JP2004022636A - Ceramic electronic part and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for chamfering, without chipping or cracking, even if the thickness of a rectangular parallelepiped chip of ceramic for an electronic part body provided to a ceramics electronic part is 0.3 mm thick or less. <P>SOLUTION: A plurality of chips 31 are arranged on a foamed release sheet 32 with the main surfaces 33 of the chips 31 arrayed in plane at prescribed intervals 34. The chip 31 is blast-processed in which a blast material 38 is blown from a blast nozzle 36 for chamfering the chip 31. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a ceramic electronic component and a ceramic electronic component, and more particularly to an improvement in a method for chamfering a chip serving as an electronic component body provided in the ceramic electronic component.
[0002]
[Prior art]
8 and 9 each show a multilayer ceramic capacitor as an example of a ceramic electronic component that is of interest to the present invention.
[0003]
The multilayer ceramic capacitor 1 shown in FIG. 8 has a general structure. The multilayer ceramic capacitor 1 has an electronic component body 2 provided by a rectangular chip made of ceramic. The electronic component body 2 has a laminated structure including a plurality of ceramic layers 3 made of a dielectric ceramic. Along the specific interface between the ceramic layers 3, the first and second internal electrodes 4 and 5 are formed so as to face each other and alternately.
[0004]
The first internal electrode 4 is formed so as to reach a specific side surface 6 of the electronic component body 2, and the second internal electrode 5 is formed so as to reach a side surface 7 facing the side surface 6. . First and second external electrodes 8 and 9 are formed on side surfaces 6 and 7, respectively, and are electrically connected to the first and second internal electrodes, respectively.
[0005]
In order to manufacture such a multilayer ceramic capacitor 1, the electronic component body 2 is manufactured through a firing step, and then chamfering is performed mainly for the purpose of preventing chipping or cracking of the electronic component body 2, Thereafter, a conductive paste is applied on each of the side surfaces 6 and 7 by dipping, and the conductive paste is baked to form first and second external electrodes 8 and 9.
[0006]
The multilayer ceramic capacitor 11 shown in FIG. 9 has a structure that is advantageously employed in a thin multilayer ceramic capacitor. The multilayer ceramic capacitor 11 includes an electronic component body 12 provided by a rectangular chip made of ceramic. The electronic component body 12 has a laminated structure including a plurality of ceramic layers 13 made of a dielectric ceramic. Along the specific interface between the ceramic layers 13, the first and second internal electrodes 14 and 15 are formed so as to face each other and alternately.
[0007]
At opposite ends of the electronic component body 12, first and second through conductors 16 and 17 are provided so as to penetrate in the thickness direction, respectively. The first and second through conductors 16 and 17 are electrically connected to the first and second internal electrodes 14 and 15, respectively, inside the electronic component body 2.
[0008]
First external electrodes 18 and 19 are formed on main surfaces 20 and 21 of electronic component body 12, respectively, so as to be electrically connected to first through conductor 16, and are electrically connected to second through conductor 17. Second external electrodes 22 and 23 are formed on main surfaces 20 and 21 of electronic component body 12, respectively, so as to be electrically connected.
[0009]
In order to manufacture such a multilayer ceramic capacitor 11, in the raw state of the electronic component body 12, through holes 24 and 25 for the first and second through conductors 16 and 17 are provided, and the through holes 24 and 25 are provided. The inside is filled with a conductive paste. The conductive paste may be applied only on the inner peripheral surfaces of the through holes 24 and 25. Next, the raw electronic component body 12 is fired, and then chamfering is performed mainly for the purpose of preventing chipping and cracking of the electronic component body 12, and thereafter, a conductive paste is applied by screen printing, By baking this, external electrodes 18, 19, 22 and 23 are formed.
[0010]
In the production of the multilayer ceramic capacitors 1 and 11, the chamfering process described above is usually performed by barrel polishing. By barrel polishing, chamfering is performed at each ridge line portion of the sintered chip that becomes the electronic component body 2 or 12, and the surface is polished, thereby removing burrs and chipping due to remaining burrs and the like. Chipping such as cracking is prevented.
