JP2004014570A - Tape cutting and compressively bonding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape cutting and compressively bonding apparatus capable of sticking accurately each tape piece to a predetermined position present on a lead frame or a plastic board. <P>SOLUTION: The cutting and compressively bonding apparatus has a tape cutting mechanism for cutting a tape 14 exhibiting adhesiveness by heating into tape pieces 14a each having a constant length, a tape holder 5 capable of sucking and holding each tape piece 14a simultaneously with cutting, a compressively bonding mechanism for holding and heating a lead frame or a plastic board 10 so as to bond compressively each tape piece thereto, a carrying mechanism capable of making the tape holder 5 reciprocate between a position having the tape cutting mechanism and a position having the tape compressively bonding mechanism, a guide roller 16 capable of positioning the tape holder 5 accurately in the case of cutting each tape piece 14a so as to lower the tape holder 5, and stoppers 9, 9a capable of stopping in a predetermined position the tape holder 5 for sucking, holding and raising each cut tape piece 14a. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention uses a tape cutting and pressing device, in particular, a tape cutting method called scrapless to prevent a step at a lead end portion of a lead frame and to attach a tape for mounting an IC chip on a lead frame or a plastic substrate. The present invention relates to a tape cutting / compression device that performs
[0002]
[Prior art]
2. Description of the Related Art In recent years, semiconductor lead frames have become complicated and diversified in shape, and IC chips are mounted on lead frames or plastic substrates via an insulating tape that is heat resistant and has no thermal expansion and contraction. In addition, pasting of an insulating tape for suppressing an upper and lower level difference of a lead generated at the time of manufacturing such as conventional press working or etching working is also a necessary process. Conventionally, as shown in FIG. 6, a die die 2 for punching a tape is mounted on a lead frame or a plastic substrate 10 whose lower surface is heated by a heater block 12, and the insulating tape is insulated by a punch 1, as shown in FIG. A method of crimping a tape piece obtained by cutting or shearing the tape 14 and, as shown in FIG. 7, a tape piece cut by a die 2 of another stage is attached to a tape holder 5 provided with suction holes 4. And then heat-pressed the sheet to a lead frame or a plastic substrate 10 set on the stage of the heater block 12 and thermocompression-bonded. On the other hand, as disclosed in JP-A-11-68019, the latter method has been widely practiced.
[0003]
[Problems to be solved by the invention]
However, the latter method has the following problems. That is, in this tape cutting method, in order to prevent the tape from rising and to reduce the burrs on the shearing surface, a method called so-called holding punching, in which the tape is punched while sandwiching the tape between the punch 1 and the tape holder 5, is used. The clearance between the tape holder 5 and the die 2 at the cutting position needs to be as small as possible. However, when the tape is punched, the pushing force of the punch 1 generates a reaction force in the rotation direction of the arm 7 on the tape holder 5, which affects the positioning control of the servo motor 8, which is the rotation force of the arm 7, 5 and the tape punching position are shifted. Furthermore, at that time, the tape holder 5 for tape pressing on the opposite side also rotates, and there is a problem that an error occurs in the tape attachment position on the lead frame or the plastic substrate 10.
[0004]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the related art, and has as its object to provide a tape cutting and pressure bonding method that can accurately attach a tape piece to a predetermined position on a lead frame or a plastic substrate. It is to provide a device.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, a tape cutting pressure bonding positioning device according to the present invention includes a tape cutting mechanism that cuts a tape that exhibits adhesiveness by heating into a piece of tape having a predetermined length, and a tape that can hold the tape piece by suction simultaneously with cutting. A holder, a crimping mechanism capable of holding and heating the lead frame or the plastic substrate and crimping the tape piece to a predetermined position on the lead frame or the plastic substrate, and a position where the tape holder has the tape cutting mechanism and the crimping mechanism. In a tape cutting and pressing device having a transport mechanism capable of reciprocating to a position having a mechanism, a guide roller capable of accurately positioning and lowering the tape holder when cutting the tape piece, and the cut tape piece And a stopper that can stop the tape holder that rises by holding the tape holder at a predetermined position. It is characterized in that was example.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the illustrated examples. FIG. 1 is a front view of a main part of an embodiment of a tape cutting and pressing apparatus according to the present invention, FIG. 2 is a right side view of FIG. 1 with a part cut away, and FIG. FIG. 4 is a plan view of a supply tape and a cut tape piece, and FIG. 5 is a plan view of a lead frame to which the cut tape piece is attached.
