JP4612408B2 - Circuit structure - Google Patents

Description

This invention generally relates to a circuit structure, the particular those related to the circuit assembly, such as FPC (flexible printed circuit board) used in electrical and electronic equipment and the like.

  Conventional circuit components are used in, for example, IC cards, cellular phones, portable terminals (PDAs), portable sound sources (radio, portable tape recorder, portable CD player, etc.), digital cameras, digital video cameras, and the like, so that they are relatively small. In recent years, miniaturization and thinning have been progressing.

  As a method for manufacturing a circuit structure, for example, a method described in Japanese Patent Application Laid-Open No. 2004-46360 (Patent Document 1) is known. This manufacturing method includes the following manufacturing steps. First, a resin film and a metal foil are bonded together. Next, a resist layer is printed on the metal foil using a resist ink. Thereafter, the portion of the metal foil not covered with the resist layer is dissolved and removed by etching. If necessary, the resist layer is peeled off.

  However, it is difficult to manufacture a long circuit structure by the conventional method of manufacturing a circuit structure. That is, in such a process, it is possible to manufacture a small circuit structure for an IC card or the like, but it is difficult or impossible to manufacture a long circuit structure. This is because, in order to print the resist layer, it is necessary to use a plate cylinder (gravure roll or the like) such as a gravure plate, but there is a limit to the size of the plate cylinder (maximum: width 1500 mm × diameter about 300 mm). Because there is.

In addition, in order to manufacture a long circuit structure, a plurality of strip circuit structures are manufactured by the conventional manufacturing method as described above, and the strip circuit structures are connected by soldering or conductive paste. It is possible to combine them. However, when strip-shaped circuit components are joined together by soldering, the resin film as the base material is thermally damaged and contracted by the heat conduction that occurs during soldering. There is a problem that cannot be obtained. In particular, when the metal foil is an aluminum foil, there is no solder that can satisfactorily bond the metal foils constituting the circuit pattern layer. On the other hand, when strip-shaped circuit components are connected using conductive paste, the contact resistance of the connection portion increases, and sufficient performance may not be obtained due to secular change or poor adhesion of the conductive paste. is there.
JP 2004-46360 A

Therefore, an object of the present invention is to provide a long circuit structure that can be industrially produced continuously and has excellent reliability and dimensional accuracy.

A circuit structure according to the present invention is a circuit structure including a base material containing a resin and a circuit pattern layer formed on the surface of the base material. And a second circuit component part, first, second and third connection parts, and first and second folded circuit component parts. The first circuit component part has a circuit pattern layer part extending linearly in one direction. The second circuit component portion has a circuit pattern layer portion extending linearly substantially in the same direction as the direction in which the circuit pattern layer portion of the first circuit component portion extends. The first connection portion of the L-shaped, having one end which is parallel connected integrally the surface of the substrate at one end of the first circuit component portion. The substantially triangular first folded circuit structure portion is integrally formed continuously with the L-shaped other end of the first connection portion in parallel with the surface of the substrate, and the first connection portion L It is folded back in parallel to the surface of the substrate so as to extend in a direction substantially perpendicular to the direction in which the other end of the letter shape extends. The second connection part is integrally connected to one end of the first folded circuit structure part in parallel to the surface of the base material, and extends in substantially the same direction as the first and second circuit structure parts. ing. The substantially triangular second folded circuit structure portion is formed integrally and continuously on one end of the second connection portion and in parallel with the surface of the substrate, with respect to the direction in which the second connection portion extends. It is folded back in parallel with the surface of the substrate so as to extend in a substantially orthogonal direction. Third connecting portion of the L-shaped, and the end while the one connected to an end of the second folding circuit structure portion, parallel to the surface of the integrally substrate at one end of the second circuit component parts And the other end connected to .

  As described above, according to the present invention, a long circuit structure excellent in reliability and dimensional accuracy can be industrially continuously produced.

