JP2004031796A - Chip type composite part and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip type composite part which is small in occupied area and capable of detecting ambient temperatures accurately even if a thermistor itself generates heat, wherein the thermistor and a resistor are provided and connected in series on a base for the formation of the chip type composite part, and to provide a method of manufacturing the same. <P>SOLUTION: An internal electrode A2 is formed near the one end of an alumina base 1, and a thermistor layer 3 is formed thereon. An internal electrode B4 is formed as spreading over the thermistor layer 3 and extending toward the other end of the alumina base 1. A resistor layer 5 is formed so as to cover the internal electrode B4 on the alumina base 1. An internal electrode C6 is formed as spreading over the resistor layer 5 and extending toward the other end of the alumina base 1; and the exposed top surfaces of the thermistor layer 3, the internal electrode B4, and the resistor layer 5 are covered with a protective coat 7. A part of the internal electrode B4 located between the thermistor layer 3 and the resistor layer 5 is equipped with extensions that extend to the side ends of the alumina base 1, respectively. Terminal electrodes A8 and B9 are provided to the ends of the alumina base 1, and side electrodes 10 and 11 are provided to the sides of the alumina base 1. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a chip-type composite component in which a thermistor and a resistance element are connected in series on a base, and a method of manufacturing the same.
[0002]
[Prior art]
In a circuit for applying a constant voltage, for example, when an NTC thermistor is used, when the thermistor is activated, a current of the thermistor flows and a temperature rise inevitably occurs. When the temperature rises, the resistance value of the thermistor decreases due to the characteristics of the thermistor, so that the power consumption increases, and the self-heating of the thermistor itself makes it impossible to accurately detect the ambient temperature.
[0003]
That is, power consumption (W) = {voltage (V)} ² / resistance value (R), and if the resistance value decreases as the temperature rises, the power applied to the thermistor increases. This causes a vicious cycle in which the temperature rises more and more.
[0004]
Conventionally, in order to suppress an increase in power supplied to the thermistor, a resistance element is connected in series to increase the applied power due to a decrease in the resistance value of the thermistor due to a rise in temperature (increase in the amount of self-ripening of the thermistor) Has been taken by dividing the voltage into resistors connected in series to prevent erroneous temperature detection.
[0005]
[Problems to be solved by the invention]
However, conventionally, a resistance element and a thermistor are individually prepared and mounted on a substrate, for example, to realize a serial connection. For this reason, a mounting space for each of the thermistor and the resistance element is absolutely necessary, and there is a limit to miniaturization.
[0006]
In some cases, a thermistor and a resistor are mounted on a single chip for miniaturization. However, for example, as described in JP-A-2000-124008, a thermistor and a resistor are connected in parallel in a conventional lamination technology. I could only do it. Therefore, realization of a composite chip in which a thermistor and a resistor are connected in series has been awaited.
[0007]
In addition, even if the thermistor and the resistor are connected in series, there is a possibility that the change in the resistance of the thermistor with respect to the temperature change cannot be properly detected only by detecting the combined characteristics of the thermistor and the resistor.
[0008]
For example, in the case where the resistance value of the thermistor at, for example, 25 ° C. is 200Ω and the resistance connected in series is 1 MΩ, the change in the resistance value with respect to a change in the ambient temperature is about several tens of Ω. Since the resistance value changes only slightly, it becomes a practically inadequate component.
[0009]
[Means for Solving the Problems]
The present invention has been made with the object of solving the above-described problems, and by providing a method for manufacturing a composite chip capable of connecting a thermistor and a resistor in series with one chip and reliably detecting a temperature change, It is an object of the present invention to accurately detect the ambient temperature even when the thermistor itself generates heat with a small occupied area. Then, for example, the following configuration is provided as a means for achieving the object and solving the above-described problem.
[0010]
That is, a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material, the thermistor layer formed on one end of the base, and the other end of the base. A resistor layer formed at a predetermined interval from the thermistor layer, a first electrode formed on one surface of the thermistor layer from one end of the base, and a second electrode formed on the other end of the base. A second electrode formed on one surface of the resistor layer, and a second electrode formed between the other surface of the thermistor layer and the other surface of the resistor layer, extending to the side surface of the base between the thermistor layer and the resistor layer. A third electrode having an extending portion extending therefrom, wherein a thermistor layer, a third electrode, a resistor layer, and a second electrode are connected in series from the first electrode.
[0011]
Then, for example, the first electrode is formed on the base, the thermistor layer is formed on the center of the base from the first electrode, and the third electrode is formed on the base from the thermistor layer. And forming the resistor layer on the substrate from above the third electrode, and forming the second electrode on the other end of the substrate from above the resistor layer. .
[0012]
Further, for example, the first electrode and the second electrode are formed on the base, and the thermistor layer is formed on the center of the base from the first electrode, and the thermistor layer is formed on the second electrode from the second electrode. A resistor layer is formed on a central portion of the substrate, and the third electrode is formed on the resistor layer from the upper surface of the thermistor layer, through the central portion of the substrate.
