JP2003344684A - Material for optoelectric hybrid substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a material for an optoelectric hybrid substrate which allows the manufacture of the high quality optoelectric hybrid substrate by a simple method, using a conventional technique for manufacturing a printed wiring board. <P>SOLUTION: The printed wiring board is formed of a first resin layer 1 consisting of a light transmissible resin; a second resin layer 2 consisting of a light transmissible resin which is brought into contact with the first resin layer 1, in which the solvent solubility is varied by the irradiation with active energy rays, and in which the refractive index is higher than that of the resin forming the first resin layer 1 or the refractive index is made higher than that of the resin forming the first resin layer 1, by the irradiation of the active energy rays; and a metal layer 13 provided on the side of the first resin layer 1 reverse to the second resin layer 2. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an opto-electric hybrid board used as a material for producing an optical / electrical wiring mixed board (optical / electrical mixed board) in which optical wiring and electric wiring are provided on the same board in a mixed manner. It is about materials.

[0002]

2. Description of the Related Art Conventionally, the following two types of methods have been used to manufacture an opto-electric hybrid board formed by laminating optical wiring and electric wiring in multiple layers.

That is, one method is to sequentially stack a clad layer, a core layer and a clad layer constituting an optical waveguide of an optical wiring layer on a substrate on which an electric wiring is provided, and further plate an electrical wiring layer on the clad layer. It is a method of stacking and forming.

Another method is to sequentially stack a clad layer, a core layer and a clad layer constituting an optical waveguide of an optical wiring layer on a temporary substrate, and then bond the optical wiring layer to an electric wiring board. Then, the temporary substrate is peeled off, and an electric wiring layer is stacked on the optical wiring layer by plating or the like to form the optical wiring layer.

[0005]

However, in the above method, since the optical wiring layer and the electric wiring layer are sequentially formed and stacked, the number of steps is increased, and the electric wiring layer is formed by plating. Moreover, there is a problem that the wiring accuracy is poor and it is difficult to stably industrially produce a high-quality opto-electric hybrid board.

The present invention has been made in view of the above points, and it is possible to produce a high-quality opto-electric hybrid board by a simple method using the conventional printed wiring board manufacturing technology. An object is to provide a material for an electric mixed board.

[0007]

A material for an opto-electric hybrid board according to claim 1 of the present invention is provided in contact with a first resin layer 1 made of a light-transmissive resin and an active material. Light whose solvent solubility is changed by irradiation with energy rays and whose refractive index is higher than that of the resin forming the first resin layer 1 or whose refractive index is higher than that of the resin forming the first resin layer 1 by irradiation of active energy rays. It is characterized by comprising a second resin layer 2 made of a transparent resin and a metal layer 13 provided on the surface of the first resin layer 1 opposite to the second resin layer 2.

The opto-electric hybrid board material according to claim 2 of the present invention is provided in contact with the first resin layer 1 made of a light transmissive resin, and is refracted by irradiation with active energy rays. A third resin made of a light-transmissive resin in which the refractive index is higher than that of the resin forming the first resin layer 1 and the portion not irradiated with active energy rays and the portion irradiated with active energy rays. The layer 3 and the metal layer 13 provided on the surface of the first resin layer 1 opposite to the third resin layer 3 are provided.

The opto-electric hybrid board material according to claim 3 of the present invention is provided in contact with the first resin layer 1 made of a light transmissive resin, and is refracted by irradiation with active energy rays. The refractive index of the portion irradiated with active energy rays is lower than that of the portion not irradiated with active energy rays, and the portion not irradiated with active energy rays forms the first resin layer 1. A fourth resin layer 4 made of a light-transmitting resin having a higher refractive index than the resin, and a metal layer 1 provided on the surface of the first resin layer 1 opposite to the fourth resin layer 4.
3 is provided.

The opto-electric hybrid board material according to claim 4 of the present invention is provided on the fifth resin layer 5 and the fifth resin layer 5 made of a light-transmissive resin whose refractive index changes by irradiation with active energy rays. And a metal layer 13 formed of the metal.

