JP2004034402A

JP2004034402A - Mold, method and apparatus for manufacturing mold, and method and apparatus for manufacturing tape-shaped component package

Info

Publication number: JP2004034402A
Application number: JP2002192217A
Authority: JP
Inventors: Teruyasu Sakurai; 櫻井　輝泰
Original assignee: Yayoi Co Ltd
Current assignee: Yayoi Co Ltd
Priority date: 2002-07-01
Filing date: 2002-07-01
Publication date: 2004-02-05

Abstract

PROBLEM TO BE SOLVED: To solve the problem that when an electronic component housed in a tape-shaped component package is put on an angular part between the inside surface and bottom surface of an embossment part and slanted, the component is not image-recognized in the next process. SOLUTION: In a mold for forming the tape-shaped component package having the recessed embossment part for housing the electronic component and a protruding bottom-raising part which is located on the bottom surface of the embossment part and supports the component by heating suction, A protruded part corresponding to the embossment part and a recessed part formed in the upper surface of the protruded part to correspond to the bottom raising part are formed. In the protruded part, an open part which is shallower than the recessed part is formed on the outer wall side of the protruded part. COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、金型、その製造方法及び製造装置、並びにテープ状部品包装体の製造方法及び製造装置に関し、例えば電子部品を搬送する際に用いるテープ状部品包装体及びその製造に使用する金型に適用して好適なものである。
【０００２】
【従来の技術】
従来、ＩＣ（Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ）チップ等の極性を有する電子部品は、例えば図１１（Ａ）〜（Ｃ）に示すようなキャリアテープ１と、当該キャリアテープ１に貼着されるカバーテープ（図示せず）とからなるテープ状の部品包装体（以下、これをテープ状部品包装体と呼ぶ）に収納されて搬送されている。
【０００３】
この場合かかるキャリアテープ１においては、図１２（Ａ）からも明らかなように、一面１Ａ側に当該キャリアテープ１の長手方向（矢印ａ）に沿って僅かな深さのガイド溝部１Ｂが形成されると共に、当該ガイド溝部１Ｂの底面に電子部品を収納するための凹部（以下、これをエンボス部と呼ぶ）１Ｃが一定間隔で形成されている。
【０００４】
さらにこのエンボス部１Ｃの底面の所定位置には、図１２（Ａ）〜（Ｃ）に示すように、所定の幅及び高さをもつ２本の段部（以下、これを底上げ部と呼ぶ）１ＣＡ、１ＣＢが矢印ｂ方向に沿って平行に突出形成されており、当該エンボス部１Ｃ内に電子部品ＩＣを収納した際に、底上げ部１ＣＡ、１ＣＢが電子部品ＩＣの各電極ＢＰに接触することなく、当該電子部品ＩＣの下面に当接することにより、電子部品ＩＣの各電極ＢＰが接触により破損するのを未然に防止し得るようになされている。
【０００５】
またキャリアテープ１の幅方向（矢印ｂ）の一端部には所定ピッチで送り穴１Ｄが穿設されており、かくして送り穴１Ｄを基準とし、ガイド溝部１Ｂをガイドとして、キャリアテープ１を蛇行させることなくその長手方向に所定ピッチで順次走行させることができるようになされている。
【０００６】
さらにカバーテープは、キャリアテープ１の一面１Ａ側に当該キャリアテープ１Ａの長手方向に沿って各エンボス部１Ｃを覆うように貼着されている。
【０００７】
これによりかかるテープ状部品包装体においては、キャリアテープ１の各エンボス部１Ｃ内に収納された電子部品を、そのエンボス部１Ｃの内壁面とカバーテープとによって所定状態に保持し得るようになされている。
【０００８】
なお、この種のテープ状部品包装体については、ＪＩＳ（Ｊａｐａｎｅｓｅ　Ｉｎｄｕｓｔｒｉａｌ　Ｓｔａｎｄａｒｄｓ）による種々の規格が設けられており、例えばＪＩＳ　Ｃ　０８０６−３規格では、テープ幅が８〔ｍｍ〕、１２〔ｍｍ〕、１６〔ｍｍ〕及び２４〔ｍｍ〕等の各種定型テープ幅Ｗのキャリアテープ１について、送り穴１Ｃのピッチ（送り穴間ピッチ）Ｐ０及びエンボス部１Ｃのピッチ（エンボス部間ピッチ）Ｐ１や、そのキャリアテープ１に対するカバーテープのテープ幅などが厳格に規定されている。
【０００９】
【発明が解決しようとする課題】
ところで、キャリアテープ１は、予備加熱された熱可塑性樹脂テープを所定の金型（図示せず）の加工面に吸着させながら、当該熱可塑性樹脂テープに上述したガイド溝部１０Ｂやエンボス部１０Ｃを順次形成するようにして製造されるようになされている。
【００１０】
ここで金型は、通常、円筒状の回転式刃物であるフライス（端面にも切れ刃のあるものをエンドミルと呼ぶ）が搭載されたフライス盤を用いてその加工面を所望形状に切削するようになされている。
【００１１】
例えば図１３（Ａ）〜（Ｃ）に示すように、金型２の加工面２Ａに所定の幅及び深さの溝２Ｇを長手方向に沿って形成する場合、金型２の加工面２Ａの一端側に位置決めしたエンドミル３を回転駆動させながら矢印ａ方向に沿って他端側に突き抜けるまで移動させる。
【００１２】
このような手法で加工面が切削された金型２を用いてキャリアテープ１を加熱吸着により製造する工程において、金型２の外周部における凸部の形状が完全な直角であっても、成形後のキャリアテープ１におけるエンボス部１Ｃの底上げ部１ＣＡ、１ＣＢの角部は完全な直角にはならずに、当該角部に湾曲した突出部分（以下、これをＲ突出部と呼ぶ）１ＣＡＲ、１ＣＢＲが形成されることがほとんどであった（後述する図１４（Ｂ））。
【００１３】
このため図１２（Ｃ）と対応する図１４（Ａ）及びその拡大図である図１４（Ｂ）に示すように、キャリアテープ１の各エンボス部１Ｃ内に順次電子部品ＩＣを収納した際、当該各電子部品ＩＣが対応するエンボス部１Ｃ内の底上げ部１ＣＡ、１ＣＢの角部に形成されたＲ突出部１ＣＡＲ、１ＣＢＲに乗り上げてしまい、この結果電子部品ＩＣがエンボス部１Ｃの底面に対して傾斜した状態になる場合がある。
【００１４】
この状態のまま次工程に進んで、キャリアテープ内に電子部品ＩＣが収納されたか否かを画像認識の手法により検出する場合、電子部品ＩＣの傾斜の度合い（例えば１．０°でも）によって強い反射光が生じるときがあり、このとき電子部品ＩＣの撮像画像からはその表面に記されている番号等の数字や外郭形状等を正確に認識することが非常に困難となるおそれがあった。
【００１５】
本発明は以上の点を考慮してなされたもので、テープ状部品包装体に安定して電子部品を収納し得る金型及びその製造方法並びにテープ状部品包装体の製造装置及び製造方法を提案しようとするものである。
【００１６】
【課題を解決するための手段】
かかる課題を解決するため本発明においては、電子部品ＩＣを収納するための凹形状のエンボス部１０Ｃと、当該エンボス部１０Ｃの底面に位置し電子部品ＩＣを支持するための凸形状の底上げ部１０ＣＡ、１０ＣＢとを有するテープ状部品包装体１０を加熱吸着により形成するための金型２７において、エンボス部１０Ｃに対応する凸部４０Ｃと、底上げ部１０ＣＡ、１０ＣＢに対応させて、凸部４０Ｃの上面に形成された凹部４０ＣＡ、４０ＣＢとを設け、凹部４０ＣＡ、４０ＣＢは、凸部４０Ｃの外周側壁側に当該凹部４０ＣＡ、４０ＣＢの深さより浅い開放部分（４０ＣＡＴ、４０ＣＢＴの上側の開放部位）が形成されるようにした。
【００１７】
また本発明においては、電子部品ＩＣを収納するための凹形状のエンボス部１０Ｃと、当該エンボス部１０Ｃの底面に位置し電子部品ＩＣを支持するための凸形状の底上げ部１０ＣＡ、１０ＣＢとを有するテープ状部品包装体１０を加熱吸着により形成するための金型２７の製造方法において、エンボス部１０Ｃに対応する凸部４０Ｃを形成する第１の工程と、底上げ部１０ＣＡ、１０ＣＢに対応させて、凸部４０Ｃの上面に当該凸部４０Ｃの外周側壁側に開放部分（４０ＣＡＴ、４０ＣＢＴの上側の開放部位）が形成されるように凹部４０ＣＡ、４０ＣＢを形成する第２の工程とを設け、第２の工程では、開放部分を凹部４０ＣＡ、４０ＣＢの深さよりも浅く形成するようにした。
【００１８】
さらに本発明においては、電子部品ＩＣを収納するための凹形状のエンボス部１０Ｃと、当該エンボス部１０Ｃの底面に位置し電子部品ＩＣを支持するための凸形状の底上げ部１０ＣＡ、１０ＣＢとを有するテープ状部品包装体１０を加熱吸着により形成するための金型２７の製造装置５０において、エンボス部１０Ｃに対応する凸部４０Ｃを形成する第１の加工手段と、底上げ部１０ＣＡ、１０ＣＢに対応させて、凸部４０Ｃの上面に当該凸部４０Ｃの外周側壁側に開放部分（４０ＣＡＴ、４０ＣＢＴの上側の開放部位）が形成されるように凹部４０ＣＡ、４０ＣＢを形成する第２の加工手段５４と、第１及び第２の加工手段５４を駆動する駆動手段と、金型２７と第１及び第２の加工手段５４とを相対的に移動させる移動手段５２、５３と、駆動手段及び移動手段５２、５３を制御する制御手段５１とを設け、第２の加工手段５４では、開放部分を凹部４０ＣＡ、４０ＣＢの深さよりも浅く形成するようにした。
【００１９】
さらに本発明においては、熱可塑性樹脂テープ２５を加熱後に金型２７の表面に吸着させるようにして、電子部品ＩＣを収納するための凹形状のエンボス部１０Ｃと、当該エンボス部１０Ｃの底面に位置し電子部品ＩＣを支持するための凸形状の底上げ部１０ＣＡ、１０ＣＢとを有するテープ状部品包装体１０を製造するための製造方法において、金型２７の表面には、エンボス部１０Ｃに対応する凸部４０Ｃが形成されると共に、底上げ部１０ＣＡ、１０ＣＢに対応させて凸部４０Ｃの上面に凹部４０ＣＡ、４０ＣＢが形成され、さらに凸部４０Ｃの外周側壁側に当該凹部４０ＣＡ、４０ＣＢの深さより浅い開放部分（４０ＣＡＴ、４０ＣＢＴの上側の開放部位）が形成され、吸着時に、熱可塑性樹脂テープ２５及び金型２７の凹部４０ＣＡ、４０ＣＢ間に入り込んだ空気が開放部分を介して外部に開放されるようにした。
【００２０】
さらに本発明においては、熱可塑性樹脂テープ２５を加熱後に金型２７の表面に吸着させるようにして、電子部品ＩＣを収納するための凹形状のエンボス部１０Ｃと、当該エンボス部１０Ｃの底面に位置し電子部品ＩＣを支持するための凸形状の底上げ部１０ＣＡ、１０ＣＢとを有するテープ状部品包装体１０を製造するための製造装置２０において、熱可塑性樹脂テープ２５を金型２７の表面に吸着させる吸着手段２６を設け、金型２７の表面には、エンボス部１０Ｃに対応する凸部４０Ｃが形成されると共に、底上げ部１０ＣＡ、１０ＣＢに対応させて凸部４０Ｃの上面に凹部４０ＣＡ、４０ＣＢが形成され、さらに凸部４０Ｃの外周側壁側に当該凹部４０ＣＡ、４０ＣＢの深さより浅い開放部分（４０ＣＡＴ、４０ＣＢＴの上側の開放部位）が形成され、吸着手段２６による吸着時に、熱可塑性樹脂テープ２５及び金型２７の凹部４０ＣＡ、４０ＣＢ間に入り込んだ空気が開放部分を介して外部に開放されるようにした。
【００２１】
この結果この金型２７に熱可塑性樹脂テープ２５を加熱吸着して得られたテープ状部品包装体１０には、エンボス部１０Ｃの各底上げ部１０ＣＡ、１０ＣＢの端に、当該エンボス部１０Ｃの内周側面との間で切欠き溝１０ＣＡＧ、１０ＣＢＧを形成することができ、かくしてテープ状部品包装体１０のエンボス部１０Ｃ内に電子部品ＩＣを収納した際に当該電子部品ＩＣの下面端部がエンボス部１０Ｃの内周側面及び底面間の角部に形成される湾曲した突出部分に乗り上げるのを回避することができる。
【００２２】
これに加えて金型２７による加熱吸着を行う際、当該金型２７の凹部４０ＣＡ、４０ＣＢと熱可塑性樹脂テープ２５をとの間の空気が、突条部４０ＣＴＡ、４０ＣＢＴの上側の開放部分を介して開放させ得る分、凹部４０ＣＡ、４０ＣＢを含む凸部４０Ｃ全体を隙間なく熱可塑性樹脂テープ２５に吸着させることができ、この結果、エンボス部１０Ｃが精度良く形成されたテープ状部品包装体１０を製造することができる。
【００２３】
【発明の実施の形態】
以下図面について、本発明の一実施の形態を詳述する。
【００２４】
（１）本実施の形態によるキャリアテープ１０の構成
図１（Ａ）〜（Ｃ）に本実施の形態によるキャリアテープ１０を示し、このキャリアテープ１０は、熱可塑性樹脂テープを加熱成形加工するようにして形成されている。上面図を示す図１（Ａ）に対して、図１（Ｂ）は矢印Ａ−Ａ´でとった断面図であり、図１（Ｃ）は矢印Ｂ−Ｂ´でとった断面図である。
【００２５】
このキャリアテープ１０には、一面１０Ａに長手方向（矢印ａ）に沿って僅かな深さのガイド溝部１０Ｂが形成されると共に、当該ガイド溝部１０Ｂの底面にエンボス部１０Ｃが一定間隔で形成されている。
【００２６】
このエンボス部１０Ｃの底面の所定位置には、所定の幅及び高さをもつ２本の段部（以下、これを底上げ部と呼ぶ）１０ＣＡ、１０ＣＢが矢印ｂ方向に沿って平行に突出形成されており、図２（Ａ）に示すように、当該エンボス部１０Ｃ内に電子部品ＩＣを収納した際に、矢印Ａ−Ａ´でとった断面を示す図２（Ｂ）のように、底上げ部１０ＣＡ、１０ＣＢが電子部品ＩＣの各電極ＢＰに接触することなく、当該電子部品ＩＣの下面に当接することにより、電子部品ＩＣの各電極ＢＰが接触により破損するのを未然に防止し得るようになされている。
【００２７】
本実施の形態の場合、キャリアテープ１０のエンボス部１０Ｃの各底上げ部１０ＣＡ、１０ＣＢの両端には、当該エンボス部１０Ｃの内周側面との間で所定の深さ及びサイズの溝（以下、これを切欠き溝と呼ぶ）１０ＣＡＧ、１０ＣＢＧがそれぞれ形成され、エンボス部１０Ｃの内周側面及び底面間に形成されるＲ形状部（図示せず）のうち、各底上げ部１０ＣＡ、１０ＣＢの両端には積極的にそれぞれ切欠き溝１０ＣＡＧ、１０ＣＢＧが形成された分だけＲ形状部が形成されるのを未然に回避するようになされている。
【００２８】
またキャリアテープ１０の幅方向（矢印ｂ）の一端部には所定ピッチで送り穴１０Ｄが穿設されており、かくして送り穴１０Ｄを基準とし、ガイド溝部１０Ｂをガイドとして、キャリアテープ１０を蛇行させることなくその長手方向に所定ピッチで順次走行させることができるようになされている。
【００２９】
さらにこのキャリアテープ１０に対応するカバーテープ（図示せず）は、キャリアテープ１０の一面１０Ａ側に矢印ａ方向に沿って各エンボス部１０Ｃを覆うように貼着され、かくしてキャリアテープ１０の各エンボス部１０Ｃ内に収納された電子部品ＩＣを、そのエンボス部１０Ｃの内壁面とカバーテープとによって所定状態に保持し得るようになされている。
【００３０】
なおこの実施の形態の場合、キャリアテープ１０における隣接するエンボス部１０Ｃの間の部分（以下、この部分をリブ部１０Ｅと呼ぶ）には、所定の形状及びサイズの凹部（以下、これをガード部と呼ぶ）１０Ｇがエンボス部１０Ｃの底面とほぼ同じ深さで形成されており、キャリアテープ１０が巻取リール（図示せず）に巻回されたときに各エンボス部１０Ｃ同士が嵌まり込むのを回避することができるようになされている。
【００３１】
かかるガード部１０Ｇは、矢印ａ方向の幅がエンボス部１０Ｃの矢印ａ方向の幅よりも短く、かつ矢印ｂ方向の幅がエンボス部１０Ｃの矢印ｂ方向の幅よりも長くなるように、形状及びサイズが予め設定されており、各エンボス部１０Ｃ同士のみならず各ガード部１０Ｇ同士さらにはエンボス部１０Ｃ及びガード部１０Ｇ間で嵌まり込むのを回避するようになされている。
【００３２】
（２）キャリアテープ製造装置２０の構成
次に、かかるキャリアテープ１０を製造するためのキャリアテープ製造装置２０（図３）の構成について説明する。
【００３３】
本実施の形態によるキャリアテープ製造装置２０においては、図３に示すように、予備加熱部２１、成型加工部２２及び裁断穿孔部２３を有している。そしてこのキャリアテープ製造装置２０では、テープ供給ドラム２４から熱可塑性樹脂テープ２５を一定速度で順次引き出し、これを予備加熱部２１において予備加熱した後、成形加工部２２に供給する。
【００３４】
成形加工部２２は、真空ポンプ等を含んでなる円筒形状の負圧供給部２６と、当該負圧供給部２６に図示しない真空シールを介して回転自在に嵌め込まれたドーナッツ形状の雄型の金型２７と、当該金型２７を熱可塑性樹脂テープ２５の走行速度に応じた速度で回転駆動する図示しない駆動機構とを有している。
【００３５】
そして成形加工部２２は、予備加熱部２１から供給される予備加熱された熱可塑性樹脂テープ２５を負圧供給部２６から金型２７に与えられる負圧により当該金型２７の外周面２７Ａに吸着するようにして、当該熱可塑性樹脂テープ２５にキャリアテープ１０（図１）のガイド溝部１０Ｂや、エンボス部１０Ｃ、ガード部１０Ｇ及びリブ部１０Ｅを順次形成する。
【００３６】
さらにこのようにしてエンボス部１０Ｃ及びリブ部１０Ｅ等が形成された熱可塑性樹脂テープ２５は、この後裁断穿孔部２３に送り出され、当該裁断穿孔部２３において所定幅に裁断されると共に、かかるキャリアテープ１０の送り穴１０Ｄが穿設される。これによりキャリアテープ１０が形成され、この後このキャリアテープ１０が図示しないテープ巻取り部に送り出されて、巻取りリール２８に巻き取られる。
【００３７】
このようにしてこのキャリアテープ製造装置２０においては、図１に示すキャリアテープ１０を製造することができるようになされている。
【００３８】
ここで図４は、成形加工部２２の金型２７の具体構成を示すものである。この図４からも明らかなように、金型２７は、第１〜第５の金型構成部３０〜３４を合わせ穴３５を基準として所定の位置関係で一体に組み合わせることにより構成されている。
【００３９】
このとき第３の金型構成部３２には、図５に示すように、かかるキャリアテープ１０のガイド溝部１０Ｂや、エンボス部１０Ｃ、リブ部１０Ｅ及びガード部１０Ｇに応じた形状の凸部４０がその外周面に一周に亘って形成されており、このうちキャリアテープ１０のガード部１０Ｇにそれぞれ対応する部分（ガード部１０Ｇの内部形状を反転した外部形状を有し、当該ガード部１０Ｇのガード部間ピッチと同じピッチで形成された部分。以下、この部分をガード形成凸部４０Ｇと呼ぶ）は、第２及び第４の金型構成部３１、３３の外周面上に間隙を介して僅かにはみ出すように形成されている。
【００４０】
またキャリアテープ１０のエンボス部１０Ｃにそれぞれ対応する部分（エンボス部１０Ｃの内部形状を反転した外部形状を有し、当該エンボス部１０Ｃのエンボス部間ピッチと同じピッチで形成された部分。以下、この部分をエンボス形成凸部４０Ｃと呼ぶ）は、２つの底上げ部１０ＣＡ、１０ＣＢに対応する部分（以下、この部分を底上げ形成凹部４０ＣＡ、４０ＣＢと呼ぶ）が溝状に形成され、当該各底上げ形成凹部４０ＣＡ、４０ＣＢの両端にはそれぞれ切欠き溝１０ＣＡＧ、１０ＣＢＧに対応する部分（以下、この部分を突条部と呼ぶ）４０ＣＡＴ、４０ＣＢＴが突出して形成されている。
【００４１】
また第２及び第４の金型構成部３１、３３における第３の金型構成部３２との接合面には、それぞれ当該第２又は第４の金型構成部３１、３３の外周面側に開放する所定形状の第１の溝部３１Ａ、３３Ａが所定ピッチで複数形成されると共に、これら各第１の溝部３１Ａ、３３Ａにそれぞれ対応させて、第１の溝部３１Ａ、３３Ａ及び負圧供給部２６（図３）間を連通する第２の溝部３１Ｂ、３３Ｂが複数形成されている。
【００４２】
さらに第３の金型構成部３２のエンボス形成凸部４０Ｃにおける２つの底上げ形成凹部４０ＣＡ、４０ＣＢの間には、例えば直径が０．１５〔ｍｍ〕以下の微小な吸引孔３２Ａが穿設されており、当該吸引孔３２Ａに対応して、第２及び第４の金型構成部３１、３３の対応する第１の溝部３１Ａ、３３Ａと連通するように貫通孔３２Ｂが穿設されている。
【００４３】
さらに第３の金型構成部３２の外周部には、当該第３の金型構成部３２の外周面に形成された上述の凸部４０のうち、キャリアテープ１０の各リブ部１０Ｅにそれぞれ対応する部分（リブ部１０Ｅの表面形状を反転した外部形状を有し、凸部４０の隣接するエンボス形成用凸部４０Ｃ間に形成された部分。以下、この部分をリブ形成用凸部４０Ｅと呼ぶ）には、２つの例えば直径が０．１５〔ｍｍ〕以下の微小な吸引孔３２Ｃが各リブ形成用凸部４０Ｅの幅方向（矢印ａ）の中心上に位置するように穿設されている。この吸引孔３２Ｃも上述した貫通孔３２Ｂと連通されている。
【００４４】
これにより成形加工部２２（図３）においては、予備加熱部２１から供給される予備加熱された熱可塑性樹脂テープ２５を金型２７の外周面２７Ａ上に吸着する際に、負圧供給部２６から第２及び第４の金型構成部３１、３３の各第２の溝部３１Ｂ、３３Ｂを介して各第１の溝部３１Ａ、３３Ａに与えられる負圧と、第３の金型構成部３２の各貫通孔３２Ｂを介して各吸引孔３２Ａ、３２Ｃに与えられる負圧とに基づいて、金型２７の外周面２７Ａ（図２）上に順次吸着することができ、かくして当該金型２７の第３の金型構成部３２における凸部４０の外部形状に応じた形状に熱可塑性樹脂テープ２５を成形加工することができるようになされている。
