JP2004014902A - 半導体製造装置 - Google Patents

半導体製造装置 Download PDF

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Publication number
JP2004014902A
JP2004014902A JP2002168192A JP2002168192A JP2004014902A JP 2004014902 A JP2004014902 A JP 2004014902A JP 2002168192 A JP2002168192 A JP 2002168192A JP 2002168192 A JP2002168192 A JP 2002168192A JP 2004014902 A JP2004014902 A JP 2004014902A
Authority
JP
Japan
Prior art keywords
temperature
semiconductor manufacturing
thermocouple
temperature controller
thermocouples
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002168192A
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English (en)
Japanese (ja)
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JP2004014902A5 (enExample
Inventor
Hideto Yamaguchi
山口　英人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2002168192A priority Critical patent/JP2004014902A/ja
Publication of JP2004014902A publication Critical patent/JP2004014902A/ja
Publication of JP2004014902A5 publication Critical patent/JP2004014902A5/ja
Pending legal-status Critical Current

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JP2002168192A 2002-06-10 2002-06-10 半導体製造装置 Pending JP2004014902A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002168192A JP2004014902A (ja) 2002-06-10 2002-06-10 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002168192A JP2004014902A (ja) 2002-06-10 2002-06-10 半導体製造装置

Publications (2)

Publication Number Publication Date
JP2004014902A true JP2004014902A (ja) 2004-01-15
JP2004014902A5 JP2004014902A5 (enExample) 2005-10-13

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ID=30435168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002168192A Pending JP2004014902A (ja) 2002-06-10 2002-06-10 半導体製造装置

Country Status (1)

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JP (1) JP2004014902A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007112181A3 (en) * 2006-03-24 2007-11-22 Tokyo Electron Ltd Method of monitoring a semiconductor processing system using a wireless sensor network
CN100456187C (zh) * 2006-08-03 2009-01-28 上海交通大学 热处理无线虚拟仪表集中控制系统
CN119876565A (zh) * 2025-03-21 2025-04-25 浙江亨达光学有限公司 一种热处理炉、温控方法及其存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0931656A (ja) * 1995-07-24 1997-02-04 Ebara Corp 薄膜気相成長装置
JP2001126997A (ja) * 1999-10-29 2001-05-11 Hitachi Kokusai Electric Inc 縦型半導体製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0931656A (ja) * 1995-07-24 1997-02-04 Ebara Corp 薄膜気相成長装置
JP2001126997A (ja) * 1999-10-29 2001-05-11 Hitachi Kokusai Electric Inc 縦型半導体製造装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007112181A3 (en) * 2006-03-24 2007-11-22 Tokyo Electron Ltd Method of monitoring a semiconductor processing system using a wireless sensor network
US8026113B2 (en) 2006-03-24 2011-09-27 Tokyo Electron Limited Method of monitoring a semiconductor processing system using a wireless sensor network
CN100456187C (zh) * 2006-08-03 2009-01-28 上海交通大学 热处理无线虚拟仪表集中控制系统
CN119876565A (zh) * 2025-03-21 2025-04-25 浙江亨达光学有限公司 一种热处理炉、温控方法及其存储介质

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