[0007]
1 and 2, reference numeral 1 denotes a punch, 2 denotes a die that slides on the punch 1 and has a tape introduction slit 2a, and 3 denotes a tape feeder capable of feeding a predetermined amount of a tape 14 described later into the tape introduction slit 2a. The roller 4 has a suction hole connected to the suction device, 5 has a suction hole 4 and is a tape holder which can enter the die 2, and 6 is connected to the tape holder 5 so as to have an ascending behavior. A cylinder having a piston 6a, 7 is a rotating arm having cylinders 6 attached to both ends, 8 is a servomotor for driving the rotating arm 7, 9 is attached to the rotating arm 7, and is normally provided on the top surface of the piston 6a. A cylinder 10 having a piston 9a against which the piston 6a can be stopped in the position shown in FIGS. 11 is a guide rail for guiding the lead frame or the plastic substrate 10, 12 is a heater block, 13 is a cylinder that allows the heater block 12 to approach the lead frame or the plastic substrate 10, and 14 is a tape feed roller 3 for introducing a tape. A tape which is fed into the slit 2a by a predetermined amount and exhibits adhesiveness when heated, 15 is a tape reel around which the tape 14 is wound, and 16 is a guide for guiding the tape holder 5 to vertically enter the die 2. A roller 17 is a holder for rotatably holding the guide roller 16 at a predetermined position, and 18 is a press cylinder for operating the punch 1.
[0008]
A pair of tape holders 5, cylinders 6 and 9 attached to both ends of the rotating arm 7 are all arranged on one vertical line, and when they are in a position aligned with the punch 1, the punch 1 and the die 2 together with a tape cutting mechanism for cutting the tape into fixed length tape pieces, and when at a position aligned with the heater block 12, a pressure bonding mechanism for pressing the tape pieces. Further, the cylinder 9 can also function as a stopper for stopping the tape holder 5 at a predetermined raised position.
[0009]
Next, the operation of the above device will be described with reference to FIGS. First, the servo motor 8 is started to rotate the rotary arm 7, and the tape holder 5 is transported to a position immediately above the punch 1. At this time, the other tape holder 5 is at a position directly above the lead frame or the plastic substrate 10 carried to a position directly above the heater block 12 by the guide rail 11. On the other hand, at the same time, the tape feed roller 14 is driven, and each of the leading ends of the opposing tape 14 is fed out into the tape punching hole 2b of the die 2 by a predetermined length (FIG. 3 (a)). )).
[0010]
Then, the cylinder 6 is operated, and the tape holder 5 is inserted into the tape punching hole 2b (FIG. 3B). Next, the stopper cylinder 9 operates to lower the piston 9a, and at the same time, the press cylinder 18 starts operating to raise the punch 1. By this movement, each of the leading ends of the opposing tape 14 is cut between the punch 1 and the tape holder 5, and a tape piece 14a (see FIG. 4) is cut out (FIG. 3C).
[0011]
Next, the press cylinder 18 is operated again to lower the punch 1 to the initial position, and the cylinder 6 is operated again to raise the piston 6a, so that the piston 6a comes into contact with the piston 9a of the stopper cylinder 9 (3 (d )). At this time, the tape holder 5 is restrained by the guide roller 16. Next, the stopper cylinder 9 operates again, the piston 9a rises to the initial position, the tape holder 5 also rises with it, and the constraint by the guide roller 16 is released while the tape piece 14a is held at the lower end (FIG. 3 ( a)).