【００４５】
また成形加工部２２において、かかる吸気孔３２Ａ、３２Ｃの大きさを直径が０．１５〔ｍｍ〕以下としているため、製造されたキャリアテープ１０の対応部位に不要な凸部が成形されるのを極力抑えることができる。かくするにつき、例えばこの後の工程においてキャリアテープ１０の各エンボス部１０Ｃ内に順次電子部品ＩＣを収納した後キャリアテープ１０上にカバーテープを貼着したときにも、かかる不要な凸部の存在によってキャリアテープ１０及びカバーテープ間に隙間が生じるのを未然にかつ有効に抑えることができる。
【００４６】
このようにキャリアテープ製造装置２０の成形加工部２２では、予備加熱部２１から供給される予備加熱された熱可塑性樹脂テープ２５を、負圧供給部２６から金型２７に与えられる負圧に基づいて当該金型２７の外周面２７Ａ上に吸着するようにしてキャリアテープ１０を精度良く形成する。
【００４７】
（３）金型加工装置の構成
ここで図６に、フライス盤による切削加工を行う金型加工装置５０を示し、架台（図示せず）の内部に装置全体を制御する制御装置５１が配置されている。
【００４８】
この架台上には、図示しないテーブル駆動機構から与えられる推進力に基づいてＸ軸方向（矢印ｘ方向）及びＹ軸方向（矢印ｙ方向）に移動自在にテーブル５２が配置されており、供給される加工対象の金型２７をこのテーブル５２上に固定保持した状態で架台上をＸ軸方向及びＹ軸方向に自在に搬送し得るようになされている。
【００４９】
また架台上には可動体５３がＺ軸方向（矢印ｚ方向）に沿って移動自在に取り付けられ、当該可動体５３にはその下側から突出するようにエンドミル５４がＺ軸方向と平行な中心軸Ｋ１を中心として回転自在に挿着されている。
【００５０】
エンドミル５４は、アクチュエータ（図示せず）と連結され、制御装置５１の制御下で当該アクチュエータの駆動に応じて回転し得るようになされている。
【００５１】
これにより金型加工装置５０では、制御装置５１が所定のタイミングで可動体５３、テーブル５２及びアクチュエータを当該各位置に応じた数値制御に基づいて駆動させることによって、金型２７の加工面（すなわち外周面）２７Ａを所望形状に切削することができるようになされている。
【００５２】
本実施の形態において、金型加工装置５０を用いて、金型２７の加工面２７Ａに形成したエンボス形成凸部４０Ｃに対して各底上げ形成凹部４０ＣＡ、４０ＣＢを形成する場合、まずテーブル５２上に固定保持された金型２７をＸ軸方向及びＹ軸方向に移動させて、エンドミル５４に対して当該金型２７の加工面２７Ａにおける切削開始位置に位置決めする。
【００５３】
このときエンドミル５４が、図７（Ａ）〜（Ｃ）に示すように、金型２７の加工面２７Ａの一端から外側に僅かにはみ出す位置（以下、この位置を切削開始位置と呼ぶ）となるように、テーブル５２を位置決めする。
【００５４】
続いてエンドミル５４を回転駆動させながらＺ軸方向に下降移動させて金型２７の加工面２７Ａを切削開始位置から切削を開始し、所定の深さ位置になったとき、この状態のままテーブル５２をＸ軸方向にスライド移動させて金型２７の加工面２７Ａに１本の溝を形成させつつ、エンドミル５４が当該加工面２７Ａの他端から外側に僅かにはみ出す位置（以下、この位置を切削終了位置と呼ぶ）に到達したときにテーブル５２を駆動停止させる。
【００５５】
そしてエンドミル５４をＺ方向に上昇移動させた後、続いて現在のエンドミル５４よりも僅かに径が大きいエンドミル（図示せず）に取り替えて、当該新たなエンドミルを用いて、金型２７の加工面２７Ａを再度上述と同じ切削開始位置から切削終了位置までを上述の溝よりも少し浅い位置で切削することにより、金型２７の加工面２７Ａには図７（Ａ）に示すような底上げ形成凹部４０ＣＡ（４０ＣＢ）が形成される。
【００５６】
実際に底上げ形成凹部４０ＣＡ（４０ＣＢ）には、図８（Ａ）に示すエンボス形成凸部４０Ｃにおいて矢印Ａ−Ａ´を断面にとって示すように、その両端にそれぞれ切欠き溝１０ＣＡＧ、１０ＣＢＧに対応する突条部４０ＣＡＴ（４０ＣＢＴ）が突出して形成されることとなる（図８（Ｂ））。
【００５７】
従ってかかるエンボス形成凸部４０Ｃを有する金型２７（図８（Ａ））を上述した図３に示すキャリアテープ製造装置２０に使用してキャリアテープ１０を製造した場合、当該キャリアテープ１０には、金型のエンボス形成凸部４０Ｃを反転した外部形状でなるエンボス部１０Ｃが形成されると共に、当該各底上げ形成凹部４０ＣＡ、４０ＣＢを反転した外部形状でなる底上げ部１０ＣＡ、１０ＣＢがそれぞれ形成され、さらに当該各底上げ部１０ＣＡ、１０ＣＢの両端には突条部４０ＣＡＴ、４０ＣＢＴを反転した外部形状でなる切欠き溝１０ＣＡＧ、１０ＣＢＧがそれぞれ形成される。
【００５８】
（４）本実施の形態の動作及び効果
以上の構成において、本実施の形態の金型２７では、予めエンボス形成凸部４０Ｃを形成した後、エンドミル５４が搭載された金型加工装置５０を用いて、当該エンボス形成凸部４０Ｃに２本の底上げ形成凹部４０ＣＡ、４０ＣＢを形成する。このとき金型２７の加工面２７Ａに形成された各底上げ形成凹部４０ＣＡ、４０ＣＢの両端には、エンドミル５４の切削開始位置及び切削終了位置に応じた突条部４０ＣＡＴ、４０ＣＢＴがそれぞれ形成される。
【００５９】
そしてキャリアテープ製造装置２０において、熱可塑性樹脂テープ２５を加熱後に負圧供給部２６から金型２７に与えられる負圧に基づいて当該金型２７の外周面２７Ａ上に吸着させるようにして、当該金型２７に形成されたエンボス形成凸部４０Ｃ等を所定ピッチで形成したキャリアテープ１０を製造する。
【００６０】
ここで金型２７の切削加工時において、エンドミル５４の切削開始位置及び切削終了位置が、金型２７の加工面２７Ａの両端から外側に僅かにはみ出す位置にあり、当該両端から全くはみ出していない位置にした場合と比較して、当該加工面２７Ａの両端側面が僅かに切削されている。
【００６１】
従って負圧供給部２６から金型２７に負圧が与えられた際、当該金型２７の外周面２７Ａに熱可塑性樹脂テープ２５が吸着されたときでも、熱可塑性樹脂テープ２５及び底上げ形成凹部４０ＣＡ、４０ＣＢ間の空気が、突条部４０ＣＴＡ、４０ＣＢＴの上側の僅かな切削部位を開放部分として開放させ得る分、エンボス形成凸部４０Ｃ全体を隙間なく熱可塑性樹脂テープ２５に吸着させることができ、この結果、エンボス部１０Ｃが精度良く形成されたキャリアテープ１０を製造することができる。
【００６２】
これに加えて、金型２７の切削加工時において、エンドミル５４で底上げ形成凹部４０ＣＡ、４０ＣＢを形成した後、さらに当該エンドミル５４よりも僅かに径が大きいエンドミル（図示せず）に取り替えて、当該新たなエンドミルを用いて、金型２７の加工面２７Ａを再度上述と同じ切削開始位置から切削終了位置までを上述の溝よりも少し浅い位置で切削するようにしたことにより、金型２７の加工面２７Ａの両端側面における突条部４０ＣＴＡ、４０ＣＢＴの上側の僅かな切削部位の形状を一層滑らかに形成することができ、その分エンボス形成凸部４０Ｃ全体をより一層隙間なく熱可塑性樹脂テープ２５に吸着させることができ、かくしてエンボス部１０Ｃがより一層精度良く形成されたキャリアテープ１０を製造することができる。
【００６３】
このようにしてキャリアテープ１０には、エンボス部１０Ｃの各底上げ部１０ＣＡ、１０ＣＢの両端に、当該エンボス部１０Ｃの内周側面との間で切欠き溝１０ＣＡＧ、１０ＣＢＧを形成することができる。
【００６４】
従ってこのキャリアテープ１０では、エンボス部１０Ｃの内周側面及び底面間に形成されるＲ形状部のうち、各底上げ部１０ＣＡ、１０ＣＢの両端には積極的に切欠き溝１０ＣＡＧ、１０ＣＢＧが形成された分だけＲ形状部を取り除くことができる。
【００６５】
この結果、キャリアテープ１０のエンボス部１０Ｃ内に電子部品ＩＣを収納した際に当該電子部品ＩＣの下面端部がエンボス部１０Ｃの内周側面及び底面間に形成されるＲ形状部に乗り上げるのを回避することができる。
【００６６】
さらにはキャリアテープ１０内に電子部品ＩＣが収納されたか否かを画像認識により検出する次工程において、電子部品ＩＣの傾斜の度合いによっては画像認識に誤りが生じるほどの反射光が生じるのを未然に防止することができる。
【００６７】
以上の構成によれば、外周面２７Ａにエンボス形成凸部４０Ｃが形成された金型２７について、エンドミル５４の切削開始位置及び切削終了位置に応じて突条部４０ＣＡＴ、４０ＣＢＴがそれぞれ形成されるように各底上げ形成凹部４０ＣＡ、４０ＣＢを切削加工したことにより、当該金型２７を用いて製造したキャリアテープ１０には、エンボス部１０Ｃの各底上げ部１０ＣＡ、１０ＣＢの両端に、当該エンボス部１０Ｃの内周側面との間で切欠き溝１０ＣＡＧ、１０ＣＢＧを形成することができ、当該エンボス部１０Ｃの内周側面及び底面間に形成されるＲ形状部のうち、各底上げ部１０ＣＡ、１０ＣＢの両端には積極的に切欠き溝１０ＣＡＧ、１０ＣＢＧが形成された分だけＲ形状部を取り除くことができ、かくして、キャリアテープ１０のエンボス部１０Ｃ内に電子部品ＩＣを傾斜することなく安定した状態で収納することができる。
【００６８】
（５）他の実施の形態
なお上述の実施の形態においては、本発明を、図３に示すようなキャリアテープ製造装置２０を用いてキャリアテープ（テープ状部品包装体）１０を製造するようにした場合について述べたが、本発明はこれに限らず、この他種々のキャリアテープの製造装置にも広く適用することができる。この場合、熱可塑性樹脂テープ２５を金型２７の表面に吸着させる負圧供給部（吸着手段）２６も種々の構成のものを適用しても良い。
【００６９】
また上述の実施の形態においては、本発明を電子部品ＩＣを包装するキャリアテープ（テープ状部品包装体）１０に適用するようにした場合について述べたが、本発明はこれに限らず、電子部品ＩＣ以外の部品を包装するキャリアテープにも広く適用することができる。
【００７０】
例えば図１との対応した図９において、キャリアテープ６０は、エンボス部６０Ｃの各底上げ部６０ＣＡ、６０ＣＢの構成が異なる以外全て図１に示すキャリアテープ１０と同様に構成されている。図９では底上げ部６０ＣＡ、６０ＣＢ以外は全て同一のアルファベットを記述するようにして図１と対応させるようにしている。
【００７１】
かかるキャリアテープ６０におけるエンボス部６０Ｃの各底上げ部６０ＣＡ、６０ＣＢは、図１に示すキャリアテープ１０と異なり、ト字状の段部形状を有し、エンボス部６０Ｃの内周側面との間でそれぞれ３箇所（全部で６箇所）の切欠き溝を形成するようになされている。
【００７２】
また例えば図１との対応した図１０において、キャリアテープ７０は、エンボス部７０Ｃの各底上げ部７０ＣＡ、７０ＣＢの構成が異なる以外全て図１に示すキャリアテープ１０と同様に構成されている。図１０では底上げ部７０ＣＡ、７０ＣＢ以外は全て同一のアルファベットを記述するようにして図１と対応させるようにしている。
【００７３】
かかるキャリアテープ６０におけるエンボス部６０Ｃの各底上げ部６０ＣＡ、６０ＣＢは、図１に示すキャリアテープ１０と異なり、エンボス部６０Ｃの底面全体に亘って６個の半球状の段部形状を有し、エンボス部６０Ｃの内周側面との間でそれぞれ６箇所の切欠き溝を形成するようになされている。
【００７４】
さらに上述の実施の形態においては、電子部品ＩＣを収納するための凹形状のエンボス部１０Ｃと、当該エンボス部１０Ｃの底面に位置し電子部品ＩＣを支持するための凸形状の底上げ部１０ＣＡ、１０ＣＢとを有するキャリアテープ（テープ状部品包装体）１０を加熱吸着により形成するための金型２７について、図８（Ａ）及び（Ｂ）に示すように、エンボス部１０Ｃに対応するエンボス形成凸部（凸部）４０Ｃと、底上げ部１０ＣＡ、１０ＣＢに対応させて、エンボス形成凸部（凸部）４０Ｃの上面に形成された底上げ形成凹部（凹部）４０ＣＡ、４０ＣＢとを設け、底上げ形成凹部（凹部）４０ＣＡ、４０ＣＢは、エンボス形成凸部（凸部）４０Ｃの外周側壁側に当該底上げ形成凹部（凹部）４０ＣＡ、４０ＣＢの深さより浅い開放部分（突条部４０ＣＡＴ、４０ＣＢＴの上側の開放部位）を形成するようにした場合について述べたが、本発明はこれに限らず、要は、テープ状部品包装体１０のエンボス部１０Ｃ内に電子部品ＩＣを収納した際に当該電子部品ＩＣの下面端部がエンボス部１０Ｃの内周側面及び底面間の角部に形成される湾曲した突出部分に乗り上げるのを回避することができれば、この他種々の構成からなる金型に広く適用するようにしても良い。
【００７５】
さらに上述の実施の形態においては、キャリアテープ（テープ状部品包装体）１０を加熱吸着により形成するための金型２７の製造装置として、図６に示すような構成の金型加工装置５０を適用した場合について述べたが、本発明はこれに限らず、上述した金型を製造することができればこの他種々の構成のものを広く適用するようにしても良い。
【００７６】
なお本実施の形態の場合、図６の金型加工装置５０では、キャリアテープ１０の底上げ部１０ＣＡ、１０ＣＢに対応させて、エンボス形成凸部（凸部）４０Ｃの上面に当該凸部４０Ｃの外周側壁側に開放部分が形成されるように底上げ形成凹部（凹部）４０ＣＡ、４０ＣＢを形成する第２の加工手段として、エンドミル５４を適用し、当該エンドミル５４を駆動する駆動手段として、図示しないアクチュエータを適用し、金型２７とエンドミル５４とを相対的に移動させる移動手段として、テーブル５２及び移動体５３を適用し、さらにアクチュエータ（駆動手段）及びテーブル５２及び移動体５３（移動手段）を制御する制御手段として、制御装置５１を適用するようにした。
【００７７】
この金型加工装置５０では、キャリアテープ１０のエンボス部１０Ｃに対応するエンボス形成凸部（凸部）４０Ｃを形成する第１の加工手段の構成を記載していないが、実際には、エンドミル５４に代えてエンボス形成凸部（凸部）４０Ｃを形成するために最適なフライスを新たに取り付けるようにして、当該フライスを第１の加工手段として適用するようにした。
【００７８】
さらに上述の実施の形態においては、底上げ部１０ＣＡ、１０ＣＢに対応させてエンボス形成凸部（凸部）４０Ｃの上面に形成された底上げ形成凹部（凹部）４０ＣＡ、４０ＣＢに重ねて、当該底上げ形成凹部（凹部）４０ＣＡ、４０ＣＢの幅よりも広くかつ当該底上げ形成凹部（凹部）４０ＣＡ、４０ＣＢの深さより浅い第２の凹部（図示せず）を形成するようにした場合について述べたが、本発明はこれに限らず、熱可塑性樹脂テープ２５と金型２７との吸着性を向上させることができれば、第２の凹部としては種々の形状にしても良い。
【００７９】
【発明の効果】
上述のように本発明によれば、電子部品を収納するための凹形状のエンボス部と、当該エンボス部の底面に位置し電子部品を支持するための凸形状の底上げ部とを有するテープ状部品包装体を加熱吸着により形成するための金型において、エンボス部に対応する凸部、底上げ部に対応させて、凸部の上面に形成された凹部とを設け、凹部は、凸部の外周側壁側に当該凹部の深さより浅い開放部分が形成されるようにしたことにより、かくしてテープ状部品包装体のエンボス部内に電子部品を収納した際に当該電子部品の下面端部がエンボス部の内周側面及び底面間の角部に形成される湾曲した突出部分に乗り上げるのを回避することができ、かくしてテープ状部品包装体に安定して電子部品を収納し得る金型を実現できる。
【００８０】
また本発明によれば、電子部品を収納するための凹形状のエンボス部と、当該エンボス部の底面に位置し電子部品を支持するための凸形状の底上げ部とを有するテープ状部品包装体を加熱吸着により形成するための金型の製造方法において、エンボス部に対応する凸部を形成する第１の工程と、底上げ部に対応させて、凸部の上面に当該凸部の外周側壁側に開放部分が形成されるように凹部を形成する第２の工程とを設け、第２の工程では、開放部分を凹部の深さよりも浅く形成するようにしたことにより、テープ状部品包装体のエンボス部内に電子部品を収納した際に当該電子部品の下面端部がエンボス部の内周側面及び底面間の角部に形成される湾曲した突出部分に乗り上げるのを回避することができ、かくしてテープ状部品包装体に安定して電子部品を収納し得る金型の製造方法を実現できる。
【００８１】
さらに本発明によれば、電子部品を収納するための凹形状のエンボス部と、当該エンボス部の底面に位置し電子部品を支持するための凸形状の底上げ部とを有するテープ状部品包装体を加熱吸着により形成するための金型の製造装置において、エンボス部に対応する凸部を形成する第１の加工手段と、底上げ部に対応させて、凸部の上面に当該凸部の外周側壁側に開放部分が形成されるように凹部を形成する第２の加工手段と、第１及び第２の加工手段を駆動する駆動手段と、金型と第１及び第２の加工手段とを相対的に移動させる移動手段と、駆動手段及び移動手段を制御する制御手段とを設け、第２の加工手段では、開放部分を凹部の深さよりも浅く形成するようにしたことにより、テープ状部品包装体のエンボス部内に電子部品を収納した際に当該電子部品の下面端部がエンボス部の内周側面及び底面間の角部に形成される湾曲した突出部分に乗り上げるのを回避することができ、かくしてテープ状部品包装体に安定して電子部品を収納し得る金型の製造装置を実現できる。
【００８２】
さらに本発明によれば、熱可塑性樹脂テープを加熱後に金型の表面に吸着させるようにして、電子部品を収納するための凹形状のエンボス部と、当該エンボス部の底面に位置し電子部品を支持するための凸形状の底上げ部とを有するテープ状部品包装体を製造するための製造方法において、金型の表面には、エンボス部に対応する凸部が形成されると共に、底上げ部に対応させて凸部の上面に凹部が形成され、さらに凸部の外周側壁側に当該凹部の深さより浅い開放部分が形成され、吸着時に、熱可塑性樹脂テープ及び金型の凹部間に入り込んだ空気が開放部分を介して外部に開放されるようにしたことにより、テープ状部品包装体のエンボス部内に電子部品を収納した際に当該電子部品の下面端部がエンボス部の内周側面及び底面間の角部に形成される湾曲した突出部分に乗り上げるのを回避することができ、かくしてテープ状部品包装体に安定して電子部品を収納し得るテープ状部品包装体の製造方法を実現できる。
【００８３】
さらに本発明においては、熱可塑性樹脂テープを加熱後に金型の表面に吸着させるようにして、電子部品ＩＣを収納するための凹形状のエンボス部と、当該エンボス部の底面に位置し電子部品を支持するための凸形状の底上げ部とを有するテープ状部品包装体を製造するための製造装置において、熱可塑性樹脂テープを金型の表面に吸着させる吸着手段を設け、金型の表面には、エンボス部に対応する凸部が形成されると共に、底上げ部に対応させて凸部の上面に凹部が形成され、さらに凸部の外周側壁側に当該凹部の深さより浅い開放部分が形成され、吸着手段による吸着時に、熱可塑性樹脂テープ及び金型の凹部間に入り込んだ空気が開放部分を介して外部に開放されるようにしたことにより、テープ状部品包装体のエンボス部内に電子部品を収納した際に当該電子部品の下面端部がエンボス部の内周側面及び底面間の角部に形成される湾曲した突出部分に乗り上げるのを回避することができ、かくしてテープ状部品包装体に安定して電子部品を収納し得るテープ状部品包装体の製造装置を実現できる。
【図面の簡単な説明】
【図１】本実施の形態によるキャリアテープの構成を示す正面図、Ａ−Ａ´断面図及びＢ−Ｂ´断面図である。
【図２】図１に示すキャリアテープのエンボス部の詳細構成を示す上面図及び断面図である。
【図３】本実施の形態によるキャリアテープ製造装置の概略構成を示す略線図である。
【図４】本実施の形態による金型の具体構成を示す断面図及び側面図である。
【図５】本実施の形態による金型の具体構成を示す正面図及びＡ−Ａ´断面図である。
【図６】本実施の形態による金型加工装置の概略構成を示す略線図である。
【図７】本実施の形態による切削加工工程の説明に供する略線図である。
【図８】本実施の形態による製造後の金型の説明に供する部分的上面図及びその断面図である。
【図９】他の実施の形態によるキャリアテープの構成を示す正面図、Ａ−Ａ´断面図及びＢ−Ｂ´断面図である。
【図１０】他の実施の形態によるキャリアテープの構成を示す正面図、Ａ−Ａ´断面図及びＢ−Ｂ´断面図である。
【図１１】従来のキャリアテープの構成を示す正面図、Ａ−Ａ´断面図及びＢ−Ｂ´断面図である。
【図１２】図１１に示す従来のキャリアテープのエンボス部の詳細構成を示す上面図及び断面図である。
【図１３】従来の切削加工工程の説明に供する略線図である。
【図１４】電子部品の乗り上げ状態の説明に供する部分的な断面図である。
【符号の説明】
１０、６０、７０……キャリアテープ、１０Ｃ……エンボス部、１０ＣＡ、１０ＣＢ……底上げ部、１０ＣＡＧ、１０ＣＢＧ……切欠き溝、１０Ｅ……リブ部、１０Ｇ……ガード部、２０……キャリアテープ製造装置、２１……予備加熱部、２２……成形加工部、２５……熱可塑性樹脂テープ、２６……負圧供給部、２７……金型、２７Ａ……外周面、３０〜３４……金型構成部、３１Ａ、３３Ａ……第１の溝部、３１Ｂ、３３Ｂ……第２の溝部、４０Ｃ……エンボス形成用凸部、４０ＣＡ、４０ＣＢ……底上げ形成凹部、４０ＣＡＴ、４０ＣＢＴ……突条部、５０……金型加工装置、５１……制御装置、５２……テーブル、５３……可動体、５４……エンドミル。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mold, a manufacturing method and a manufacturing apparatus thereof, and a manufacturing method and a manufacturing apparatus of a tape-shaped component package, and for example, a tape-shaped component package used for transporting electronic components and a mold used for manufacturing the same. It is suitable for application to.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an electronic component having a polarity such as an IC (Integrated Circuit) chip includes, for example, a carrier tape 1 as shown in FIGS. 11A to 11C and a cover tape (not shown) attached to the carrier tape 1. ) Is stored in a tape-shaped component package (hereinafter, referred to as a tape-shaped component package) and transported.
