JP2004039938A - Chip-like electronic part, its mounting structure, its intermediate substrate, manufacturing method, and inspection method for chip-like electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip-like electronic part which can easily be connected to a wiring board, and can be replaced and inspected, and to provide a mounting structure and an intermediate substrate of the part, a manufacturing method of them and an inspection method of the chip-like electronic part. <P>SOLUTION: A plurality of first resin chips 3 are arranged and fixed on a first substrate 1. A wiring groove 5 is formed in a first photosensitive layer 10 where a plurality of the resin chips 3 are buried. First element separation grooves 8 are formed at peripheries of a plurality of the resin chips 3. A separation groove 19 is formed on a second photosensitive layer 15 covered after a plurality of separated resin chips 20 are transferred. The separation groove is filled with a conductive adhesive layer 16. The resin chips are further transferred after filling and a conductive adhesive layer 16 between the plurality of the resin chips 20 is removed. A third resin chip 31 having the conductive adhesive layer 16 from an electrode pad to the side of the first photoconductive layer 10 is separated. The conductive adhesive layer 16 is solder-connected to wiring 22 on a mounted substrate 21 at the side of the resin chip 31. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip-shaped electronic component, its mounting structure, its intermediate substrate, a manufacturing method thereof, and a chip-shaped electronic component inspection method.
[0002]
[Prior art]
Conventionally, for example, as a manufacturing method of an image display device, an electronic component (for example, a semiconductor chip) is separated by dicing from a wafer, the separated electronic component is transferred from a dicing sheet to a chip tray, and subjected to predetermined processing and transfer processes. A method is known in which an electronic component is picked up from a chip tray by vacuum suction and wired after being mounted or connected to a substrate.
[0003]
This method is generally performed, for example, in a semiconductor package manufacturing process.
[0004]
[Problems to be solved by the invention]
FIG. 14 is a schematic view showing an example of the image display device 62 as described above, and includes a p-type semiconductor layer 58 and an n-type semiconductor layer 59, and a light emitting element having an electrode pad 57 and an electrode pad 60 on the upper surface. The structure which mounts the resin chip 64 which sealed the light emitting diode element 67 of resin with resin is shown. The electrode pad 57 is taken out through the wiring 57a and the conductive plug layer 57b connected to the p-type semiconductor layer 58, and the electrode pad 60 is connected to the wiring 60a through the conductive plug layer 60b. Thus, probing inspection can be performed between the wirings 57a-60a before finally being sealed with resin.
[0005]
In this device 62, the resin chip 64 is fixed on the insulating layers 55 and 56 laminated on the mounting substrate 53 via the adhesive layer 54, and the element 67 is driven adjacent thereto. IC (semiconductor integrated circuit) chips 61 are provided in parallel. Then, after forming a plurality of connection holes (via holes) 50, wirings 51 are formed on the surface of the insulating layer 63 covering them. By the wiring 51, the light emitting element of the resin chip 64 and the semiconductor chip 61 and the respective electronic components and the wiring layer 52 are electrically connected.
[0006]
In the structure as described above, light emitted from the light emitting diode element 67 including the p-type semiconductor layer 58 and the n-type semiconductor layer 59 is emitted to the substrate 53 side.
[0007]
Here, in the resin chip 64 as the light emitting module as shown in FIG. 14, the exposed portions of the electrode pad 57 and the electrode pad 60 that are connected to the wiring 51 are provided only on one surface (upper surface) of the resin chip 64. Therefore, it is necessary to embed the resin chip 64 in the insulating layer 63 and form the wiring 51 after forming the connection holes.
[0008]
Further, the display surface of the image display device 62 may be either on the transparent substrate 53 side or the insulating layer 63 side, but when the insulating layer 63 side is used as the display surface instead of the substrate 53 side as described above. The light emitting diode element 67 needs to be turned upside down. For this purpose, the transfer process of the resin chip 64 is increased once before fixing to the substrate 53, and a relatively long manufacturing process is required.
[0009]
In addition, as a result of performing the performance inspection after embedding the resin chip 64 in the insulating layer 64, even if the light emitting element of the resin chip 64 is found to be defective, it is already embedded in the insulating layer 63. A defective resin chip cannot be removed.
[0010]
Therefore, as shown in FIG. 14, solder bumps 66 are respectively provided on the electrode pads 57 and the electrode pads 60 of a new good resin chip (repair chip) 64, and the good resin chip 64 is embedded in the insulating layer 63. Flip chip mounting is performed by soldering to the wiring 51 on the defective resin chip 64.
[0011]
When light is emitted from the light emitting element of the newly mounted non-defective resin chip 64 in this way, it is necessary to fix the non-defective resin chip by shifting the position from the lower defective resin chip 64 so as not to prevent light emission. is there.
