JP2003501820A5 - - Google Patents
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- Publication number
- JP2003501820A5 JP2003501820A5 JP2001501410A JP2001501410A JP2003501820A5 JP 2003501820 A5 JP2003501820 A5 JP 2003501820A5 JP 2001501410 A JP2001501410 A JP 2001501410A JP 2001501410 A JP2001501410 A JP 2001501410A JP 2003501820 A5 JP2003501820 A5 JP 2003501820A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- phase
- backing
- styrene
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 7
- 239000002131 composite material Substances 0.000 description 5
- 229920001400 block copolymer Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical group C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 229920000359 diblock copolymer Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 229920003046 tetrablock copolymer Polymers 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/328,916 | 1999-06-09 | ||
| US09/328,916 US6234875B1 (en) | 1999-06-09 | 1999-06-09 | Method of modifying a surface |
| PCT/US1999/024445 WO2000074896A1 (en) | 1999-06-09 | 1999-10-18 | Method of modifying a surface of a structured wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003501820A JP2003501820A (ja) | 2003-01-14 |
| JP2003501820A5 true JP2003501820A5 (cg-RX-API-DMAC10.html) | 2006-12-14 |
Family
ID=23283024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001501410A Pending JP2003501820A (ja) | 1999-06-09 | 1999-10-18 | 構造化ウェハの表面修正方法 |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6234875B1 (cg-RX-API-DMAC10.html) |
| EP (1) | EP1189729B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP2003501820A (cg-RX-API-DMAC10.html) |
| KR (1) | KR100638289B1 (cg-RX-API-DMAC10.html) |
| CN (1) | CN1352589A (cg-RX-API-DMAC10.html) |
| AT (1) | ATE272465T1 (cg-RX-API-DMAC10.html) |
| AU (1) | AU1317500A (cg-RX-API-DMAC10.html) |
| BR (1) | BR9917355A (cg-RX-API-DMAC10.html) |
| CA (1) | CA2374004A1 (cg-RX-API-DMAC10.html) |
| DE (1) | DE69919230T2 (cg-RX-API-DMAC10.html) |
| ES (1) | ES2224717T3 (cg-RX-API-DMAC10.html) |
| HK (1) | HK1044504B (cg-RX-API-DMAC10.html) |
| TW (1) | TWI231245B (cg-RX-API-DMAC10.html) |
| WO (1) | WO2000074896A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6390890B1 (en) | 1999-02-06 | 2002-05-21 | Charles J Molnar | Finishing semiconductor wafers with a fixed abrasive finishing element |
| US6413153B1 (en) | 1999-04-26 | 2002-07-02 | Beaver Creek Concepts Inc | Finishing element including discrete finishing members |
| US6641463B1 (en) | 1999-02-06 | 2003-11-04 | Beaver Creek Concepts Inc | Finishing components and elements |
| TW501197B (en) * | 1999-08-17 | 2002-09-01 | Hitachi Chemical Co Ltd | Polishing compound for chemical mechanical polishing and method for polishing substrate |
| US7736687B2 (en) | 2006-01-31 | 2010-06-15 | Advance Bio Prosthetic Surfaces, Ltd. | Methods of making medical devices |
| US6976905B1 (en) * | 2000-06-16 | 2005-12-20 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system |
| KR100905266B1 (ko) * | 2000-12-01 | 2009-06-29 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| US6561889B1 (en) | 2000-12-27 | 2003-05-13 | Lam Research Corporation | Methods for making reinforced wafer polishing pads and apparatuses implementing the same |
| US6572463B1 (en) * | 2000-12-27 | 2003-06-03 | Lam Research Corp. | Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same |
| US6612916B2 (en) * | 2001-01-08 | 2003-09-02 | 3M Innovative Properties Company | Article suitable for chemical mechanical planarization processes |
| US6612917B2 (en) * | 2001-02-07 | 2003-09-02 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
| US6632129B2 (en) | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
| US6627550B2 (en) * | 2001-03-27 | 2003-09-30 | Micron Technology, Inc. | Post-planarization clean-up |
| US6629879B1 (en) * | 2001-05-08 | 2003-10-07 | Advanced Micro Devices, Inc. | Method of controlling barrier metal polishing processes based upon X-ray fluorescence measurements |