[0011]
Further, in the case of the electronic component body 2 shown in FIG. 8, the internal electrodes 4 and 5 can be reliably exposed on the side surfaces 6 and 7 by chamfering. In the case of the electronic component body 12 shown in FIG. 9, the through conductors 16 and 17 can be reliably exposed on the main surfaces 20 and 21 by the chamfering process. Further, when dicing and cutting a mother structure that gives a plurality of chips by separation in order to obtain a plurality of chips, the saw marks are also removed by the barrel polishing.
[0012]
[Problems to be solved by the invention]
However, as a result of the above-mentioned barrel polishing, chips may be chipped or cracked. In particular, a chip having a small thickness such as a chip for the electronic component body 12 shown in FIG. 9, for example, a chip having a thickness of 0.3 mm or less such as 0.15 mm or 0.1 mm has chipping or chipping. Chipping such as cracking is more likely to occur.
[0013]
In order to prevent such chipping, reducing the time for performing barrel polishing or reducing the number of rotations per unit time applied in barrel polishing, if conditions for barrel polishing are moderated, it is sufficient. Since the polished state cannot be achieved, chipping is likely to occur in a later step. In the case of the multilayer ceramic capacitor 1 shown in FIG. 8, the connection between the internal electrodes 4 and 5 and the external electrodes 8 and 9 is made. Failure may occur.
[0014]
Therefore, an object of the present invention is to provide a method of manufacturing a ceramic electronic component and a ceramic electronic component that can solve the above-described problems.
[0015]
[Means for Solving the Problems]
The present invention is first directed to a method for manufacturing a ceramic electronic component, and is characterized in that, in order to solve the above-described technical problem, blasting is simply employed in a chamfering step.
[0016]
More specifically, the method for manufacturing a ceramic electronic component according to the present invention includes the steps of: forming a plurality of rectangular parallelepiped chips formed of ceramic for an electronic component body provided in the ceramic electronic component; And a step of aligning and arranging the chips on the support table at a predetermined interval from each other, and a step of blasting a plurality of chips on the support table to chamfer the chips. Features. The above-described blasting step is performed for both a state in which the first main surface of the chip faces outward and a state in which the second main surface faces outward.
[0017]
The support described above is preferably provided by a sheet having an adhesive surface. Therefore, in order to arrange the chips on the support, a step of adhering the plurality of chips to the adhesive surface is performed.
[0018]
The sheet described above is preferably provided by a foam release sheet. The foamed release sheet is generally used in the field of semiconductor devices and other electronic components to fix a structure to be cut by dicing with an adhesive.
[0019]
In the method for manufacturing a ceramic electronic component according to the present invention, when the above-described foamed release sheet is used as the support, the step of disposing the chips on the support includes the step of foaming a mother structure that provides a plurality of chips by separation. It is preferable to include a step of sticking on a release sheet and a step of separating the mother structure on a foamed release sheet to obtain a plurality of chips. With such a configuration, it is possible to obtain a state in which a plurality of chips are arranged and arranged on the support table when the mother structure is separated.
[0020]
In the step of separating the mother structure, it is preferable to dice and cut the mother structure. According to this, at the stage after the dicing cut, a predetermined interval can be naturally formed between the plurality of chips.
[0021]
In the present invention, when the sheet having the adhesive surface as described above is used as the support, in the step of arranging the chips on the support, the sheet is pulled in the surface direction, whereby a predetermined distance is set between the chips. May be formed, or a predetermined space may be formed between the chips by bending the sheet with the side on which the chips are arranged facing outward.
[0022]
In the method for manufacturing a ceramic electronic component according to the present invention, in the step of performing the blast processing, preferably, a longitudinal blast nozzle that covers a width of a region where a plurality of chips is arranged is used. In this case, in the blasting step, the blast nozzle is arranged above the chip, and the blast nozzle and the support are relatively moved in a direction intersecting with the longitudinal direction of the blast nozzle, whereby a plurality of chips are formed. To achieve the blasting process for the entire area where. In this case, the relative movement between the blast nozzle and the support may be such that only the blast nozzle is moved, only the support is moved, or both the blast nozzle and the support are moved.
[0023]
The direction in which the blast material is sprayed by the blast nozzle is preferably selected so as to be in the range of 30 to 60 degrees with respect to the main surface of each chip.