[0013]
Further, for example, the third electrode is formed on the base, the thermistor layer is formed from the vicinity of the center of the third electrode to the vicinity of one end of the base, and the center of the third electrode is formed. The resistor layer is formed near the other end of the base from the vicinity, the first electrode is formed on one end of the base from the thermistor layer, and the other of the base is formed from the resistor layer on the other end. It is characterized in that the second electrode is formed on an end.
[0014]
Further, for example, the first electrode, the second electrode, and the third electrode are formed in a row at predetermined intervals on the base, and the thermistor layer is formed across the first electrode and the third electrode. And forming the resistor layer over the second electrode and the third electrode.
[0015]
Furthermore, for example, a coat layer is further formed thereon to form a protective coat, and external connection electrodes respectively connected to the first electrode and the second electrode are formed, and an extension of the third electrode is formed. A side electrode connected to the end of the protruding portion is formed.
[0016]
Further, for example, an identification mark is displayed on an upper part of either the thermistor layer or the resistor layer.
[0017]
Alternatively, a method of manufacturing a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material, wherein a first electrode extending from one end of the base to the center is formed. A first electrode forming step, a thermistor layer forming step of forming the thermistor layer from the first electrode on the base central part, and a center of the base from the other surface of the thermistor layer to the other end of the base. Forming a third electrode having an extending portion extending to the side surface of the base at a portion, and forming a resistor layer on the base from the third electrode And a second electrode forming step of forming the second electrode on the other end of the base from above the resistor layer, wherein the third electrode formed in the third electrode forming step includes: In addition to the other surface of the thermistor layer and the resistor layer It is formed between the faces, characterized by a method for manufacturing a chip-type composite part having an extending portion extending to the substrate side in the resistor layers and the thermistor layer.
[0018]
Furthermore, a method of manufacturing a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material, wherein a first electrode extending from one end surface of the base to the center is formed. A first electrode forming step of forming, a second electrode forming step of forming the second electrode extending to the center from the other end surface of the base, and the thermistor from the first electrode to the center of the base. A thermistor layer forming step of forming a layer; a resistor layer forming step of forming a resistor layer from the second electrode on the base central portion; and the resistor from the thermistor layer upper surface through the base central portion. A third electrode forming step of forming a third electrode formed on a body layer and having an extended portion extending to a side surface of the base at a central portion of the base, a method of manufacturing a chip-type composite component. I do.
[0019]
Alternatively, there is provided a method of manufacturing a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material, the method further comprising: A third electrode forming step of forming an electrode, a thermistor layer forming step of forming a thermistor layer from near the center of the third electrode to near one end of the base, and from near the center of the third electrode. A resistor layer forming step of forming the resistor layer near the other end of the base; a first electrode forming step of forming the first electrode on the one end of the base from above the thermistor layer; A method of manufacturing a chip-type composite component, comprising a second electrode forming step of forming the second electrode from the resistor layer on the other end of the base.
[0020]
Alternatively, a method of manufacturing a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material, wherein a first electrode extending from one end of the base to the center is formed. A first electrode forming step, a third electrode forming step of forming a third electrode having an extending portion extending to a side surface of the base at a central portion of the base, and extending to a center from an end face of the other end of the base. A second electrode forming step of forming a second electrode, a thermistor layer forming step of forming the thermistor layer across the first electrode and the second electrode, and a step of forming the second electrode and the third electrode. Forming a resistor layer over the electrodes, wherein the first electrode, the second electrode, and the third electrode formed on the base are arranged in a row at predetermined intervals. Chip type composite parts characterized by being formed in And manufacturing method.
[0021]
Then, for example, a protective coat forming step of further forming a coat layer thereon to form a protective coat, and an external electrode forming step of forming external connection electrodes respectively connected to the first electrode and the third electrode And a method of manufacturing a chip-type composite component having a side electrode forming step of forming a side electrode connected to the extension of the third electrode.
[0022]
Further, for example, a method of manufacturing a composite chip component having an identification mark displaying step of displaying an identification mark on either the thermistor layer or the resistor layer of the protective coating layer is provided.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is a cross-sectional view for explaining a configuration of a composite chip according to an embodiment of the present invention, and FIG. 2 is a top view of the composite chip according to the embodiment. It is the figure which looked at the figure section from the upper surface. FIG. 1 is a sectional view taken along the line BB of FIG.
[0024]
In the present embodiment, an example in which a thermistor and a resistor are connected in series on an alumina base will be described as an example of a composite chip.
[0025]
In the figure, reference numeral 1 denotes an alumina substrate having electrical insulation, and the alumina substrate 1 is formed of an alumina sintered body. In the present embodiment, when the composite chip is completed, it is formed into a mounting area of about 1.28 mm ² (a composite chip having a size of 1.6 mm × 0.8 mm × 0.8 mm).
[0026]
Reference numeral 2 denotes an internal electrode A formed from the end face of one end of the alumina base 1 to the center, and reference numeral 3 denotes a thermistor layer formed so as to cover the entire surface except the end of the internal electrode A2. The thermistor layer 3 of the present embodiment is formed in a substantially square shape.
