JP2001298143A - Manufacturing die for lead and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing die for a lead suitable for various kinds of semiconductor devices. SOLUTION: A lead manufacturing die includes a mother die 1 with guide rails 119 and 120 at upper and lower holders 101 and 102, and a child die 2 made up of a punch 106 mounted at a punch holder 105 and a die block 112 mounted on a die plate 111. By sliding the punch holder 105 and the die plate 111 on the guide rails 119 and 120, the child die 2 can be easily mounted on or removed from the mother die 1. The child die 2 suitable for a semiconductor device to be processed is manufactured and mounted on the mother die 1. By pressing the upper holder 101, the punch holder 105 is lowered, and the punch 106 and the block die 112 are combined to manufacture the semiconductor device mounted on a field rail 116.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die and a processing method for a lead processing apparatus used for processing outer leads and the like protruding from a package after processing the package in the manufacture of a semiconductor device using a lead frame. About the method.

[0002]

2. Description of the Related Art In general, in a semiconductor device using a lead frame, a semiconductor element is mounted on the lead frame, the semiconductor element and the lead frame are electrically connected using wire bonding or the like, and the semiconductor element is sealed with a resin or the like. To form a package. At this time, the outer leads projecting from the package are subjected to processing such as cutting and bending by a lead processing device.

FIGS. 3A and 3B show a die of a lead processing apparatus. FIG. 3A is a front view of a lead processing die, and FIG. 3B is a side view thereof. The lead processing die has an upper die holder 201 and a lower die holder 202. The upper die holder 201 is provided with a shank holder 204 to which a shank 203 is connected. Upper die holder 201
On the surface opposite to the surface on which the shank holder 204 is installed, the guide bush 209 and the punch holder 2
05 is installed. A punch 206 is connected to the punch holder 205, and a pad 208 is connected via a spring 207.

On the other hand, a guide post 210 and a die plate 211 are provided on the lower die holder 202. The die plate 211 is provided with a die block 212 and a sub post 213. The guide post 210
One end thereof is connected to the upper die holder 201 and the guide bush 20.
9, the upper die holder 201 and the guide bush 209 can move up and down along the guide post 210. Also,
One end of the sub-post 213 is inserted into a hole 215 provided in the pad 208 so that the pad 208 can move up and down along the sub-post 213. The die block 212 is provided with a field rail 216 held by a gripper (not shown).

Next, the operation of the lead processing die shown in FIGS. 3A and 3B will be described.

First, the lead rail 21 on which the semiconductor element 217 is packaged is fed by the feed rail 216.
8 is conveyed and set at a predetermined position of a lead processing die shown in FIG. 3 (a) or (b). Lead frame 218
Is correctly set, the shank 203 is pressed by a hydraulic press, a motor press, or the like, and the upper die holder 201 descends along the guide post 210. Upper die holder 20
1, the punch holder 205 and the punch 206
Is processed, and accordingly, the spring 207 and the pad 2
08 descends along the subpost 213. As a result, the pad 208 comes into contact with the feed rail 216, and the feed rail 216 is sandwiched between the pad 208 and the die block 212. When the upper mold holder 201 further moves down, the spring 207 is compressed, and the tip of the punch 206 comes into contact with the lead frame 218. When the upper die holder 201 is further lowered, the punch 206 is fitted with the die block 212, and the lead frame 218 is processed.

[0007]

As shown in FIGS. 3A and 3B, a conventional lead processing die includes a punch 206 for punching a lead frame 218 and a semiconductor device (semiconductor element 217, lead frame). 218), a functional unit including a die block 212 and the like, an upper die holder 201 for transmitting pressure to the punch 206, and a die block 2
In this case, the lower mold holder 202 for mounting (fixing) the mold 12 is integrated into one type and one type. Therefore, every time the type of semiconductor device increases, it is necessary to manufacture a mold suitable for each type, and it takes enormous cost and time to manufacture the semiconductor device.

