JP2003515924A - 集積回路用アクティブパッケージ - Google Patents

集積回路用アクティブパッケージ

Info

Publication number
JP2003515924A
JP2003515924A JP2001540823A JP2001540823A JP2003515924A JP 2003515924 A JP2003515924 A JP 2003515924A JP 2001540823 A JP2001540823 A JP 2001540823A JP 2001540823 A JP2001540823 A JP 2001540823A JP 2003515924 A JP2003515924 A JP 2003515924A
Authority
JP
Japan
Prior art keywords
integrated circuit
package
terminal
capacitor
capacitors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001540823A
Other languages
English (en)
Japanese (ja)
Inventor
ドラガン ダニーロ ネブリジック
ミラン マーセル ジェヴティッチ
チョー チー ファン
ケンドール ウィリアム カー
Original Assignee
ザ ボード オブ トラスティーズ オブ ザ ユニバーシティ オブ イリノイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ザ ボード オブ トラスティーズ オブ ザ ユニバーシティ オブ イリノイ filed Critical ザ ボード オブ トラスティーズ オブ ザ ユニバーシティ オブ イリノイ
Publication of JP2003515924A publication Critical patent/JP2003515924A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dc-Dc Converters (AREA)
  • Filters And Equalizers (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2001540823A 1999-11-22 2000-11-22 集積回路用アクティブパッケージ Pending JP2003515924A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16682399P 1999-11-22 1999-11-22
US60/166,823 1999-11-22
PCT/US2000/032198 WO2001039252A2 (en) 1999-11-22 2000-11-22 Active package for integrated circuit

Publications (1)

Publication Number Publication Date
JP2003515924A true JP2003515924A (ja) 2003-05-07

Family

ID=22604828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001540823A Pending JP2003515924A (ja) 1999-11-22 2000-11-22 集積回路用アクティブパッケージ

Country Status (8)

Country Link
EP (1) EP1234321A1 (xx)
JP (1) JP2003515924A (xx)
KR (1) KR20020070437A (xx)
CN (1) CN100385664C (xx)
AU (1) AU1628301A (xx)
CA (1) CA2392273C (xx)
IL (1) IL149814A0 (xx)
WO (1) WO2001039252A2 (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812566B2 (en) * 2002-01-02 2004-11-02 Intel Corporation Lower profile package with power supply in package
US7230321B2 (en) 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
KR100541655B1 (ko) 2004-01-07 2006-01-11 삼성전자주식회사 패키지 회로기판 및 이를 이용한 패키지
KR100963199B1 (ko) * 2008-06-11 2010-06-14 전자부품연구원 능동 소자 칩 내장형 기판 및 그의 제조 방법
US10354943B1 (en) * 2018-07-12 2019-07-16 Infineon Technologies Ag Multi-branch terminal for integrated circuit (IC) package
CN109906003B (zh) * 2019-04-16 2021-04-16 常州信息职业技术学院 弹性夹持式集成电路封装装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
FR2547113B1 (fr) * 1983-06-03 1986-11-07 Inf Milit Spatiale Aeronaut Boitier d'encapsulation de composant electronique, durci vis-a-vis des radiations
US4714981A (en) * 1986-04-09 1987-12-22 Rca Corporation Cover for a semiconductor package
US4978638A (en) * 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
US6198250B1 (en) * 1998-04-02 2001-03-06 The Procter & Gamble Company Primary battery having a built-in controller to extend battery run time

Also Published As

Publication number Publication date
WO2001039252A9 (en) 2002-09-26
AU1628301A (en) 2001-06-04
CA2392273C (en) 2007-05-01
WO2001039252A3 (en) 2002-07-11
CN100385664C (zh) 2008-04-30
EP1234321A1 (en) 2002-08-28
WO2001039252A2 (en) 2001-05-31
CA2392273A1 (en) 2001-05-31
IL149814A0 (en) 2002-11-10
CN1425198A (zh) 2003-06-18
KR20020070437A (ko) 2002-09-09

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