[0003]
In this case, in the carrier tape 1, as is clear from FIG. 12A, a guide groove 1 B having a slight depth is formed on the one surface 1 A side along the longitudinal direction (arrow a) of the carrier tape 1. In addition, concave portions (hereinafter, referred to as embossed portions) 1C for accommodating electronic components are formed at regular intervals on the bottom surface of the guide groove portion 1B.
[0004]
Further, at a predetermined position on the bottom surface of the embossed portion 1C, as shown in FIGS. 12A to 12C, two steps having a predetermined width and height (hereinafter, referred to as a raised portion). 1CA and 1CB are formed so as to protrude in parallel in the direction of arrow b, and when the electronic component IC is stored in the embossed portion 1C, the raised portions 1CA and 1CB contact each electrode BP of the electronic component IC. Instead, by contacting the lower surface of the electronic component IC, each electrode BP of the electronic component IC can be prevented from being damaged by contact.
[0005]
Further, at one end of the carrier tape 1 in the width direction (arrow b), perforations 1D are formed at a predetermined pitch, and thus the carrier tape 1 is meandered with the perforation 1D as a reference and the guide groove 1B as a guide. The vehicle can be sequentially driven at a predetermined pitch in the longitudinal direction without the need.
[0006]
Further, the cover tape is attached to one surface 1A side of the carrier tape 1 so as to cover each embossed portion 1C along the longitudinal direction of the carrier tape 1A.
[0007]
Thus, in such a tape-shaped component package, the electronic component housed in each embossed portion 1C of the carrier tape 1 can be held in a predetermined state by the inner wall surface of the embossed portion 1C and the cover tape. I have.
[0008]
Various types of standards based on JIS (Japanese Industrial Standards) are provided for this type of tape-shaped component package. For example, in the JIS C 0806-3 standard, the tape width is 8 [mm], 12 [mm]. , 16 [mm] and 24 [mm], etc., for the carrier tape 1 having various standard tape widths W, the pitch of the feed holes 1C (pitch between the feed holes) P0 and the pitch of the embossed portions 1C (the pitch between the embossed portions) P1, The tape width of the cover tape with respect to the carrier tape 1 is strictly defined.
[0009]
[Problems to be solved by the invention]
By the way, the carrier tape 1 sequentially attaches the guide groove 10B and the embossed portion 10C to the thermoplastic resin tape while adsorbing the preheated thermoplastic resin tape to a processing surface of a predetermined mold (not shown). It is made to be manufactured as it is formed.
[0010]
Here, the die is usually cut into a desired shape using a milling machine equipped with a milling machine (a machine having a cutting edge also at an end surface is called an end mill) which is a cylindrical rotary blade. Has been done.
[0011]
For example, as shown in FIGS. 13A to 13C, when a groove 2 G having a predetermined width and depth is formed in the processing surface 2 A of the mold 2 along the longitudinal direction, the processing surface 2 A of the While rotating the end mill 3 positioned at one end, the end mill 3 is moved in the direction of arrow a until it penetrates to the other end.
[0012]
In the process of manufacturing the carrier tape 1 by heating and suction using the mold 2 whose working surface has been cut by such a method, even if the shape of the convex portion on the outer peripheral portion of the mold 2 is a perfect right angle, The corners of the raised portions 1CA and 1CB of the embossed portion 1C of the carrier tape 1 later do not become a perfect right angle, but protruded portions (hereinafter referred to as R protruding portions) 1CAR and 1CBR curved to the corners. Was mostly formed (FIG. 14B described later).
[0013]
Therefore, as shown in FIG. 14 (A) corresponding to FIG. 12 (C) and FIG. 14 (B) which is an enlarged view thereof, when the electronic component ICs are sequentially stored in each embossed portion 1C of the carrier tape 1, Each of the electronic component ICs rides on the R protruding portions 1CAR, 1CBR formed at the corners of the raised bottom portions 1CA, 1CB in the corresponding embossed portion 1C, and as a result, the electronic component IC moves with respect to the bottom surface of the embossed portion 1C. In some cases, it may be inclined.
[0014]
In this state, the process proceeds to the next step, and when it is detected by an image recognition method whether or not the electronic component IC is stored in the carrier tape, it is strong depending on the degree of inclination of the electronic component IC (for example, even at 1.0 °). In some cases, reflected light is generated, and at this time, it may be extremely difficult to accurately recognize a number such as a number written on the surface, an outer shape, and the like from a captured image of the electronic component IC.
[0015]
The present invention has been made in consideration of the above points, and proposes a mold capable of stably storing electronic components in a tape-shaped component package, a method of manufacturing the same, and a device and a method of manufacturing the tape-shaped component package. What you are trying to do.
[0016]
[Means for Solving the Problems]
In order to solve this problem, the present invention provides a concave embossed portion 10C for accommodating an electronic component IC, and a convex raised portion 10CA located on the bottom surface of the embossed portion 10C for supporting the electronic component IC. In the mold 27 for forming the tape-shaped component package body 10 having the heat-adhesion, the convex portion 40C corresponding to the embossed portion 10C and the upper surface of the convex portion 40C corresponding to the raised portions 10CA, 10CB. The concave portions 40CA, 40CB are formed with an open portion (open portion above the 40CAT, 40CBT) shallower than the depth of the concave portion 40CA, 40CB on the outer peripheral side wall side of the convex portion 40C. It was to so.
[0017]
Further, the present invention has a concave embossed portion 10C for accommodating the electronic component IC, and a convex raised portion 10CA, 10CB located on the bottom surface of the embossed portion 10C for supporting the electronic component IC. In the method of manufacturing the mold 27 for forming the tape-shaped component package 10 by heat suction, the first step of forming the convex portion 40C corresponding to the embossed portion 10C, and the bottom raising portions 10CA and 10CB, A second step of forming the concave portions 40CA and 40CB on the upper surface of the convex portion 40C such that an open portion (opened portion above the 40CAT and 40CBT) is formed on the outer peripheral side wall side of the convex portion 40C; In this step, the open portion is formed shallower than the depths of the concave portions 40CA and 40CB.
[0018]
Further, the present invention has a concave embossed portion 10C for accommodating the electronic component IC, and a convex raised portion 10CA, 10CB located on the bottom surface of the embossed portion 10C and supporting the electronic component IC. In the manufacturing apparatus 50 of the mold 27 for forming the tape-shaped component package 10 by heat suction, the first processing means for forming the convex portion 40C corresponding to the embossed portion 10C and the bottom raising portions 10CA and 10CB are provided. A second processing means 54 for forming the concave portions 40CA, 40CB so that an open portion (open portion above the 40CAT, 40CBT) is formed on the outer peripheral side wall of the convex portion 40C on the upper surface of the convex portion 40C; Driving means for driving the first and second processing means 54, and moving means 52 and 53 for relatively moving the mold 27 and the first and second processing means 54 And a control unit 51 for controlling the driving means and the moving means 52, 53 provided in the second processing means 54, the open portion of the concave portion 40CA, and to form shallower than the depth of 40CB.
[0019]
Further, in the present invention, the thermoplastic resin tape 25 is attracted to the surface of the mold 27 after heating, so that a concave embossed portion 10C for accommodating the electronic component IC and a bottom surface of the embossed portion 10C are provided. In the manufacturing method for manufacturing the tape-shaped component packaging body 10 having the convex raised portions 10CA and 10CB for supporting the electronic component IC, the surface of the mold 27 has a projection corresponding to the embossed portion 10C. The recess 40CA, 40CB is formed on the upper surface of the protrusion 40C corresponding to the raised portion 10CA, 10CB, and the opening is shallower than the depth of the recess 40CA, 40CB on the outer peripheral side wall of the protrusion 40C. A portion (opened portion on the upper side of 40CAT, 40CBT) is formed. And so the air that has entered between 40CB is opened to the outside through the open portion.
[0020]