The opto-electric hybrid board material according to claim 5 of the present invention comprises a first resin layer 1 made of a light-transmissive resin, a sixth resin layer 6 provided in contact with the first resin layer 1. A seventh resin layer 7 made of a light-transmitting resin provided in contact with the surface of the sixth resin layer 6 opposite to the first resin layer 1, and a surface of the first resin layer 1 opposite to the sixth resin layer 6. And a metal layer 13 provided on the surface of the sixth resin layer 6, the refractive index of the sixth resin layer 6 is changed by irradiation with active energy rays, and the portion irradiated with active energy rays is not irradiated with active energy rays. It is characterized in that it is made of a light-transmissive resin having a higher refractive index than the resin forming the portion and the first resin layer 1 and the resin forming the seventh resin layer 7.

The material for opto-electric hybrid board according to claim 6 of the present invention comprises a first resin layer 1 made of a light-transmissive resin, an eighth resin layer 8 provided in contact with the first resin layer 1. A ninth resin layer 9 made of a light-transmissive resin provided in contact with the surface of the eighth resin layer 8 opposite to the first resin layer 1, and a portion of the first resin layer 1 opposite to the eighth resin layer 8. A metal layer 13 provided on the surface, the eighth resin layer 8 has a refractive index changed by irradiation with active energy rays, and a portion irradiated with active energy rays is a portion not irradiated with active energy rays. The portion not irradiated with the active energy ray has a lower refractive index and is made of a light-transmissive resin having a higher refractive index than the resin forming the first resin layer 1 and the resin forming the ninth resin layer 9. It is characterized by being.

An opto-electric hybrid board material according to a seventh aspect of the present invention comprises a tenth resin layer 10 and an eleventh resin layer 11 made of a light transmissive resin provided in contact with the tenth resin layer 10. , A metal layer 13 provided on the surface of the tenth resin layer 10 opposite to the eleventh resin layer 11, and the tenth resin layer 10 has a refractive index changed by irradiation with an active energy ray and is activated. The portion irradiated with energy rays is made of a light-transmissive resin having a higher refractive index than the portion not irradiated with active energy rays and the resin forming the eleventh resin layer 11. Is.

The material for an opto-electric hybrid board according to claim 8 of the present invention is the eleventh resin layer comprising the twelfth resin layer 12 and the light transmitting resin provided in contact with the twelfth resin layer 12. 11
And a metal layer 13 provided on the surface of the twelfth resin layer 12 opposite to the eleventh resin layer 11, and the twelfth resin layer 12
However, the refractive index changes due to irradiation with active energy rays,
Further, the portion irradiated with the active energy ray has a lower refractive index than the portion not irradiated with the active energy ray, and the portion not irradiated with the active energy ray has a refractive index lower than that of the resin forming the eleventh resin layer 11. Is made of a highly transparent resin.

The invention of claim 9 is characterized in that, in any one of claims 1 to 8, an adhesive layer 14 is provided between the metal layer 13 and the resin layer adjacent thereto. .

Further, the invention of claim 10 is based on claims 1 to 9.
In any one of the above, the transparent cover film 15 is provided on the surface opposite to the metal layer 13.

The invention of claim 11 relates to claims 1 to 1.
0, any one of which is characterized in that a support 16 which is peelable from the metal layer 13 is laminated on the surface of the metal layer 13 opposite to the resin layer.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

FIG. 1 (a) shows an example of the embodiment of the invention of claim 1, in which the second resin layer 2 is laminated in direct contact with one surface of the first resin layer 1 and the first resin layer 2 is laminated. It is formed by laminating a metal layer 13 on the surface of the layer 1 opposite to the surface on which the second resin layer 2 is provided. As the metal layer 13, a metal foil of copper, aluminum, nickel or the like can be used, but among them, a copper foil is preferable. The thickness of the metal layer 13 is not particularly limited, but is usually 9 to 70 μm.
It is generally about m.