[0012]
Further, when the resin chip 64, which should be a non-defective product mounted by flip chip, becomes further defective, no response can be made. Further, since the non-defective resin chip 64 is additionally mounted on the upper portion, it is necessary to form an insulating layer for protection on the non-defective resin chip 64, and the manufacturing process is further increased.
[0013]
The present invention has been made in view of the situation as described above, and its purpose is to facilitate connection (mounting) of a chip-like electronic component to a wiring board and to replace (repair) with a non-defective product. An object of the present invention is to provide a chip-shaped electronic component, a mounting structure thereof, an intermediate substrate thereof, a manufacturing method thereof, and a method for inspecting the chip-shaped electronic component.
[0014]
[Means for Solving the Problems]
That is, the present invention includes a step of arranging and fixing a plurality of chip parts on a support,
Coating with an insulating material so as to embed the plurality of chip components;
Removing a portion to be a wiring region of the insulating material, and forming a separation groove around each of the plurality of chip components;
Filling a conductive material between the plurality of separated chip components;
After the filling, removing the substance between the plurality of chip parts and separating the chip-like electronic parts having the conductive substance from the electrode portion to the side surface of the insulating substance;
And a manufacturing method of a mounting structure to which a step of connecting the conductive substance and the wiring board is added on the side surface of the separated chip-like electronic component. is there.
[0015]
The present invention also includes a step of disposing and fixing a plurality of chip parts on the support;
Coating with an insulating material so as to embed the plurality of chip components;
Removing a portion to be a wiring region of the insulating material, and forming a separation groove around each of the plurality of chip components;
Filling a conductive material between the separated chip components;
The present invention relates to a method for manufacturing an intermediate substrate for manufacturing chip-shaped electronic components.
[0016]
The present invention also includes a step of disposing and fixing a plurality of chip parts on the support;
Coating with an insulating material so as to embed the plurality of chip components;
Removing a portion to be a wiring region of the insulating material, and forming a separation groove around each of the plurality of chip components;
Filling a conductive material between the plurality of separated chip components;
A step of inspecting the plurality of chip parts through the conductive material after the filling;
The present invention relates to an inspection method for chip-shaped electronic components.
[0017]
The present invention also relates to a chip-shaped electronic component in which the chip component is coated with an insulating material, and a conductive material is deposited from the electrode part of the chip component to the side surface of the insulating material.
[0018]
According to another aspect of the present invention, there is provided a chip-shaped electronic component in which the chip component is coated with an insulating material and the conductive material is deposited from the electrode portion of the chip component to the side surface of the insulating material. The present invention relates to a chip-shaped electronic component mounting structure connected to a wiring board through a substance.
[0019]
According to the present invention, a plurality of chip-like electronic components in which a chip component is coated with an insulating material and a conductive material is deposited from an electrode portion of the chip component to a side surface of the insulating material are provided on a support. It is related to the intermediate substrate for manufacturing the chip-shaped electronic component, which is fixed to the substrate.
[0020]
According to the present invention, the chip component is covered with the insulating material, and the chip-shaped electronic component is configured by applying the conductive material from the electrode portion to the side surface of the insulating material. It becomes possible to connect to the wiring board via the wiring, and it is not necessary to cover (embed) with an insulating layer and form a connection hole, so that mounting of the chip-shaped electronic component is facilitated. Moreover, even if it is found that the chip-like electronic component is defective after mounting, the chip-like electronic component is not embedded in the insulating layer, so it can be easily removed from the wiring board and the good chip-like shape as many times as possible. Can be replaced with electronic components.
[0021]
Further, since the chip-like electronic component is not embedded in the insulating layer, it can be configured such that any surface thereof does not hinder the operation, and a transfer process for that purpose is not required.
[0022]
In addition, since a plurality of separated chip parts are filled with a conductive material, and then a plurality of chip parts are inspected via the conductive substance, non-defective chip-like electronic parts can be sorted in advance before mounting and wiring Compared to the case where the inspection is performed after connecting on the substrate, the number of man-hours for replacing the chip-like electronic component can be reduced.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, after the chip component is fixed to the first support, the chip component on the third support is transferred to the second support and then the third support in sequence. It is desirable to coat with an insulating material, and after the formation of the separation groove and the filling of the conductive material, the surface is transferred to a fourth support and further separated into the chip-like electronic component by removing the material.
[0024]
In addition, it is desirable that the transfer of the chip component to the second support is performed with a pitch change.
[0025]
Alternatively, after the conductive material is filled, the chip-like electronic component may be separated by removing the material on the third support.
[0026]
Further, in order to deposit the conductive material on the chip-shaped electronic component, after the plurality of chip components are embedded in the conductive material on a support, the conductive material is placed between the plurality of chip components. You may remove and isolate | separate into the said chip-shaped electronic component.