Therefore, in the lead processing dies shown in FIGS. 3A and 3B, a method in which the punch 206 is detachable, the punch 206 corresponding to each type is manufactured, and only the punch 206 is replaced. I can think of a punch 20
The place where 6 is installed is surrounded by a spring 207, a pad 208, and the like, and it is not easy to attach and remove the punch 206. Therefore, the punch 206 may be damaged. When the punch 206 is made replaceable, the punch 206 is replaced every time the punch 206 is replaced.
Must be accurately set on the punch holder 205, and this adjustment takes time.

A similar problem occurs not only when bending leads of a semiconductor device but also when processing various types of leads.

[0010] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a lead processing die and a processing method which can cope with various kinds of semiconductor devices. Another object of the present invention is to reduce the processing cost and the processing time.

[0011]

In order to achieve the above object, a lead processing die according to the present invention comprises a lower die holder, a guide post installed on the lower die holder, and a lower post holder facing the lower die holder. Arranged, a matrix having an upper mold holder that moves up and down along the guide post, a die plate having a die block for mounting a semiconductor device, a subpost installed on the die plate, and a die plate A lead processing die, comprising: a punch holder that is disposed to face and moves up and down along the subpost, and a sub die that is provided on the punch holder and that punches the semiconductor device. The master includes a master mounting part for mounting the predetermined part of the slave, the slave includes a small mounting part mounted on the master mounting part, and the small mounting part is mounted on the master mounting part. Wearing By mounting the master mold, it is possible to house the slave mold in the master mold, press the upper mold holder, move the punch holder in the die block direction, and process the semiconductor device by the punch. It is characterized by having.

[0012] According to the above configuration, since only the daughter mold needs to be manufactured in accordance with the type of the semiconductor device, the cost and time required to manufacture the semiconductor device can be reduced.

[0013] Further, a plurality of child molds may be provided so that they can be exchanged for a common mother mold. Thereby, it is possible to cope with various kinds of semiconductor devices.

[0014] The mother die mounting portion includes a first guide rail installed on the upper die holder and a second guide rail installed on the lower die holder. A protrusion provided at an upper end of the punch holder; and a protrusion provided at a lower end of the die plate. The protrusion of the punch holder is slid along the first guide rail, and By sliding the convex portion of the die plate along the guide rail of (1), the master may be stored in the master, or the master may be removable from the master.

The processing method of the present invention is also directed to a lower die holder, a guide post installed on the lower die holder, an upper die that is disposed to face the lower die holder, and moves up and down along the guide post. A step of preparing a matrix including a mold holder, a die plate including a die block on which a workpiece is mounted, a subpost installed on the die plate, and a subpost disposed opposite to the die plate; A step of preparing a plurality of die units each including a punch holder that moves up and down along with a punch and a punch that is mounted on the punch holder and that processes the workpiece, and a punch corresponding to the workpiece. Select a slave mold, set it on the master mold, press the upper mold holder of the master mold, move the punch holder in the die block direction, and move the punch holder forward by the punch. Comprising a step of processing the workpiece, and characterized by being usable to replace the subtype as a unit relative to the base type.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing the overall configuration of a lead processing die according to the present embodiment. FIG.
2A is a diagram showing only a mother die of the lead processing die shown in FIG. 1, and FIG. 2B is a diagram showing only a child die of the lead processing die shown in FIG.

As shown in FIG. 1, the lead processing die according to the present embodiment includes a mother die 1 and a slave die 2.

As shown in FIG. 2A, the mother die 1 includes an upper die holder 101, a guide bush 109 and an upper guide rail 119 mounted on the upper die holder, and a lower die holder 10
2 and guide post 11 installed on lower mold holder 102
0 and the lower rail 120.

The upper mold holder 101 has a shank holder 1
A pressure is applied by a shank 103 connected to a shank holder 104.

One end of the guide post 110 is connected to a hole 1 provided in the upper die holder 101 and the guide bush 109.
14, the upper die holder 101 moves up and down along the guide post 110.

The upper guide rail 119 has a predetermined length and a L-shaped cross section, and is formed by the upper die holder 101 and the guide bush 109 as shown in FIG. Corners are provided symmetrically.