The first resin layer 1 is made of a light transmissive resin. Examples of the light transmissive resin include thermosetting resins such as epoxy resin, polyimide resin, unsaturated polyester resin, and epoxy acrylate resin, and photocurable resin such as UV curable resin can also be used. .

The second resin layer 2 is made of a light transmissive resin whose solvent solubility changes by irradiation with active energy rays. Examples of the resin whose solvent solubility changes by irradiation with active energy rays include photocurable acrylic resins, epoxy resins, polyimide resins, silicon resins, electron beam curable resins, and photodecomposable naphthoquinone resins. be able to. The resin forming the second resin layer 2 is a resin having a higher refractive index than the resin forming the first resin layer 1, or when the solubility of the solvent is reduced by irradiation with active energy rays, the active energy is It is also an essential condition that the resin has a refractive index higher than that of the resin forming the first resin layer 1 by the irradiation of rays.

An example of a method of manufacturing the opto-electric hybrid board material will be described. When a metal foil is used as the metal layer 13, a resin forming the first resin layer 1 is coated on the matte surface. Examples of the coating method include a comma coater, a curtain coater, a die coater, screen printing, offset printing and the like. Next, a resin for forming the second resin layer 2 is coated on the first resin layer 1 by the same coating method to obtain the opto-electric hybrid board material as shown in FIG. It is possible.

Next, a method for manufacturing an opto-electric hybrid board using the thus-obtained opto-electric hybrid board material will be described. First, as shown in FIG. 2A, the second resin layer 2
The active energy ray E is radiated from the side opposite to the metal layer 13 for exposure. The irradiation of the active energy ray is performed in a pattern corresponding to the wiring pattern of the optical wiring, and the pattern irradiation of the active energy ray can be performed by, for example, mask exposure of ultraviolet rays, drawing exposure of laser, or the like. Next, the second resin layer 2 is partially dissolved in the solvent by causing the solvent to act on the second resin layer 2 for development. At this time, when the second resin layer 2 is formed of a resin, such as a photocurable resin, which changes so that the solubility of the portion irradiated with the active energy ray becomes low, a portion other than the portion irradiated with the active energy ray is not formed. The resin is dissolved in the solvent, and the resin in the portion irradiated with the active energy rays remains. Further, when the second resin layer 2 is formed of a resin such as a photodegradable resin that changes to have a high solubility in a portion irradiated with active energy rays, the resin in the portion irradiated with active energy rays is a solvent. The resin remains in the area other than the area where the resin is dissolved and is exposed to the active energy rays.

After the second resin layer 2 is thus formed in the optical wiring pattern as shown in FIG. 2B, the transparent resin layer is formed on the surface of the first resin layer 1 on which the second resin layer 2 is provided. 20 is provided by coating the second resin layer 2 as shown in FIG.
Is covered with a transparent resin layer 20. As the transparent resin layer 20, a translucent resin having a lower refractive index than the second resin layer 2 is used, and for example, the same resin as the first resin layer 1 can be used. Then, the printed wiring board 22 provided with the electric wiring 21 is used, and the transparent resin layer 20 is adhered to the surface of the printed wiring board 22 with the adhesive 23, so that the printed wiring as shown in FIG. Laminated on the plate 22. After this, the metal layer 13 on the surface is subjected to printed wiring to form the electric wiring 24 as shown in FIG. 2E, and further laser via processing or plating processing is performed to form the electric wiring 21, 24.
Connect.

In FIG. 2E, the refractive index of the second resin layer 2 of the optical wiring pattern is more than that of the first resin layer 1 and the transparent resin layer 20 which are in direct contact with the second resin layer 2. Since the second resin layer 2 is the core layer 26 and the first resin layer 1 and the transparent resin layer 20 are the clad layers 27, an optical waveguide is formed, and the second resin layer 2 forms an optical wiring. Therefore, it can be used as an opto-electric hybrid board in which the optical wiring by the second resin layer 2 and the electric wirings 21 and 24 are laminated. If the adhesive 23 is light transmissive and has a lower refractive index than the second resin layer 2, the transparent resin layer 2
There is no need to use 0.