[0027]
Reference numeral 4 denotes an internal electrode B formed from the upper surface of the thermistor layer 3 to the other side of the alumina substrate 1. The internal electrode B4 has extended portions 4a and 4b extending to both ends of the central side of the alumina substrate 1. ing.
[0028]
Reference numeral 5 denotes a resistor layer formed so as to cover the internal electrode B4. In the present embodiment, the resistor layer 5 is formed in a substantially square shape.
[0029]
Reference numeral 6 denotes an internal electrode C formed from the upper surface of the resistor layer 5 to the other end of the alumina substrate 1. Reference numeral 7 denotes a protective coat for coating the thermistor layer 3, the resistor layer 5, and the internal electrodes. After the thermistor layer 3 and the resistor layer 5 are connected in series on the alumina substrate 1 by the internal electrodes in this manner, the central portion of the alumina substrate 1 excluding the ends is covered with the protective coat 7 to coat the surface. Thereby, it can be prevented from aging.
[0030]
Finally, a terminal electrode A8 is connected to the internal electrode A2 at one end of the alumina base 1, and a terminal electrode A8 is connected to a side surface of one end of the alumina base 1, and the other end of the alumina base 1 is connected to an internal electrode C6 at the other end of the alumina base 1. The terminal electrode B9 is connected to the end side surface, and the side electrodes A10 and B11 are formed on both side surfaces of the alumina base 1 by being connected to the internal electrodes A2 at both end sides of the alumina base 1.
[0031]
In the present embodiment, the display material 15 is added to the surface of the protective coat 7 near the terminal electrode A8 in order to easily identify the terminal electrode connected to the thermistor layer 3 at the time of completion.
[0032]
The display material 15 may be applied with a paint that is easily distinguishable from the protective coat 7, or may be displayed with a stamp using ink that is easily distinguishable from the protective coat 7. Any material or any method may be used so long as it can be identified. Alternatively, another distinction may be made by cutting a part of the protective coat 7.
[0033]
As a result, the appearance of the composite chip is as shown in FIG. 3, and the front and back of the composite chip can be easily identified by adding the display material 15. Furthermore, even when only the thermistor element is connected, the mounting direction of the chip when mounting the composite chip can be easily identified, and the terminal electrode and the side electrode on the side where the display material 15 is added are connected to the wiring pattern of the mounting board. The position can be determined without fail, and the mounting result can be easily confirmed.
[0034]
The alumina substrate 1 used in the present embodiment is, for example, a 96% Al ₂ O ₃ alumina substrate, and it is desirable to select an appropriate substrate thickness according to the chip size.
[0035]
The internal electrodes A2, B4, and C6 can be formed by sputtering, screen printing, or the like of any noble metal such as Ag, Ag / Pd, Pt, and Au. For example, a metal glaze of Ag-Pd-glass can be formed by screen printing or the like. Note that the internal electrodes may be formed of Au or Ag.
[0036]
Similarly, the thermistor layer 3 is formed by screen printing or the like with a thermistor paste having arbitrary characteristics. As the thermistor paste used in the present embodiment, three to four types of composite oxides selected from Mn, Ni, Co, Fe, Al, and Cu according to characteristics are used. The firing temperature of the thermistor layer 3 can be set to 850 ° C. to 1300 ° C., but is preferably set to 1000 ° C. or less.
[0037]
When the firing temperature is set low, for example, when the temperature is 1000 ° C. or lower, the thermistor is used to improve the sinterability at a low temperature and increase the adhesion to the internal electrode A2 and the alumina substrate 1. Add the glass material into the paste.
[0038]
Specifically, for example, it is manufactured by the following method.
[0039]
(1) Oxides of various metals having a thermistor component ratio of Mn: 30 to 60 mol%, Ni: 10 to 30 mol%, Co: 10 to 30 mol%, and Fe: 10 to 30 mol% are used as raw materials. A slurry is produced by mixing with water or alcohol by a wet ball mill. The metal oxide used as a starting _{material, Mn 3 O 4, NiO,} Co 3 0 4, it is desirable that the _Fe 2 _{0 3} and the like.
[0040]
{Circle over (2)} The mixed slurry is dried in a drying step to remove water or alcohol, and then pre-baked at 800 ° C. to 1000 ° C. to produce a raw material powder.
[0041]
{Circle around (3)} The powder that has been preliminarily calcined is ground by a wet ball mill. At this time, water or alcohol is used as the solvent.
[0042]
{Circle around (4)} The obtained slurry is dried in a drying step to remove water or alcohol components, and then ethyl cellulose and α-terpineol are added, and a thermistor paste is prepared using a three-roll mill.
[0043]
{Circle around (5)} When glass is added to the thermistor paste, borosilicate glass powder is added to the thermistor paste and made into a paste by a three-roll mill.
[0044]
By manufacturing the thermistor paste as described above and forming the thermistor paste on the alumina substrate 1 by screen printing, a small-sized, high-performance thermistor can be manufactured.