[0024]
In the preferred embodiment described above, when the blast nozzle and the support base relatively reciprocate, between the forward movement and the backward movement, the direction in which the blast material is sprayed by the blast nozzle is such that the chip is blown. It is preferable that the surface is changed to be symmetrical with a plane orthogonal to the main surface as a plane of symmetry.
[0025]
Instead of the above embodiment, two blast nozzles may be used. In this case, the direction in which the blast material is sprayed by the first blast nozzle and the direction in which the blast material is sprayed by the second blast nozzle are symmetric with respect to each other, with the plane orthogonal to the main surface of the chip as the plane of symmetry. It is preferred that
[0026]
Further, the direction in which the blast nozzle and the support table are relatively moved may be selected to be a direction that forms an angle of substantially 45 degrees with the direction in which the side that defines the main surface of each chip extends.
[0027]
As described above, the step of blasting is performed for both the state in which the first main surface of the chip is directed outward and the state in which the second main surface is directed outward. It is preferable to carry out a step of transferring from the first sheet to the second sheet due to the difference in adhesive strength of the adhesive surface.
[0028]
The present invention is also directed to a ceramic electronic component having a chip as an electronic component body obtained by the above-described manufacturing method. The effect of the present invention is particularly remarkable when the electronic component body has a thickness of 0.3 mm or less.
[0029]
The electronic component body described above preferably has a laminated structure including a plurality of ceramic layers.
[0030]
The ceramic electronic component according to the present invention has the following structural features. That is, the ceramic electronic component according to the present invention has first and second main surfaces facing each other, and four side surfaces connecting between the first and second main surfaces, and is made of ceramic. A chip having a rectangular parallelepiped shape is used as a main body of the electronic component, and chamfering at a ridge line at which each of the first and second main surfaces of the chip and the side surface intersect is performed at a ridge line at which adjacent side surfaces intersect with each other. Deeper than chamfer.
[0031]
BEST MODE FOR CARRYING OUT THE INVENTION
1 to 4 illustrate a first embodiment of the present invention. Here, FIG. 1 is a plan view showing a state in which a plurality of chips 31 are arranged on a foam release sheet 32 as a support base. The chip 31 is to be the electronic component body 2 or 12 shown in FIG. 8 or 9 described above, and has a relatively thin rectangular parallelepiped shape. The chips 31 are arranged on the foamed release sheet 32 with their main surfaces 33 arranged in a plane and arranged with a predetermined interval 34 therebetween.
[0032]
The foam release sheet 32 has an adhesive surface 35 for holding the chip 31 by adhesive. Although not shown in detail, the foam release sheet 32 has, for example, a structure in which a base material made of polyethylene terephthalate is provided, and a foam release layer is formed thereon, and the thickness thereof is about 0.15 mm as a whole. It is. The foam release layer is made of, for example, a thermosetting resin or an ultraviolet curable resin, and the adhesive surface 35 described above is given by the adhesive force of the resin before curing. When the chip 31 is to be peeled off from the foamed release sheet 32, if heat or ultraviolet rays are applied to the foamed release layer, it is cured, thereby losing tackiness. Can be.
[0033]
In order to obtain the state shown in FIG. 1, after preparing a plurality of chips 31, they may be arranged and arranged on the foamed release sheet 32, but preferably, the following steps are performed. You. That is, a mother structure that provides a plurality of chips 31 by separation is prepared, and this mother structure is adhered to the foamed release sheet 32. Then, the mother structure is separated on the foam release sheet 32 to obtain a plurality of chips 31. In this separation step, if the mother structure is diced and cut, the groove formed by the dicing cut can function as the above-described space 34 as it is.
[0034]
In this embodiment, the chip 31 has, for example, a longitudinal dimension of 1.0 to 1.6 mm, a width dimension of 0.5 to 0.8 mm, and a thickness dimension of 0.1 to 0.3 mm. ing. The interval between the adjacent chips 31 on the foam release sheet 32 is, for example, about 0.15 mm.
[0035]
FIG. 2 is a front view showing a state where the blasting process is being performed.