Here, in the opto-electric hybrid board material according to the present invention, it is not essential to stack it on the printed wiring board 22, and the electric wiring 24 obtained by printing the metal layer 13 of the opto-electric hybrid board material. It may be possible to manufacture an opto-electric hybrid board formed on only one surface, or by laminating with a metal foil instead of the printed wiring board,
You may make it manufacture the opto-electric hybrid board | substrate which formed the electric wiring 24 on both surfaces.

FIG. 1B shows another embodiment, in which a flame-retardant adhesive layer 14 is provided between the metal layer 13 and the first resin layer 1. Examples of the adhesive forming the adhesive layer 14 include epoxy resin-based, polyimide resin-based, unsaturated polyester resin-based, and epoxy acrylate resin-based thermosetting resin-based adhesives. As the flame retardant, a halogen-based, phosphorus-based, or silicon-based flame retardant can be used, and the adhesive layer 14 may further contain an ultraviolet absorber or the like. When a metal foil is used as the metal layer 13, the matte surface is coated with an adhesive by the above-described coating method, and when a solvent is contained, it is dried and removed, and then cured or semi-cured if necessary. By the adhesive resin layer 14
Can be formed. After that, this adhesive resin layer 14
By coating and providing the first resin layer 1 on the above and the second resin layer 2 on the above, the material for the opto-electric hybrid board can be obtained. .

By thus providing the adhesive layer 14 between the metal layer 13 and the resin layer, the adhesive strength of the metal layer 13 can be increased by the adhesive layer 14. Further, since the adhesive layer 14 contains a flame retardant, it is possible to impart flame retardancy.

FIG. 1C shows still another embodiment, in which a transparent cover film 15 is provided on the surface of the second resin layer 2 opposite to the metal layer 13. As the cover film 15, a polyester film, a polypropylene film, a polyethylene film, a polyacetate film, or the like can be used, but the cover film 15 is not limited thereto. The thickness of the cover film 15 is also not particularly limited, but one having a thickness of about 5 to 100 μm can be preferably used. Further, the surface of the cover film 15 may be subjected to a release treatment. The cover film 15 is stretched by forming a resin layer and then laminating the resin layer on the resin layer.
5 may be coated to form a resin layer.

When the cover film 15 is stretched on the surface of the resin layer as described above, the resin layer is not exposed, so that the handling property when handling the opto-electric hybrid board material is improved. Through the cover film 15
It can be exposed as shown in FIG.
When developing as in (b), the cover film 1
5 is peeled off from the resin layer.

FIG. 1 (d) shows still another embodiment, in which a support 16 is releasably attached to the surface of the metal layer 13 opposite to the side on which the first resin layer 1 is provided and laminated. I am doing it. Any material having rigidity may be used as the support 16, but a metal plate, a resin plate, a ceramic plate, or the like can be used. When a metal foil is used as the metal layer 13, the metal foil can be releasably adhered and attached to the surface of the support 16. Alternatively, the metal layer 13 can be formed by plating the surface of the support 16. In this manner, the metal layer 13 is stretched on the support 16, and the metal layer 13 is reinforced by the support 16 having high rigidity. In this state, a resin layer is formed on the surface of the metal layer 13, or as shown in FIG. It is possible to perform various types of processing, and the handling property during processing is improved.

FIG. 1E shows an example in which the metal layers 13 are stretched on both sides of the support 16 to form the opto-electric hybrid board material on both sides of the support 16.

FIG. 3 (a) shows an example of an embodiment of the invention of claim 2 in which the third resin layer 3 is laminated in direct contact with one surface of the first resin layer 1 and the first resin layer 3 is laminated. It is formed by laminating a metal layer 13 on the surface of the layer 1 opposite to the surface on which the third resin layer 3 is provided. As the first resin layer 1 and the metal layer 13, those described above can be used.