[0045]
Further, the resistor layer 5 of the present embodiment may be formed by screen-printing a resistor paste having arbitrary characteristics, or by forming a resistor material by sputtering or the like. As the resistor material used here, RuO ₂ , SnO _2, or the like can be used, and an arbitrary material can be selected according to the resistance value.
[0046]
When the resistor layer 5 is formed by screen printing, the resistor powder is used as a paste. In this case, the firing temperature of the resistor layer 5 is desirably set to 600 ° C. to 1000 ° C. When the firing temperature is the same as that of the thermistor layer 3, the thermistor layer 3 and the resistor layer 3 (including the internal electrode B4) may be formed by simultaneous firing.
[0047]
The terminal electrodes A8, B9 and the side electrodes A10, B11 are formed by dipping or sputtering an arbitrary conductive material such as Ag, Ag / Pd, Ni / Cr, Cu, etc., and nickel, solder or Sn is electroplated thereon. It is desirable to secure the solderability by forming by such as.
[0048]
The protective coat 7 is arbitrarily selected from glass or a heat-resistant resin and is formed by screen printing or the like. For example, a paste using borosilicate glass, or an epoxy or polyimide resin can be used.
[0049]
The thermistor characteristics and the resistance value characteristics of the resistance element of the composite chip manufactured as described above can be adjusted by laser trimming of the thermistor layer, the resistance layer or the internal electrode, or the internal electrode / structure (electric distance).
[0050]
Next, a method of manufacturing the composite chip having the above-described configuration will be described with reference to FIGS. 4 to 14 are views for explaining a method of manufacturing the composite chip according to the present embodiment, and schematically show each manufacturing process.
[0051]
4 shows a step of forming an internal electrode A on an alumina substrate as an insulating substrate, FIG. 5 shows a step of forming a thermistor layer thereon, and FIG. 6 shows a step of forming an internal electrode B. 7 shows a step of forming a resistor layer thereon, FIG. 8 shows a step of forming an internal electrode C thereon, FIG. 9 shows a step of further forming a protective coat thereon, and FIG. FIG. 11 shows a step of cutting a display material on a protective coat, FIG. 11 shows a step of cutting into a strip-shaped aggregated component shape, FIG. 12 shows a step of further forming a terminal electrode, and FIG. FIG. 14 shows a process of forming the side electrodes A and B on the individual composite chips.
[0052]
First, as shown in FIG. 4, an internal electrode A102 is formed of, for example, Ag on an insulating substrate 101 of alumina sintered body having a predetermined size (the following description describes an example of manufacturing 12 composite chips). Print with Pd-glass metal glaze.
[0053]
Subsequently, as shown in FIG. 5, a thermistor paste (for example, a composite metal oxide having a thermistor characteristic and having a particle size of about several μm and having a thermistor characteristic) is applied to the upper surface of the extension except for the end for each internal electrode A102. Each of the thermistor layers 103 is formed by printing (CO ₂ O ₃ + NiO + Mn ₂ O ₃ ), a glass frit, and an organic vehicle) and firing at, for example, about 850 ° C.
[0054]
Next, as shown in FIG. 6, an internal electrode B104 is printed for each thermistor layer 103 from the upper surface of the thermistor layer 103 to the alumina substrate 101 by, for example, Ag-Pd-glass metal glaze. Note that, at this time, the internal electrodes B104 are interlocked with each other in the row direction in FIG.
[0055]
Further, as shown in FIG. 7, a resistor paste is printed from above each internal electrode B104 to above the alumina substrate 101 to form each resistor layer 105.
[0056]
Then, as shown in FIG. 8, for each resistor layer 105, the internal electrode C106 is printed from the upper surface of the resistor layer 105 to the alumina substrate 101 by, for example, Ag-Pd-glass metal glaze. At the same time, the via holes are filled with an electrode glaze. Then, each resistor layer 105 is formed by firing at, for example, about 850 ° C.
[0057]
When the thermistor layer 103 and the resistor layer 105 are fired at the same temperature, they may be fired at once instead of firing after forming the thermistor layer 103.
[0058]
Here, when it is necessary to adjust the resistance value or the thermistor characteristic, the internal electrode C6 is cut on the resistor layer 105 by a laser beam, and the resistance value is adjusted according to the position of the kerf. The cutting method may be adjusted by a sand blast method instead of using a laser beam, or the internal electrode C106 may be formed in a comb shape in advance, and cut and adjusted at an appropriate position in a continuous portion of the comb shape.
[0059]
Next, as shown in FIG. 9, for example, the internal electrodes B104 (excluding the extending portions to both side end portions) at the center of each composite chip, the thermistor layer 102, and the resistor layer 105 are covered. A heat-resistant epoxy resin is formed by printing, and the resin is cured at, for example, about 130 ° C. to form the protective coat 107.
[0060]
Then, as shown in FIG. 10, a display material 115 is applied to the vicinity of the end of the protective coat 107 on the side of the internal electrode A102 (above the thermistor layer). The display material 115 is for making it possible to determine which side the thermistor layer 103 is on, and it is needless to say that the display material 115 may be displayed on the internal electrode 105 side (on the resistor layer).