| US6811470B2 (en) | 2001-07-16 | 2004-11-02 | Applied Materials Inc. | Methods and compositions for chemical mechanical polishing shallow trench isolation substrates |
| US7199056B2 (en) * | 2002-02-08 | 2007-04-03 | Applied Materials, Inc. | Low cost and low dishing slurry for polysilicon CMP |
| US6943114B2 (en) * | 2002-02-28 | 2005-09-13 | Infineon Technologies Ag | Integration scheme for metal gap fill, with fixed abrasive CMP |
| US7063597B2 (en) | 2002-10-25 | 2006-06-20 | Applied Materials | Polishing processes for shallow trench isolation substrates |
| US6908366B2 (en) * | 2003-01-10 | 2005-06-21 | 3M Innovative Properties Company | Method of using a soft subpad for chemical mechanical polishing |
| KR101018942B1 (ko) * | 2003-01-10 | 2011-03-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 화학 기계적 평탄화 적용을 위한 패드 구조물 |
| US6951504B2 (en) * | 2003-03-20 | 2005-10-04 | 3M Innovative Properties Company | Abrasive article with agglomerates and method of use |
| JP4746540B2 (ja) * | 2003-06-03 | 2011-08-10 | ネクスプラナー コーポレイション | 化学機械的平坦化のための機能的に漸次的変化されたパッドの組み立て |
| EP1561541B1 (en) * | 2004-02-05 | 2008-04-30 | JSR Corporation | Chemical mechanical polishing pad and polishing process |
| US7485028B2 (en) | 2004-03-19 | 2009-02-03 | Saint-Gobain Performance Plastics Corporation | Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same |
| US7086939B2 (en) * | 2004-03-19 | 2006-08-08 | Saint-Gobain Performance Plastics Corporation | Chemical mechanical polishing retaining ring with integral polymer backing |
| US20050252547A1 (en) * | 2004-05-11 | 2005-11-17 | Applied Materials, Inc. | Methods and apparatus for liquid chemical delivery |
| US20050282029A1 (en) * | 2004-06-18 | 2005-12-22 | 3M Innovative Properties Company | Polymerizable composition and articles therefrom |
| US7150771B2 (en) * | 2004-06-18 | 2006-12-19 | 3M Innovative Properties Company | Coated abrasive article with composite tie layer, and method of making and using the same |
| US7150770B2 (en) * | 2004-06-18 | 2006-12-19 | 3M Innovative Properties Company | Coated abrasive article with tie layer, and method of making and using the same |
| US20060088976A1 (en) * | 2004-10-22 | 2006-04-27 | Applied Materials, Inc. | Methods and compositions for chemical mechanical polishing substrates |
| US7344574B2 (en) * | 2005-06-27 | 2008-03-18 | 3M Innovative Properties Company | Coated abrasive article, and method of making and using the same |
| US7344575B2 (en) * | 2005-06-27 | 2008-03-18 | 3M Innovative Properties Company | Composition, treated backing, and abrasive articles containing the same |
| TWI292185B (en) * | 2005-07-11 | 2008-01-01 | Fujitsu Ltd | Manufacture of semiconductor device with cmp |
| US8016644B2 (en) * | 2007-07-13 | 2011-09-13 | UNIVERSITé LAVAL | Method and apparatus for micro-machining a surface |
| US20090215266A1 (en) * | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| DE102009025242B4 (de) * | 2009-06-17 | 2013-05-23 | Siltronic Ag | Verfahren zum beidseitigen chemischen Schleifen einer Halbleiterscheibe |
| DE102009033206A1 (de) * | 2009-07-15 | 2011-01-27 | Brand, Guido | Polierverfahren und Poliervorrichtung zur Korrektur von geometrischen Abweichungsfehlern auf Präzisionsoberflächen |
| PL2665583T3 (pl) * | 2011-01-22 | 2017-01-31 | Rud. Starcke Gmbh & Co. Kg | Korpus ścierny |
| JP5934053B2 (ja) * | 2012-08-14 | 2016-06-15 | セイコープレシジョン株式会社 | Ｘ線処理装置 |
| WO2015153597A1 (en) | 2014-04-03 | 2015-10-08 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
| TWI769988B (zh) | 2015-10-07 | 2022-07-11 | 美商3M新設資產公司 | 拋光墊與系統及其製造與使用方法 |
| CN111087973B (zh) * | 2019-12-17 | 2021-07-27 | 吉林大学 | 一种植物纤维发酵改性增强摩擦材料制备装置及制备方法 |
| US20230347470A1 (en) * | 2022-04-28 | 2023-11-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Pad for chemical mechanical polishing |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4244775A (en) | 1979-04-30 | 1981-01-13 | Bell Telephone Laboratories, Incorporated | Process for the chemical etch polishing of semiconductors |