The third resin layer 3 is made of a light transmissive resin whose refractive index is changed by irradiation with active energy rays and whose refractive index is increased by irradiation with active energy rays. As the resin whose refractive index is increased by irradiation with such active energy rays, for example, “Polyguide (Po
and a photopolymerizable monomer contained in an acrylic resin can be used. The resin forming the third resin layer 3 is a resin having a higher refractive index in the portion irradiated with the active energy ray than in the portion not irradiated with the active energy ray and the resin forming the first resin layer 1. There is also an essential condition.

This opto-electric hybrid board material is similar to that described above, and when a metal foil is used as the metal layer 13, the matte surface thereof is coated with a resin forming the first resin layer 1, It can be produced by coating the resin forming the third resin layer 3 on one resin layer 1.

Next, a method of manufacturing an opto-electric hybrid board using the thus-obtained opto-electric hybrid board material will be described. First, as shown in FIG. 4A, the third resin layer 3
The active energy ray E is irradiated from the side opposite to the metal layer 13. The irradiation of the active energy ray is performed in a pattern corresponding to the wiring pattern of the optical wiring, and the pattern irradiation of the active energy ray can be performed by, for example, mask exposure of ultraviolet rays, drawing exposure of laser, or the like. At this time,
Although the refractive index of the portion of the third resin layer 3 which is not irradiated with the active energy ray does not change, the portion of the third resin layer 3 which is irradiated with the active energy ray has a higher refractive index, and the third resin layer 3 has a higher refractive index. High refractive index portion 3a and low refractive index portion 3 in the non-irradiated portion
b is formed. The refractive index of the high refractive index portion 3a of the third resin layer 3 is higher than that of the first resin layer 1.

In this way, as shown in FIG. 4B, after forming the high refractive index portion 3a in the optical wiring pattern shape on the third resin layer 3, the first resin layer 1 of the third resin layer 3 is provided. The transparent resin layer 20 is coated on the opposite side to the side shown in FIG.
As shown in (c), the third resin layer 3 is covered with the transparent resin layer 20. As the transparent resin layer 20, a translucent resin having a refractive index lower than that of the high refractive index portion 3a of the third resin layer 3 is used, and for example, the same resin as the first resin layer 1 can be used. Then, the printed wiring board 22 produced by providing the electric wiring 21 is used, and the transparent resin layer 20 is adhered to the surface of the printed wiring board 22 with the adhesive 23, so that the printed wiring as shown in FIG. It is laminated on the plate 22, and then the surface metal layer 13 is subjected to printed wiring to form the electrical wiring 24 as shown in FIG. 4 (e). The wirings 21 and 24 can be connected.

In FIG. 4 (e), the refractive index of the high refractive index portion 3a of the third resin layer 3 of the optical wiring pattern is the same as that of the low refractive index portion 3b of the third resin layer 3 or the third resin layer 3. Since the refractive index of the first resin layer 1 and the transparent resin layer 20 that are in direct contact with the layer 3 is higher than that of the third resin layer 3, the high refractive index portion 3a of the third resin layer 3 is the core layer 26 and the low refractive index portion 3b of the third resin layer 3. An optical waveguide in which the first resin layer 1 and the transparent resin layer 20 serve as the clad layer 27 is configured, and the optical wiring is formed by the high refractive index portion 3a of the third resin layer 3. It can be used as an opto-electric hybrid board in which the optical wiring by the high refractive index portion 3a of No. 3 and the electric wirings 21 and 24 are laminated.

FIGS. 3 (b), (c), (d) and (e) show another embodiment, and FIG. 3 (b) is similar to the above description.
Flame-retardant adhesive layer 1 between the metal layer 13 and the resin layer
4 is provided, as in FIG. 3 (c), a transparent cover film 15 is provided on the surface of the resin layer opposite to the metal layer 13, and FIG. 3 (d) is as described above. The support 16 is removably attached to the surface of the metal layer 13 opposite to the side on which the resin layer is provided. In FIG. 3 (e), the metal layer 13 is attached to both surfaces of the support 16. The opto-electric hybrid board material is formed on both sides of the support 16.