Thereafter, as shown in FIG. 11, the insulating substrate 101 is divided from a portion indicated by a broken line (a dividing groove may be formed in advance) with the length direction of each composite chip piece as the width direction, and the strip-like divided body 120 is formed. obtain.
[0061]
Next, as shown in FIG. 12, continuous terminal electrodes 108 and 109 are formed on both sides of the strip-like divided body 120 in the width direction, and one terminal electrode is used as the internal electrode 102 and the other terminal electrode is used as the internal electrode C106. Are connected to each other. The terminal electrodes 108 and 109 are formed by a method of vacuum deposition of Ni-Cr, a method of applying and firing Ag-Pd-glass metal glaze, and a method of applying and curing an epoxy resin paint by dispersing Ag. You.
[0062]
Subsequently, as shown in FIG. 13, the strip-like divided body 120 is cut for each composite chip at, for example, a broken line position (a division groove may be formed in advance) in FIG. Finally, as shown in FIG. 14, side electrodes 110 and 111 are formed on the side surfaces of the individual composite chip body 150, and the side chip electrodes 110 and 111 are connected to the internal electrodes 104. To complete.
[0063]
The side electrodes 110 and 111 are formed by a method of vacuum deposition of Ni-Cr, a method of applying and firing Ag-Pd-glass metal glaze, and a method of dispersing Ag and applying and curing an epoxy resin paint. You.
[0064]
In the present embodiment described above, an example is described in which the side electrodes are formed on both sides instead of one side to increase the design margin of the mounting board wiring pattern at the time of mounting. In the case where it is sufficient to form only one of the side electrodes, only one of the side electrodes may be formed.
[0065]
Also, since the thermistor connection terminal electrode can be identified if the front and back of the component can be distinguished, when a side electrode is provided only on one side, it is possible to determine which side of the component is provided with the thermistor layer, and the display material 15 is not necessarily added. The display need not be performed, and the display may be omitted.
[0066]
As described above, according to the present embodiment, the internal electrode A2 is formed near one end of the alumina substrate 1, the thermistor layer 3 is formed thereon, and the other side of the alumina substrate 1 is An internal electrode B4 is formed on the end side, a resistor layer 5 is formed so as to cover the internal electrode B4 on the alumina substrate 1, and an internal electrode C6 is formed on the resistor layer 5 and the other end of the alumina substrate 1. Then, the upper surface exposed portions of the thermistor layer 3, the internal electrode B4, and the resistor layer 5 are covered with the protective coat 7, and the terminal electrodes A8 and B9 are formed at both ends, so that the thermistor element and the resistor element can be made the same small size. It can be formed in series on a chip, and even if the resistance value decreases due to heat generation of the thermistor element, the influence can be minimized.
[0067]
In addition, since the side electrodes 10 and 11 for connecting the internal electrode B4 to the outside are provided, thermistor-specific detection such as temperature change detection can be performed by the thermistor alone while power supply is performed in series with the thermistor and resistance. Thus, a specific change of the thermistor can be detected more reliably and accurately.
[0068]
[Second Embodiment]
In the above description, an example is described in which the thermistor layer 3 is formed on the internal electrode A2, the internal electrode B4 is formed thereon, the resistor layer 5 is formed thereon, and the internal electrode C6 is formed on the internal electrode A2. explained. However, the present invention is not limited to the above example. For example, the internal electrode A2 and the internal electrode C6 are both formed on the alumina substrate 1, and the thermistor layer 3 and the resistor layer are formed on the internal electrode A2 and the internal electrode C6. 5, the internal electrode B4 may be formed on the thermistor layer 3, the resistor layer 5, and the intermediate alumina substrate 1. By forming in this way, the manufacturing process can be simplified.
[0069]
A second embodiment of the present invention thus formed will be described below with reference to FIGS. FIG. 15 is a cross-sectional view for explaining the configuration of the composite chip according to the second embodiment of the present invention, and FIG. 16 is a top view of the composite chip according to the second embodiment. -A is a view of a cross section viewed from above. FIG. 15 is a sectional view taken along the line BB of FIG. The same components as those in the first embodiment described above are denoted by the same reference numerals, and the detailed description is omitted.
[0070]
In the second embodiment, first, an internal electrode A2 having substantially the same shape as that of the first embodiment is printed on an alumina substrate. Subsequently, an internal electrode C206 having an upper area substantially similar to that of the first embodiment is printed.
[0071]
Then, a thermistor paste is printed on the internal electrode 2 in substantially the same manner as in the first embodiment, and baked at, for example, about 850 ° C. to form each thermistor layer 3. Next, a resistor paste is printed on the internal electrode C206 so as to cover the internal electrode C206 excluding the end portions, and covers at least the central upper surfaces of the thermistor layer 2 and the resistor layer 205, and on the intermediate alumina substrate 1 The internal electrode B204 is formed by printing or the like so as to extend to the end portions on both sides at the portion, and is baked at about 850 ° C., for example.