  1 to 6 are a plan view and a cross-sectional view sequentially illustrating a manufacturing process of a long circuit structure according to an embodiment of the present invention. FIG. 2 is a cross-sectional view seen from the direction along line II-II in FIG.

  As shown in FIG. 1, by forming a circuit pattern layer 13 on a resin film substrate 11, a circuit component base material is prepared. The circuit pattern layer 13 is manufactured by the process shown in FIG.

  As shown in FIG. 2A, the resin film substrate 11 is fixed to the metal foil 130 by thermal bonding or dry lamination bonding with the adhesive layer 12 interposed on one surface of the metal foil 130. Thus, the laminated body of the metal foil 130 and the resin film base material 11 is prepared.

  As shown in FIG. 2B, a resist ink layer 14 having a predetermined pattern according to the circuit specifications of the electronic / electric device is printed on the surface of the metal foil 130 by gravure printing or the like. After printing, the resist ink layer 14 is cured.

  As shown in FIG. 2C, the metal foil 130 is etched using the resist ink layer 14 as a mask, that is, the portion of the metal foil 130 not covered with the resist ink layer 14 is dissolved and removed. Thus, the circuit pattern layer 13 is formed.

  Thereafter, as shown in FIG. 2D, the resist ink layer 14 is removed as necessary.

  In the circuit component base material prepared in this manner, the resin film substrate 11 is cut out or punched out together with the circuit pattern layer 13 in accordance with the cutout region 20 as shown by a one-dot chain line in FIG. At this time, the circuit component base material is cut from one edge of the circuit pattern layer 13 toward the other edge, but the circuit component connection portion where the circuit pattern layer 13 is continuous at the other edge is formed. The first and second separation circuit component parts are left and separated at a part other than the other edge part. That is, as shown in FIG. 3, the separation body 1 a as a first separation circuit constituent part having a separation portion 13 a of the circuit pattern layer 13, leaving a connection portion (conduction portion) 13 c in which the circuit pattern layer 13 is continuous, The separation body 1b is formed as a second separation circuit constituent body portion having the separation portion 13b of the circuit pattern layer 13.

  As shown in FIG. 4, as the circuit pattern layer portions in the first and second separation circuit constituent portions, the separation portions 13a and 13b of the circuit pattern layer 13 in the separation bodies 1a and 1b are along one direction. The separators 1a and 1b are arranged so as to extend continuously. At this time, the connection portion 13c in which the circuit pattern layer 13 is continuous is raised in the vertical direction, and the connection portion 13c is bent in a direction intersecting with the extending direction of the separation portions 13a and 13b of the circuit pattern layer 13. That is, the folded circuit structure part is formed by folding back the circuit structure connection part in which the circuit pattern layer 13 is continuous. As a result, as shown in FIG. 5, the folded portions 13d and 13e of the circuit pattern layer 13 raised in the direction substantially perpendicular to the separating portions 13a and 13b of the circuit pattern layer 13 are formed in the folded circuit structure portion. The

  Thereafter, if necessary, as shown in FIG. 6, the folded portions 13d and 13e are arranged on one side, for example, among the separating portions 13a and 13b arranged so as to continuously extend along one direction. Then, the folded portion 13f is formed by folding or folding on the separation portion 13b side. In this way, the long circuit structure 1 of the present invention can be produced. If necessary, the folded circuit component having the folded portion 13f may be fixed to the resin film substrate 11 or may be covered with a resin film of an appropriate size prepared separately.

  FIG. 7 is a partial plan view (A) of the long circuit structure 1 according to one embodiment of the present invention manufactured as described above, along the line BB in the partial plan view (A). It is the partial sectional enlarged view (B) seen from the direction, and the side view (C) seen from the direction shown by the arrow C in the partial sectional enlarged view (B).

