JPH10129623A - Production of carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce burrs in containing holes for tip parts, in a carrier tape used for tip parts. SOLUTION: In a carrier tape 11 in which containing holes 13 for tip parts and feeding holes 12 are formed, burrs in the containing holes 13 for tip parts are burned and cut by a hot air generator 16 at the underface side and burrs in the containing holes 13 for tip parts are burned and cut by a hot air generator 17 at the upper face side. In this way, a carrier tape having less burr in the containing holes for tip parts, can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a carrier tape for packaging chip parts and the like.

[0002]

2. Description of the Related Art As a conventional method for producing a carrier tape, a method described in Japanese Patent Application Laid-Open No. 4-51407 is known.

Hereinafter, a conventional carrier tape will be described with reference to the drawings. FIG. 3 is a side view of an upper mold used for manufacturing a conventional carrier tape, and FIG. 4 is a bottom view of the same.

In the drawing, reference numeral 1 denotes a storage hole punch used to form a chip component storage hole, 2 denotes a feed hole punch used to form a feed hole, and 3 denotes a positioning punch used to position a tape member.

A conventional method for manufacturing a carrier tape using the above-described mold will be described.

First, an upper die having a receiving hole punch 1 for forming a chip component receiving hole, a feed hole punch 2 for forming a feed hole, and a positioning punch 3 for positioning a tape member, and a chip of the upper die. A punch formed by a lower die having a hole slightly larger than these punches below a storage hole punch 1 forming a component storage hole, a feed hole punch 2 forming a feed hole, and a positioning punch 3 for positioning a tape member. In the apparatus, a carrier tape is manufactured by forming a through hole in a tape member by an up and down movement of an upper mold. At this time, there are two types of through holes formed in the tape member: a chip component storage hole and a feed hole.

[0007]

However, in this method of manufacturing a carrier tape, since a hole is formed by applying a shearing force to the tape member, burrs are generated on the cut surface of the tape member, and the burrs are formed on the chip component. There is a problem that the mounting rate tends to be hindered by the mounting machine, and the mounting rate is particularly reduced in the case of minute chip components.

An object of the present invention is to provide a method for producing a carrier tape with less burrs.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is directed to a carrier tape in which chip component storage holes and feed holes are formed, in which burrs generated in the chip component storage holes are burned off by hot air. is there.

As a result, a carrier tape with less burrs in the chip housing hole can be obtained.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to a first aspect of the present invention is directed to a chip component storage hole which has feed holes at least on one side in the longitudinal direction at equal intervals and stores chip components near the center. Passing through the hot air from one of the carrier tapes having the cavities to burn off the burrs in the chip component storage holes, and passing the hot air from the other of the carrier tapes having the burrs burned off from one of the chip component storage holes Accordingly, the step of burning off the burrs in the chip component storage holes has the effect of burning off the burrs in the component storage holes.

The invention described in claim 2 is the first invention.
The step of burning off the burrs in the chip component accommodating hole according to the invention described above is such that hot air is passed only to the formation region in the chip component accommodating hole that is intermittently continuous, and the carrier tape having less burr in the chip component accommodating hole. Is obtained.

[0013] The invention described in claim 3 is the first invention.
The step of burning off the burrs in the chip component storage hole by passing the hot air described in (1) has a time lag, and has an effect that the hot air reliably passes through the chip component storage hole by an independent process. is there.

Hereinafter, a method of manufacturing a carrier tape according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic view showing a method for manufacturing a carrier tape according to an embodiment of the present invention, and FIG. 2 is an enlarged perspective view of the carrier tape as the main part.

In the drawing, reference numeral 11 denotes a square having a substantially circular feed hole 12 on one side in the longitudinal direction at regular intervals and having a chip part (not shown) in the vicinity of the center thereof according to the shape of the chip or chip part. A carrier tape made of paper or the like having a chip component storage hole 13 having a predetermined shape, and provided with a feed hole 12 and a chip component storage hole 13 using a punch or the like manufactured by the same manufacturing method as described in the related art. Things. At this time, as shown in FIG. 2, the chip component storage hole 13 has a burr 12a.
Reference numerals 14 and 15 denote sprocket wheels and guide rollers provided at regular intervals to convey the carrier tape. 16 is provided between the sprocket wheel 14 and the guide roller 15, and blows hot air of about 500 ° C. only from the lower part of the carrier tape 11 to a region where the chip component storage hole 13 is formed, thereby removing burrs in the chip component storage hole 13. This is a hot air generator that burns down the lower surface. Reference numeral 17 denotes a chip component storage hole 13 provided between the lower surface side hot air generator 16 and the sprocket wheel 14 from above the carrier tape 11.
A hot air generator of about 500 ° C. is blown only to the formation region of the chip component to burn off the burrs in the chip component storage hole 13. The upper side hot air generator 17 and the lower side hot air generator 16 have a time difference between the chip component accommodating holes 13.
It burns off the burr inside.

Hereinafter, a method of manufacturing a carrier tape according to an embodiment of the present invention will be described.

First, the chip component storage hole 13 and the feed hole 12
The carrier tape 11 on which the carrier tape 11 is formed passes through the step of burning off the burrs 12 a in the chip component storage holes 13 by the carrier sprocket wheel 14 of the carrier tape 11. The step of burning off the burrs 12 a in the chip component storage holes 13 is performed by about 500 mm from the lower surface side of the carrier tape 11.
° C hot air is applied to the chip component storage holes 13 of the carrier tape 11.
The burr 12a in the chip component storage hole 13 is burned off by the lower surface side hot air generator 16 that blows only the formation region of
Next, the burr 12a in the chip component storage hole 13 is burned off by the upper surface side hot air generator 17 that blows hot air of about 500 ° C. only from the upper surface side of the carrier tape 11 to the formation region of the chip component storage hole 13 of the carrier tape 11. And a carrier tape.

In this embodiment, the step of burning off the burrs in the chip component storage holes on the lower surface side is provided before the step of burning out the burrs in the chip component storage holes on the upper surface side. Has the same effect.

In this embodiment, the feed holes are provided on one side in the longitudinal direction of the carrier tape, but they may be provided on both sides.

[0021]

As described above, according to the present invention, a carrier tape with less burrs can be obtained in the chip component storage hole, and the advantageous effect that the mounting rate of the chip component is improved can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a method for manufacturing a carrier tape according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a carrier tape which is the main part.

FIG. 3 is a side view of an upper mold used for manufacturing a conventional carrier tape.

FIG. 4 is a bottom view of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Carrier tape 12 Feed hole 12a Burr 13 Chip component accommodation hole 16 Lower surface side hot air generator 17 Upper surface side hot air generator

Claims (3)

[Claims] The hot air is passed from one side of a carrier tape having a feed hole at an equal interval on at least one side in a longitudinal direction and a chip component storage hole for storing a chip component near the center. A step of burning off burrs in the chip component storage holes, and a step of burning off burrs in the chip component storage holes by passing hot air from the other of the carrier tapes from which burrs have been burned off in one of the chip component storage holes. A method for producing a carrier tape comprising: 2. The method of manufacturing a carrier tape according to claim 1, wherein in the step of burning off the burrs in the chip component storage holes, hot air is passed only to the formation region in the chip component storage holes that are intermittently continuous. 3. The step of burning off the burrs in the chip component storage holes by passing hot air through has a time difference.
A method for producing the carrier tape described in the above.