[0036]
In performing the blast processing, the blast nozzle 36 is disposed above the chip 31. The blast nozzle 36 has a longitudinal shape that covers the width of the region where the plurality of chips 31 are arranged, as indicated by the dashed line in FIG. Further, in order to achieve the blast processing on the entire area where the plurality of chips 31 are arranged, the blast nozzle 36 is moved in a direction intersecting with the longitudinal direction of the blast nozzle 36 as shown by an arrow 37. .
[0037]
The preferred direction of spraying the blast material 38 by the blast nozzle 36 depends on the thickness dimension of the chip 31 and the size of the interval 34, but is generally 30 to 60 degrees with respect to the main surface 33 of each chip 31. Is preferably selected so as to fall within the range. Thus, the blast material 38 can be sprayed simultaneously and substantially evenly on both the main surface 33 and the side surface 39 of the chip 31.
[0038]
In such a blasting process, for example, alumina powder is used as the blast material 38 as a medium, and sand blasting (dry blasting) is performed by blowing the alumina powder with air.
[0039]
Further, as described above, after the blast nozzle 36 is moved in the direction of the arrow 37, it is preferable to move the blast nozzle 36 in the opposite direction as indicated by the broken arrow 40. As described above, when the blast nozzle 36 is reciprocated, the direction in which the blast material 38 is sprayed by the blast nozzle 36 between the forward movement indicated by the arrow 37 and the backward movement indicated by the arrow 40 is shown in FIG. As shown in the figure, it is preferable that a plane orthogonal to the main surface 33 of the chip 31 is changed to be symmetrical with respect to a plane of symmetry. Thereby, in the backward movement of the blast nozzle 36, the blast material 38 can be simultaneously sprayed on both the side surface 41 of the chip 31 and the main surface 33 facing the side surface 39 described above.
[0040]
In this embodiment, it is preferable that the blast nozzle 36 is disposed so that its longitudinal direction is oriented in the horizontal direction in FIG. 1, and is further reciprocated as indicated by the double-headed arrow 42.
[0041]
As shown in FIG. 2, after the blast processing is performed with the main surface 33 of the chip 31 facing outward, the same blast processing is performed with the main surface 43 facing the main surface 33 facing outward. Repeated. As described above, in order to perform the blasting process with the main surface 43 facing outward, the chip 31 is transferred from the illustrated first foam release sheet 32 to another second foam release sheet. At this time, it is preferable that the second foam release sheet has a stronger adhesive force on the adhesive surface than the first foam release sheet 32. By adopting such a configuration, the second foam release sheet is superimposed on the chip 31 arranged on the first foam release sheet 32, and after appropriately pressing, the first foam release sheet 32 is removed. By peeling, the chips 31 can be efficiently and reliably transferred onto the second foamed release sheet.
[0042]
FIG. 3 is a perspective view showing the appearance of the chip 31, and is for explaining the degree of chamfering by blast processing. Note that FIG. 3 does not show a chamfered state, and therefore, it may be understood that the illustrated chip 31 is in a state before the blast processing.
[0043]
Referring to FIG. 3, chip 31 has opposite main surfaces 33 and 43 as described above, and includes four side surfaces connecting main surfaces 33 and 43 in addition to side surfaces 39 and 41 described above. It has a rectangular parallelepiped shape having side surfaces 44 and 45.
[0044]
The frequency at which the blast material 38 is sprayed in the blasting process shown in FIG. 2 is relatively high at the ridge line 46 where each of the main surfaces 33 and 43 intersects the side surfaces 39, 41, 44 and 45, while being adjacent to each other. The sides 39, 41, 44 and 45 are relatively low at the ridge 47 where they intersect. As a result, as shown in FIG. 4, the chamfer at the ridge line 46 of the former is deeper than the chamfer at the ridge line 47 of the latter. FIG. 4 illustrates a cross section of a ridge line 46 surrounded by a broken line in FIG.
