JP2003516610A5 - - Google Patents
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- Publication number
- JP2003516610A5 JP2003516610A5 JP2001543744A JP2001543744A JP2003516610A5 JP 2003516610 A5 JP2003516610 A5 JP 2003516610A5 JP 2001543744 A JP2001543744 A JP 2001543744A JP 2001543744 A JP2001543744 A JP 2001543744A JP 2003516610 A5 JP2003516610 A5 JP 2003516610A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19959262A DE19959262A1 (de) | 1999-12-09 | 1999-12-09 | Leitfähiges pastöses Material und dessen Verwendung |
| DE19959262.4 | 1999-12-09 | ||
| PCT/EP2000/011371 WO2001043146A1 (en) | 1999-12-09 | 2000-11-16 | Non-silicone conductive paste for the electrical industry, and its use |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003516610A JP2003516610A (ja) | 2003-05-13 |
| JP2003516610A5 true JP2003516610A5 (cg-RX-API-DMAC7.html) | 2007-03-29 |
| JP4436993B2 JP4436993B2 (ja) | 2010-03-24 |
Family
ID=7931917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001543744A Expired - Fee Related JP4436993B2 (ja) | 1999-12-09 | 2000-11-16 | 電気工業用の非シリコーン伝導性ペースト及びその使用方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (4) | US6518496B1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1240648B8 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4436993B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR100743732B1 (cg-RX-API-DMAC7.html) |
| AT (1) | ATE266241T1 (cg-RX-API-DMAC7.html) |
| AU (1) | AU2159401A (cg-RX-API-DMAC7.html) |
| CA (1) | CA2394050A1 (cg-RX-API-DMAC7.html) |
| DE (2) | DE19959262A1 (cg-RX-API-DMAC7.html) |
| ES (1) | ES2220577T3 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2001043146A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19959262A1 (de) * | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
| EP1345485A3 (de) * | 2002-03-11 | 2006-04-19 | Helmut Kahl | Gerätegehäuse mit einem elektromagnetisch abgeschirmten Raumbereich |
| CN100375276C (zh) * | 2002-06-06 | 2008-03-12 | 富士高分子工业株式会社 | 导热片材及其制造方法 |
| US7346549B2 (en) * | 2002-06-27 | 2008-03-18 | At&T Knowledge Ventures, L.P. | System and method for wirelessly transacting access to a set of events and associated digital content/products |
| US6864573B2 (en) * | 2003-05-06 | 2005-03-08 | Daimlerchrysler Corporation | Two piece heat sink and device package |
| KR101155940B1 (ko) | 2003-11-05 | 2012-07-05 | 다우 코닝 코포레이션 | 열 전도성 그리스, 당해 그리스가 사용되는 방법 및디바이스 |
| SE0302985D0 (sv) * | 2003-11-13 | 2003-11-13 | Mydata Automation Ab | A method for generating a jetting program |
| JP2005187793A (ja) * | 2003-12-24 | 2005-07-14 | Rohm & Haas Electronic Materials Llc | 改良された接着剤 |
| US20090169724A1 (en) * | 2007-12-27 | 2009-07-02 | Toshiaki Ogiwara | Conductive paste for use in membrane touch switch applications |
| FR2939441B1 (fr) | 2008-12-08 | 2010-12-24 | Solvay | Procede de preparation d'un materiau polymere transparent comprenant des nanoparticules minerales ayant un facteur de forme strictement superieur a 1,0 |
| US7816785B2 (en) * | 2009-01-22 | 2010-10-19 | International Business Machines Corporation | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package |
| JP5651676B2 (ja) | 2009-03-16 | 2015-01-14 | ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ | 熱伝導性グリース、並びに、該グリースを用いる方法及びデバイス |
| KR20170063991A (ko) * | 2010-08-27 | 2017-06-08 | 도와 일렉트로닉스 가부시키가이샤 | 저온 소결성 은 나노 입자 조성물 및 상기 조성물을 이용하여 형성된 전자 물품 |
| KR101048083B1 (ko) * | 2010-10-14 | 2011-07-11 | 주식회사 이노칩테크놀로지 | 전자파 차폐 가스켓 |