[0027]
It is desirable that the element constituting the chip component is a light emitting element.
[0028]
Moreover, it is desirable to use a nano paste containing conductive particles as the conductive substance.
[0029]
Further, it is preferable that a photosensitive material is used as the insulating material, and the separation groove is formed by this exposure and development.
[0030]
Moreover, it is desirable to use the chip component in which the element is embedded in a protective substance.
[0031]
Further, it is desirable that the connection to the wiring board is made by solder capable of batch connection by reflow.
[0032]
Further, after the connection to the wiring board, the chip-like electronic component side may be covered with a light-transmitting insulating material.
[0033]
Next, a preferred embodiment of the present invention will be specifically described with reference to the drawings.
[0034]
First embodiment
1 to 8 show a first embodiment of the present invention.
[0035]
In the present embodiment, a flat first substrate 1 is used as shown in FIG.
[0036]
Next, as shown in FIG. 1B, a large number of first resin chips 3 are arranged and fixed on the first substrate 1.
[0037]
The first resin chip 3 is the same as that shown in FIG. 14, and is coated so as to substantially wrap each light emitting diode element 2 with uncured resin, and cured to form the first resin layer 12. Then, a connection hole is formed, and the electrode pad 6 and the electrode pad 7 are formed. These pads are electrically connected to the p-type semiconductor layer 26 of the light-emitting diode element 2 via the wiring layer 6a and the plug layer 6b and to the n-type semiconductor layer 27 via the wiring layer 7a and the plug layer 7b, respectively. ing. The wiring layers 6a and 7a are formed for a probing test.
[0038]
Next, as shown in FIG. 1C, a photosensitive resin is applied on the upper surface of the first substrate 1 so as to cover the space between the adjacent first resin chips 3, the first resin chip 3, and the like. Thus, the first photosensitive layer 10 is formed.
[0039]
Next, as shown in FIG. 1D, the wiring groove portion 5 including the connection hole (via hole) on the electrode pad 6 and the electrode pad 7 is formed by exposure and development of the photosensitive layer 10.
[0040]
Next, as shown in FIG. 2 (e), a part of the first photosensitive layer 10 is removed by etching at a predetermined position between the first resin chips 3, and the adjacent first resin chips 3 are separated. Then, the first element isolation trench 8 is formed. The first photosensitive layer 10 that covers the first resin chip 3 separated by the first element isolation groove 8 is referred to as a second resin chip 20. This figure also shows a plan view showing this state.
[0041]
Next, as shown in FIG. 2 (f), after the first substrate 1 in the state of FIG. 2 (e) is turned upside down, the first peeling is performed as a transfer substrate as shown in FIG. 3 (g). The plurality of second resin chips 20 on the first substrate 1 are transferred onto the first temporary holding member 9 on which the layer (peelable adhesive material layer) 11 is formed. At this time, the transfer is not performed simultaneously on the entire surface, but is performed selectively, and the transfer is performed while increasing the pitch (interval) between the adjacent second resin chips 20. This transfer step can be performed by irradiating laser light from the side of the first substrate 1 to which the second resin chip 20 is fixed.
[0042]
In addition, as a material of the first release layer 11 on the first temporary holding member 9 which is a transfer substrate, a film or a substrate whose adhesive strength is reduced by irradiating UV (ultraviolet) light like a dicing tape. Or a thermal foam sheet or a substrate that is peeled off by heating can be used.
[0043]
Thus, as shown in FIG. 3 (h), the adjacent second resin chips 20 are arranged on the first temporary holding member 9 at a distance from that when the second resin chips 20 are arranged on the first substrate 1. The
[0044]
Next, as shown in FIG. 3 (i), the first substrate 1 in the state of FIG. 3 (h) is turned upside down, and then the first temporary holding member as shown in FIG. 4 (j). The adhesiveness of the first release layer 11 is lowered by irradiating UV light from the side 9 or heating, and is fixed to the first temporary holding member 9 via the first release layer 11. The second resin chip 20 is peeled from the first temporary holding member 9 and transferred onto the entire surface of the second peeling layer 14 of the second temporary holding member 13 as shown in FIG. And fix.
[0045]
Next, as shown in FIG. 4L, a photosensitive resin is applied on the second temporary holding member 13 so as to cover the space between the adjacent second resin chips 20, the upper surface of the resin chip 20, and the like. Then, the second photosensitive layer 15 is formed.
[0046]
Next, as shown in FIG. 5 (m), by exposing and developing the photosensitive layer 15, the wiring groove portion 5 including the connection hole (via hole) on the electrode pad 6 and the electrode pad 7 is exposed, and the groove portion 5 is exposed. A separation groove 19 is formed on the side surface of the resin chip 20 continuously. At this time, since the gap between the resin chips 20 is enlarged in the step of FIG.