[0072]
In the case where the thermistor layer 3 and the resistor layer 205 are fired at the same temperature, firing may not be carried out after printing the thermistor paste but may be fired collectively after printing the internal electrode B204.
[0073]
Here, when it is necessary to adjust the resistance value or the thermistor characteristic, the internal resistance B204 is cut on the resistor layer 105 by, for example, a laser beam, and the resistance value is adjusted according to the position of the kerf. The cutting method may be adjusted by a sand blast method in addition to the laser beam, or the internal electrode B204 may be formed in a comb shape in advance, and the comb-shaped continuous portion may be cut at an appropriate position.
[0074]
Thereafter, a heat-resistant epoxy resin, for example, is formed by printing so as to cover the thermistor layer 2, the internal electrode B204, and the exposed portion of the resistor layer 205 except for both ends of the internal electrodes A2, C206. The composition is cured to form a protective coat 207.
[0075]
After dividing into strips, terminal electrodes A208 and terminal electrodes B209 are formed on both ends of the alumina substrate 1, and after dividing into individual chips, side electrodes 210 and 211 are formed on both side surfaces.
[0076]
As described above, according to the second embodiment, a composite chip component can be manufactured only by forming three layers to form an electrode, a thermistor layer, and a resistor layer. Can be simultaneously printed, thereby simplifying the manufacturing process.
[0077]
Further, the formation accuracy of each layer can be made longer than in the first embodiment, and a great advantage can be obtained in the manufacture of a small chip.
[0078]
[Third Embodiment]
In the second embodiment described above, first, the internal electrode A2 and the internal electrode C206 are printed on the alumina substrate 1, and then the thermistor layer 3 and the resistor layer 205 are formed thereon. The example of forming B204 has been described. However, the present invention is not limited to the above example. For example, the internal electrode B may be formed first. First, a third embodiment of the present invention in which the internal electrode B is formed will be described below with reference to FIGS. FIG. 17 is a cross-sectional view for explaining the configuration of the composite chip of the third embodiment according to the present invention, and FIG. 18 is a top view of the composite chip of the third embodiment. -A is a view of a cross section viewed from above. FIG. 17 is a sectional view taken along the line BB of FIG. The same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0079]
In the third embodiment, first, as shown in FIG. 18, an internal electrode B304 having a substantially rectangular shape and extending at both sides at the center is formed on the center of the alumina base by printing or the like. .
[0080]
Subsequently, a thermistor paste is printed in a shape having an upper area substantially the same as that of the first embodiment so as to cover at least one end of the internal electrode B304 except for the central part, and is baked at, for example, about 850 ° C. A thermistor layer 303 is formed. Next, a resistor paste is printed so as to cover the other end of the internal electrode B304 in a shape substantially the same as that of the first embodiment in an upper area, and further, at least a central upper surface of the thermistor layer 2 and the resistor layer 205 The internal electrodes A302 and C306 are printed so as to cover, and are baked at, for example, about 850 ° C.
[0081]
When the thermistor layer 3 and the resistor layer 205 are fired at the same temperature, the internal electrodes A302 and C306 may be fired collectively after printing, instead of firing after printing the thermistor paste.
[0082]
Here, when it is necessary to adjust the resistance value or the thermistor characteristic, the internal resistance C306 is cut on the resistor layer 305 by, for example, a laser beam, and the resistance value is adjusted according to the position of the kerf. The cutting method may be adjusted by a sand blast method other than the laser beam, or the internal electrode C306 may be formed in a comb shape in advance, and the comb-shaped continuous portion may be cut at an appropriate position.
[0083]
Thereafter, a heat-resistant epoxy resin, for example, is formed by printing so as to cover the thermistor layer 302, the internal electrode B304, and the exposed portion of the resistor layer 305 except for both ends of the internal electrodes A302 and C306. The composition is cured to form a protective coat 307.
[0084]
After dividing into strips, terminal electrodes A308 and terminal electrodes B309 are formed on both ends of the alumina substrate 1, and after dividing into individual chips, side electrodes 310 and 311 are formed on both side surfaces.
[0085]
As described above, according to the third embodiment, as in the second embodiment, a composite chip component can be manufactured only by forming it into three layers, and the manufacturing process is simplified.
[0086]
[Fourth Embodiment]
In the second embodiment described above, first, the internal electrode A2 and the internal electrode C206 are printed on the alumina substrate 1, and then the thermistor layer 3 and the resistor layer 205 are formed thereon. The example of forming B204 has been described. However, the present invention is not limited to the above example. For example, the internal electrodes A, B, and C may be formed first. First, a fourth embodiment according to the present invention in which all the internal electrodes are formed will be described below with reference to FIGS. FIG. 19 is a cross-sectional view for explaining the configuration of the composite chip according to the fourth embodiment of the present invention, and FIG. 20 is a top view of the composite chip according to the fourth embodiment. -A is a view of a cross section viewed from above. FIG. 19 is a sectional view taken along the line BB of FIG. The same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0087]
In the fourth embodiment, first, internal electrodes A402, B404, and C406 are formed at predetermined intervals in a row at the center of the alumina base 1 as shown in FIG.
