JPH07245497A - Device for supplying and sealing electronic component - Google Patents

Abstract

PURPOSE:To surely separate top tape and embossed tape and stably take out an electronic component. CONSTITUTION:A separator 37 is arranged so as to face the direction wherein carrier tape 1 is proceeding, the carrier tape 1 from a component reel 32 is separated into top tape 3 and embossed tape 2 and reels 38 and 39 are provided so as to take up each tape. A guiding and pressing roller 36 provided prior to the carrier tape separator is permitted to rotate each reel in the direction reverse to the electronic component supplying direction, and after storing the electronic component in the embossed tape 2, the top tape 3 and the embossed tape 2 are fitted by the guiding and pressing roller 36 and are taken up by the component reel 32. Thus, the carrier tape is surely separated into the top tape and the embossed tape at the position and the electronic component is stably supplied, and the carrier tape can be used again.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention takes out an electronic component such as an IC or a variable capacitor sealed in a carrier tape composed of an embossed tape having a plurality of cavities and a top tape from the carrier tape for printing. A device for supplying electronic components to be mounted on a wiring board, etc. Also, a plurality of electronic components can be housed in the carrier tape by using the device for supplying electronic components, and the electronic components can be sealed. It relates to the device.

[0002]

2. Description of the Related Art First, a conventional carrier tape and electronic component supplying apparatus will be described with reference to FIGS. 2 shows a carrier tape in use, FIG. A is a perspective view thereof, FIG. B is a sectional view taken along line AA of FIG. A, and FIG. 3 shows a conventional electronic component supply apparatus. It is a conceptual side view.

As shown in FIG. 2, one of the storage forms of electronic parts currently in use is a long embossed tape 2.
A carrier tape 1 including a top tape 3 and a top tape 3 is used. That is, a plurality of cavities 4 capable of accommodating the electronic components P are formed at predetermined intervals on one embossed tape 2 that constitutes the carrier tape 1.
Then, one flange portion 5 of the embossing tape 2 is along its side edge, and the other flange portion 6 is continuous between the series of sprocket holes 8 and the series of cavities 4 over their entire length, and to each other. Parallel fitting grooves 7 are formed.

On the other hand, the top tape 3 is a thin film tape and has a width that can sufficiently cover the cavity 4, but does not cover the sprocket hole 8, and its both side edges 9, The ridges 10 are formed along the side edges of the ridges 10, and are continuous over the entire length of the ridges 10 and are parallel to each other and can be fitted into the fitting grooves 7.

A plurality of electronic components P can be housed and enclosed in the carrier tape 1 having such a structure. That is, the individual electronic parts P are housed in the respective cavities 4 of the embossed tape 2, and the top tape 3 is attached to the ridges 1 thereof.
1 can be pressed so that the embossed tape 2 fits into the fitting groove 7 of the embossed tape 2 and sealed.

The carrier tape described above is formed of a plastic film material such as polyvinyl chloride, polypropylene, polyethylene glycol terephthalate,
It has enough flexibility to be wound on a reel. An example of a carrier tape having such a structure is disclosed in JP-A-63-16
5260, Showa 63-194162 and Showa 4-2
It is disclosed in the publication of 7765.

Next, a conventional electronic component supply apparatus for supplying the electronic component P enclosed in the carrier tape 1 to a printed wiring board or the like will be described with reference to FIG. The electronic component supply device 20 shown in FIG.
Is installed, and on the upper right thereof, a component reel 22 in which a carrier tape 1 containing an electronic component P is wound with its top tape 3 facing outward is rotatably supported. A guide roller 23 is arranged at a position close to the upper surface of the stage 21, and a component supply unit 24 is arranged at a position on the upper left end surface of the stage 21.

In such an electronic component supply device 20, the carrier tape 1 is guided from the component reel 22 to the guide roller 2
The tape is sent out along the upper surface of the stage 21 with the embossed tape 2 below and the top tape 3 above through the sheet 3, and is conveyed to the component supply unit 24. The guide roller 23 has a columnar shape, and a sprocket is formed on the circumference of the guide roller 23. The sprocket hole 8 of the carrier tape 1 is engaged with the guide roller 23 so that the carrier tape 1 can be securely supplied to the component supply section 2.
I am able to lead to 4.

The carrier tape 1 guided to the position before the component supply unit 24 is the embossed tape 2 indicated by the arrow X.
As shown by, the top tape 3 is pulled in a leftward direction in a substantially horizontal state, as shown by an arrow Y,
The top tape 3 is forcibly peeled from the embossed tape 2 by pulling it diagonally upward to the left, and the cavity 4 of the embossed tape 2 is removed by a robot arm (not shown) or the like.
Electronic components P are sequentially taken out from the inside and supplied to a printed wiring board or the like.