[0047]
Next, as shown in FIG. 5N, the conductive adhesive layer 16 is formed by filling the wiring groove 5 and the second element isolation groove 19 with a conductive adhesive using a printing method or the like. .
[0048]
At this time, if necessary, fill with a vacuum dress using a vacuum printing method, or if the groove 19 is relatively small, it is sufficient to use a conductive adhesive made of nanopaste containing fine conductive particles. Can be filled. Further, if the conductive particles are also solder (lead-free solder) particles, they are more preferable because they are melted during the reflow process in the manufacturing process described later and become low resistance.
[0049]
In this state, the conductive adhesive layer 16 is used as the wiring of each third resin chip 28, and this is electrically connected to the power source to apply a voltage to drive the single color light emitting diode element 2. A test (light emission test) can be performed.
[0050]
Next, as shown in FIG. 5 (o), the adhesive property of the second release layer 14 is reduced by irradiating UV light from the second temporary holding member 13 side, so that the second release layer 14, the second resin chip 20 fixed to the second temporary holding member 13 through 14 is peeled from the second temporary holding member 13 together with the conductive adhesive layer 16 and the second photosensitive layer 15, As shown in FIG. 6 (p), the entire surface is transferred and fixed onto the third release layer 18 on the third temporary holding member 17.
[0051]
Next, as shown in FIG. 6 (q), a part of the second photosensitive layer 15 and a part of the conductive adhesive layer 16 between the adjacent second resin chips 20 are cut with a blade or a laser (dicing). Then, the third element isolation trench 30 is formed. At this time, the conductive adhesive layer 16 is exposed in the separation groove 30, thereby completing each third resin chip 31 that can be mounted on the mounting substrate as a chip-shaped electronic component.
[0052]
Next, as shown in FIG. 7 (r), the adhesiveness of the third release layer 18 is lowered by irradiating UV or laser light from the third temporary holding member 17 side, and the third Each of the third resin chips 31 fixed to the third temporary holding member 17 through the release layer 18 is peeled off from the third temporary holding member 17, and as shown in FIG. The adhesive layer 23 on the mounting substrate 21 is individually transferred and fixed.
[0053]
At this time, the individual resin chips 31 are thinned out, peeled off from the third temporary holding member 17, and transferred and mounted on the mounting substrate 21. Each resin having the three-color light emitting diode elements 2 is mounted. The chip 31 is fixed at a predetermined position with a pitch of 600 μm, for example.
[0054]
In addition, an adhesive layer 23 is formed on the mounting substrate 21 in advance, but in order to prevent the wiring portion 22 on the mounting substrate 21 from being soiled by the adhesion of the adhesive, the application range of the adhesive is changed to a resin chip. It can be applied to a predetermined pattern by printing or a dispenser according to the size of 31, or can be formed into a predetermined pattern by application of a photosensitive adhesive, exposure, and development.
[0055]
Alternatively, without using the adhesive as described above, for example, a solder paste may be supplied onto the connection wiring portion 22 by a printing method or the like, and the resin chip 31 may be mounted with the adhesiveness of the paste.
[0056]
Next, as shown in FIG. 7 (t), the solder is adhered between the resin chip 31 and the wiring part 22 on the mounting substrate 21, and the solder part 24 is formed by reflow, whereby the electrode of the resin chip 31 is obtained. Each of the pad 6 and the electrode pad 7 is connected to the wiring part 22 by the conductive adhesive layer 16 connected thereto. The resin chips 31 can be collectively connected to the mounting substrate 21 by this solder reflow.
[0057]
If necessary, after the solder is connected, the flux is washed, and then, as shown in FIG. 8 (u), a low shrinkage resin containing filler such as visible light transmissive silica is applied to the entire surface to obtain a transparent resin layer. 25 is formed. And you may perform a grinding | polishing process in order to planarize the unevenness | corrugation of the surface of the transparent resin layer 25. FIG.
[0058]
Light is emitted from the light emitting element 2 of the resin chip 31 thus mounted to the mounting substrate 21 side. Although not shown, each light emitting element 2 of each resin chip 31 is driven by a driver IC connected via the conductive adhesive layer 16 and the wiring part 22 as an image display device.
[0059]
According to the present embodiment, the light emitting diode element 2 is electrically connected to the wiring part 22 on the substrate 21 by solder via the conductive adhesive layer 16 provided on the side surface of the resin chip 31 that is a module. Since the structure is to be mounted, it is not necessary to embed and fix the resin chip in the insulating layer or the like and connect it via the connection hole as in the prior art, and it can be mounted on the mounting substrate 21 relatively easily.