[0012]
Thus, when the piston 6a reaches the upper limit position, the motor 8 rotates by 180 degrees, and the tape holder 5 holding the tape piece 14a is guided by the guide rail 11 to be fixed above the heater block 12. Alternatively, it is moved to a position directly above the plastic substrate 10, and the tape holder 5 which has been on the heater block 12 is moved to a position immediately above the tape punching hole 2 b of the die 2.
[0013]
When the tape holder 5 with the tape piece 14a sucked is positioned in this manner, the heater cylinder 13 is activated to raise the heater block 12 in the heated state to a predetermined position (position shown), and in synchronization with this. Then, the cylinder 9 operates again to lower the tape holder 5 to a position where the lower end thereof is pressed against the lead frame or the plastic substrate 10. As a result, the tape piece 14a is heated and becomes tacky, and is thermocompression-bonded to a predetermined position of the lead frame or the plastic substrate 10 (see FIG. 5). After a lapse of a predetermined time, the tape holder 5 stops sucking and moves up to the predetermined position again, the heater block 13 also moves down to the initial position, and the lead frame or the plastic substrate 10 is moved one frame by a transfer device (not shown). To complete one operation cycle.
[0014]
After the second time, while one tape holder 5 presses the tape piece 14a onto the lead frame or the plastic substrate 10, the other tape holder 5 rises while holding the punched tape piece 14a. Immediately before the motor 8 comes off (see FIG. 3B), the ascent is stopped by the piston 9a of the cylinder 9, and the swing of the entire rotary unit including the rotary arm 7, the cylinders 6 and 9 due to the activation of the motor 8 is restrained. Then, the restraint is performed in a state where the thermocompression bonding of the tape piece 14a to the lead frame or the plastic substrate 10 is completed, the one tape holder 5 is lifted, and there is no fear of the misalignment of the pressure of the tape portion 14a. The tape holder 5 starts to rise again, and the restraint from the roller guide 16 is released.
[0015]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a device capable of accurately and continuously adhering a tape piece cut to a predetermined length to a predetermined position on a lead frame or a plastic substrate. .
[Brief description of the drawings]
FIG. 1 is a front view of a main part of an embodiment of a tape cutting and pressing device according to the present invention.
FIG. 2 is a right side view of FIG. 1 with a part cut away.
FIG. 3 is a side view similar to FIG. 2 for explaining the operation of cutting the tape and positioning the tape holder.
FIG. 4 is a plan view of a supply tape and a cut piece of tape.
FIG. 5 is a plan view of the lead frame to which the cut tape pieces are attached.
FIG. 6 is a fragmentary front view of an example of a conventional tape cutting and pressing device.
FIG. 7 is a fragmentary front view showing a part of another example of the conventional tape cutting and pressing device.
[Explanation of symbols]
Reference Signs List 1 punch 2 die 2a tape introduction slit 2b tape punching hole 3 tape feed roller 4 suction hole 5 tape holder 6, 9, 13, 18 cylinder 7 rotation arm 8 motor 10 lead frame or plastic substrate 11 guide rail 12 heater block 14 Tape 14a Tape strip 15 Tape reel 16 Guide roller 17 Guide roller holder

Claims (1)

A tape cutting mechanism for cutting a tape exhibiting adhesiveness by heating into a piece of tape of a predetermined length, a tape holder capable of holding the tape piece by suction at the same time as cutting; Or a tape comprising a pressure bonding mechanism capable of pressing the tape piece to a predetermined position on a plastic substrate, and a transport mechanism capable of reciprocating the tape holder between a position having the tape cutting mechanism and a position having the pressure bonding mechanism. In the cutting and pressing device, a guide roller that can accurately position and lower the tape holder when the tape piece is cut, and the tape holder that suctions and holds the cut tape piece and rises can be stopped at a predetermined position. A tape cutting and pressure bonding device comprising a stopper.

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