| US9999158B2 (en) | 2013-01-03 | 2018-06-12 | Henkel IP & Holding GmbH | Thermally conductive EMI suppression compositions |
| EP3105300B1 (en) | 2014-02-13 | 2019-08-21 | Honeywell International Inc. | Compressible thermal interface materials |
| EP3426746B1 (en) | 2016-03-08 | 2021-07-14 | Honeywell International Inc. | Phase change material |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653959A (en) * | 1970-04-14 | 1972-04-04 | Grace W R & Co | Encapsulating and potting composition and process |
| US4011360A (en) * | 1974-04-10 | 1977-03-08 | Chomerics, Inc. | Electrically conductive silicone rubber stock |
| EP0103695A1 (en) * | 1982-07-16 | 1984-03-28 | Showa Denko Kabushiki Kaisha | Vulcanized olefin-based rubber composition |
| JPS61123665A (ja) * | 1984-11-19 | 1986-06-11 | Matsushita Electric Ind Co Ltd | 導電性樹脂組成物の製造方法 |
| JPS6333443A (ja) * | 1986-07-28 | 1988-02-13 | Sumitomo Bakelite Co Ltd | 導電性樹脂組成物 |
| US4994903A (en) * | 1989-12-18 | 1991-02-19 | Texas Instruments Incorporated | Circuit substrate and circuit using the substrate |
| JP2902109B2 (ja) * | 1989-12-21 | 1999-06-07 | エイムズバリー・グループ・インコーポレイテツド | 金属被覆用触媒性水溶性高分子フィルム |
| EP0555184B1 (de) * | 1992-02-07 | 1996-07-17 | Ciba-Geigy Ag | Füllstoff für wärmeleitende Kunststoffe |
| EP0562179A1 (en) * | 1992-03-26 | 1993-09-29 | Sumitomo Chemical Company, Limited | Electroconductive resin composition |
| JPH06136211A (ja) * | 1992-10-22 | 1994-05-17 | Asahi Chem Ind Co Ltd | スチレン系樹脂組成物 |
| DE4319965C3 (de) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
| JP3490500B2 (ja) * | 1994-06-28 | 2004-01-26 | 鐘淵化学工業株式会社 | 硬化性導電性組成物 |
| AU2740695A (en) * | 1994-07-01 | 1996-01-25 | Neste Oy | Electrically conducting polymer compositions |
| CN1185230A (zh) * | 1995-05-10 | 1998-06-17 | 保险丝公司 | Ptc电路保护装置及其制造过程 |
| KR20000076164A (ko) * | 1997-03-11 | 2000-12-26 | 나카노 가스히코 | 도전성 엘라스토머 필름, 그 제조방법 및 도전성 엘라스토머 조성물 |
| WO1998040439A1 (en) * | 1997-03-14 | 1998-09-17 | Minnesota Mining And Manufacturing Company | Cure-on-demand, moisture-curable compositions having reactive silane functionality |
| JP3913859B2 (ja) * | 1997-09-10 | 2007-05-09 | 株式会社カネカ | 硬化性組成物 |
| US6281433B1 (en) * | 1999-08-03 | 2001-08-28 | Lucent Technologies Inc. | Faceplate for network switching apparatus |
| DE19959262A1 (de) * | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
-
1999
- 1999-12-09 DE DE19959262A patent/DE19959262A1/de not_active Withdrawn
-
2000
- 2000-09-25 US US09/669,083 patent/US6518496B1/en not_active Expired - Fee Related
- 2000-11-16 KR KR1020027007233A patent/KR100743732B1/ko not_active Expired - Fee Related
- 2000-11-16 WO PCT/EP2000/011371 patent/WO2001043146A1/en not_active Ceased
- 2000-11-16 ES ES00985043T patent/ES2220577T3/es not_active Expired - Lifetime
- 2000-11-16 DE DE60010515T patent/DE60010515T2/de not_active Expired - Lifetime
- 2000-11-16 AT AT00985043T patent/ATE266241T1/de not_active IP Right Cessation
- 2000-11-16 AU AU21594/01A patent/AU2159401A/en not_active Abandoned
- 2000-11-16 JP JP2001543744A patent/JP4436993B2/ja not_active Expired - Fee Related
- 2000-11-16 EP EP00985043A patent/EP1240648B8/en not_active Expired - Lifetime
- 2000-11-16 CA CA002394050A patent/CA2394050A1/en not_active Abandoned
-
2001
- 2001-11-08 US US10/008,752 patent/US6921780B2/en not_active Expired - Fee Related
- 2001-11-08 US US10/006,755 patent/US6563044B2/en not_active Expired - Fee Related
- 2001-11-08 US US10/010,475 patent/US6780927B2/en not_active Expired - Fee Related