JP2004040073A5 - - Google Patents
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- Publication number
- JP2004040073A5 JP2004040073A5 JP2003004559A JP2003004559A JP2004040073A5 JP 2004040073 A5 JP2004040073 A5 JP 2004040073A5 JP 2003004559 A JP2003004559 A JP 2003004559A JP 2003004559 A JP2003004559 A JP 2003004559A JP 2004040073 A5 JP2004040073 A5 JP 2004040073A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34766802P | 2002-01-11 | 2002-01-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004040073A JP2004040073A (ja) | 2004-02-05 |
JP2004040073A5 true JP2004040073A5 (ja) | 2006-02-23 |
Family
ID=23364714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003004559A Ceased JP2004040073A (ja) | 2002-01-11 | 2003-01-10 | 抵抗器構造物 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6781506B2 (ja) |
EP (1) | EP1327995A3 (ja) |
JP (1) | JP2004040073A (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4217778B2 (ja) * | 2003-04-11 | 2009-02-04 | 古河電気工業株式会社 | 抵抗層付き導電性基材、抵抗層付き回路基板及び抵抗回路配線板 |
CN1810065B (zh) * | 2003-06-30 | 2011-06-29 | 揖斐电株式会社 | 印刷线路板 |
AT500807B1 (de) | 2004-01-23 | 2006-11-15 | Austria Tech & System Tech | Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement |
US7022464B2 (en) * | 2004-08-25 | 2006-04-04 | Peter Kukanskis | Integral plated resistor and method for the manufacture of printed circuit boards comprising the same |
US7190016B2 (en) * | 2004-10-08 | 2007-03-13 | Rohm And Haas Electronic Materials Llc | Capacitor structure |
US6964884B1 (en) * | 2004-11-19 | 2005-11-15 | Endicott Interconnect Technologies, Inc. | Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same |
US7192654B2 (en) * | 2005-02-22 | 2007-03-20 | Oak-Mitsui Inc. | Multilayered construction for resistor and capacitor formation |
US7596842B2 (en) * | 2005-02-22 | 2009-10-06 | Oak-Mitsui Inc. | Method of making multilayered construction for use in resistors and capacitors |
EP1772901B1 (en) * | 2005-10-07 | 2012-07-25 | Rohm and Haas Electronic Materials, L.L.C. | Wafer holding article and method for semiconductor processing |
US20100264225A1 (en) * | 2005-11-22 | 2010-10-21 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
KR101312259B1 (ko) * | 2007-02-09 | 2013-09-25 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조방법 |
US8293323B2 (en) * | 2007-02-23 | 2012-10-23 | The Penn State Research Foundation | Thin metal film conductors and their manufacture |
US20090050856A1 (en) * | 2007-08-20 | 2009-02-26 | Lex Kosowsky | Voltage switchable dielectric material incorporating modified high aspect ratio particles |
US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
US20090220771A1 (en) * | 2008-02-12 | 2009-09-03 | Robert Fleming | Voltage switchable dielectric material with superior physical properties for structural applications |
TWI369693B (en) * | 2008-04-10 | 2012-08-01 | Ind Tech Res Inst | Thin film resistor structure and fabrication method thereof |
US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
US8362871B2 (en) * | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
SG174370A1 (en) * | 2009-03-25 | 2011-10-28 | Jx Nippon Mining & Metals Corp | Metal foil with electric resistance film and production method therefor |
JP2012201980A (ja) * | 2011-03-28 | 2012-10-22 | Jx Nippon Mining & Metals Corp | 電気抵抗層付き金属箔及びその製造方法 |
DE102014109990B4 (de) * | 2014-07-16 | 2022-10-27 | Infineon Technologies Austria Ag | Messwiderstand mit vertikalem Stromfluss, Halbleiterpackage mit einem Messwiderstand und Verfahren zur Herstellung eines Messwiderstandes |