  In particular, as shown in FIG. 7C, the folded portions 13d and 13e of the circuit pattern layer 13 intersect with the direction along the line BB in FIG. 7A, that is, the circuit pattern layer 13 The separating portions 13a and 13b are folded in a direction substantially orthogonal to the extending direction. Further, as shown in FIG. 7B, one end portion of the separation portion 13b of the circuit pattern layer 13 is folded back in the BB line direction, and the folded portion 13e is integrally and continuously connected to the one end portion. And 13d are formed.

  In the above-described embodiment, the separation portions 13a and 13b of the circuit pattern layer 13 are shown as simple linear patterns with a constant width. However, electronic / electrical devices are used to connect or form various electric elements. It may be formed in a predetermined pattern having various shapes according to the circuit specifications.

  As the metal foil used for forming the circuit pattern layer 13 in the circuit structure 1 of the present invention, an aluminum foil, a copper foil, or the like having a thickness of 5 μm to 100 μm can be used. It is preferable to use a foil. The aluminum foil may be a known pure aluminum foil or aluminum alloy foil as long as the above thickness is satisfied. Specifically, pure aluminum (JIS (AA) 1000 series, such as 1N30, 1N70, etc.), Al-Mn series (JIS (AA) 3000 series, such as 3003, 3004 etc.), Al-Mg series (JIS (AA)). 5000-based), Al-Fe-based (JIS (AA) 8000-based, for example, 8021, 8079, etc.) foils can be employed. Iron (Fe), silicon (Si), copper (Cu), nickel (Ni), chromium (Cr), titanium (Ti), zirconium (Zr), zinc (Zn), manganese (Mn) contained in the aluminum foil, About components, such as magnesium (Mg) and gallium (Ga), if it exists in the range of the well-known content prescribed | regulated by JIS etc., it does not interfere. However, these additive elements or unavoidable impurity elements greatly affect the strength and electrical resistance of the aluminum foil, and may be appropriately selected or controlled according to the required performance. In addition, since the strength and electrical resistance of aluminum foil change by heat treatment, a hard material, a semi-hard material, and a soft material may be properly used as necessary. In addition, the aluminum foil can be subjected to degreasing / washing, anchor coating, primer, surface treatment and the like, if necessary.

  The resin film substrate 11 constituting the circuit structure 1 of the present invention is made of polyethylene (high density polyethylene, low density polyethylene, linear low density polyethylene, etc.), polypropylene, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Nylon, vinyl chloride, low-shrinkage polyethylene terephthalate and low-shrinkage polyethylene naphthalate, vinylidene chloride, ethylene / vinyl alcohol copolymer, PBT (polybutylene terephthalate), ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer At least one selected from films such as coalescence is preferable, and among these, at least one selected from polyethylene terephthalate film and polyethylene naphthalate film is particularly preferable. The thickness of the resin film substrate 11 is preferably 9 μm or more and 200 μm or less, more preferably 12 μm or more and 100 μm or less.

  The metal foil 130 and the resin film substrate 11 may be fixed by a known bonding method. Examples of the material of the adhesive layer 12 include a two-component curable urethane adhesive and a polyether urethane adhesive. A method using dry lamination using a polyester adhesive, polyester polyol adhesive, polyester polyurethane polyol adhesive, co-extrusion, extrusion coating, thermal lamination using an anchor coating agent, or the like can be employed.

  The metal foil and the resin film are not limited to one each, and two or more of the same type or different types can be laminated. For example, you may laminate | stack metal foil on both surfaces of a resin film.

  The resist ink used for forming the resist ink layer 14 in the production method of the present invention is not particularly limited. For example, the main component is an acrylic monomer having at least one carboxyl group in the molecule and an alkali-soluble resin. It is preferable to use an ultraviolet curable resist ink. This resist ink is suitable for continuous mass production because it can be gravure printed, has acid resistance, and can be easily removed by alkali. After applying gravure printing to the metal foil with a predetermined circuit pattern using this resist ink and curing it by irradiating with ultraviolet rays, the metal foil is acid-etched, for example, with ferric chloride aqueous solution, hydroxylated, etc. in accordance with a normal method. The circuit pattern layer can be formed by peeling and removing the resist ink layer with an alkali such as an aqueous sodium solution. When an acid-soluble resin is used in place of the alkali-soluble resin, the resist ink layer can be peeled and removed using an organic acid or an inorganic acid by etching the metal foil with an alkaline solution.

