JP2003502634A5 - - Google Patents
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- Publication number
- JP2003502634A5 JP2003502634A5 JP2001503510A JP2001503510A JP2003502634A5 JP 2003502634 A5 JP2003502634 A5 JP 2003502634A5 JP 2001503510 A JP2001503510 A JP 2001503510A JP 2001503510 A JP2001503510 A JP 2001503510A JP 2003502634 A5 JP2003502634 A5 JP 2003502634A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/330,249 | 1999-06-10 | ||
| US09/330,249 US6366352B1 (en) | 1999-06-10 | 1999-06-10 | Optical inspection method and apparatus utilizing a variable angle design |
| PCT/US2000/016020 WO2000077500A1 (en) | 1999-06-10 | 2000-06-09 | Optical inspection method and apparatus utilizing a variable angle design |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003502634A JP2003502634A (ja) | 2003-01-21 |
| JP2003502634A5 true JP2003502634A5 (cg-RX-API-DMAC7.html) | 2010-09-24 |
Family
ID=23288944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001503510A Pending JP2003502634A (ja) | 1999-06-10 | 2000-06-09 | 可変角度のデザインを用いた光検査の方法及び装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6366352B1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1185855A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2003502634A (cg-RX-API-DMAC7.html) |
| KR (1) | KR100861604B1 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2000077500A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6288780B1 (en) | 1995-06-06 | 2001-09-11 | Kla-Tencor Technologies Corp. | High throughput brightfield/darkfield wafer inspection system using advanced optical techniques |
| WO1996039619A1 (en) | 1995-06-06 | 1996-12-12 | Kla Instruments Corporation | Optical inspection of a specimen using multi-channel responses from the specimen |
| US6774991B1 (en) * | 1999-05-27 | 2004-08-10 | Inspex Incorporated | Method and apparatus for inspecting a patterned semiconductor wafer |
| US6369888B1 (en) * | 1999-11-17 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for article inspection including speckle reduction |
| JP3996728B2 (ja) * | 2000-03-08 | 2007-10-24 | 株式会社日立製作所 | 表面検査装置およびその方法 |
| US7130029B2 (en) | 2000-09-20 | 2006-10-31 | Kla-Tencor Technologies Corp. | Methods and systems for determining an adhesion characteristic and a thickness of a specimen |
| US7349090B2 (en) | 2000-09-20 | 2008-03-25 | Kla-Tencor Technologies Corp. | Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography |
| US6633831B2 (en) | 2000-09-20 | 2003-10-14 | Kla Tencor Technologies | Methods and systems for determining a critical dimension and a thin film characteristic of a specimen |
| US6919957B2 (en) | 2000-09-20 | 2005-07-19 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen |
| US7106425B1 (en) | 2000-09-20 | 2006-09-12 | Kla-Tencor Technologies Corp. | Methods and systems for determining a presence of defects and a thin film characteristic of a specimen |
| US6891627B1 (en) | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
| DE10115578A1 (de) * | 2001-03-29 | 2002-10-10 | Leica Microsystems | Verfahren und Anordnung zum Ausgleichen von Abbildungsfehlern |
| US6538730B2 (en) * | 2001-04-06 | 2003-03-25 | Kla-Tencor Technologies Corporation | Defect detection system |
| US6657714B2 (en) | 2001-09-24 | 2003-12-02 | Applied Materials, Inc. | Defect detection with enhanced dynamic range |
| US6906305B2 (en) * | 2002-01-08 | 2005-06-14 | Brion Technologies, Inc. | System and method for aerial image sensing |
| US6828542B2 (en) * | 2002-06-07 | 2004-12-07 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
| US6861660B2 (en) * | 2002-07-29 | 2005-03-01 | Applied Materials, Inc. | Process and assembly for non-destructive surface inspection |
| US7433053B2 (en) * | 2002-08-08 | 2008-10-07 | Applied Materials, Israel, Ltd. | Laser inspection using diffractive elements for enhancement and suppression of surface features |
| US6807503B2 (en) * | 2002-11-04 | 2004-10-19 | Brion Technologies, Inc. | Method and apparatus for monitoring integrated circuit fabrication |
| AU2003290785A1 (en) * | 2003-02-11 | 2004-09-06 | Applied Materials Israel, Ltd. | System and method for inspection of a substrate that has a refractive index |
| US7030978B2 (en) | 2003-04-25 | 2006-04-18 | Applied Materials, Israel, Ltd | System and method for inspection of a substrate that has a refractive index |
| US7180658B2 (en) | 2003-02-21 | 2007-02-20 | Kla-Tencor Technologies Corporation | High performance catadioptric imaging system |