Further, in the present invention, the thermoplastic resin tape 25 is attracted to the surface of the mold 27 after heating, so that a concave embossed portion 10C for accommodating the electronic component IC and a bottom surface of the embossed portion 10C are provided. In the manufacturing apparatus 20 for manufacturing the tape-shaped component package 10 having the convex raised portions 10CA and 10CB for supporting the electronic component IC, the thermoplastic resin tape 25 is adsorbed on the surface of the mold 27. The suction means 26 is provided, and a convex portion 40C corresponding to the embossed portion 10C is formed on the surface of the mold 27, and concave portions 40CA, 40CB are formed on the upper surface of the convex portion 40C corresponding to the raised bottom portions 10CA, 10CB. Further, on the outer peripheral side wall side of the convex portion 40C, an open portion (the upper open portion of the 40CAT, 40CBT) shallower than the depth of the concave portion 40CA, 40CB is formed. Position) is formed, at the time of suction by the suction unit 26, and as the recess 40CA thermoplastic resin tape 25 and the mold 27, air that has entered between 40CB is opened to the outside through the open portion.
[0021]
As a result, the tape-shaped component package 10 obtained by heating and adsorbing the thermoplastic resin tape 25 to the mold 27 has the inner periphery of the embossed portion 10C at the end of each of the raised portions 10CA and 10CB of the embossed portion 10C. Notch grooves 10CAG and 10CBG can be formed between the side surface and the side surface, and when the electronic component IC is stored in the embossed portion 10C of the tape-shaped component package 10, the lower surface end of the electronic component IC is embossed. It is possible to avoid riding on the curved protruding portion formed at the corner between the inner peripheral side surface and the bottom surface of the 10C.
[0022]
In addition, when performing heat adsorption by the mold 27, air between the concave portions 40CA and 40CB of the mold 27 and the thermoplastic resin tape 25 passes through the upper open portions of the ridges 40CTA and 40CBT. As a result, the entire convex portion 40C including the concave portions 40CA and 40CB can be adsorbed to the thermoplastic resin tape 25 without any gap. As a result, the tape-shaped component package 10 in which the embossed portion 10C is formed with high accuracy can be obtained. Can be manufactured.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
[0024]
(1) Configuration of carrier tape 10 according to the present embodiment
1A to 1C show a carrier tape 10 according to the present embodiment. The carrier tape 10 is formed by subjecting a thermoplastic resin tape to heat molding. FIG. 1B is a cross-sectional view taken along arrow AA ′, and FIG. 1C is a cross-sectional view taken along arrow BB ′ with respect to FIG. .
[0025]
The carrier tape 10 has a guide groove portion 10B having a slight depth along the longitudinal direction (arrow a) on one surface 10A, and embossed portions 10C formed at regular intervals on the bottom surface of the guide groove portion 10B. I have.
[0026]
At a predetermined position on the bottom surface of the embossed portion 10C, two stepped portions (hereinafter referred to as bottom raised portions) 10CA and 10CB having predetermined widths and heights are formed so as to protrude in parallel in the direction of the arrow b. As shown in FIG. 2 (A), when the electronic component IC is stored in the embossed portion 10C, the raised bottom portion as shown in FIG. 2 (B) showing a section taken along arrow AA ′. By contacting the lower surfaces of the electronic component IC without the 10CA and 10CB contacting the respective electrodes BP of the electronic component IC, it is possible to prevent the electrodes BP of the electronic component IC from being damaged by contact. Has been done.
[0027]
In the case of the present embodiment, both ends of each raised portion 10CA, 10CB of the embossed portion 10C of the carrier tape 10 are provided with a groove having a predetermined depth and size between the inner peripheral side surface of the embossed portion 10C (hereinafter, referred to as a groove). Are referred to as notched grooves) 10CAG, 10CBG are respectively formed, and among the R-shaped portions (not shown) formed between the inner peripheral side surface and the bottom surface of the embossed portion 10C, both ends of each raised portion 10CA, 10CB are provided at both ends. The formation of the R-shaped portion by the amount of the formation of the notch grooves 10CAG and 10CBG is avoided in advance.
[0028]
Further, at one end of the carrier tape 10 in the width direction (arrow b), perforations 10D are formed at a predetermined pitch, and thus the carrier tape 10 is meandered with the perforation 10D as a reference and the guide groove 10B as a guide. The vehicle can be sequentially driven at a predetermined pitch in the longitudinal direction without the need.
[0029]
Further, a cover tape (not shown) corresponding to the carrier tape 10 is adhered to one surface 10A side of the carrier tape 10 so as to cover each embossed portion 10C along the direction of the arrow a. The electronic component IC housed in the portion 10C can be held in a predetermined state by the inner wall surface of the embossed portion 10C and the cover tape.
[0030]
In the case of this embodiment, a portion of the carrier tape 10 between the adjacent embossed portions 10C (hereinafter, this portion is referred to as a rib portion 10E) is provided with a concave portion having a predetermined shape and size (hereinafter, referred to as a guard portion). 10G is formed at substantially the same depth as the bottom surface of the embossed portion 10C, and when the carrier tape 10 is wound around a take-up reel (not shown), the embossed portions 10C fit together. Has been made so that it can be avoided.
[0031]
The guard portion 10G is shaped and shaped such that the width in the direction of arrow a is shorter than the width of the embossed portion 10C in the direction of arrow a and the width in the direction of arrow b is longer than the width of the embossed portion 10C in the direction of arrow b. The size is set in advance so as to avoid being fitted not only between the embossed portions 10C but also between the guard portions 10G and between the embossed portions 10C and the guard portions 10G.
[0032]
(2) Configuration of carrier tape manufacturing apparatus 20
Next, the configuration of the carrier tape manufacturing apparatus 20 (FIG. 3) for manufacturing the carrier tape 10 will be described.
[0033]
As shown in FIG. 3, the carrier tape manufacturing apparatus 20 according to the present embodiment includes a preheating unit 21, a molding unit 22, and a cutting and punching unit 23. In the carrier tape manufacturing apparatus 20, the thermoplastic resin tape 25 is sequentially pulled out from the tape supply drum 24 at a constant speed, preheated in a preheating unit 21, and then supplied to a forming unit 22.
[0034]
The forming section 22 includes a cylindrical negative pressure supply section 26 including a vacuum pump and the like, and a donut-shaped male mold rotatably fitted into the negative pressure supply section 26 via a vacuum seal (not shown). It has a mold 27 and a drive mechanism (not shown) for rotating the mold 27 at a speed corresponding to the traveling speed of the thermoplastic resin tape 25.
[0035]
The forming section 22 adsorbs the preheated thermoplastic resin tape 25 supplied from the preheating section 21 to the outer peripheral surface 27A of the mold 27 by the negative pressure applied to the mold 27 from the negative pressure supply section 26. As a result, the guide groove portion 10B, the embossed portion 10C, the guard portion 10G, and the rib portion 10E of the carrier tape 10 (FIG. 1) are sequentially formed on the thermoplastic resin tape 25.
[0036]
Further, the thermoplastic resin tape 25 on which the embossed portions 10C and the rib portions 10E and the like are formed is thereafter sent out to the cut and pierced portion 23, cut into a predetermined width in the cut and pierced portion 23, and the carrier A feed hole 10D of the tape 10 is formed. As a result, the carrier tape 10 is formed. Thereafter, the carrier tape 10 is sent out to a tape winding unit (not shown) and wound on the take-up reel 28.
[0037]
In this manner, the carrier tape manufacturing apparatus 20 can manufacture the carrier tape 10 shown in FIG.
[0038]
Here, FIG. 4 shows a specific configuration of the mold 27 of the molding section 22. As is clear from FIG. 4, the mold 27 is configured by integrally combining the first to fifth mold components 30 to 34 in a predetermined positional relationship with the matching hole 35 as a reference.
[0039]
At this time, as shown in FIG. 5, the third mold component 32 includes a guide groove 10B of the carrier tape 10, a projection 40 having a shape corresponding to the embossed portion 10C, the rib 10E, and the guard 10G. A portion corresponding to the guard portion 10G of the carrier tape 10 (having an outer shape obtained by inverting the inner shape of the guard portion 10G and forming a guard portion of the guard portion 10G). A portion formed at the same pitch as the interval pitch. This portion is hereinafter referred to as a guard forming convex portion 40G) is slightly spaced from the outer peripheral surfaces of the second and fourth mold components 31 and 33 via a gap. It is formed so as to protrude.
[0040]