  When performing gravure printing, a gravure cell for forming a resist ink layer 14 corresponding to a plurality of separation portions is prepared so that the longitudinal directions of the separation portions 13a and 13b of the circuit pattern layer formed later by etching are aligned. The gravure rolls may be formed so as to be aligned substantially parallel to the circumferential direction or the width direction. Of course, it goes without saying that a gravure cell is also formed in a portion where the resist ink layer 14 corresponding to the connection portion 13c of the circuit pattern layer is formed.

  The circuit structure 1 of the present invention preferably has a total length (length in the longitudinal direction) of 1600 mm or more, and the length (length in the longitudinal direction) of each individual separator 1a or 1b is preferably 200 mm or more and 1000 mm or less.

  FIG. 8 is a plan view showing an example of a circuit component base material prepared in the method of manufacturing a circuit component according to another embodiment of the present invention.

  As shown in FIG. 8, by forming a circuit pattern layer 53 on a resin film substrate 51, a circuit component base material is prepared. The circuit pattern layer 53 is manufactured in the same manner as the process shown in FIG.

  In the circuit component base material thus prepared, the resin film base material 51 is cut out or punched out together with the circuit pattern layer 53 in accordance with the cutout region 60 as shown by a one-dot chain line in FIG. At this time, the circuit component base material is cut from one edge of the circuit pattern layer 53 toward the other edge, but is cut into a substantially T shape, and the circuit pattern layer 53 continues at the other edge. The first and second separated circuit component parts separated by the part other than the other edge portion are formed, leaving the circuit structure connection part. That is, as shown in FIG. 8, the first separation circuit constituent part having the separation part 53a of the circuit pattern layer 53, leaving the connection parts (conduction parts) 53c, 53d, 53e in which the circuit pattern layer 53 is continuous, A second separation circuit component portion having a separation portion 53b of the circuit pattern layer 53 is formed.

  Then, by folding back at a folding line 70 indicated by a two-dot chain line in FIG. 8, that is, by folding at the folding line 70 so that the surfaces of the separating portions 53a and 53b are located on the same side, the first and first 2 folding circuit components are formed.

  FIG. 9 is a plan view showing only the circuit pattern layer 53 in the circuit structure manufactured as described above.

  The circuit structure includes first and second circuit structure parts, first, second and third connection parts, and first and second folded circuit structure parts. As shown in FIG. 9, the first circuit component part has a separation part 53a as a circuit pattern layer part extending in one direction. The second circuit component portion has a separation portion 53b as a circuit pattern layer portion extending in substantially the same direction as the direction in which the separation portion 53a of the first circuit structure portion extends.

  The first connection part is integrally connected to the first circuit component part, and has a connection part 53c as a circuit pattern layer part electrically connected to the separation part 53a. The first folded circuit component portion is formed integrally and continuously with the first connection portion, and extends, for example, in a direction substantially orthogonal to the direction in which the L-shaped first connection portion extends. The circuit pattern layer portion that is folded back and electrically connected to the connection portion 53c has, for example, a substantially triangular folded portion 53f. The folded portion 53f is, for example, an L-shaped connection portion 53c. Is folded so as to extend in a direction substantially perpendicular to the extending direction.