FIG. 5 (a) shows an example of the embodiment of the invention of claim 3, in which the fourth resin layer 4 is laminated in direct contact with one side of the first resin layer 1 and the first resin layer 4 is laminated. It is formed by laminating the metal layer 13 on the surface of the layer 1 opposite to the surface on which the fourth resin layer 4 is provided. As the first resin layer 1 and the metal layer 13, those described above can be used.

The fourth resin layer 4 is made of a light-transmissive resin whose refractive index is changed by irradiation with active energy rays and whose refractive index is lowered by irradiation with active energy rays. As the resin whose refractive index is lowered by irradiation with such active energy rays, for example, polysilane such as polymethylphenylsilane, whose refractive index is lowered by irradiation with ultraviolet rays, or photopolymerizable in a polycarbonate resin dissolved in a solvent. It is possible to use a composite resin in which the acrylic monomer is added to form a film, and the acrylic monomer is distilled off under vacuum after exposure. It is also an essential condition that the resin forming the fourth resin layer 4 has a higher refractive index than the resin forming the first resin layer 1 in the portion not irradiated with active energy rays.

This opto-electric hybrid board material is the same as that described above, and when a metal foil is used as the metal layer 13, the matte surface thereof is coated with a resin forming the first resin layer 1. It can be manufactured by coating the resin forming the fourth resin layer 4 on one resin layer 1.

Next, a method of manufacturing an opto-electric hybrid board using the thus-obtained opto-electric hybrid board material will be described. First, as shown in FIG. 6A, the fourth resin layer 4
The active energy ray E is irradiated from the side opposite to the metal layer 13. The irradiation of the active energy ray is performed in a pattern opposite to the wiring pattern of the optical wiring, and the pattern irradiation of the active energy ray can be performed by, for example, mask exposure of ultraviolet rays, drawing exposure of laser, or the like. At this time, the refractive index of the portion of the fourth resin layer 4 which is not irradiated with the active energy ray does not change, but the refractive index of the portion which is irradiated with the active energy ray becomes low, and High refractive index portion 4a of non-irradiated portion and low refractive index portion 4b of irradiated portion
Is formed. The refractive index of the high refractive index portion 4a of the fourth resin layer 4 is higher than that of the first resin layer 1.

In this way, as shown in FIG. 6B, after forming the high refractive index portion 4a in the fourth resin layer 4 in the shape of the optical wiring pattern, the first resin layer 1 of the fourth resin layer 4 is provided. The transparent resin layer 20 is coated on the surface opposite to the side shown in FIG.
As shown in (c), the fourth resin layer 4 is covered with the transparent resin layer 20. As the transparent resin layer 20, a transparent resin having a refractive index lower than that of the high refractive index portion 4a of the fourth resin layer 4 is used, and for example, the same resin as the first resin layer 1 can be used. Then, the printed wiring board 22 produced by providing the electric wiring 21 is used, and the transparent resin layer 20 is adhered to the surface of the printed wiring board 22 with the adhesive 23, so that the printed wiring as shown in FIG. The metal layer 13 on the surface is laminated on the plate 22, and then the printed wiring is processed to form the electric wiring 24 as shown in FIG. 6 (e). The wirings 21 and 24 can be connected.

In FIG. 6 (e), the refractive index of the high refractive index portion 4a of the fourth resin layer 4 of the optical wiring pattern is the same as that of the low refractive index portion 4b of the fourth resin layer 4 or the fourth resin layer 4. Since the refractive index of the first resin layer 1 and the transparent resin layer 20 that are in direct contact with the layer 4 is larger than the refractive index portion 4a of the fourth resin layer 4, the high refractive index portion 4a of the fourth resin layer 4 is the core layer 26 and the low refractive index portion 4b of the fourth resin layer 4. An optical waveguide in which the first resin layer 1 and the transparent resin layer 20 serve as the cladding layer 27 is configured, and optical wiring is formed by the high refractive index portion 4a of the fourth resin layer 4. It can be used as an opto-electric hybrid board in which the optical wiring by the high refractive index portion 4a of No. 4 and the electric wirings 21 and 24 are laminated.

