JP2004040073A5 - - Google Patents

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Publication number
JP2004040073A5
JP2004040073A5 JP2003004559A JP2003004559A JP2004040073A5 JP 2004040073 A5 JP2004040073 A5 JP 2004040073A5 JP 2003004559 A JP2003004559 A JP 2003004559A JP 2003004559 A JP2003004559 A JP 2003004559A JP 2004040073 A5 JP2004040073 A5 JP 2004040073A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2003004559A
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JP2004040073A (ja
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Publication date
Application filed filed Critical
Publication of JP2004040073A publication Critical patent/JP2004040073A/ja
Publication of JP2004040073A5 publication Critical patent/JP2004040073A5/ja
Ceased legal-status Critical Current

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JP2003004559A 2002-01-11 2003-01-10 抵抗器構造物 Ceased JP2004040073A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34766802P 2002-01-11 2002-01-11

Publications (2)

Publication Number Publication Date
JP2004040073A JP2004040073A (ja) 2004-02-05
JP2004040073A5 true JP2004040073A5 (ja) 2006-02-23

Family

ID=23364714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003004559A Ceased JP2004040073A (ja) 2002-01-11 2003-01-10 抵抗器構造物

Country Status (3)

Country Link
US (1) US6781506B2 (ja)
EP (1) EP1327995A3 (ja)
JP (1) JP2004040073A (ja)

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JP4217778B2 (ja) * 2003-04-11 2009-02-04 古河電気工業株式会社 抵抗層付き導電性基材、抵抗層付き回路基板及び抵抗回路配線板
CN1810065B (zh) * 2003-06-30 2011-06-29 揖斐电株式会社 印刷线路板
AT500807B1 (de) 2004-01-23 2006-11-15 Austria Tech & System Tech Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement
US7022464B2 (en) * 2004-08-25 2006-04-04 Peter Kukanskis Integral plated resistor and method for the manufacture of printed circuit boards comprising the same
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
US6964884B1 (en) * 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
US7192654B2 (en) * 2005-02-22 2007-03-20 Oak-Mitsui Inc. Multilayered construction for resistor and capacitor formation
US7596842B2 (en) * 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
EP1772901B1 (en) * 2005-10-07 2012-07-25 Rohm and Haas Electronic Materials, L.L.C. Wafer holding article and method for semiconductor processing
US20100264225A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
KR101312259B1 (ko) * 2007-02-09 2013-09-25 삼성전자주식회사 박막 트랜지스터 및 그 제조방법
US8293323B2 (en) * 2007-02-23 2012-10-23 The Penn State Research Foundation Thin metal film conductors and their manufacture
US20090050856A1 (en) * 2007-08-20 2009-02-26 Lex Kosowsky Voltage switchable dielectric material incorporating modified high aspect ratio particles
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
TWI369693B (en) * 2008-04-10 2012-08-01 Ind Tech Res Inst Thin film resistor structure and fabrication method thereof
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
SG174370A1 (en) * 2009-03-25 2011-10-28 Jx Nippon Mining & Metals Corp Metal foil with electric resistance film and production method therefor
JP2012201980A (ja) * 2011-03-28 2012-10-22 Jx Nippon Mining & Metals Corp 電気抵抗層付き金属箔及びその製造方法
DE102014109990B4 (de) * 2014-07-16 2022-10-27 Infineon Technologies Austria Ag Messwiderstand mit vertikalem Stromfluss, Halbleiterpackage mit einem Messwiderstand und Verfahren zur Herstellung eines Messwiderstandes
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
US20190297758A1 (en) * 2018-03-23 2019-09-26 Intel IP Corporation Electromagnetic shielding cap, an electrical system and a method for forming an electromagnetic shielding cap
DE102019219615A1 (de) 2019-12-13 2021-06-17 Heraeus Deutschland GmbH & Co. KG Herstellungsverfahren für Edelmetall-Elektroden
CN116137197A (zh) * 2023-04-20 2023-05-19 广州方邦电子股份有限公司 一种复合基材及电路板
CN116685051B (zh) * 2023-07-03 2024-02-06 广州方邦电子股份有限公司 金属箔、载体箔、覆金属层叠板、印刷线路板及电池

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US6086743A (en) * 1997-08-06 2000-07-11 Gould Electronics, Inc. Adhesion enhancement for metal foil
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CN1352870A (zh) * 1998-07-31 2002-06-05 联合讯号公司 用于制造印刷电路板中的集成电阻的组合物及方法
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US6489035B1 (en) * 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
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