  The second connection part is integrally connected to the first folded circuit component part, and has a connection part 53d as a circuit pattern layer part electrically connected to the folded part 53f. As shown in FIG. 9, the connection portion 53d as the circuit pattern layer portion is disposed on the back side by being folded back by the folded portion 53f. The second folded circuit component part is formed integrally and continuously with the second connection part, and is folded so as to extend in a direction substantially perpendicular to the direction in which the second connection part extends. The circuit pattern layer portion electrically connected to the connection portion 53d has, for example, a substantially triangular folded portion 53g, and the folded portion 53g extends in a direction substantially orthogonal to the direction in which the connecting portion 53d extends. Wrapped to exist.

  The third connection portion integrally connects the second folded circuit component portion and the second circuit component portion, and integrally connects the folded portion 53g and the separating portion 53b. As the pattern layer portion, for example, an L-shaped connection portion 53e is provided.

  In other words, the first folded circuit component portion is folded so as to extend in a direction substantially orthogonal to the direction in which one end portion of the first circuit component portion extends, and one of the separation portions 53a. A folded portion 53f is provided as a circuit pattern layer portion folded so as to extend in a direction substantially orthogonal to the extending direction of the connecting portion 53c as an end portion. The second folded circuit component portion is formed integrally and continuously with the second circuit component portion, and extends in a direction substantially orthogonal to the direction in which one end of the second circuit component portion extends. Folded in such a way that it is integrally connected to the first folded circuit component part, electrically connected to the separating part 53b, and in a direction in which the connecting part 53e as one end of the separating part 53b extends. On the other hand, a folded portion 53g is provided as a circuit pattern layer portion that is folded back so as to extend in a substantially orthogonal direction and is electrically connected to the folded portion 53f.

  In the circuit pattern layer 53 shown in FIG. 9, the length L1 of the connecting portion 53c, the length L2 of the connecting portion 53d, and the length L3 of the connecting portion 53e may be set arbitrarily and adjusted as necessary. However, it may be considerably shorter than the length of the separation portion 53a or the separation portion 53b, may be a length that can be substantially ignored, or may be a length that is substantially close to zero. The separation part 53a as the circuit pattern layer part and the separation part 53b as the circuit pattern layer part may be electrically connected via the connection parts (conduction parts) 53c, 53d, and 53e. Also in this embodiment, a long circuit structure excellent in reliability and dimensional accuracy can be industrially continuously produced.

  The circuit structure of the present invention can be used as a flexible printed circuit board for electric / electronic devices, etc., but if necessary, further mount electric / electronic components such as IC chips, diodes, capacitors, resistors, coils, etc. You can also Moreover, a concealing sheet such as white PET can be laminated on the front surface, back surface, or both surfaces of the circuit structure.

A urethane dry laminate adhesive 1.5 g / m ² is applied to one surface of an aluminum foil (JIS 1N30 material) having a thickness of 30 μm as a metal foil 130, and an adhesive layer 12 is interposed by a dry laminate method to form a resin. A polyethylene terephthalate (PET) film having a thickness of 38 μm as the film substrate 11 was bonded. The other surface of the aluminum foil is gravure-printed with a resist ink having the following composition so as to have the shape of the circuit pattern layer 13 shown in FIG. 1, and irradiated with a UV lamp with an irradiation dose of 480 W / cm for 15 seconds. The ink layer was cured.

  Next, a 7% hydrochloric acid aqueous solution was used to dissolve and remove the portion of the aluminum foil not covered with the resist ink layer by etching. Thereafter, the resist ink layer was peeled off by dipping in a 1% aqueous sodium hydroxide solution at a temperature of 20 ° C. for 10 seconds. After washing with water, the circuit component base material was produced by drying with warm air at a temperature of 70 ° C.

  The circuit component base material provided with the continuous circuit pattern layer 13 by the connecting portion 13c is cut out into a shape as shown in FIG. 3 to form the separated bodies 1a and 1b. The connecting portion 13c is shown in FIGS. In this way, a test piece (circuit pattern layer width of 15 mm) of the circuit structure having the folded portion 13f of the circuit pattern layer 13 as shown in FIG. 7 was produced. This test piece was used in the following Test Example 1 as an example of the present invention.