[0060]
In addition, as a result of conducting a drive inspection of the resin chip 31 after mounting (mounting) the resin chip 31 in the state of FIG. 7 (t), it is found that the light-emitting diode element 2 of the resin chip 31 is defective. However, since the resin chip 31 is not embedded and fixed in the insulating layer or the like, if the solder portion 24 is melted and removed and the good resin chip 31 is soldered again, it can be easily replaced (repaired) with a new good chip 31. )can do.
[0061]
In this case, since there is no obstacle that obstructs the light emitted from the light emitting diode element 2 in the state after repair, it is not necessary to shift the position of the non-defective resin chip with respect to the defective chip below as in the prior art. .
[0062]
Further, in the state of FIG. 5 (n), since the resin chip 20 can be inspected through the conductive adhesive layer 16 filled between the plurality of separated resin chips 20, the resin chip 31 is mounted on the mounting substrate 21. It is possible to perform a light emission test before mounting, and to improve the rate at which only good resin chips 31 can be connected to the mounting substrate 21 compared to the case where the inspection can be performed only after connecting on the mounting substrate 21. it can.
[0063]
Further, by adopting a module structure in which the light emitting diode element 2 is embedded in the resin chip 31, it can be mounted by a mounter similar to a general-purpose surface mount component and can be connected by solder reflow. A display device can be manufactured.
[0064]
Further, as will be described later, when it is desired to change the light emitting direction from the light emitting diode element 2 (that is, when the direction of the resin chip 31 is turned upside down), there is no need to add a transfer step as in the prior art. Rather, it is possible by reducing the transfer process described above.
[0065]
Second embodiment
9 to 10 show a second embodiment of the present invention.
[0066]
In this embodiment, as shown in FIG. 9 (a), after the steps from FIG. 1 (a) to FIG. 5 (n) are performed in the same manner, the transfer step is omitted, and FIG. Flip upside down as shown in b).
[0067]
Next, as shown in FIG. 9C, a portion of the second photosensitive layer 15 and a portion of the conductive adhesive layer 16 between adjacent resin chips 20 are cut (diced) with a blade or a laser, etc. Element isolation trenches 30 are formed. At this time, the conductive adhesive layer 16 is exposed in the separation groove 30 to complete individual resin chips 31 that can be mounted on the mounting substrate.
[0068]
Thereafter, the resin chip 31 is mounted on the mounting substrate 21 as shown in FIG. 10 (d) through the steps from FIG. 7 (r) to FIG. 7 (t) described above.
[0069]
As described above, in the present embodiment, since one part of the transfer process is omitted, the resin chip 31 is mounted on the mounting substrate 21 in the inverted state as compared with FIG. The light can be emitted to the opposite side of the substrate 21 and can be easily performed by reducing the number of transfer processes.
[0070]
In addition, in this embodiment, the same operations and effects as described in the first embodiment are obtained.
[0071]
Third embodiment
11 to 12 show a third embodiment of the present invention.
[0072]
In the present embodiment, as shown in FIG. 11 (a), after performing the steps from FIG. 1 (a) to FIG. 3 (h) in the same manner, as shown in FIG. 11 (b), On the first temporary holding member 9, the conductive adhesive layer 16 is filled between and below the resin chips 20 leaving the upper surface of the resin chips 20.
[0073]
Next, as shown in FIG. 11C, a part of the conductive adhesive layer 16 between the adjacent resin chips 20 is cut (diced) with a blade or a laser to form the element isolation groove 30. As a result, the individual resin chips 31 having the conductive adhesive layer 16 on the side surfaces are separated.
[0074]
Next, as shown in FIG. 12 (d), the first temporary holding member 9 to which the resin chip 31 is fixed is directed downward, and the steps from FIG. 7 (r) to FIG. 7 (t) are performed. As in FIG. 7 (t), transfer and mounting are performed on the mounting substrate 21.
[0075]
As described above, this embodiment is the same as the first embodiment except that one intermediate step is omitted in the manufacturing process of the image display device. However, the same mounting structure can be obtained even if the number of steps is reduced. It is advantageous that
[0076]
In addition, in this embodiment, the same operations and effects as described in the first embodiment are obtained.
[0077]
The embodiment of the present invention described above can be further modified based on the technical idea of the present invention.
[0078]
For example, the material, formation position, shape, and the like of the conductive adhesive layer 16 and other constituent layers attached to the upper surface and side surfaces (wiring regions including via holes) of the resin chip 31 may be arbitrarily changed.
[0079]
In addition, after the process of FIG. 9C, it is possible to transfer the image to another holding member once under a pitch change, and to fix it to the mounting substrate 21. In this case, a mounting structure similar to that shown in FIG.
[0080]
The above embodiment relates to a resin chip incorporating a planar light emitting diode element. In addition to this, for example, as shown in FIG. 13, for example, an electrode pad 6 and an electrode pad 7 are provided. The light emitting diode element 2 may have a conical shape with a triangular cross section. In this case, either a chip component in which the element is coated with a resin or a chip component that is not coated can be applied. For example, a sapphire substrate is used in FIG. Etching) or the like may be cut at predetermined intervals and separated into individual chips, and then the steps shown in FIG.
