JP2004031732A5 - - Google Patents
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- JP2004031732A5 JP2004031732A5 JP2002187257A JP2002187257A JP2004031732A5 JP 2004031732 A5 JP2004031732 A5 JP 2004031732A5 JP 2002187257 A JP2002187257 A JP 2002187257A JP 2002187257 A JP2002187257 A JP 2002187257A JP 2004031732 A5 JP2004031732 A5 JP 2004031732A5
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- JP
- Japan
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- groove
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002187257A JP3953900B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002187257A JP3953900B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004031732A JP2004031732A (ja) | 2004-01-29 |
JP2004031732A5 true JP2004031732A5 (uk) | 2005-06-02 |
JP3953900B2 JP3953900B2 (ja) | 2007-08-08 |
Family
ID=31182345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002187257A Expired - Fee Related JP3953900B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3953900B2 (uk) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7765691B2 (en) * | 2005-12-28 | 2010-08-03 | Intel Corporation | Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate |
JP5183045B2 (ja) * | 2006-07-20 | 2013-04-17 | 三洋電機株式会社 | 回路装置 |
JP2008060372A (ja) * | 2006-08-31 | 2008-03-13 | Sanyo Electric Co Ltd | 回路装置およびその製造方法、配線基板およびその製造方法 |
US8436250B2 (en) | 2006-11-30 | 2013-05-07 | Sanyo Electric Co., Ltd. | Metal core circuit element mounting board |
JP2010278379A (ja) * | 2009-06-01 | 2010-12-09 | Murata Mfg Co Ltd | 配線基板およびその製造方法 |
JPWO2011002031A1 (ja) | 2009-06-30 | 2012-12-13 | 三洋電機株式会社 | 素子搭載用基板および半導体モジュール |
KR101044127B1 (ko) | 2009-11-16 | 2011-06-28 | 삼성전기주식회사 | 방열기판 및 그 제조방법 |
JP2012114217A (ja) | 2010-11-24 | 2012-06-14 | Nitto Denko Corp | 配線回路基板の製造方法 |
KR101177651B1 (ko) * | 2011-01-25 | 2012-08-27 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP5178899B2 (ja) | 2011-05-27 | 2013-04-10 | 太陽誘電株式会社 | 多層基板 |
-
2002
- 2002-06-27 JP JP2002187257A patent/JP3953900B2/ja not_active Expired - Fee Related
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