Further, portions corresponding to the embossed portions 10C of the carrier tape 10 (portions having an outer shape obtained by inverting the inner shape of the embossed portions 10C and formed at the same pitch as the pitch between the embossed portions of the embossed portions 10C. The portions corresponding to the two raised portions 10CA and 10CB (hereinafter referred to as the raised portions 40CA and 40CB) are formed in a groove shape, and the respective raised portions are referred to as embossed protrusions 40C. At both ends of 40CA and 40CB, portions (hereinafter, referred to as ridges) 40CAT and 40CBT corresponding to the notch grooves 10CAG and 10CBG are formed to protrude.
[0041]
In addition, the bonding surfaces of the second and fourth mold components 31 and 33 with the third mold component 32 are provided on the outer peripheral surface side of the second or fourth mold components 31 and 33, respectively. A plurality of first groove portions 31A, 33A having a predetermined shape to be opened are formed at a predetermined pitch, and the first groove portions 31A, 33A and the negative pressure supply portion 26 correspond to the first groove portions 31A, 33A, respectively. (FIG. 3) A plurality of second grooves 31B and 33B are formed to communicate between them.
[0042]
Further, a small suction hole 32A having a diameter of, for example, 0.15 [mm] or less is formed between the two raised bottom concave portions 40CA and 40CB in the embossed convex portion 40C of the third mold component 32. In addition, a through-hole 32B is formed corresponding to the suction hole 32A so as to communicate with the corresponding first groove 31A, 33A of the second and fourth mold components 31, 33.
[0043]
Further, the outer peripheral portion of the third mold component portion 32 corresponds to each of the rib portions 10E of the carrier tape 10 among the above-mentioned convex portions 40 formed on the outer peripheral surface of the third mold component portion 32. (A portion formed between the emboss-forming protrusions 40C adjacent to the protrusion 40 and having an external shape inverted from the surface shape of the rib 10E. Hereinafter, this portion is referred to as a rib-forming protrusion 40E). ), Two minute suction holes 32C having a diameter of, for example, 0.15 [mm] or less are formed so as to be located on the center in the width direction (arrow a) of each rib-forming projection 40E. . This suction hole 32C also communicates with the above-described through hole 32B.
[0044]
Thus, in the forming section 22 (FIG. 3), when the preheated thermoplastic resin tape 25 supplied from the preheating section 21 is adsorbed on the outer peripheral surface 27A of the mold 27, the negative pressure supply section 26 is used. And the negative pressure applied to each of the first grooves 31A and 33A via the second grooves 31B and 33B of the second and fourth mold components 31 and 33, and the pressure of the third mold component 32 Based on the negative pressure applied to each of the suction holes 32A and 32C through each of the through holes 32B, the suction can be sequentially performed on the outer peripheral surface 27A of the mold 27 (FIG. 2). The thermoplastic resin tape 25 can be formed into a shape corresponding to the external shape of the projection 40 in the third mold component 32.
[0045]
In addition, since the diameters of the suction holes 32A and 32C are set to 0.15 [mm] or less in the forming portion 22, unnecessary protrusions are formed at corresponding portions of the manufactured carrier tape 10. It can be suppressed as much as possible. Thus, for example, even when electronic components ICs are sequentially stored in the respective embossed portions 10C of the carrier tape 10 and a cover tape is pasted on the carrier tape 10 in a subsequent step, the presence of such unnecessary projections also occurs. As a result, it is possible to effectively and effectively suppress the occurrence of a gap between the carrier tape 10 and the cover tape.
[0046]
As described above, in the forming section 22 of the carrier tape manufacturing apparatus 20, the pre-heated thermoplastic resin tape 25 supplied from the pre-heating section 21 is formed based on the negative pressure applied to the mold 27 from the negative pressure supplying section 26. Thus, the carrier tape 10 is formed with high precision so as to be adsorbed on the outer peripheral surface 27A of the mold 27.
[0047]
(3) Configuration of die processing equipment
Here, FIG. 6 shows a mold processing device 50 that performs cutting by a milling machine, and a control device 51 that controls the entire device is disposed inside a gantry (not shown).
[0048]
A table 52 is arranged on the gantry so as to be movable in the X-axis direction (arrow x direction) and the Y-axis direction (arrow y direction) based on a propulsive force applied from a table driving mechanism (not shown). The metal mold 27 to be processed is fixedly held on the table 52 and can be freely conveyed on the gantry in the X-axis direction and the Y-axis direction.
[0049]
A movable body 53 is mounted on the gantry so as to be movable along the Z-axis direction (arrow z direction), and an end mill 54 is attached to the movable body 53 so as to protrude from below the center thereof in a direction parallel to the Z-axis direction. It is inserted rotatably around the axis K1.
[0050]
The end mill 54 is connected to an actuator (not shown), and is configured to be able to rotate according to the drive of the actuator under the control of the control device 51.
[0051]
Thus, in the mold processing apparatus 50, the control device 51 drives the movable body 53, the table 52, and the actuator at a predetermined timing based on numerical control corresponding to each of the positions, so that the processing surface of the mold 27 (ie, The outer peripheral surface 27A can be cut into a desired shape.
[0052]
In the present embodiment, when using the mold processing device 50 to form the respective raised bottom concave portions 40CA and 40CB with respect to the embossed convex portions 40C formed on the processing surface 27A of the die 27, first, the table 52 is placed on the table 52. The fixedly held mold 27 is moved in the X-axis direction and the Y-axis direction, and positioned at the cutting start position on the processing surface 27A of the mold 27 with respect to the end mill 54.
[0053]
At this time, as shown in FIGS. 7A to 7C, the end mill 54 is located at a position slightly protruding outward from one end of the processing surface 27A of the mold 27 (hereinafter, this position is referred to as a cutting start position). The table 52 is positioned as described above.
[0054]
Subsequently, the end mill 54 is moved downward in the Z-axis direction while being rotationally driven to start cutting the processing surface 27A of the mold 27 from the cutting start position. When the end surface 54 reaches a predetermined depth position, the table 52 remains in this state. Is slid in the X-axis direction to form one groove in the processing surface 27A of the mold 27, and the end mill 54 slightly protrudes outward from the other end of the processing surface 27A (hereinafter, this position is cut). When reaching the end position, the driving of the table 52 is stopped.
[0055]
After the end mill 54 is moved upward in the Z direction, the end mill 54 is replaced with an end mill (not shown) having a slightly larger diameter than the current end mill 54, and the processing surface of the mold 27 is formed using the new end mill. 27A is again cut from the same cutting start position to the cutting end position as described above at a position slightly shallower than the above-described groove, so that the processing surface 27A of the mold 27 has a bottom-up forming recess as shown in FIG. 40CA (40CB) is formed.
[0056]
Actually, as shown by the arrow AA 'in the cross section of the embossed projection 40C shown in FIG. 8A, the raised bottom recess 40CA (40CB) corresponds to the notch grooves 10CAG, 10CBG at both ends. The ridge portion 40CAT (40CBT) is formed so as to protrude (FIG. 8B).
[0057]
Therefore, when the carrier tape 10 is manufactured by using the mold 27 (FIG. 8A) having the embossed projections 40C in the above-described carrier tape manufacturing apparatus 20 shown in FIG. 3, the carrier tape 10 includes: An embossed portion 10C having an external shape obtained by inverting the embossed convex portion 40C of the mold is formed, and a raised portion 10CA, 10CB having an external shape obtained by inverting each of the raised concave portions 40CA, 40CB is further formed. Notched grooves 10CAG, 10CBG each having an external shape obtained by inverting the ridges 40CAT, 40CBT are formed at both ends of each of the bottom raised portions 10CA, 10CB, respectively.
[0058]
(4) Operation and effect of this embodiment
In the above-described configuration, in the mold 27 of the present embodiment, after forming the emboss forming protrusions 40C in advance, two molds are formed on the emboss forming protrusions 40C by using the mold processing device 50 on which the end mill 54 is mounted. Are formed. At this time, protrusions 40CAT and 40CBT corresponding to the cutting start position and the cutting end position of the end mill 54 are formed at both ends of the raised bottom concave portions 40CA and 40CB formed on the processing surface 27A of the mold 27, respectively.
[0059]
Then, in the carrier tape manufacturing apparatus 20, the thermoplastic resin tape 25 is heated to be adsorbed on the outer peripheral surface 27A of the mold 27 based on the negative pressure applied to the mold 27 from the negative pressure supply unit 26 after heating. The carrier tape 10 in which the embossed protrusions 40C and the like formed on the mold 27 are formed at a predetermined pitch is manufactured.
[0060]