[0081]
The present invention is not limited to the above-described light emitting diode element, but an electric circuit such as a liquid crystal element, a photodiode element, a piezoelectric element, a transistor element, a diode element, a resistance element, a magnetic element, an optical element, and a light emitting display device having these. It can be applied to the device.
[0082]
[Effects of the invention]
As described above, according to the present invention, the chip component is covered with an insulating material, and the conductive material is applied from the electrode portion to the side surface of the insulating material to constitute the chip-shaped electronic component. The side surface can be connected to the wiring board via a conductive material, and it is not necessary to cover (embed) with an insulating layer and to form a connection hole, thereby facilitating mounting of a chip-shaped electronic component. Moreover, even if it is found that the chip-like electronic component is defective after mounting, the chip-like electronic component is not embedded in the insulating layer, so it can be easily removed from the wiring board and the good chip-like shape as many times as possible. Can be replaced with electronic components.
[0083]
Further, since the chip-like electronic component is not embedded in the insulating layer, it can be configured such that any surface thereof does not hinder the operation, and a transfer process for that purpose is not required.
[0084]
In addition, since a plurality of separated chip parts are filled with a conductive material, and then a plurality of chip parts are inspected via the conductive substance, non-defective chip-like electronic parts can be sorted in advance before mounting and wiring Compared to the case where the inspection is performed after connecting on the substrate, the number of man-hours for replacing the chip-like electronic component can be reduced.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view sequentially showing manufacturing steps of an image display device according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view and a plan view sequentially showing a manufacturing process of the image display device.
3 is a cross-sectional view sequentially showing manufacturing steps of the image display device. FIG.
4 is a cross-sectional view sequentially showing manufacturing steps of the image display device. FIG.
FIG. 5 is a cross-sectional view sequentially showing manufacturing steps of the image display device.
6A and 6B are a cross-sectional view and a plan view sequentially showing a manufacturing process of the image display device.
FIG. 7 is a cross-sectional view sequentially showing a manufacturing process of the image display device.
FIG. 8 is a cross-sectional view showing a manufacturing process of the image display device.
FIG. 9 is a cross-sectional view sequentially showing manufacturing steps of an image display device according to a second embodiment of the present invention.
FIG. 10 is a cross-sectional view showing a manufacturing process of the image display device.
FIG. 11 is a cross-sectional view sequentially showing manufacturing steps of an image display device according to a third embodiment of the present invention.
FIG. 12 is a cross-sectional view showing a manufacturing process of the image display device.
FIG. 13 is a cross-sectional view of a resin chip according to another embodiment of the present invention.
FIG. 14 is a cross-sectional view showing an image display device according to a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... 1st board | substrate, 2 ... Light emitting diode element, 3 ... 1st resin chip,
5 ... Wiring groove, 6 ... Electrode pad, 7 ... Electrode pad, 8 ... First element isolation groove,
9 ... first temporary holding member, 10 ... first photosensitive layer, 11 ... first release layer,
12 ... 1st resin layer, 13 ... 2nd member for temporary holding, 14 ... 2nd peeling layer,
15 ... second photosensitive layer, 16 ... conductive adhesive layer, 17 ... third temporary holding member,
18 ... 3rd peeling layer, 19 ... 2nd element isolation groove, 20 ... 2nd resin chip,
21 ... Mounting substrate, 22 ... Wiring part, 23 ... Adhesive layer, 24 ... Solder part,
25 ... transparent resin layer, 26 ... p-type semiconductor layer, 27 ... n-type semiconductor layer,
30 ... third element isolation groove, 31 ... third resin chip (chip-shaped electronic component)

Claims (57)

Arranging and fixing a plurality of chip parts on a support;
Coating with an insulating material so as to embed the plurality of chip components;
Removing a portion to be a wiring region of the insulating material, and forming a separation groove around each of the plurality of chip components;
Filling a conductive material between the plurality of separated chip components;
A step of removing a substance between the plurality of chip parts after the filling, and separating the conductive substance into each chip-like electronic part having an electrode portion and a side surface of the insulating substance. Production method. After the chip component is fixed to the first support, it is sequentially transferred to the second support and then to the third support, and the chip component on the third support is covered with the insulating material. 2. The chip-shaped electron according to claim 1, wherein after the formation of the separation groove and filling of the conductive material, surface transfer is performed on a fourth support, and further, the chip-shaped electronic component is separated by removing the material. A manufacturing method for parts. The manufacturing method of the chip-shaped electronic component according to claim 2, wherein the transfer of the chip component to the second support is performed with a pitch change. The method for manufacturing a chip-shaped electronic component according to claim 2, wherein the chip-shaped electronic component is separated by removing the material on the third support after filling with the conductive material. 2. The chip according to claim 1, wherein after the plurality of chip components are embedded in the conductive material on a support, the conductive material is removed between the plurality of chip components and separated into the chip-shaped electronic components. Method for manufacturing an electronic component. The manufacturing method of the chip-shaped electronic component according to claim 1, wherein an element constituting the chip component is a light emitting element. The manufacturing method of the chip-shaped electronic component according to claim 1, wherein a nano paste is used for the conductive substance. The method for manufacturing a chip-shaped electronic component according to claim 1, wherein a photosensitive substance is used as the insulating substance, and the separation grooves are formed by the exposure and development. The method for manufacturing a chip-shaped electronic component according to claim 1, wherein the chip component in which an element is embedded in a protective substance is used. Arranging and fixing a plurality of chip parts on a support;
