JP2004006300A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004006300A5 JP2004006300A5 JP2003104066A JP2003104066A JP2004006300A5 JP 2004006300 A5 JP2004006300 A5 JP 2004006300A5 JP 2003104066 A JP2003104066 A JP 2003104066A JP 2003104066 A JP2003104066 A JP 2003104066A JP 2004006300 A5 JP2004006300 A5 JP 2004006300A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003104066A JP4308564B2 (ja) | 2002-04-09 | 2003-04-08 | プラズマ処理装置及びプラズマ処理用トレー |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002106164 | 2002-04-09 | ||
| JP2003104066A JP4308564B2 (ja) | 2002-04-09 | 2003-04-08 | プラズマ処理装置及びプラズマ処理用トレー |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004006300A JP2004006300A (ja) | 2004-01-08 |
| JP2004006300A5 true JP2004006300A5 (enExample) | 2006-04-20 |
| JP4308564B2 JP4308564B2 (ja) | 2009-08-05 |
Family
ID=30446786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003104066A Expired - Fee Related JP4308564B2 (ja) | 2002-04-09 | 2003-04-08 | プラズマ処理装置及びプラズマ処理用トレー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4308564B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4394073B2 (ja) * | 2003-05-02 | 2010-01-06 | 東京エレクトロン株式会社 | 処理ガス導入機構およびプラズマ処理装置 |
| JP4622764B2 (ja) * | 2005-09-15 | 2011-02-02 | パナソニック株式会社 | プラズマ処理方法 |
| JP5131762B2 (ja) * | 2008-05-09 | 2013-01-30 | サムコ株式会社 | プラズマ処理方法及びプラズマ処理装置並びにプラズマ処理用トレイ |
| JP4709945B2 (ja) * | 2009-04-13 | 2011-06-29 | パナソニック株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| US9490166B2 (en) * | 2010-12-08 | 2016-11-08 | Evatec Ag | Apparatus and method for depositing a layer onto a substrate |
| JP7002302B2 (ja) * | 2016-12-13 | 2022-02-10 | 芝浦メカトロニクス株式会社 | 成膜装置 |
-
2003
- 2003-04-08 JP JP2003104066A patent/JP4308564B2/ja not_active Expired - Fee Related