Here, during the cutting of the mold 27, the cutting start position and the cutting end position of the end mill 54 are located at positions slightly protruding outward from both ends of the processing surface 27A of the die 27, and are positions not protruding at all from the both ends. As compared with the case of the above, both side surfaces of the processing surface 27A are slightly cut.
[0061]
Therefore, when a negative pressure is applied to the mold 27 from the negative pressure supply unit 26, even when the thermoplastic resin tape 25 is attracted to the outer peripheral surface 27A of the mold 27, the thermoplastic resin tape 25 and the bottom-up forming recess 40CA , 40CB, the small embossed portion of the ridges 40CTA, 40CBT can be opened as an open portion, so that the entire embossed projection 40C can be adsorbed to the thermoplastic resin tape 25 without any gap, As a result, it is possible to manufacture the carrier tape 10 in which the embossed portion 10C is formed with high accuracy.
[0062]
In addition to this, at the time of cutting the mold 27, after forming the raised bottom concave portions 40CA and 40CB with the end mill 54, the end mill 54 is further replaced with an end mill (not shown) having a slightly larger diameter than the end mill 54, and By using a new end mill, the processing surface 27A of the mold 27 is again cut from the same cutting start position to the cutting end position as described above at a position slightly shallower than the above-described groove, thereby processing the mold 27. The shape of the slightly cut portion above the ridges 40CTA and 40CBT on both end side surfaces of the surface 27A can be formed more smoothly, and the entire embossed projection 40C can be formed on the thermoplastic resin tape 25 without any gap by that much. The carrier tape 10 having the embossed portions 10C formed with higher accuracy can be manufactured.
[0063]
In this manner, in the carrier tape 10, the notched grooves 10CAG and 10CBG can be formed at both ends of the raised bottom portions 10CA and 10CB of the embossed portion 10C between the inner peripheral side surfaces of the embossed portion 10C.
[0064]
Therefore, in the carrier tape 10, the notch grooves 10CAG and 10CBG were positively formed at both ends of the raised portions 10CA and 10CB in the R-shaped portion formed between the inner peripheral side surface and the bottom surface of the embossed portion 10C. The R-shaped portion can be removed by an amount.
[0065]
As a result, when the electronic component IC is stored in the embossed portion 10C of the carrier tape 10, the lower end of the electronic component IC rides on the R-shaped portion formed between the inner peripheral side surface and the bottom surface of the embossed portion 10C. Can be avoided.
[0066]
Further, in the next step of detecting whether or not the electronic component IC is stored in the carrier tape 10 by image recognition, it is necessary to prevent the occurrence of reflected light that may cause an error in image recognition depending on the degree of inclination of the electronic component IC. Can be prevented.
[0067]
According to the above-described configuration, the ridges 40CAT and 40CBT are formed on the mold 27 having the embossed protrusions 40C formed on the outer peripheral surface 27A in accordance with the cutting start position and the cutting end position of the end mill 54, respectively. The carrier tape 10 manufactured by using the mold 27 by cutting each of the raised bottom concave portions 40CA and 40CB into the embossed portions 10CA and 10CB of the embossed portion 10C. Notch grooves 10CAG and 10CBG can be formed between the peripheral side surface and the R-shaped portions formed between the inner peripheral side surface and the bottom surface of the embossed portion 10C. The R-shaped portion can be removed as much as the notch grooves 10CAG and 10CBG are formed positively, and thus the carrier tape In 0 of the embossed portion 10C can be stored in a stable state without tilting the electronic component IC.
[0068]
(5) Other embodiments
In the above-described embodiment, the present invention has been described in connection with the case where the carrier tape (tape-like component package) 10 is manufactured using the carrier tape manufacturing apparatus 20 as shown in FIG. The present invention is not limited to this, and can be widely applied to various other types of carrier tape manufacturing apparatuses. In this case, the negative pressure supply unit (adsorption means) 26 for adsorbing the thermoplastic resin tape 25 to the surface of the mold 27 may have various configurations.
[0069]
Further, in the above-described embodiment, a case has been described in which the present invention is applied to the carrier tape (tape-like component package) 10 for wrapping electronic component ICs. The present invention can be widely applied to a carrier tape for packaging components other than ICs.
[0070]
For example, in FIG. 9 corresponding to FIG. 1, the carrier tape 60 has the same configuration as the carrier tape 10 shown in FIG. 1 except that the configurations of the raised portions 60CA and 60CB of the embossed portion 60C are different. In FIG. 9, the same alphabet is described except for the raised portions 60CA and 60CB so as to correspond to FIG.
[0071]
Each of the raised portions 60CA and 60CB of the embossed portion 60C of the carrier tape 60 has a T-shaped step shape unlike the carrier tape 10 shown in FIG. Three cutout grooves (six in total) are formed.
[0072]
In addition, for example, in FIG. 10 corresponding to FIG. 1, the carrier tape 70 has the same configuration as that of the carrier tape 10 shown in FIG. 1 except that the configurations of the raised portions 70CA and 70CB of the embossed portion 70C are different. In FIG. 10, the same alphabet is described except for the raised portions 70CA and 70CB so as to correspond to FIG.
[0073]
Each of the raised portions 60CA and 60CB of the embossed portion 60C of the carrier tape 60 has six hemispherical steps over the entire bottom surface of the embossed portion 60C, unlike the carrier tape 10 shown in FIG. Six notch grooves are formed with the inner peripheral side surface of the portion 60C, respectively.
[0074]
Further, in the above-described embodiment, a concave embossed portion 10C for accommodating the electronic component IC, and a convex bottom raised portion 10CA, 10CB located on the bottom surface of the embossed portion 10C for supporting the electronic component IC. As shown in FIGS. 8A and 8B, an embossed projection corresponding to the embossed portion 10C of the mold 27 for forming the carrier tape (tape-shaped component package) 10 having the following components by heat suction. (Convex portions) 40C, and raised bottom concave portions (recessed portions) 40CA and 40CB formed on the upper surface of the embossed convex portions (convex portions) 40C corresponding to the raised bottom portions 10CA and 10CB. ) 40CA, 40CB are open on the outer peripheral side wall of the embossed projections (projections) 40C, and shallower than the depths of the raised bottom recesses (recesses) 40CA, 40CB. In this case, the present invention is not limited to this, and the point is that the electronic component is formed in the embossed portion 10C of the tape-shaped component package 10. If the lower end of the electronic component IC can be prevented from riding on the curved protruding portion formed at the corner between the inner peripheral side surface and the bottom surface of the embossed portion 10C when the electronic component IC is stored, various other types are possible. The present invention may be widely applied to a mold having the above configuration.
[0075]
Further, in the above-described embodiment, a mold processing apparatus 50 having a configuration as shown in FIG. 6 is applied as a manufacturing apparatus of the mold 27 for forming the carrier tape (tape-shaped component package) 10 by heat suction. However, the present invention is not limited to this, and various other configurations may be widely applied as long as the above-described mold can be manufactured.
[0076]
In the case of the present embodiment, in the mold processing apparatus 50 of FIG. 6, the outer periphery of the convex portion 40C is provided on the upper surface of the embossed convex portion (convex portion) 40C in correspondence with the raised portions 10CA and 10CB of the carrier tape 10. An end mill 54 is applied as second processing means for forming the raised recesses (recesses) 40CA and 40CB so that an open portion is formed on the side wall side, and an actuator (not shown) is used as a driving means for driving the end mill 54. The table 52 and the moving body 53 are applied as moving means for relatively moving the mold 27 and the end mill 54, and further, the actuator (driving means) and the table 52 and the moving body 53 (moving means) are controlled. As the control means, the control device 51 is applied.
[0077]
This mold processing apparatus 50 does not describe the configuration of the first processing means for forming the embossed projections (convex portions) 40C corresponding to the embossed portions 10C of the carrier tape 10; Instead of this, a new milling cutter for forming the embossed projection (convex section) 40C was newly attached, and the milling cutter was applied as the first processing means.
[0078]
Further, in the above-described embodiment, the raised raised concave portions (recessed portions) 40CA, 40CB formed on the upper surface of the embossed convex portions (convex portions) 40C corresponding to the raised raised portions 10CA, 10CB are overlapped. (Recess) The second recess (not shown) wider than the width of the recesses 40CA, 40CB and shallower than the depth of the raised recesses (recesses) 40CA, 40CB has been described. However, the present invention is not limited thereto, and the second concave portion may have various shapes as long as the adsorption between the thermoplastic resin tape 25 and the mold 27 can be improved.