Coating with an insulating material so as to embed the plurality of chip components;
Removing a portion to be a wiring region of the insulating material, and forming a separation groove around each of the plurality of chip components;
Filling a conductive material between the plurality of separated chip components;
After this filling, removing the substance between the plurality of chip parts, and separating the conductive substance into each chip-like electronic part having from the electrode part to the side surface of the insulating material,
A method of manufacturing a mounting structure, comprising a step of connecting the conductive substance and a wiring board on the side surface of the chip-shaped electronic component. After the chip component is fixed to the first support, it is sequentially transferred to the second support and then to the third support, and the chip component on the third support is covered with the insulating material. After the formation of the separation groove and filling of the conductive material, the surface is transferred to a fourth support, and further, the material is removed to separate the chip-shaped electronic component. The manufacturing method of the mounting structure of Claim 10 connected to the said wiring board. The manufacturing method of the mounting structure according to claim 11, wherein the transfer of the chip component to the second support is performed under a pitch change, and the separated chip-like electronic component is connected to the wiring board. After the conductive material is filled, the chip-like electronic component is separated on the third support by removing the material, and the separated chip-like electronic component is connected to the wiring board via transfer if necessary. The manufacturing method of the mounting structure of Claim 11. After the plurality of chip components are embedded in the conductive material on the support, the conductive material is removed between the plurality of chip components to separate the chip-shaped electronic components, and the separated chip-shaped electrons The manufacturing method of the mounting structure according to claim 10, wherein if necessary, the component is connected to the wiring board via transfer. The method for manufacturing a mounting structure according to claim 10, wherein an element constituting the chip component is a light emitting element. The method for manufacturing a mounting structure according to claim 10, wherein a nanopaste is used for the conductive substance. The method for manufacturing a mounting structure according to claim 10, wherein a photosensitive material is used as the insulating material, and the separation groove is formed by the exposure and development. The method for manufacturing a mounting structure according to claim 10, wherein the connection to the wiring board is performed by solder. The method for manufacturing a mounting structure according to claim 10, wherein the chip-like electronic component side is covered with a light-transmissive insulating material after connection to the wiring board. The manufacturing method of the mounting structure of Claim 10 using the said chip component with which an element is embed | buried in a protective substance. Arranging and fixing a plurality of chip parts on a support;
Coating with an insulating material so as to embed the plurality of chip components;
Removing a portion to be a wiring region of the insulating material, and forming a separation groove around each of the plurality of chip components;
And a step of filling a conductive substance between the plurality of separated chip components. After the chip component is fixed to the first support, it is sequentially transferred to the second support and then to the third support, and the chip component on the third support is covered with the insulating material. The method of manufacturing an intermediate substrate for manufacturing a chip-shaped electronic component according to claim 21, wherein, if necessary, after the formation of the separation groove and the filling of the conductive material, surface transfer is performed on a fourth support. The material between the plurality of chip components is removed after filling with the conductive material, and the chip-shaped electronic components having the conductive material from the electrode portion to the side surface of the insulating material are separated. Of manufacturing an intermediate substrate for manufacturing a chip-shaped electronic component. The method of manufacturing an intermediate substrate for manufacturing a chip-shaped electronic component according to claim 21, wherein the transfer of the chip component to the second support is performed with a pitch change. 24. The method of manufacturing an intermediate substrate for manufacturing a chip-shaped electronic component according to claim 23, wherein the chip-shaped electronic component is separated by removing the material on the third support after filling with the conductive material. The chip according to claim 21, wherein after the plurality of chip components are embedded in the conductive material on a support, the conductive material is removed between the plurality of chip components and separated into the chip-shaped electronic components. Of manufacturing an intermediate substrate for manufacturing a shaped electronic component. The method for manufacturing an intermediate substrate for manufacturing a chip-shaped electronic component according to claim 21, wherein the element constituting the chip component is a light-emitting element. The method for manufacturing an intermediate substrate for manufacturing a chip-shaped electronic component according to claim 21, wherein a nanopaste is used for the conductive substance. The method for manufacturing an intermediate substrate for manufacturing a chip-shaped electronic component according to claim 21, wherein a photosensitive material is used as the insulating material, and the separation grooves are formed by exposure and development. The method for manufacturing an intermediate substrate for manufacturing a chip-shaped electronic component according to claim 21, wherein the chip component in which an element is embedded in a protective substance is used. Arranging and fixing a plurality of chip parts on a support;