[0088]
Subsequently, a thermistor paste is printed over the internal electrode A402 and the internal electrode B404 so that the upper area is substantially the same as that of the first embodiment, and the thermistor layer 403 is formed by firing at, for example, about 850 ° C. . Next, a resistor paste is printed over the internal electrode B404 and the internal electrode C406 so that the upper area is substantially the same as that of the first embodiment, and baked at, for example, about 850 ° C.
[0089]
When the thermistor layer 3 and the resistor layer 205 are fired at the same temperature, the thermistor paste and the resistor paste may be printed continuously or simultaneously, and then fired collectively.
[0090]
Here, when it is necessary to adjust the resistance value or the thermistor characteristic, a part of the resistor layer 305 is cut by, for example, a laser beam, and the contact position with the internal electrode (or the contact area) is cut. And adjust the resistance value.
[0091]
Thereafter, a heat-resistant epoxy resin is formed by printing, for example, so as to cover the exposed portions of the upper surface of the thermistor layer 403, the resistor layer 405, and the internal electrodes B404, and the resin is cured at, for example, about 130 ° C. to form a protective coat 407.
[0092]
After dividing into strips, terminal electrodes A 408 and terminal electrodes B 409 are formed on both ends of the alumina base 1, and after dividing into individual chips, side electrodes are formed on both side surfaces.
[0093]
As described above, according to the fourth embodiment, since the internal electrodes are first formed directly on the alumina substrate 1 by printing or the like, the electrodes may be formed on a flat surface, and the electrodes can be easily formed. it can. Further, the internal electrodes can be printed at one time, and the manufacturing process can be simplified. Further, the thermistor layer 403 and the resistor layer 405 formed on the internal electrodes are also easy to form because the thickness of the internal electrodes is not so large, the positional accuracy to be formed has a margin, and the size is easily reduced. Can provide chips.
[0094]
【The invention's effect】
As described above, according to the present invention, a thermistor element and a resistor element can be formed in series on one chip, and a composite chip having a high-precision thermistor characteristic with a small occupation area and little change in characteristics due to heat generation or the like. Parts can be provided.
[0095]
In addition, while power is supplied in series with the thermistor in a resistance series, thermistor-specific detection such as temperature change detection can be performed by the thermistor alone, and the thermistor-specific change can be more reliably and accurately detected.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a configuration of a composite chip according to an embodiment of the present invention.
FIG. 2 is a top view of the composite chip according to the embodiment.
FIG. 3 is an external view of a composite chip according to the present embodiment.
FIG. 4 is a diagram for explaining a method of manufacturing the composite chip according to the embodiment.
FIG. 5 is a diagram for explaining a method of manufacturing the composite chip according to the embodiment.
FIG. 6 is a diagram for explaining a method of manufacturing the composite chip according to the embodiment.
FIG. 7 is a diagram for explaining a method of manufacturing the composite chip according to the embodiment.
FIG. 8 is a diagram illustrating a method for manufacturing a composite chip according to the present embodiment.
FIG. 9 is a diagram illustrating a method for manufacturing a composite chip according to the present embodiment.
FIG. 10 is a diagram for explaining the method of manufacturing the composite chip according to the embodiment.
FIG. 11 is a diagram illustrating a method for manufacturing a composite chip according to the present embodiment.
FIG. 12 is a diagram illustrating a method for manufacturing a composite chip according to the present embodiment.
FIG. 13 is a view illustrating a method for manufacturing the composite chip according to the embodiment.
FIG. 14 is a diagram illustrating a method for manufacturing a composite chip according to the present embodiment.
FIG. 15 is a cross-sectional view illustrating a configuration of a composite chip according to a second embodiment of the present invention.
FIG. 16 is a top view of the composite chip according to the second embodiment.
FIG. 17 is a cross-sectional view illustrating a configuration of a composite chip according to a third embodiment of the present invention;
FIG. 18 is a top view of the composite chip according to the third embodiment.
FIG. 19 is a cross-sectional view illustrating a configuration of a composite chip according to a fourth embodiment of the present invention.
FIG. 20 is a top view of the composite chip according to the fourth embodiment.