[0045]
As described above, since the chamfer at the ridge line 46 is deeper than the chamfer at the ridge line 47, the chamfer radius at the ridge line 46 is larger than the chamfer radius at the ridge line 47. When the external electrodes 8 and 9 and 18, 19, 22 and 23 are formed in the electronic component main bodies 2 and 12 shown in FIG. 8 or FIG. Is better when the chamfer radius at the ridge line 46 is larger. On the other hand, the chamfer radius at the ridge line 47 does not significantly affect the solderability. Therefore, when the chamfer at the ridge line 46 is made deeper as in this embodiment, good solderability can be obtained.
[0046]
FIG. 5 is a diagram corresponding to FIG. 1 for describing a second embodiment of the present invention. 5, elements corresponding to the elements shown in FIG. 1 are denoted by the same reference numerals, and overlapping description will be omitted.
[0047]
In the second embodiment, the direction of movement of the blast nozzle 36 substantially forms an angle of 45 degrees with the direction in which the side defining the main surface 33 of each chip 31 extends, as indicated by an arrow 48. It is characterized by being selected in such a direction.
[0048]
According to this embodiment, the blast material can be sprayed simultaneously and substantially evenly on two side surfaces of the chip 31, for example, the side surfaces 39 and 44 or the side surfaces 41 or 45. Therefore, the four side surfaces 39 and 41 of the chip 31 are moved only in one direction such that the blast nozzle 36 is moved in the direction indicated by the arrow 48 and then moved back in the direction indicated by the dashed arrow 49. , 44 and 45 can be sufficiently sprayed with the blast material. In other words, it is not necessary to move the blast nozzle 36 in a direction orthogonal to the arrows 48 and 49.
[0049]
In the second embodiment as well, the direction in which the blast material is sprayed by the blast nozzle 36 is selected as described above with reference to FIG. That is, the spraying direction of the blast material is selected so as to be in the range of 30 to 60 degrees with respect to the main surface 33 of each chip 31, and the blast nozzle 36 moves in the directions of arrows 48 and 49. The blasting direction of the blast material is changed so that the plane orthogonal to the main surface 33 of the chip 31 is symmetrical.
[0050]
Also, in this embodiment, the blast nozzle 36 has a longitudinal shape that covers the width of the region where the plurality of chips 31 are arranged, and the moving direction of the blast nozzle 36 is The direction is chosen to intersect.
[0051]
FIG. 6 is a diagram corresponding to FIG. 2 for describing a third embodiment of the present invention. 6, elements corresponding to the elements shown in FIG. 2 are denoted by the same reference numerals, and redundant description will be omitted.
[0052]
The third embodiment is characterized in that two blast nozzles 36a and 36b are used. Further, the direction in which the blast material 38 is sprayed by the first blast nozzle 36a and the direction in which the blast material 38 is sprayed by the second blast nozzle 36b are symmetrical with respect to a plane orthogonal to the main surface 33 of the chip 31. Is to be.
[0053]
According to this embodiment, it is not necessary to reciprocate the blast nozzles 36a and 36b, but only one way as shown by an arrow 37, for example. Other configurations are the same as those in the first embodiment described above.
[0054]
FIG. 7 is a diagram corresponding to FIG. 2 for describing a fourth embodiment of the present invention. 7, elements corresponding to the elements shown in FIG. 2 are denoted by the same reference numerals, and redundant description will be omitted.
[0055]
In the fourth embodiment, when the mother structure is separated on the foam release sheet 32 to obtain a plurality of chips 31, the gaps 34 between the chips 31 are substantially absent or larger than a predetermined size. It is advantageously applied when it is small. For example, when the mother structure is separated by dicing cut, a relatively large space is formed as the gap 34. However, when push-cutting or the like is applied, the gap 34 is substantially absent or slightly set as the gap 34. Is formed.
[0056]
In the case described above, the foam release sheet 32 is disposed on, for example, the cylindrical member 51, whereby the foam release sheet 32 is curved with the side on which the chip 31 is disposed facing outward. This makes it possible to reliably form the predetermined interval 34 between the chips 31.
[0057]
Further, in this embodiment, if the blasting direction of the blast material 38 by the blast nozzle 36 is directed to the center of the cylindrical member 51, each side surface of the adjacent chips 31 defining the space 34, for example, the side surfaces 39 and 41 is formed. Since it is in a V-shaped open state, the blast material 38 can be sprayed simultaneously and substantially evenly on two side surfaces of the chip 31 defining the space 34, for example, the side surfaces 39 and 41.