[0079]
【The invention's effect】
As described above, according to the present invention, a tape-shaped component having a concave embossed portion for accommodating an electronic component, and a convex raised portion positioned on the bottom surface of the embossed portion for supporting the electronic component In a mold for forming a package by heat adsorption, a convex portion corresponding to the embossed portion and a concave portion formed on the upper surface of the convex portion corresponding to the raised portion are provided, and the concave portion is an outer peripheral side wall of the convex portion. By forming an open portion shallower than the depth of the concave portion on the side, when the electronic component is stored in the embossed portion of the tape-shaped component package, the lower surface end of the electronic component becomes the inner periphery of the embossed portion. It is possible to avoid riding on the curved protruding portion formed at the corner between the side surface and the bottom surface, and thus realize a mold capable of stably storing electronic components in the tape-like component package.
[0080]
Further, according to the present invention, a tape-shaped component package having a concave embossed portion for housing an electronic component and a convex raised portion for supporting the electronic component located on the bottom surface of the embossed portion is provided. In a method for manufacturing a mold for forming by heat adsorption, a first step of forming a convex portion corresponding to an embossed portion, and an outer peripheral side wall of the convex portion on an upper surface of the convex portion corresponding to a raised portion. A second step of forming a concave portion so that an open portion is formed, and in the second step, the open portion is formed shallower than the depth of the concave portion, thereby embossing the tape-shaped component package. When the electronic component is stored in the part, it is possible to prevent the lower end of the electronic component from riding on the curved protruding portion formed at the corner between the inner peripheral side surface and the bottom surface of the embossed portion. Good for parts packaging It can be realized a method of manufacturing a mold capable of housing electronic components and.
[0081]
Further, according to the present invention, there is provided a tape-shaped component package having a concave embossed portion for accommodating an electronic component and a convex raised portion for supporting the electronic component located on the bottom surface of the embossed portion. In a mold manufacturing apparatus for forming by heat adsorption, a first processing means for forming a convex portion corresponding to an embossed portion, and an outer peripheral side wall of the convex portion on an upper surface of the convex portion corresponding to a raised bottom portion. Second processing means for forming a concave portion so that an open portion is formed in the mold, driving means for driving the first and second processing means, and a mold and the first and second processing means are relatively positioned. And a control means for controlling the driving means and the moving means, and in the second processing means, the open portion is formed to be shallower than the depth of the concave portion, so that the tape-shaped component package is formed. Electronic components inside the embossed part In this case, it is possible to prevent the lower end of the electronic component from riding on the curved protruding portion formed at the corner between the inner peripheral side surface and the bottom surface of the embossed portion, thus stabilizing the tape-shaped component package. Thus, a die manufacturing apparatus capable of storing electronic components can be realized.
[0082]
Furthermore, according to the present invention, a concave embossed portion for accommodating an electronic component and an electronic component located on the bottom surface of the embossed portion are arranged so that the thermoplastic resin tape is adsorbed to the surface of the mold after heating. In a manufacturing method for manufacturing a tape-shaped component package having a convex-shaped raised portion for supporting, a convex portion corresponding to an embossed portion is formed on a surface of a mold, and the convex-shaped portion corresponds to the raised portion. As a result, a concave portion is formed on the upper surface of the convex portion, and an open portion shallower than the depth of the concave portion is formed on the outer peripheral side wall side of the convex portion, and at the time of suction, air that has entered between the concave portion of the thermoplastic resin tape and the mold is By opening to the outside through the open portion, when the electronic component is stored in the embossed portion of the tape-shaped component package, the lower end of the electronic component is located between the inner peripheral side surface and the bottom surface of the embossed portion. Corner Can avoid the ride the curved protruded portion is formed, thus possible to realize a manufacturing method of the tape-shaped parts package, you can hold the electronic part stably in a tape-like part package.
[0083]
Further, in the present invention, a concave embossed portion for accommodating the electronic component IC and an electronic component located on the bottom surface of the embossed portion are arranged so that the thermoplastic resin tape is adsorbed to the surface of the mold after heating. In a manufacturing apparatus for manufacturing a tape-shaped component package having a raised bottom with a convex shape for supporting, a suction means for suctioning a thermoplastic resin tape to the surface of a mold is provided, and the surface of the mold is provided with: A convex portion corresponding to the embossed portion is formed, a concave portion is formed on the upper surface of the convex portion corresponding to the raised portion, and an open portion shallower than the depth of the concave portion is formed on the outer peripheral side wall of the convex portion. The air that has entered between the recesses of the thermoplastic resin tape and the mold at the time of adsorption by the means is released to the outside through the open portion, so that the electronic components are contained in the embossed portion of the tape-shaped component package. When a product is stored, the lower end of the electronic component can be prevented from riding on a curved protruding portion formed at the corner between the inner peripheral side surface and the bottom surface of the embossed portion, and thus the tape-like component package A device for manufacturing a tape-shaped component package that can stably store electronic components can be realized.
[Brief description of the drawings]
FIG. 1 is a front view, an AA ′ sectional view, and a BB ′ sectional view showing a configuration of a carrier tape according to the present embodiment.
FIG. 2 is a top view and a cross-sectional view showing a detailed configuration of an embossed portion of the carrier tape shown in FIG.
FIG. 3 is a schematic diagram illustrating a schematic configuration of a carrier tape manufacturing apparatus according to the present embodiment.
FIG. 4 is a cross-sectional view and a side view showing a specific configuration of a mold according to the present embodiment.
5A and 5B are a front view and a sectional view taken along the line AA 'showing a specific configuration of a mold according to the present embodiment.
FIG. 6 is a schematic diagram illustrating a schematic configuration of a mold processing apparatus according to the present embodiment.
FIG. 7 is a schematic diagram for explaining a cutting step according to the present embodiment;
FIG. 8 is a partial top view and a cross-sectional view for explaining a mold after manufacturing according to the present embodiment.
FIG. 9 is a front view, an AA ′ cross-sectional view, and a BB ′ cross-sectional view showing a configuration of a carrier tape according to another embodiment.
FIG. 10 is a front view, an AA ′ cross-sectional view, and a BB ′ cross-sectional view showing a configuration of a carrier tape according to another embodiment.
FIG. 11 is a front view, an AA ′ cross-sectional view, and a BB ′ cross-sectional view showing the configuration of a conventional carrier tape.
12 is a top view and a sectional view showing a detailed configuration of an embossed portion of the conventional carrier tape shown in FIG.
FIG. 13 is a schematic diagram for explaining a conventional cutting process.
FIG. 14 is a partial cross-sectional view for explaining a riding state of the electronic component.
[Explanation of symbols]
10, 60, 70 carrier tape, 10C embossed portion, 10CA, 10CB bottom raised portion, 10CAG, 10CBG notch groove, 10E rib portion, 10G guard portion, 20 carrier tape Manufacturing apparatus, 21: preheating section, 22: forming section, 25: thermoplastic resin tape, 26: negative pressure supply section, 27: mold, 27A: outer peripheral surface, 30 to 34 Mold forming part, 31A, 33A... First groove, 31B, 33B... Second groove, 40C... Emboss forming convex part, 40CA, 40CB... Bottom raised forming concave part, 40CAT, 40CBT. 50, mold processing device, 51, control device, 52, table, 53, movable body, 54, end mill.