The lower guide rail 120 has a predetermined length, and its cross section has an inverted L-shape symmetrically with the upper guide rail. The lower guide rail 120 is shown in FIG.
As shown in FIG.
Are symmetrically provided at the corner formed by

On the other hand, as shown in FIG. 2B, the secondary mold 2 has a punch holder 105, a punch 106 installed on the punch holder 105, and a pad 108 connected to the punch holder 105 via a spring 107. , A die plate 111, and a die block 112 and a subpost 113 installed on the die plate 111.

The punch holder 105 has a shape with its upper end protruding along the upper guide rail 119 installed on the matrix 1. Similarly, the die plate 111
Has a shape with its lower end protruding along the lower guide rail 120 installed on the matrix 1.

One end of the sub post 113 is
Is inserted into the hole 115 provided in the
08 moves up and down along the subpost 113.

The matrix 1 shown in FIG.
In the case of processing a lead frame using a lead processing die composed of the sub die 2 shown in (b), first, a sub die 2 having a punch 106 suitable for a lead frame to be processed is manufactured. Set it on the master 1. By sliding the punch holder 105 of the slave 2 on the upper guide rail 119 of the master 1 and sliding the die plate 111 of the slave 2 on the lower guide rail 120 of the master 1, as shown in FIG. Then, the slave mold 2 is stored (set; mounted) in the master mold 1. The punch holder 105 and the die plate 111 are held by the upper guide rail 119 and the lower guide rail 120, so that the die 2 does not shake due to the impact at the time of pressing.
Does not deviate from child type 2.

After accommodating the master mold 2 in the master mold 1, a feed rail 116 suitable for a lead frame to be processed is placed on the die block 112 and held by a gripper (not shown).

Hereinafter, the lead processing dies (the master mold 1 and the slave mold 2) are controlled by a control device (not shown). First, the lead frame to be processed is conveyed by the feed rail 116 and set at a predetermined position. Subsequently, the shank 10 is pressed by a hydraulic press or a motor press.
3 is pressed, the upper die holder 101 is pressed, and descends along the guide post 110. Accordingly, the punch holder 105 and the pad 108 descend, and the pad 108
Contacts the feed rail 116. As a result, the feed rail 116 is connected to the pad 108 and the die block 11.
2 between.

When the upper die holder 101 is further lowered, the spring 107 is compressed by the punch holder 105 and the pad 108, and the tip of the punch 106 comes into contact with the lead frame to be processed. Further, the upper die holder 101
Is lowered, the punch 106 is combined with the die block 112, and the lead frame is processed (curved) into a desired shape.

After processing the lead frame, the shank 103
The pressure of the hydraulic press or the motor press, which has been pressurized, is reduced, the upper die holder 101 rises, and accordingly, the punch holder 105 rises, and the punch 106 comes off the lead frame. Further, when the upper die holder 101 is raised,
The spring 107 is restored, and the pad 108 is raised.
Finally, when the upper die holder 101, the punch holder 105, the punch 106, and the pad 108 return to the initial positions, the processed lead frame is separated from the lead processing dies (the master mold 1 and the slave mold 2) by the feed rail 116. It is carried out.

After unloading the processed lead frame, the feed rail 1 is fed from the lead processing dies (mother 1 and slave 2).
16 is removed, and the punch holder 105 and the die plate 111 of the die 2 are slid along the upper guide rail 119 and the lower guide rail 120 of the die 1 to remove the die 2 from the die 1.

As described above, the lead processing die of the present embodiment is composed of the master die 1 and the slave die 2,
Are guide rails 119 and 1 for guiding the die 2
Because of the provision of 20, the secondary mold 2 can be removed. In addition, by manufacturing sub-molds suitable for individual semiconductor devices and exchanging each sub-model with a common mother die 1, it is possible to cope with various types of semiconductor devices.

In the above embodiment, the case where the lead of the semiconductor device is bent and the die for bending are described. However, the present invention relates to a die and a processing method for processing an arbitrary object to be processed. Applicable to

Although the present embodiment has been described using the feed rail 116 suitable for the lead frame to be processed, a feed frame of a common size may be used.