[0058]
Further, in this embodiment, since the foam sheet 32 can be moved by rotating the cylindrical member 51, the blast nozzle 36 is fixed, and the entire area where the plurality of chips 31 are arranged is kept. Blasting can be achieved.
[0059]
Further, in the above description, the side where the chips 31 are arranged is directed outward, and the foam release sheet 32 is curved, so that the side surfaces 39 and 41 of the adjacent chips 31 are opened in a V-shape. In the embodiment, the bending of the foam release sheet 32 is usually repeated so that the side surfaces 44 and 45 of the adjacent chips 31 are opened in a V-shape.
[0060]
In order to form a predetermined space 34 between the chips 31, the following method may be employed instead of the method shown in FIG. 7. That is, referring to FIG. 2, if the foam release sheet 32 is pulled in the plane direction as indicated by arrows 52 and 53, the interval 34 can be widened to a predetermined size.
[0061]
Although the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.
[0062]
For example, in the first embodiment described with reference to FIGS. 1 to 4, the blast nozzle 36 is configured to move, but the movement may be relative to the foam release sheet 32. For example, even if the foam release sheet 32 is moved, both the blast nozzle 36 and the foam release sheet 32 may be moved.
[0063]
Similarly, in the fourth embodiment described with reference to FIG. 7, even if the blast nozzle 36 is configured to move instead of the foam release sheet 32 moving, the foam release sheet 32 and the blast nozzle 36 may be configured to move.
[0064]
Further, although the illustrated blast nozzle 36 has a long shape, a blast nozzle having an arbitrary shape such as a circular shape can be used.
[0065]
Further, at the time of the blasting, in addition to the above-mentioned dry type, for example, a wet blast in which alumina powder is sprayed with water may be employed depending on the type of the chip 31 to be blasted. , The type and particle size thereof can be appropriately changed.
[0066]
Further, in the illustrated embodiment, the foam release sheet 32 is used as a support for disposing a plurality of chips 31, but instead of this, a sheet other than the foam release sheet having an adhesive surface is used. May be used, and a plate-like member made of, for example, a rigid body may be used instead of a sheet-like member.
[0067]
Further, the chip 31 is exemplified as one constituting an electronic component main body for a multilayer ceramic capacitor, and has a multilayer structure including a plurality of ceramic layers. However, the chip 31 may have a single-layer plate shape. Good.
[0068]
【The invention's effect】
As described above, according to the present invention, in order to chamfer chips made of ceramics for the electronic component body provided in the ceramic electronic component, the main surfaces of the chips are arranged in a plane and are spaced apart from each other by a predetermined distance. In this state, the chips are blasted with respect to the chips in this state, and the chips play a role of reinforcement, and have a thin thickness of, for example, 0.3 mm or less. Even in the case of chips, chipping and cracking can be less likely to occur as compared with the case where barrel polishing is applied.
[0069]
In the barrel polishing, it is impossible to visually observe the chamfered state of the chip while performing the processing. However, if the blast processing is applied as in the present invention, the processing is performed during the processing. The state of the chamfer of the chip can be visually observed.
[0070]
Further, according to the present invention, even after the blast processing is completed, the state in which the plurality of chips are aligned on the support base is maintained, so that a process such as a visual inspection of the chips is immediately performed. be able to.
[0071]
In the present invention, when a sheet having an adhesive surface is used as the support, the process of aligning and arranging a plurality of chips on the support can be efficiently performed.
[0072]
When a foam release sheet is used as the above-described sheet, a mother structure separation step of obtaining a plurality of chips is performed in a state where a mother structure provided by a plurality of chips is adhered to the foam release sheet by separation. Since it can be performed, a complicated step of arranging the individual chips on the support table can be omitted.
[0073]
In the step of separating the mother structure described above, when dicing cut is applied, a predetermined interval is naturally formed between the separated adjacent chips, so that the trouble of forming the predetermined interval is omitted. be able to.
[0074]
In the present invention, when a sheet having an adhesive surface such as a foamed release sheet is used as the support base, the sheet is pulled in the surface direction, or the sheet is bent with the side where the chips are arranged facing outward. By doing so, a predetermined interval can be reliably formed between the chips, or the interval can be expanded to a predetermined size.