FIGS. 5 (b), (c), (d) and (e) show another embodiment, and FIG. 5 (b) is similar to the above description.
Flame-retardant adhesive layer 1 between the metal layer 13 and the resin layer
4 is provided, as in FIG. 5 (c), a transparent cover film 15 is provided on the surface of the resin layer opposite to the metal layer 13, and FIG. 5 (d) is as described above. In addition, the support 16 is removably attached to the surface of the metal layer 13 opposite to the side where the resin layer is provided. The opto-electric hybrid board material is formed on both sides of the support 16.

FIG. 7 (a) shows an example of the embodiment of the invention of claim 4, which is one side of the fifth resin layer 5 made of a light-transmissive resin whose refractive index changes by irradiation with active energy rays. Is formed by providing a metal layer 13 on the surface. As the metal layer 13, the above-mentioned one can be used. The resin forming the fifth resin layer 5 may be any resin whose refractive index changes by irradiation with active energy rays,
As described above, any of those having a high refractive index by irradiation with active energy rays and those having a low refractive index by irradiation with active energy rays may be used. This opto-electric hybrid board material can be prepared by coating the matte surface with a resin forming the fifth resin layer 5 in the same manner as described above when a metal foil is used as the metal layer 13. it can.

Next, a method of manufacturing an opto-electric hybrid board using the thus-obtained opto-electric hybrid board material will be described. First, as shown in FIG. 8A, the fifth resin layer 5
The active energy ray E is irradiated from the side opposite to the metal layer 13. When the refractive index of the resin forming the fifth resin layer 5 is lowered by the irradiation of the active energy ray, the irradiation of the active energy ray is performed in a pattern opposite to the wiring pattern of the optical wiring, and, for example, ultraviolet rays are used. Pattern irradiation of active energy rays can be performed by mask exposure, laser drawing exposure, or the like. At this time, the refractive index of the portion of the fifth resin layer 5 which is not irradiated with the active energy ray does not change, but the refractive index of the portion which is irradiated with the active energy ray becomes low, and A high refractive index portion 5a of the non-irradiated portion and a low refractive index portion 5b of the irradiated portion are formed.

In this way, as shown in FIG. 8B, after the high refractive index portion 5a is formed in the fifth resin layer 5 in the shape of the optical wiring pattern, the fifth resin layer 5 is provided with the metal layer 13 side. The transparent resin layer 20 is coated on the opposite surface,
As shown in (c), the fifth resin layer 5 is covered with the transparent resin layer 20. As the transparent resin layer 20, a translucent resin having a refractive index lower than that of the high refractive index portion 5a of the fifth resin layer 5 is used. For example, the same resin as the above-mentioned first resin layer 1 can be used. . Then, the printed wiring board 22 manufactured by providing the electric wiring 21 is used.
The transparent resin layer 20 is adhered to the surface of the substrate with an adhesive 23 so as to be laminated on the printed wiring board 22 as shown in FIG. 8D, and then the surface metal layer 13 is printed and processed. 8 (e), the electrical wiring 24 is formed, and the electrical wirings 21 and 24 can be connected by laser via processing or plating processing. Here, in the metal layer 13, a portion corresponding to the high refractive index portion 5a of the fifth resin layer 5 is left, or the high refractive index portion 5 of the fifth resin layer 5 is left.
It is preferable to form the electric wiring 24 with the metal layer 13 in the portion corresponding to a.