| US7053355B2 (en) | 2003-03-18 | 2006-05-30 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
| US7002677B2 (en) * | 2003-07-23 | 2006-02-21 | Kla-Tencor Technologies Corporation | Darkfield inspection system having a programmable light selection array |
| US20050122508A1 (en) * | 2003-10-31 | 2005-06-09 | Sachio Uto | Method and apparatus for reviewing defects |
| JP4996856B2 (ja) * | 2006-01-23 | 2012-08-08 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
| JP4876019B2 (ja) * | 2007-04-25 | 2012-02-15 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
| US8223327B2 (en) | 2009-01-26 | 2012-07-17 | Kla-Tencor Corp. | Systems and methods for detecting defects on a wafer |
| US8605275B2 (en) * | 2009-01-26 | 2013-12-10 | Kla-Tencor Corp. | Detecting defects on a wafer |
| JP5687014B2 (ja) * | 2010-09-24 | 2015-03-18 | 株式会社日立ハイテクノロジーズ | 光学式表面欠陥検査装置及び光学式表面欠陥検査方法 |
| JP5593213B2 (ja) * | 2010-12-24 | 2014-09-17 | 株式会社日立ハイテクノロジーズ | 検査装置 |
| NL2014399A (en) * | 2014-04-24 | 2015-11-02 | Asml Holding Nv | Compact two-sided reticle inspection system. |
| US10887580B2 (en) * | 2016-10-07 | 2021-01-05 | Kla-Tencor Corporation | Three-dimensional imaging for semiconductor wafer inspection |
| WO2020074250A1 (en) | 2018-10-12 | 2020-04-16 | Asml Netherlands B.V. | Detection system for an alignment sensor |
| US11536792B2 (en) | 2020-04-30 | 2022-12-27 | Applied Materials Israel Ltd. | Test of an examination tool |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3813172A (en) | 1972-01-03 | 1974-05-28 | Kollmorgen Corp | Photometric device with a plurality of measuring fields |
| JPS5324301B2 (cg-RX-API-DMAC7.html) * | 1974-09-09 | 1978-07-20 | ||
| US4669875A (en) * | 1982-11-04 | 1987-06-02 | Hitachi, Ltd. | Foreign particle detecting method and apparatus |
| JPS603457U (ja) * | 1983-06-21 | 1985-01-11 | 株式会社安川電機 | 欠点検出装置 |
| KR910000794B1 (ko) | 1985-03-28 | 1991-02-08 | 가부시끼가이샤 도오시바 | 기판의 표면검사방법 및 장치 |
| USRE33956F1 (en) | 1987-06-08 | 1994-06-07 | Optical Specialties Inc | Inspection system for array of microcircuit dies having redundant circuit patterns |
| US4898471A (en) * | 1987-06-18 | 1990-02-06 | Tencor Instruments | Particle detection on patterned wafers and the like |
| US5046847A (en) * | 1987-10-30 | 1991-09-10 | Hitachi Ltd. | Method for detecting foreign matter and device for realizing same |
| US5172000A (en) | 1990-11-02 | 1992-12-15 | Insystems, Inc. | Spatial filter for optically based defect inspection system |
| US5177559A (en) * | 1991-05-17 | 1993-01-05 | International Business Machines Corporation | Dark field imaging defect inspection system for repetitive pattern integrated circuits |
| US5276498A (en) | 1992-05-12 | 1994-01-04 | Tencor Instruments | Adaptive spatial filter for surface inspection |
| JP3314440B2 (ja) * | 1993-02-26 | 2002-08-12 | 株式会社日立製作所 | 欠陥検査装置およびその方法 |
| JP3319790B2 (ja) * | 1992-11-30 | 2002-09-03 | 株式会社日立製作所 | 異物検査方法及びその装置 |
| US5479252A (en) * | 1993-06-17 | 1995-12-26 | Ultrapointe Corporation | Laser imaging system for inspection and analysis of sub-micron particles |
| US5471066A (en) * | 1993-08-26 | 1995-11-28 | Nikon Corporation | Defect inspection apparatus of rotary type |
| JPH07229844A (ja) * | 1994-02-22 | 1995-08-29 | Nikon Corp | 異物検査装置 |
| US5712701A (en) * | 1995-03-06 | 1998-01-27 | Ade Optical Systems Corporation | Surface inspection system and method of inspecting surface of workpiece |
| US5604585A (en) | 1995-03-31 | 1997-02-18 | Tencor Instruments | Particle detection system employing a subsystem for collecting scattered light from the particles |
| JPH09178563A (ja) | 1995-12-21 | 1997-07-11 | Shimadzu Corp | 分光測定装置 |
| JPH102864A (ja) * | 1996-06-13 | 1998-01-06 | Nikon Corp | 異物検査装置 |
| US6034776A (en) * | 1997-04-16 | 2000-03-07 | The United States Of America As Represented By The Secretary Of Commerce | Microroughness-blind optical scattering instrument |
-
1999
- 1999-06-10 US US09/330,249 patent/US6366352B1/en not_active Expired - Lifetime
-
2000
- 2000-06-09 WO PCT/US2000/016020 patent/WO2000077500A1/en not_active Ceased
- 2000-06-09 KR KR1020017015891A patent/KR100861604B1/ko not_active Expired - Lifetime
- 2000-06-09 EP EP00939771A patent/EP1185855A1/en not_active Withdrawn
- 2000-06-09 JP JP2001503510A patent/JP2003502634A/ja active Pending
-
2001
- 2001-08-30 US US09/941,659 patent/US6469784B2/en not_active Expired - Lifetime