[0075]
In the present invention, when a long blast nozzle covering the width of the region where a plurality of chips are arranged is used, it is only necessary to relatively move the blast nozzle and the support base in a direction intersecting the longitudinal direction. Since the blast processing can be achieved for the entire area where a plurality of chips are arranged, the blast processing step can be efficiently performed.
[0076]
In the above case, if the blasting direction of the blast material by the blast nozzle is selected so as to be in a range of 30 to 60 degrees with respect to the main surface of each chip, the main surface and side surfaces of the chip are simultaneously and substantially evenly applied. Blast material can be sprayed on the blasting device, and the efficiency of the blasting process can be further improved.
[0077]
Further, in the above-described case, while the blast nozzle and the support table are relatively reciprocated, the direction of spraying of the blast material by the blast nozzle between the forward movement and the backward movement is determined by the tip of the chip. If the plane orthogonal to the main surface is changed to be symmetrical with respect to the plane of symmetry, it is easy to average the frequency of spraying the blast material on each side surface of the chip.
[0078]
Instead of the above method, two blast nozzles are used, and the blast material spray direction of the first blast nozzle and the blast material spray direction of the second blast nozzle are orthogonal to the main surface of the chip. If the surfaces are symmetrical to each other and are symmetrical, it becomes easy to average the frequency of blasting of the blasting material to each side of the chip only by one-way movement, thereby further improving the efficiency of the blasting process. Can be planned.
[0079]
Further, when relatively moving the blast nozzle and the support base, a movement in a direction substantially at an angle of 45 degrees with respect to a direction in which a side that defines a main surface of each chip extends is adopted. The blast material can be sprayed simultaneously and substantially evenly on two adjacent side surfaces of the chip, and this method can further increase the efficiency of the blasting process.
[0080]
In order to perform the blasting process in both the state where the first main surface of the chip is directed outward and the state where the second main surface is directed outward, the chip is transferred from the first sheet to the second sheet. If the transfer is performed based on the difference in adhesive strength between the adhesive and the adhesive surface, such transfer can be performed efficiently.
[0081]
According to the ceramic electronic component of the present invention, the chamfer at the ridge line at which each of the first and second principal surfaces of the chip and the side surface intersect is more than the chamfer at the ridge line at which the adjacent side surfaces intersect each other. When the external electrode is formed in relation to the ridgeline where the main surface and the side surface intersect, the most efficient chamfering state can be obtained for improving the solderability to the external electrode.
[Brief description of the drawings]
FIG. 1 is a plan view for explaining a first embodiment of the present invention and showing a state in which a plurality of chips 31 are arranged on a foam release sheet 32. FIG.
FIG. 2 is a front view showing a state where blast processing is being performed on the chip 31 shown in FIG. 1;
FIG. 3 is a perspective view showing an appearance of a chip 31 for explaining a chamfered state by blast processing.
4 is a cross-sectional view illustrating a degree of chamfering by blast processing, and is a cross-sectional view illustrating a chamfering state at a ridge line 46 surrounded by a broken line and a cross-sectional view illustrating a chamfering state at a ridge line 47 surrounded by a broken line in FIG. FIG.
FIG. 5 is a diagram corresponding to FIG. 1 for describing a second embodiment of the present invention.
FIG. 6 is a diagram corresponding to FIG. 2 for describing a third embodiment of the present invention.
FIG. 7 is a diagram corresponding to FIG. 2 for describing a fourth embodiment of the present invention.
FIG. 8 is a sectional view showing a multilayer ceramic capacitor 1 as an example of a ceramic electronic component that is of interest to the present invention.
FIG. 9 is a sectional view showing a multilayer ceramic capacitor 11 as another example of a ceramic electronic component of interest to the present invention.