[0010]

However, since the supplying means for the electronic parts P in the electronic part supplying device 20 separates the top tape 3 and the embossed tape 2 fitted with each other from each other only by the tension to pull them, The carrier tape 1 cannot be smoothly separated, or it is difficult to separate the carrier tape 1 at a predetermined fixed position. The embossing tape 2 and the top tape 3 are pulled while they are engaged, and the embossing tape 2 moves up and down. There has been a problem that the parts P cannot be smoothly supplied. Also, the separated top tape 3
The embossed tape 2 having no electronic parts P was used after one use, cut into an appropriate length and disposed of, thus becoming an industrial waste. This also means wasting resources.

Furthermore, this electronic component supply device 20
For the work of housing the electronic component P in the cavity 4 of the embossed tape 2 and enclosing it with the top tape 3,
It is not considered at all and must be done using a separate device.

[0012]

Therefore, the electronic component supply and encapsulation device of the present invention guides the carrier tape fed from the component reel to the upper surface of the stage by the pair of guide rollers when the electronic component is supplied, Further, it is advanced along the upper surface of the stage, and a separator is installed on the upper surface of the stage so as to face the direction of travel of the carrier tape.
The carrier tape was configured to be separated. And
A guide / press roller is provided in the vicinity of the upstream side of the separator, and a reel for top tape is installed above it.
The separated top tape is guided in a direction so as to be wound around a reel for top tape, and is separated from the reel for top tape, and an embossed tape reel is installed outside the other of the pair of guide rollers. The embossed tape after separation was wound up.

The component reel, the top tape reel and the embossing tape reel are rotated in the opposite direction to the direction of supplying the electronic component, and the embossed tape wound when the electronic component is supplied is supplied to the electronic component supplying section. After guiding and storing electronic parts in each cavity, the top tape fed out from the reel for top tape is fitted to the embossed tape in the stored state of the electronic parts by the guide and pressing roller, and then on the parts reel. The above-mentioned problems were solved by the constitution of winding.

[0014]

Therefore, the carrier tape is reliably separated by the separator, and the vertical vibration of the embossed tape after separation can be prevented. In addition, since a roller is provided in front of separating the carrier tape, when each reel is rotated in the opposite direction to that when parts are supplied, the ridges of the top tape are easily fitted into the fitting groove of the embossed tape by the guide and pressing roller. And electronic components can be encapsulated.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The electronic component supplying and enclosing apparatus of the present invention will be described below with reference to FIG. FIG. 1 is a conceptual view of an electronic component supply and encapsulation device according to the present invention. FIG. 1A is a side view thereof, and FIG. 1B is a partially enlarged perspective view of FIG.

The electronic component supply and encapsulation device 30 of FIG.
Is a stage 31, a component reel 32 rotatably supported above one end thereof, an electronic component supply unit 33 installed at the other end of the stage 31, and a component reel 32 below the component reel 32 to the stage 31. A guide roller 34 disposed in proximity to the guide roller 34, a guide roller 35 located outside the stage 31 and provided with a guide surface substantially on the same surface as the surface, and forming a pair with the guide roller 34, and the guide roller 34. And a guide / pressing roller 36 installed at an intermediate position between the electronic component supply unit 33 and the carrier tape 1 between them, and on the guide / pressing roller 36 side,
The traveling direction is changed by a separator 37 having an acute tip portion 37A and a guide / pressing roller 36, which is installed close to this and separates the delivered carrier tape 1 into an embossed tape 2 and a top tape 3. In order to wind up the top tape 3 separated by the separator 37, the top tape reel 38 installed above the guide / press roller 36 and a position separated from the top tape reel 38 are installed. , And an embossing tape reel 39 for winding the embossing tape 2. The guide roller 34, the guide / press roller 36, and the separator 37 are configured by a mechanism capable of moving forward and backward with respect to the stage 31, and when the carrier tape 1 is inserted from the parts reel 32, they are moved backward. In this case, the carrier tape 1 is easily inserted, and when supplying or encapsulating the electronic component, the carrier tape 1 is advanced to surely guide and press the carrier tape 1. in this case,
The distance D between the guide roller 34, the guide / press roller 36, the separator 37, and the stage 31 is set to be approximately the same as the thickness of the carrier tape 1.

Next, the operation of the electronic component supply / encapsulation device 30 having such a configuration will be described. First, a supply operation of the electronic component to, for example, a printed wiring board will be described. A carrier tape 1 in which an electronic component P is enclosed is mounted on a drive reel shaft (not shown) of a component reel 32 wound with the top tape 3 as an outer side, and the carrier tape 1 fed from the reel is mounted. The embossed tape 2 side faces the stage 31 and is brought under the guide / pressing roller 36 along the surface of the stage 31 while being regulated by the guide roller 34 so as to lightly contact the stage 31.

First, the leading end of the carrier tape 1 is separated into a top tape 3 and an embossed tape 2, and the separated top tape 3 is placed on the top tape reel 38 under the control of a guide / press roller 36. Wrap around. One of the separated embossed tapes 2 passes through the component supply section 33, guides the embossed tapes 2 to the embossed tape reel 39 based on the regulation of the guide roller 35, and the opening of the cavity 4 is placed outside. Let it wind up.