| DE3677735D1 (de) | 1985-12-17 | 1991-04-04 | Max Planck Gesellschaft | Verfahren zur herstellung von halbleitersubstraten. |
| JPS62259769A (ja) * | 1986-05-02 | 1987-11-12 | Nec Corp | シリコンウエハの加工方法 |
| US5399528A (en) | 1989-06-01 | 1995-03-21 | Leibovitz; Jacques | Multi-layer fabrication in integrated circuit systems |
| US5152917B1 (en) | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| TW307801B (cg-RX-API-DMAC10.html) | 1992-03-19 | 1997-06-11 | Minnesota Mining & Mfg | |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| JPH0811050A (ja) | 1994-06-28 | 1996-01-16 | Sony Corp | 研磨布及びこれを用いた半導体装置の製造方法 |
| JPH10506579A (ja) * | 1994-09-30 | 1998-06-30 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | 被覆研磨物品、その製造法及び使用方法 |
| US5643044A (en) | 1994-11-01 | 1997-07-01 | Lund; Douglas E. | Automatic chemical and mechanical polishing system for semiconductor wafers |
| US5791969A (en) | 1994-11-01 | 1998-08-11 | Lund; Douglas E. | System and method of automatically polishing semiconductor wafers |
| US5609517A (en) | 1995-11-20 | 1997-03-11 | International Business Machines Corporation | Composite polishing pad |
| JPH09148285A (ja) | 1995-11-27 | 1997-06-06 | Sony Corp | 化学的機械研磨粒子及び半導体装置の製造方法 |
| JP3440665B2 (ja) | 1995-12-20 | 2003-08-25 | ソニー株式会社 | 研磨布およびその製造方法 |
| US5778481A (en) | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
| TW349896B (en) | 1996-05-02 | 1999-01-11 | Applied Materials Inc | Apparatus and chemical mechanical polishing system for polishing a substrate |
| US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| US5759427A (en) | 1996-08-28 | 1998-06-02 | International Business Machines Corporation | Method and apparatus for polishing metal surfaces |
| US5759917A (en) | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
| EP0984846B1 (en) | 1997-01-13 | 2004-11-24 | Rodel, Inc. | Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern |
| US6328642B1 (en) | 1997-02-14 | 2001-12-11 | Lam Research Corporation | Integrated pad and belt for chemical mechanical polishing |
| US6022268A (en) | 1998-04-03 | 2000-02-08 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| KR100571892B1 (ko) | 1997-04-30 | 2006-04-18 | 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 | 반도체 웨이퍼 상부 표면의 평탄화 방법 |
| US6224465B1 (en) | 1997-06-26 | 2001-05-01 | Stuart L. Meyer | Methods and apparatus for chemical mechanical planarization using a microreplicated surface |
| US6121143A (en) * | 1997-09-19 | 2000-09-19 | 3M Innovative Properties Company | Abrasive articles comprising a fluorochemical agent for wafer surface modification |
| US6056794A (en) * | 1999-03-05 | 2000-05-02 | 3M Innovative Properties Company | Abrasive articles having bonding systems containing abrasive particles |
-
1999
- 1999-06-09 US US09/328,916 patent/US6234875B1/en not_active Expired - Lifetime
- 1999-10-18 AT AT99956604T patent/ATE272465T1/de not_active IP Right Cessation
- 1999-10-18 JP JP2001501410A patent/JP2003501820A/ja active Pending
- 1999-10-18 KR KR1020017015751A patent/KR100638289B1/ko not_active Expired - Fee Related
- 1999-10-18 DE DE69919230T patent/DE69919230T2/de not_active Expired - Fee Related
- 1999-10-18 CN CN99816713A patent/CN1352589A/zh active Pending
- 1999-10-18 ES ES99956604T patent/ES2224717T3/es not_active Expired - Lifetime
- 1999-10-18 BR BR9917355-7A patent/BR9917355A/pt active Search and Examination
- 1999-10-18 HK HK02106259.1A patent/HK1044504B/en not_active IP Right Cessation
- 1999-10-18 WO PCT/US1999/024445 patent/WO2000074896A1/en not_active Ceased
- 1999-10-18 AU AU13175/00A patent/AU1317500A/en not_active Abandoned
- 1999-10-18 CA CA002374004A patent/CA2374004A1/en not_active Abandoned
- 1999-10-18 EP EP99956604A patent/EP1189729B1/en not_active Expired - Lifetime
-
2000
- 2000-05-30 TW TW089110529A patent/TWI231245B/zh not_active IP Right Cessation