[Explanation of symbols]
1,11 multilayer ceramic capacitors
2,12 Electronic component body
3,13 ceramic layer
31 chips
32 Foam release sheet
33, 43 main surface
34 intervals
35 adhesive surface
36, 36a, 36b Blast nozzle
38 Blast material
39,41,44,45 side view

Claims (17)

A plurality of rectangular parallelepiped chips made of ceramic for an electronic component main body provided in a ceramic electronic component are placed on a support table in a state where the main surfaces of the respective chips are arranged in a plane and separated from each other by a predetermined distance. Arranging and arranging;
Blasting the plurality of chips on the support base to chamfer the chips,
The method of manufacturing a ceramic electronic component, wherein the step of performing the blast processing is performed in both a state in which a first main surface of the chip faces outward and a state in which a second main surface faces outward. The ceramic of claim 1, wherein the support is provided by a sheet having an adhesive surface, and disposing the chips on the support comprises attaching a plurality of the chips to the adhesive surface. Manufacturing method of electronic components. The method according to claim 2, wherein the sheet is provided by a foam release sheet. The step of arranging the chips on a support, the step of adhering a mother structure that provides a plurality of the chips by separation on the foamed release sheet, and obtaining a plurality of the chips, the mother structure The method of manufacturing a ceramic electronic component according to claim 3, further comprising a step of separating on the foam release sheet. The method of manufacturing a ceramic electronic component according to claim 4, wherein the step of separating the mother structure includes a step of dicing and cutting the mother structure. 6. The method according to claim 2, wherein the step of disposing the chips on a support comprises a step of pulling the sheet in a plane direction to form the predetermined interval between the chips. Manufacturing method of ceramic electronic components. The step of arranging the chips on a support base includes bending the sheet with the side on which the chips are arranged facing outward to form the predetermined space between the chips. Item 6. The method for manufacturing a ceramic electronic component according to any one of Items 2 to 5. The step of performing the blast processing includes a step of disposing a long blast nozzle covering the width of an area where the plurality of chips are arranged above the chip, and a step of arranging the entire area where the plurality of chips are arranged. The method according to any one of claims 1 to 7, further comprising: a step of relatively moving the blast nozzle and the support base in a direction intersecting with a longitudinal direction of the blast nozzle in order to achieve the blasting process. Manufacturing method of ceramic electronic components. The method for manufacturing a ceramic electronic component according to claim 8, wherein a blasting direction of the blast material by the blast nozzle is selected so as to be in a range of 30 to 60 degrees with respect to a main surface of each of the chips. The step of relatively moving the blast nozzle and the support pedestal includes the step of relatively reciprocating the blast nozzle and the support pedestal, between the forward movement and the backward movement. The method for manufacturing a ceramic electronic component according to claim 9, wherein a direction in which the blast material is sprayed by the blast nozzle is changed so as to be symmetrical with respect to a plane orthogonal to the main surface of the chip. Two blast nozzles are used, and the direction in which the blast material is sprayed by the first blast nozzle and the direction in which the blast material is sprayed by the second blast nozzle are orthogonal to the main surface of the chip. The method for manufacturing a ceramic electronic component according to claim 9, wherein the symmetry planes are symmetrical to each other. The direction of movement in the step of relatively moving the blast nozzle and the support table is selected in a direction that forms an angle of substantially 45 degrees with a direction in which a side that defines the main surface of each of the chips extends. The method of manufacturing a ceramic electronic component according to claim 8, wherein In order to perform the step of blasting both in a state where the first main surface of the chip is directed outward and in a state where the second main surface is directed outward, the chip is removed from the first sheet. The method for manufacturing a ceramic electronic component according to claim 2, further comprising a step of transferring to the second sheet due to a difference in adhesive strength of the adhesive surface. A ceramic electronic component, wherein the chip is an electronic component body obtained by the manufacturing method according to claim 1. The ceramic electronic component according to claim 14, wherein the electronic component body has a thickness of 0.3 mm or less. The ceramic electronic component according to claim 14, wherein the electronic component body has a laminated structure including a plurality of ceramic layers. A rectangular parallelepiped chip having first and second main surfaces facing each other and four side surfaces connecting the first and second main surfaces and made of ceramic is used as an electronic component body. , A ceramic electronic component,
A ceramic electronic component, wherein a chamfer at a ridge line at which each of the first and second main surfaces of the chip intersects with the side surface is deeper than a chamfer at a ridge line at which the adjacent side surfaces cross each other.

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