<Resist ink composition>
1) Beccasite J-896 (Rosin-maleic acid resin manufactured by Dainippon Ink and Chemicals, Inc.): 21 parts by weight 2) 2-acryloyloxyethyl hexahydrophthalic acid: 25 parts by weight 3) Unidic V-5510 (large Nippon Ink Chemical Co., Ltd. prepolymer and monomer mixture): 8 parts by weight 4) Irgacure 184 (trade name): 3 parts by weight 5) Ethyl acetate: 28 parts by weight 6) Modified alcohol: 12 parts by weight 7) Phthalocyanine blue: 1 part by weight 8) Silica: 2 parts by weight For a comparative test, a test piece having a width of 15 mm and a length of 150 mm was prepared as a base material for a circuit component as shown in FIG. 3 by the same method as described above. This test piece was used in the following Test Examples 2 to 6.

(Test Example 1)
The resistance value was measured by the direct current four-terminal method (50 mm between voltage measurement terminals, n = 5) with the test piece as it was. Further, the tensile breaking strength (distance between chucks: 100 mm, strain rate: 200 mm / min) of the laminated portion of the circuit pattern layer and the resin film substrate was measured. Moreover, the external appearance was evaluated visually.

(Test Example 2)
The test piece is cut at the center in the longitudinal direction, overlapped as shown in FIG. 10, and a solder layer 30 (one place) having a diameter of about 5 mm is formed by soldering so that the overlapping portion 15 is conductive. 15 was included, and the same evaluation as in Test Example 1 was performed.

(Test Example 3)
The test piece was cut at the center in the longitudinal direction, and overlapped as shown in FIGS. 11A and 11B using the same aluminum foil (width 15 mm × length 20 mm) as above, and the overlapping portions 15a and 15b. A solder layer 31a, 31b, 32a, 32b (2 locations on each side, 4 locations in total) having a diameter of about 5 mm is formed by soldering so that each of them is conductive, and a test example including the overlapping portions 15a and 15b Evaluation similar to 1 was performed.

(Test Example 4)
Evaluation was performed in the same manner as in Test Example 3 except that solder layers 31 and 32 (two locations in total on one side) were formed by soldering as shown in FIG.

(Test Example 5)
The test piece is cut at the center in the longitudinal direction, overlapped as shown in FIG. 12, and subjected to a crimping process (one caulking process) with a diameter of about 5 mm so that the overlapped part is conducted, and the overlapped part 15 The same evaluation as in Test Example 1 was performed.

(Test Example 6)
The test piece is cut at the center in the longitudinal direction, overlapped as shown in FIG. 12, and a conductive paint (trade name: Dotite) is applied so that the overlapped portion is conductive, and an application layer having a diameter of about 5 mm (two locations). ) And the same evaluation as in Test Example 1 was performed with the overlapping portion 15 included.

  The above evaluation results are shown in Table 1.

表１から、本発明の回路構成体の試験片を用いた試験例１では、電気抵抗値が低い値に維持され、引張破断強度も高い値に保持されるとともに、外観にも異常が見られなかったが、比較例としての試験例２〜４では接続部において接触抵抗が増加して電気抵抗値が高くなるだけでなく、引張破断強度も低く、基材としての樹脂フィルムであるＰＥＴフィルムが収縮し、また試験例５では重ね合わせ部において接続することができず、試験例６では接続部において接触抵抗が増加して電気抵抗値が高くなるだけでなく、引張破断強度も低くなったことがわかる。

From Table 1, in Test Example 1 using the test piece of the circuit structure of the present invention, the electrical resistance value is maintained at a low value, the tensile fracture strength is maintained at a high value, and the appearance is also abnormal. However, in Test Examples 2 to 4 as comparative examples, not only the contact resistance increased at the connection portion and the electrical resistance value increased, but also the tensile rupture strength was low, and the PET film which is a resin film as a substrate In Test Example 5, it was not possible to connect at the overlapping portion. In Test Example 6, not only the contact resistance increased and the electrical resistance value increased at the connection portion, but also the tensile strength at break became low. I understand.