Supplying and enclosing device 3 for such electronic parts
When the electronic component P is supplied by using 0, the component reel 32
Embossed tape 2 of carrier tape 1 sent from
First, the acute-angled tip portion 37A of the separator 37 facing the traveling direction is inserted between the top tape 3 and the top tape 3, and the carrier tape 1 is separated into the top tape 3 and the embossed tape 2.

The separated top tape 3 is wound up by the top tape reel 38 via the guide / pressing roller 36 with the ridge 11 facing outward, and the separated embossed tape in which the electronic component P is exposed. 2 through the lower surface of the separator 37A, and the electronic component supply unit 33
The embossed tape 2 is wound around the reel 39 for the embossed tape so that the cavity 4 side faces the outside with the guide roller 35 bending and guiding the stage 31 downward.

Then, the electronic component P is placed in the cavity 4 of the embossed tape 2 sent to the component supply section 33.
Since these are exposed, the electronic parts P can be sequentially taken out by a robot arm or the like and supplied to a printed wiring board or the like.

Next, the electronic component supplying and enclosing device 3
A case where 0 is made to function as a sealing device for the electronic component P will be described. In this case, the procedure of supplying the electronic component P may be reversed. First, the embossed tape 2 is sent from the reel 39 for embossed tape on which the embossed tape 2 is wound up to the component supply unit 33 via the guide roller 35.
Here, the electronic component P is housed in each cavity 4 of the embossing tape 2 by using the robot arm or the like used when the electronic component P is taken out.

Then, the embossed tape 2 containing the electronic component P is passed through the lower surface of the separator 37A and sent to the guide / press roller 36, and the reel 3 for the top tape is used.
Together with the top tape 3 supplied from step 8, the guide / press roller 36 pushes the top tape 3 by the guide / press roller 36 to fit the fitting groove 7 and the ridge 11. When combined, the electronic component P can be enclosed in each cavity 4. Then, the carrier tape 1 in which the electronic component P is encapsulated and integrated is wound around the component reel 32 via the guide roller 34, and can be used for mounting the next electronic component P.

[0024]

As described above, according to the device for supplying and encapsulating electronic components of the present invention, the sharp tip portion of the separator is installed so as to face the traveling direction of the carrier tape. It is possible to surely separate the top tape and the embossed tape at that place easily.

The separated embossed tape is wound by the guide / pressing roller and the embossing tape reel, and the separated top tape is wound while being tense between the top tape reel and the guide roller. It is difficult for the embossed tape and the top tape to separate from each other as described above, and the embossed tape is not pulled by the carrier tape, and therefore the embossed tape does not shake up and down. Therefore, the electronic parts could be stably taken out by the robot arm or the like, supplied to the printed wiring board, and mounted.

In the electronic component supply and encapsulation device of the present invention, the guide and pressing roller 36 also serves as a roller for encapsulating the electronic component housed in the cavity of the embossed tape with the top tape. Not only is it supplied, but by simply reversing the rotation direction of each reel when supplying it, the electronic parts housed in the cavity of the embossed tape can be easily sealed with the top tape. And it is no longer necessary to have a separate device for encapsulation. Furthermore, the separated top tape and embossed tape can be reused, and industrial waste can be reduced.

[Brief description of drawings]

FIG. 1 is a conceptual diagram of an electronic component supply and encapsulation device of the present invention, FIG. 1A is a side view thereof, and FIG. 1B is a partially enlarged perspective view of FIG.

FIG. 2 shows a currently used carrier tape, and FIG.
Is a perspective view thereof, and FIG. 6B is a sectional view taken along the line AA of FIG.

FIG. 3 is a conceptual side view of a conventional electronic component supply device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Embossing tape 3 Top tape 4 Cavity 30 Electronic component supply and encapsulation device 31 of this invention 31 Stage 32 Component reel 33 Electronic component supply section 34 Guide roller 35 Guide roller 36 Guide / press roller 37 Separator 37A Tip of separator 37 Part 38 Top tape reel 39 Emboss tape reel P Electronic components

Claims (1)

[Claims] 1. A stage and a carrier tape, which is rotatably supported above one end of the stage and in which a plurality of electronic components are fitted and sealed with an embossed tape having a plurality of cavities and a top tape. A component reel for picking up, an electronic component supply unit which is installed at the other end of the stage and supplies an electronic component, is located between the electronic component supply unit and the component reel, and is fed from the component reel. A guide roller for guiding the carrier tape to the surface of the stage, a guide / pressing roller for guiding and running the carrier tape whose traveling direction is changed by the guide roller along the surface of the stage, and the guide / pressing roller. A separator that is installed in close proximity to the carrier tape and that separates the sent carrier tape into a top tape and an embossed tape; A top tape reel installed above the guide and pressure roller for winding the top tape separated by the separator, the traveling direction of which is changed by the guide and pressure roller, and this top tape reel. An apparatus for supplying and encapsulating an electronic component, comprising: an embossed tape reel that is installed at a separated position and that winds the embossed tape.