[Explanation of symbols]
1, 101 Alumina substrate 2, 102, 302, 402 Internal electrode A
3, 103, 303, 403 Thermistor layer 4, 104, 204, 304, 404 Internal electrode B
5, 105, 205, 305, 405 Resistor layer 6, 106, 206, 306, 406 Internal electrode C
7, 107, 207, 307, 407 Protective coat 8, 108, 208, 308, 408 Terminal electrode A
9, 109, 209, 309, 409 Terminal electrode B
10, 11, 210, 211, 301, 311, 410, 411 Side electrode

Claims (13)

A chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material,
A thermistor layer formed on one end side of the base,
A resistor layer formed on the other end side of the base with a predetermined distance from the thermistor layer;
A first electrode formed on one surface of the thermistor layer from one end surface of the base;
A second electrode formed on one surface of the resistor layer from the other end surface of the base;
A third electrode formed between the other surface of the thermistor layer and the other surface of the resistor layer, the third electrode having an extending portion extending to the side surface of the base between the thermistor layer and the resistor layer;
A chip-type composite component wherein a thermistor layer, a third electrode, a resistor layer, and a second electrode are connected in series from the first electrode. Forming the first electrode on the base, forming the thermistor layer on the base central part from the first electrode, forming the third electrode on the base from the thermistor layer, 2. The device according to claim 1, wherein the resistor layer is formed on the base from the third electrode, and the second electrode is formed on the other end of the base from the resistor layer. The described chip-type composite part. The first electrode and the second electrode are formed on the base, the thermistor layer is formed on the base of the base from the first electrode, and the center of the base is formed on the second electrode. 2. The chip type composite according to claim 1, wherein a resistor layer is formed thereon, and said third electrode is formed on said resistor layer from above the said thermistor layer to above said central portion of said base. parts. The third electrode is formed on the base, the thermistor layer is formed from near the center of the third electrode to near one end of the base, and the base is formed from near the center of the third electrode. Forming the resistor layer near the other end of the substrate, forming the first electrode on the one end of the base from above the thermistor layer, and forming the first electrode on the other end of the base from above the resistor layer 2. The chip-type composite component according to claim 1, wherein said second electrode is formed. The first electrode, the second electrode, and the third electrode are formed in a row at predetermined intervals on the base, and the thermistor layer is formed across the first electrode and the third electrode. 2. The chip-type composite component according to claim 1, wherein the resistor layer is formed so as to straddle the second electrode and the third electrode. Further, a coat layer is formed thereon to form a protective coat, and external connection electrodes respectively connected to the first electrode and the second electrode are formed, and an end of an extension of the third electrode is formed. The chip-type composite component according to claim 1, wherein a side electrode connected to the chip-type composite component is formed. 7. The chip-type composite component according to claim 1, wherein an identification mark is displayed on one of the thermistor layer and the resistor layer. A method for manufacturing a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material,
A first electrode forming step of forming a first electrode extending from one end surface of the base to the center,
A thermistor layer forming step of forming the thermistor layer on the central part of the base from the first electrode;
A third electrode forming step of forming a third electrode having an extension extending from the other surface of the thermistor layer toward the other end of the base at the center of the base and to the side of the base;
A resistor layer forming step of forming a resistor layer on the base from the third electrode;
A second electrode forming step of forming the second electrode on the other end of the base from above the resistor layer,
The third electrode formed in the third electrode forming step is formed between the other surface of the thermistor layer and the other surface of the resistor layer, and extends to the side surface of the base between the thermistor layer and the resistor layer. A method of manufacturing a chip-type composite component, comprising: A method for manufacturing a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material,
A first electrode forming step of forming a first electrode extending from one end surface of the base to the center,
A second electrode forming step of forming the second electrode extending to the center from the other end surface of the base;
A thermistor layer forming step of forming the thermistor layer on the central part of the base from the first electrode;
A resistor layer forming step of forming a resistor layer from the second electrode on the base central portion;
A third electrode forming step of forming a third electrode formed on the resistor layer from the upper surface of the thermistor layer through the central portion of the base and extending to the side surface of the base at the central portion of the base; A method for producing a chip-type composite component, comprising: A method for manufacturing a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material,
A third electrode forming step of forming a third electrode having an extending portion extending to a side surface of the base at a central portion of the base;
A thermistor layer forming step of forming a thermistor layer from near the center of the third electrode to near one end of the base;
A resistor layer forming step of forming the resistor layer from near the center of the third electrode to near the other end of the base;
A first electrode forming step of forming the first electrode from the thermistor layer on one end of the base;
A method for manufacturing a chip-type composite component, comprising a second electrode forming step of forming the second electrode from the resistor layer on the other end of the base. A method for manufacturing a chip-type composite component in which a thermistor and a resistance element are connected in series on a base made of an insulating material,
A first electrode forming step of forming a first electrode extending from one end surface of the base to the center,
A third electrode forming step of forming a third electrode having an extending portion extending to a side surface of the base at a central portion of the base;
A second electrode forming step of forming a second electrode extending to the center from the other end face of the base;
A thermistor layer forming step of forming the thermistor layer across the first electrode and the second electrode;
A resistor layer forming step of forming the resistor layer across the second electrode and the third electrode,
A method of manufacturing a chip-type composite component, wherein the first electrode, the second electrode, and the third electrode formed on the base are formed in a row at predetermined intervals. A protective coat forming step of further forming a coat layer thereon and forming a protective coat,
An external electrode forming step of forming external connection electrodes respectively connected to the first electrode and the third electrode;
12. The method for manufacturing a composite chip-type component according to claim 8, further comprising a side electrode forming step of forming a side electrode connected to the extension of the third electrode. . 13. The method according to claim 12, further comprising an identification mark displaying step of displaying an identification mark on either the thermistor layer or the resistor layer of the protective coating layer.

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