  It should be considered that the embodiments and examples disclosed above are illustrative and non-restrictive in every respect. The scope of the present invention is shown not by the above embodiments and examples but by the scope of claims, and includes all modifications and variations within the scope and meaning equivalent to the scope of claims.

It is a top view which shows an example of the circuit structure base material prepared in the manufacturing method of the circuit structure according to one embodiment of this invention. It is sectional drawing (A), (B), (C), and (D) which showed the formation process of the circuit pattern layer in a circuit structure in order, and was seen from the direction along the II-II line of FIG. It is a top view which shows the isolation | separation body produced in the manufacturing method of the circuit structure body according to one embodiment of this invention. It is a top view which shows the 1st process of bending of a connection part in the manufacturing method of the circuit structure body according to one embodiment of this invention. It is a top view which shows the 2nd process of the bending of a connection part in the manufacturing method of the circuit structure according to one embodiment of this invention. It is a top view which shows the 3rd process of bending of a connection part in the manufacturing method of the circuit structure body according to one embodiment of this invention. 1A is a partial plan view of a long circuit structure according to an embodiment of the present invention, FIG. 2B is a partial cross-sectional enlarged view as seen from the direction along the line B-B in FIG. It is the side view (C) seen from the direction shown by the arrow C in an enlarged view (B). It is a top view which shows an example of the circuit structure base material prepared in the manufacturing method of the circuit structure according to another embodiment of this invention. It is a top view which shows only the circuit pattern layer in the circuit structure manufactured using the circuit structure base material shown by FIG. It is sectional drawing which shows one connection method of the overlap part of the test piece produced as a comparative example of this invention. It is sectional drawing (A) and top view (B) (C) which show another connection method of the overlapping part of the test piece produced as a comparative example of this invention. It is sectional drawing which shows another connection method of the overlap part of the test piece produced as a comparative example of this invention.

Explanation of symbols

  1: Circuit component, 1a, 1b: Separator, 11, 51: Resin film substrate, 12: Adhesive layer, 13, 53: Circuit pattern layer, 13a, 13b, 53a, 53b: Separation part, 13c, 53c 53d, 53e: connecting portion, 13d, 13e, 53f, 53g: folded portion, 13f: folded portion, 14: resist ink layer, 20, 60: cutout region, 70: folded line, 130: metal foil.

Claims (1)

A base material containing a resin;
A circuit structure comprising a circuit pattern layer formed on the surface of the substrate,
The circuit structure is
A first circuit component portion having a circuit pattern layer portion extending linearly in one direction;
A second circuit component portion having a circuit pattern layer portion extending linearly substantially in the same direction as the direction in which the circuit pattern layer portion of the first circuit component portion extends,
An L-shaped first connection portion having one end integrally connected to one end of the first circuit component portion in parallel to the surface of the base;
The L-shaped other end of the first connecting portion is formed integrally and parallel to the surface of the substrate, and the L-shaped other end of the first connecting portion extends in the extending direction. A substantially triangular first folded circuit component portion folded in parallel with the surface of the base material so as to extend in a direction substantially orthogonal to each other ,
A second connection integrally connected to one end of the first folded circuit component portion in parallel to the surface of the base material and extending in substantially the same direction as the first and second circuit component portions Part,
The second connection portion is integrally formed continuously with one end of the second connection portion and parallel to the surface of the base material, and extends in a direction substantially orthogonal to the direction in which the second connection portion extends. A substantially triangular second folded circuit component portion folded in parallel to the surface of the substrate;
One end connected to one end of the second folded circuit component part , and the other end integrally connected to one end of the second circuit component part in parallel to the surface of the base material ; An L-shaped third connecting portion having
A circuit structure including:

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