It is also possible to automate a series of operations in the present embodiment. For example, a control device can be used to convert a pre-manufactured stocker stocking several types of slave molds to a semiconductor device to be processed. After selecting a suitable slave mold and confirming that the master mold has been set, the feed rail may be set on the lead processing mold by a robot hand.

In this embodiment, the punch 2 and the die plate 111 are slid on the upper guide rail 119 and the lower guide rail 120, so that the secondary die 2 can be replaced. Any means can be used as long as it can be attached and detached and can be fixed to the matrix 1 during pressing. For example, a suspension with a stopper function is provided on the side surfaces of the punch holder 105 and the die plate 111, the rollers are slid along the side surfaces of the guide bush 109 and the guide posts 110, and after the sub-mold 2 is stored in the matrix 1, the stopper Child type 2 by function
Can also be fixed.

[0037]

As described above, according to the present invention,
A lead processing die that can be used for various types of semiconductor devices can be obtained. Further, it is possible to reduce cost and time in manufacturing a semiconductor device.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of a lead processing die according to the present embodiment.

2 (a) is a view showing only a mother die of the lead processing die shown in FIG. 1, and FIG. 2 (b) shows only a slave die of the lead processing die shown in FIG. FIG.

FIG. 3 (a) is a front view of a conventional lead processing die, and FIG. 3 (b) is a side view of the lead processing die shown in FIG. 3 (a).

[Explanation of symbols]

 Reference Signs List 1 mother die 2 child mold 101, 201 upper die holder 102, 202 lower die holder 103, 203 shank 104, 204 shank holder 105, 205 punch holder 106, 206 punch 107, 207 spring 108, 208 pat 109, 209 guide bush 110 , 210 Guide post 111, 211 Die plate 112, 212 Die block 113, 213 Sub post 114, 115, 214, 215 Hole 116, 216 Feed rail 217 Semiconductor element 218 Lead frame

Claims (4)

[Claims] 1. A mother die comprising: a lower die holder; a guide post installed on the lower die holder; and an upper die holder arranged to face the lower die holder and move up and down along the guide post. A die plate having a die block on which a semiconductor device having a lead to be processed is mounted; a subpost disposed on the die plate; and a sub-post disposed to face the die plate, and vertically moving along the sub-post. A lead processing die including a punch holder and a punch mounted on the punch holder and processing a lead of the semiconductor device, wherein the mother die mounts a predetermined portion of the slave die The sub-mold includes a small mounting portion to be mounted on the matrix mounting portion, and the small mold mounting portion is mounted on the matrix mounting portion, thereby forming the matrix. The upper die holder is pressed, the punch holder is moved in the die block direction, and the lead of the semiconductor device can be processed by the punch. Lead processing mold. 2. The apparatus according to claim 1, wherein a plurality of said sub-types are prepared, and said sub-types are interchangeable with respect to said mother type.
Lead processing die described in 1. 3. The mold mounting section includes a first guide rail installed on the upper mold holder, and a second guide rail installed on the lower mold holder. A protrusion provided at an upper end of the punch holder; and a protrusion provided at a lower end of the die plate. The protrusion of the punch holder is slid along the first guide rail, and the second Sliding the convex portion of the die plate along the guide rail of (1), thereby accommodating the sub-mold in the master, or removing the sub-mold from the master. Item 3. A lead processing die according to item 1 or 2. 4. A mother die comprising: a lower die holder; a guide post installed on the lower die holder; and an upper die holder arranged to face the lower die holder and move up and down along the guide post. Preparing a die plate having a die block on which a workpiece is to be placed, a subpost placed on the die plate, and a punch arranged to face the die plate and move up and down along the subpost. A step of preparing a plurality of sub-types each including a holder and a punch installed on the punch holder and processing the object to be processed, and selecting a sub-type including a punch corresponding to the object to be processed,
Setting the master die, pressing the upper die holder of the master die, moving the punch holder in the die block direction, and processing the workpiece by the punch, comprising: On the other hand, a machining method characterized in that a child mold can be replaced as a unit and used.