JP2004012810A5 - - Google Patents

Claims (41)

Ethylenic unsaturation containing curable resin material for resist (A), hydrated metal compound (B) and nitrogen compound (C) , and curable resin material for resist (A) derived from acrylic monomer A photocurable resin material comprising a photosensitive prepolymer (a) having a terminal group, a compound (b) having an ethylenically unsaturated group excluding the photosensitive prepolymer (a), and a photopolymerization initiator (c); Alternatively, a curable flame retardant composition, which is a thermosetting resin material . The curable flame retardant composition according to claim 1 , wherein the photosensitive prepolymer (a) is a compound having a carboxyl group and at least two ethylenically unsaturated bonds. The curable flame retardant composition according to claim 2 , wherein the photosensitive prepolymer (a) is an epoxy (meth) acrylate compound having a carboxyl group. The curable flame retardant composition according to claim 3 , wherein the epoxy (meth) acrylate compound having a carboxyl group has a solid content acid value of 10 mgKOH / g to 150 mgKOH / g . The curable flame retardant composition according to claim 2 , wherein the photosensitive prepolymer (a) is a urethane (meth) acrylate compound having a carboxyl group. 6. The curable flame retardant composition according to claim 5 , wherein the urethane (meth) acrylate compound having a carboxyl group has a solid content acid value of 5 mgKOH / g to 150 mgKOH / g. The curable flame retardant composition according to claim 1 , wherein the photosensitive prepolymer (a) includes an epoxy (meth) acrylate compound having a carboxyl group and a urethane (meth) acrylate compound having a carboxyl group. The curable flame retardant composition according to claim 7 , wherein a mass ratio of the epoxy (meth) acrylate compound having a carboxyl group and the urethane (meth) acrylate compound having a carboxyl group is 9: 1 to 1: 9. object. The urethane (meth) acrylate compound having a carboxyl group has a urethane (meth) acrylate compound having a carboxyl group having an acid value of 5 mgKOH / g to 60 mgKOH / g and a carboxyl group having an acid value of 60 mgKOH / g to 150 mgKOH / g. The curable flame retardant composition according to any one of claims 5 to 8 , which is a mixture of a urethane (meth) acrylate compound. The curable flame retardant composition according to claim 1 , wherein the thermosetting resin material is an epoxy resin. Epoxy resin is bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, phenol novolac type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolac type epoxy resin, chelate type epoxy resin, glyoxal type epoxy resin, polysulfide type epoxy resin, amino group-containing epoxy resin, rubber modified epoxy resin, dicyclopentadiene phenolic type epoxy resin, silicone modified epoxy resin, ε-caprolactone modified Epoxy resin, N-glycyl type epoxy resin, bisphenol S type epoxy resin, diglycidyl phthalate resin, heterocyclic epoxy resin, Biki Renoru type epoxy resin, biphenol type epoxy resin and tetra glycidyl xylenoyl yl curable flame retardant composition according to claim 10, characterized in that at least one selected from the group consisting of ethane resin. The curable flame retardant composition according to claim 10 , further comprising a thermal polymerization catalyst. The curable flame retardant composition according to any one of claims 1 to 12, characterized in that it comprises an organic solvent. The curable flame retardant composition according to any one of claims 1 to 13 , wherein the endothermic amount of the hydrated metal compound (B) during thermal decomposition is 400 J / g or more. The curable flame retardant composition according to any one of claims 1 to 14 , wherein the hydrated metal compound (B) is aluminum hydroxide and / or magnesium hydroxide. The curable flame retardant composition according to any one of claims 1 to 14 , wherein the hydrated metal compound (B) is a hydrotalcite or a hydrotalcite compound. The curable flame retardant according to any one of claims 1 to 16 , wherein the hydrated metal compound (B) is blended in an amount of 10 to 100 parts by mass with respect to 100 parts by mass of the curable resin material for resist (A). Composition. Nitrogen compounds (C), phosphoric acid amide, ammonium polyphosphate, melamine phosphate, according to any one of claims 1 to 17, which is at least one compound selected from the group consisting of melamine pyrophosphate and melamine polyphosphate Curable flame retardant composition. The curable flame retardant composition according to any one of claims 1 to 18 , wherein the nitrogen compound (C) is blended in an amount of 10 to 80 parts by mass with respect to 100 parts by mass of the curable resin material for resist (A). . The curable flame retardant composition according to any one of claims 1 to 19 , further comprising a particulate inorganic compound (D). 21. The curable flame retardant composition according to claim 20 , wherein the particulate inorganic compound (D) is zeolite. 21. The curable flame retardant composition according to claim 20 , wherein the particulate inorganic compound (D) is a clay mineral. 21. The curable flame retardant composition according to claim 20 , wherein the particulate inorganic compound (D) is an aluminum crosslinked clay. The curable flame retardant composition according to any one of claims 1 to 23 , further comprising a phosphate ester compound (E). The curable flame retardant composition according to claim 24 , wherein the phosphorus atom of the phosphate ester compound (E) is pentavalent. The curable flame retardant composition according to claim 24 or 25 , wherein the phosphate ester compound (E) is a compound having an aromatic group. The curable flame retardant according to any one of claims 24 to 26 , wherein the phosphate ester compound (E) is blended in an amount of 1 to 20 parts by mass with respect to 100 parts by mass of the curable resin material for resist (A). Composition. The curable flame retardant composition according to any one of claims 1 to 27, the viscosity is equal to or is 500~500,000mPa · s (25 ℃). A cured product obtained by curing the curable flame retardant composition according to any one of claims 1 to 28 . A resist ink comprising the curable flame retardant composition according to any one of claims 1 to 28 and a colorant. A curable flame retardant composition according to any one of claims 1 to 28 is used. A dry film comprising a photosensitive layer or a heat-sensitive layer formed from the curable flame retardant composition according to any one of claims 1 to 28 on a support. The dry film according to claim 32 , wherein the support is a polyester film. An insulating protective coating comprising the curable flame retardant composition according to any one of claims 1 to 28 . 35. A printed wiring board comprising the insulating protective film according to claim 34 . A method for producing a dry film comprising a step of obtaining a coating layer by applying the curable flame retardant composition according to any one of claims 1 to 28 or the resist ink according to claim 30 on a support. The method for producing a dry film according to claim 36 , comprising a step of drying the coating layer coated on the support. The method for producing a dry film according to claim 37 , wherein the coating layer is dried with hot air and / or far infrared rays. The manufacturing method of the dry film of Claims 36-38 including the process of bonding a protective film on the dried coating layer. A method for producing a resist, comprising a step of irradiating an image of energy rays on a dried coating layer, a step of removing a resist layer in an unexposed portion by development, and a step of thermosetting. 41. The method for producing a resist according to claim 40 , wherein the energy ray is visible light or ultraviolet ray, and the resist layer having a thickness of 5 to 70 μm is cured with an irradiation amount of the energy ray of 50 to 2000 mJ / cm ^2. .