Claims

To form a tape-like component package having a concave embossed portion for accommodating an electronic component and a convex-shaped raised portion located on the bottom surface of the embossed portion for supporting the electronic component by heat suction. In the mold of
A convex portion corresponding to the embossed portion;
Corresponding to the raised portion, comprising a concave portion formed on the upper surface of the convex portion,
The recess is
A mold characterized in that an opening portion shallower than the depth of the concave portion is formed on the outer peripheral side wall side of the convex portion.

A second concave portion, which is wider than the concave portion and shallower than the concave portion, is formed so as to overlap with the concave portion formed on the upper surface of the convex portion in correspondence with the raised portion. Item 2. The mold according to Item 1.

To form a tape-like component package having a concave embossed portion for accommodating an electronic component and a convex-shaped raised portion located on the bottom surface of the embossed portion for supporting the electronic component by heat suction. In the method of manufacturing a mold,
A first step of forming a convex portion corresponding to the embossed portion;
A second step of forming a concave portion corresponding to the raised portion so that an open portion is formed on the upper surface of the convex portion on the outer peripheral side wall side of the convex portion,
In the second step, the open part is formed shallower than the depth of the concave part.

A third step of forming a second concave portion, which is wider than the concave portion and shallower than the concave portion, is superimposed on the concave portion formed on the upper surface of the convex portion corresponding to the raised bottom portion. The method for manufacturing a mold according to claim 3, wherein:

To form a tape-like component package having a concave embossed portion for accommodating an electronic component and a convex-shaped raised portion located on the bottom surface of the embossed portion for supporting the electronic component by heat suction. Mold manufacturing equipment,
First processing means for forming a convex portion corresponding to the embossed portion;
Second processing means for forming a concave portion on the upper surface of the convex portion so as to form an open portion on the outer peripheral side wall of the convex portion corresponding to the raised portion;
Driving means for driving the first and second processing means;
Moving means for relatively moving the mold and the first and second processing means;
Control means for controlling the driving means and the moving means,
In the second processing means, the open portion is formed to be shallower than the depth of the concave portion.

The second processing means is an end mill having a diameter equal to a width of the concave portion,
The control unit controls the driving unit and the moving unit to position the end of the end mill at a start position slightly protruding outward from one end of the upper surface of the convex portion, and then while rotating the end mill, Starting cutting from the start position, while maintaining the depth position of the concave portion, moving the mold and the end mill relatively to form the concave portion on the upper surface of the convex portion, The die manufacturing apparatus according to claim 5, wherein the die is positioned at an end position slightly protruding outward from the other end of the upper surface of the projection.

A third processing means for forming a second concave portion which is wider than the width of the concave portion and shallower than the depth of the concave portion so as to overlap with the concave portion formed on the upper surface of the convex portion corresponding to the raised bottom portion. ,
The mold manufacturing apparatus according to claim 5, wherein the driving means drives the third processing means.

A concave embossed portion for accommodating an electronic component, and a convex shape for supporting the electronic component located on the bottom surface of the embossed portion so that the thermoplastic resin tape is adsorbed to the surface of the mold after heating. In the manufacturing method for manufacturing a tape-shaped component package having a bottom raised portion,
On the surface of the mold, a convex portion corresponding to the embossed portion is formed, a concave portion is formed on the upper surface of the convex portion corresponding to the raised bottom portion, and the concave portion is formed on the outer peripheral side wall side of the convex portion. An open part shallower than the depth of the recess is formed,
A method for producing a tape-like component package, wherein air that has entered between the thermoplastic resin tape and the concave portion of the mold is released to the outside through the open portion during the suction.

On the surface of the mold, a second concave portion that is wider than the concave portion and shallower than the concave portion is formed so as to overlap with the concave portion formed on the upper surface of the convex portion corresponding to the raised bottom portion. The method for manufacturing a tape-like component package according to claim 8, wherein

A concave embossed portion for accommodating an electronic component, and a convex shape for supporting the electronic component located on the bottom surface of the embossed portion so that the thermoplastic resin tape is adsorbed to the surface of the mold after heating. A manufacturing apparatus for manufacturing a tape-shaped component package having a bottom raised portion,
Equipped with an adsorption means for adsorbing the thermoplastic resin tape to the surface of the mold,
On the surface of the mold, a convex portion corresponding to the embossed portion is formed, a concave portion is formed on the upper surface of the convex portion corresponding to the raised bottom portion, and the concave portion is formed on the outer peripheral side wall side of the convex portion. An open part shallower than the depth of the recess is formed,
At the time of suction by the suction means, the air having entered between the concave portion of the thermoplastic resin tape and the mold is opened to the outside through the open portion. manufacturing device.

On the surface of the mold, a second concave portion that is wider than the concave portion and shallower than the concave portion is formed so as to overlap with the concave portion formed on the upper surface of the convex portion corresponding to the raised bottom portion. The apparatus for manufacturing a tape-shaped component package according to claim 10, wherein: