JP2004014902A - 半導体製造装置 - Google Patents
半導体製造装置 Download PDFInfo
- Publication number
- JP2004014902A JP2004014902A JP2002168192A JP2002168192A JP2004014902A JP 2004014902 A JP2004014902 A JP 2004014902A JP 2002168192 A JP2002168192 A JP 2002168192A JP 2002168192 A JP2002168192 A JP 2002168192A JP 2004014902 A JP2004014902 A JP 2004014902A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- semiconductor manufacturing
- thermocouple
- temperature controller
- thermocouples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002168192A JP2004014902A (ja) | 2002-06-10 | 2002-06-10 | 半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002168192A JP2004014902A (ja) | 2002-06-10 | 2002-06-10 | 半導体製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004014902A true JP2004014902A (ja) | 2004-01-15 |
| JP2004014902A5 JP2004014902A5 (OSRAM) | 2005-10-13 |
Family
ID=30435168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002168192A Pending JP2004014902A (ja) | 2002-06-10 | 2002-06-10 | 半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004014902A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007112181A3 (en) * | 2006-03-24 | 2007-11-22 | Tokyo Electron Ltd | Method of monitoring a semiconductor processing system using a wireless sensor network |
| CN100456187C (zh) * | 2006-08-03 | 2009-01-28 | 上海交通大学 | 热处理无线虚拟仪表集中控制系统 |
| CN119876565A (zh) * | 2025-03-21 | 2025-04-25 | 浙江亨达光学有限公司 | 一种热处理炉、温控方法及其存储介质 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0931656A (ja) * | 1995-07-24 | 1997-02-04 | Ebara Corp | 薄膜気相成長装置 |
| JP2001126997A (ja) * | 1999-10-29 | 2001-05-11 | Hitachi Kokusai Electric Inc | 縦型半導体製造装置 |
-
2002
- 2002-06-10 JP JP2002168192A patent/JP2004014902A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0931656A (ja) * | 1995-07-24 | 1997-02-04 | Ebara Corp | 薄膜気相成長装置 |
| JP2001126997A (ja) * | 1999-10-29 | 2001-05-11 | Hitachi Kokusai Electric Inc | 縦型半導体製造装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007112181A3 (en) * | 2006-03-24 | 2007-11-22 | Tokyo Electron Ltd | Method of monitoring a semiconductor processing system using a wireless sensor network |
| US8026113B2 (en) | 2006-03-24 | 2011-09-27 | Tokyo Electron Limited | Method of monitoring a semiconductor processing system using a wireless sensor network |
| CN100456187C (zh) * | 2006-08-03 | 2009-01-28 | 上海交通大学 | 热处理无线虚拟仪表集中控制系统 |
| CN119876565A (zh) * | 2025-03-21 | 2025-04-25 | 浙江亨达光学有限公司 | 一种热处理炉、温控方法及其存储介质 |
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