Coating with an insulating material so as to embed the plurality of chip components;
Removing a portion to be a wiring region of the insulating material, and forming a separation groove around each of the plurality of chip components;
Filling a conductive material between the plurality of separated chip components;
And a step of inspecting the plurality of chip components through the conductive substance after the filling. The inspection is performed after the filling of the conductive substance, before removing the substance between the plurality of chip parts and separating the chip-like electronic parts having the conductive substance from the electrode portion to the side surface. 31. A method for inspecting a chip-shaped electronic component according to 31. After the chip component is fixed to the first support, it is sequentially transferred to the second support and then to the third support, and the chip component on the third support is covered with the insulating material. 32. The method for inspecting a chip-shaped electronic component according to claim 31, wherein the separation groove is formed and the conductive material is filled. 34. The method for inspecting a chip-shaped electronic component according to claim 33, wherein the transfer of the chip component to the second support is performed under a pitch change. 34. The method for inspecting a chip-shaped electronic component according to claim 33, wherein the chip-shaped electronic component is separated by removing the material on the third support after filling with the conductive material. After embedding the plurality of chip components in the conductive material on a support, the conductive material is removed between the plurality of chip components and separated into the chip-shaped electronic components, and the inspection is performed in this state 32. A method for inspecting a chip-shaped electronic component according to claim 31. 32. The method for inspecting a chip-shaped electronic component according to claim 31, wherein an element constituting the chip component is a light emitting element. 32. The chip-shaped electronic component inspection method according to claim 31, wherein a nanopaste is used for the conductive substance. 32. The method for inspecting a chip-shaped electronic component according to claim 31, wherein a photosensitive substance is used as the insulating substance, and the separation groove is formed by the exposure and development. 32. The method for inspecting a chip-shaped electronic component according to claim 31, wherein the chip component in which an element is embedded in a protective substance is used. A chip-shaped electronic component, wherein the chip component is covered with an insulating material, and a conductive material is applied from an electrode portion of the chip component to a side surface of the insulating material. 42. The chip-shaped electronic component according to claim 41, wherein the element constituting the chip component is a light emitting element. 42. The chip-shaped electronic component according to claim 41, wherein the conductive substance is made of nanopaste. 42. The chip-shaped electronic component according to claim 41, wherein the insulating material is made of a photosensitive material. 42. The chip-shaped electronic component according to claim 41, wherein the chip component is configured by embedding an element in a protective substance. A chip-shaped electronic component in which a chip component is coated with an insulating material and a conductive material is deposited from the electrode portion of the chip component to the side surface of the insulating material is wired via the conductive material on the side surface. Mounting structure of chip-shaped electronic components connected to the substrate. 47. The chip-shaped electronic component mounting structure according to claim 46, wherein the element constituting the chip component is a light emitting element. 47. The chip-shaped electronic component mounting structure according to claim 46, wherein the conductive substance is made of nanopaste. The mounting structure for a chip-shaped electronic component according to claim 46, wherein the insulating material is made of a photosensitive material. The mounting structure for a chip-shaped electronic component according to claim 46, wherein the chip component is configured by embedding an element in a protective substance. A plurality of chip-shaped electronic components in which a chip component is coated with an insulating material and a conductive material is applied from an electrode portion of the chip component to a side surface of the insulating material are fixed on a support. Intermediate substrate for manufacturing chip-shaped electronic components. 52. The intermediate substrate for manufacturing a chip-shaped electronic component according to claim 51, wherein an insulating substance is filled between the plurality of chip-shaped electronic components. 52. The intermediate substrate for manufacturing a chip electronic component according to claim 51, wherein a substance between the plurality of chip electronic components is removed. 52. The intermediate substrate for manufacturing a chip-shaped electronic component according to claim 51, wherein the element constituting the chip component is a light emitting element. The intermediate substrate for manufacturing a chip-shaped electronic component according to claim 51, wherein the conductive substance is made of nanopaste. The intermediate substrate for manufacturing a chip-shaped electronic component according to claim 51, wherein the insulating material is made of a photosensitive material. 52. The intermediate substrate for manufacturing a chip-shaped electronic component according to claim 51, wherein the chip component is configured by embedding an element in a protective substance.

Images