US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
US20190297758A1 (en) * | 2018-03-23 | 2019-09-26 | Intel IP Corporation | Electromagnetic shielding cap, an electrical system and a method for forming an electromagnetic shielding cap |
DE102019219615A1 (de) | 2019-12-13 | 2021-06-17 | Heraeus Deutschland GmbH & Co. KG | Herstellungsverfahren für Edelmetall-Elektroden |
CN116137197A (zh) * | 2023-04-20 | 2023-05-19 | 广州方邦电子股份有限公司 | 一种复合基材及电路板 |
CN116685051B (zh) * | 2023-07-03 | 2024-02-06 | 广州方邦电子股份有限公司 | 金属箔、载体箔、覆金属层叠板、印刷线路板及电池 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5243320A (en) * | 1988-02-26 | 1993-09-07 | Gould Inc. | Resistive metal layers and method for making same |
US5135629A (en) * | 1989-06-12 | 1992-08-04 | Nippon Mining Co., Ltd. | Thin film deposition system |
WO1991019024A1 (en) * | 1990-05-30 | 1991-12-12 | Gould, Inc. | Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations |
US5800575A (en) * | 1992-04-06 | 1998-09-01 | Zycon Corporation | In situ method of forming a bypass capacitor element internally within a capacitive PCB |
US5366612A (en) * | 1993-04-19 | 1994-11-22 | Magma Copper Company | Process for making copper foil |
DE69432591T2 (de) * | 1993-07-21 | 2004-03-18 | Ohmega Electronics, Inc., Culver City | Material für leiterplatte mit barriereschicht |
CN1078381C (zh) * | 1994-06-08 | 2002-01-23 | 雷伊化学公司 | 含有导电聚合物的电器件 |
JPH08222857A (ja) * | 1995-02-16 | 1996-08-30 | Mitsui Mining & Smelting Co Ltd | 銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板 |
US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
US5679230A (en) * | 1995-08-21 | 1997-10-21 | Oak-Mitsui, Inc. | Copper foil for printed circuit boards |
TW420729B (en) * | 1996-02-12 | 2001-02-01 | Gould Electronics Inc | A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath |
US5908542A (en) * | 1997-07-02 | 1999-06-01 | Gould Electronics Inc. | Metal foil with improved bonding to substrates and method for making the foil |
US6086743A (en) * | 1997-08-06 | 2000-07-11 | Gould Electronics, Inc. | Adhesion enhancement for metal foil |
US5885436A (en) * | 1997-08-06 | 1999-03-23 | Gould Electronics Inc. | Adhesion enhancement for metal foil |
US6208234B1 (en) * | 1998-04-29 | 2001-03-27 | Morton International | Resistors for electronic packaging |
CN1352870A (zh) * | 1998-07-31 | 2002-06-05 | 联合讯号公司 | 用于制造印刷电路板中的集成电阻的组合物及方法 |
US6372113B2 (en) * | 1999-09-13 | 2002-04-16 | Yates Foil Usa, Inc. | Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same |
US6489034B1 (en) * | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Method of forming chromium coated copper for printed circuit boards |
US6489035B1 (en) * | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Applying resistive layer onto copper |
US6569543B2 (en) * | 2001-02-15 | 2003-05-27 | Olin Corporation | Copper foil with low profile bond enahncement |
KR100330919B1 (ko) * | 2000-04-08 | 2002-04-03 | 권문구 | 피티씨 전도성 폴리머를 포함하는 전기장치 |
US20020146556A1 (en) * | 2001-04-04 | 2002-10-10 | Ga-Tek Inc. (Dba Gould Electronics Inc.) | Resistor foil |
US6610417B2 (en) * | 2001-10-04 | 2003-08-26 | Oak-Mitsui, Inc. | Nickel coated copper as electrodes for embedded passive devices |
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2003
- 2003-01-10 EP EP03250174A patent/EP1327995A3/en not_active Withdrawn
- 2003-01-10 JP JP2003004559A patent/JP2004040073A/ja not_active Ceased
- 2003-01-13 US US10/340,992 patent/US6781506B2/en not_active Expired - Fee Related