shows the above evaluation results.
[0067]
[Table 1]

[0068]
From Table 1, it can be seen that in the samples of Examples 1 and 2 according to the present invention, the blocking phenomenon could be prevented and the adhesion to the exterior film was good, but in the sample of Comparative Example 1, the blocking phenomenon occurred. It can be seen that the samples of Comparative Examples 2 and 3 had insufficient adhesive strength to the exterior film.
[0069]
The embodiments and examples disclosed above are illustratively shown in all respects, and should not be construed as limiting. The scope of the present invention is defined by the terms of the claims, rather than the embodiments or examples described above, and includes any modifications or changes within the meaning and scope equivalent to the terms of the claims.
[0070]
【The invention's effect】
As described above, according to the antenna coil structure for IC card of the present invention, since the adhesive for dry lamination is not used, the blocking phenomenon can be prevented, and the adhesiveness with the outer layer is improved. be able to.
[0071]
Further, according to the IC card of the present invention, since the adhesive strength between the layers in the laminate constituting the IC card can be improved, the tamper resistance, embossability, durability for long-term use, and the like are improved. be able to.
[0072]
Furthermore, according to the method of manufacturing an antenna coil assembly for an IC card of the present invention, it is not necessary to use a hot-melt adhesive when laminating the exterior layers, so that the manufacturing process and the manufacturing cost can be reduced. .
[Brief description of the drawings]
FIG. 1 is a plan view showing an antenna coil structure for an IC card according to one embodiment of the present invention.
FIG. 2 is a partial cross-sectional view of the IC card antenna coil structure viewed from the direction of line II-II in FIG.
FIG. 3 is a partial cross-sectional view of the IC card viewed from the direction of line II-II in FIG.
FIG. 4 is a partial cross-sectional view showing a first manufacturing process of the antenna coil structure for an IC card according to one embodiment of the present invention;
FIG. 5 is a partial cross-sectional view showing a second manufacturing process of the antenna coil structure for an IC card according to one embodiment of the present invention;
FIG. 6 is a partial cross-sectional view showing a third manufacturing step of the antenna coil structure for an IC card according to one embodiment of the present invention;
FIG. 7 is a partial sectional view showing a fourth manufacturing step of the antenna coil structure for an IC card according to one embodiment of the present invention;
[Explanation of symbols]
1: IC card, 10: antenna coil structure for IC card, 11: resin film base, 12: adhesive layer, 13: circuit pattern layer, 14: resist ink layer, 20: IC chip, 30: exterior layer, 130: metal foil.

Claims (7)

A base material containing a vinyl chloride resin,
An antenna coil structure for an IC card, comprising: a circuit pattern layer including a metal foil formed on the surface of the base material by thermal bonding with an adhesive interposed therebetween. The antenna coil assembly for an IC card according to claim 1, wherein the adhesive is a resin containing a copolymer of vinyl chloride, vinyl acetate, and maleic acid. The circuit pattern layer includes a first circuit pattern layer formed on one surface of the substrate, and a second circuit pattern layer formed on the other surface of the substrate. The antenna coil structure for an IC card according to claim 1. The antenna coil structure for an IC card according to claim 3, wherein at least a part of the first circuit pattern layer is in contact with at least a part of the second circuit pattern layer. An IC chip mounted on the antenna coil structure for an IC card according to any one of claims 1 to 4,
And an exterior layer formed on the IC card antenna coil structure so as to cover the IC chip. A step of fixing the base material containing the vinyl chloride resin by thermal bonding with an adhesive on the surface of the metal foil,
Printing a resist ink layer having a pattern on the metal foil,
Forming a circuit pattern layer including the metal foil by etching at least a portion of the metal foil using the resist ink layer as a mask,
Removing the resist ink layer after the formation of the circuit pattern layer. The method for manufacturing an antenna coil assembly for an IC card according to claim 6, wherein the adhesive is a resin containing a copolymer of vinyl chloride, vinyl acetate, and maleic acid.

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