In FIG. 8E, the refractive index of the high refractive index portion 5a of the fifth resin layer 5 of the optical wiring pattern is the same as that of the low refractive index portion 5b of the fifth resin layer 5 and the fifth resin layer 5. 5 is higher than the refractive index of the transparent resin layer 20 which is in direct contact with
Since a is in contact with the metal layer 13 that reflects light, the high refractive index portion 5a of the fifth resin layer 5 is the core layer 26, and the low refractive index portion 5b of the fifth resin layer 5 and the transparent resin layer 20 are the cladding layers. And the high refractive index portion 5 of the fifth resin layer 5 is formed.
The optical wiring is formed by a, and the optical wiring and the electric wiring 21, 24 by the high refractive index portion 5a of the fifth resin layer 5 are formed.
It can be used as an opto-electric hybrid board in which is laminated.

When the fifth resin layer 5 is made of a light transmissive resin whose refractive index is increased by irradiation with active energy rays, the irradiation time and energy intensity of the active energy rays are adjusted. 14 described later.
As in the case of (b), the high refractive index portion 5a may be formed only in the portion in contact with the transparent resin layer 20 in the fifth resin layer 5.

7 (b), (c), (d) and (e) show another embodiment, and FIG. 7 (b) is similar to the above description.
Flame-retardant adhesive layer 1 between the metal layer 13 and the resin layer
4 is provided, FIG. 7 (c) is similar to the one described above, a transparent cover film 15 is provided on the surface of the resin layer opposite to the metal layer 13, and FIG. 7 (d) is the same as described above. The support 16 is removably attached to the surface of the metal layer 13 opposite to the side where the resin layer is provided, and FIG. 7 (e) shows that the metal layer 13 is applied to both sides of the support 16. The opto-electric hybrid board material is formed on both sides of the support 16.

FIG. 9 (a) shows an example of the embodiment of the invention of claim 5, wherein the sixth resin layer 6 is laminated in direct contact with one surface of the first resin layer 1 and the sixth resin layer 6 is laminated. The seventh resin layer 7 is laminated in direct contact with the surface of the layer 6 opposite to the first resin layer 1, and the metal layer is provided on the surface of the first resin layer 1 opposite to the side on which the sixth resin layer 6 is provided. It is formed by stacking 13.

As the first resin layer 1 and the metal layer 13, those described above can be used. The seventh resin layer 7 is made of a light transmissive resin, and preferably has the same refractive index as that of the first resin layer 1, and the same resin as the resin forming the first resin layer 1 is used. it can. Furthermore, the sixth resin layer 6 is made of a light transmissive resin whose refractive index changes by irradiation with active energy rays and whose refractive index increases by irradiation with active energy rays. The same resin as the third resin layer 3 can be used as the resin whose refractive index is increased by the irradiation of active energy rays. The resin forming the sixth resin layer 6 is such that the portion irradiated with the active energy ray is the portion not irradiated with the active energy ray, and the resin forming the first resin layer 1 and the seventh resin layer 7 are formed. It is also an essential condition that the resin has a higher refractive index than that of the resin.

This opto-electric hybrid board material is similar to that described above, and when a metal foil is used as the metal layer 13, the matte surface thereof is coated with a resin for forming the first resin layer 1, and The resin forming the sixth resin layer 6 is coated on one resin layer 1, and the seventh resin layer 7 is further formed on the resin.
It can be prepared by coating a resin forming a.

Next, a method of manufacturing an opto-electric hybrid board using the thus-obtained opto-electric hybrid board material will be described. First, as shown in FIG. 10A, the metal layer 13
The sixth resin layer 6 is irradiated with an active energy ray E through the seventh resin layer 7 from the opposite side. The irradiation of the active energy ray is performed in a pattern corresponding to the wiring pattern of the optical wiring, and the pattern irradiation of the active energy ray can be performed by, for example, mask exposure of ultraviolet rays, drawing exposure of laser, or the like. At this time, the refractive index of the portion of the sixth resin layer 6 which is not irradiated with the active energy ray does not change, but the refractive index of the portion which is irradiated with the active energy ray becomes high, and the sixth resin layer 6 has A high refractive index portion 6a in the irradiated portion and a low refractive index portion 6b in the non-irradiated portion are formed. Sixth resin layer 6
The high refractive index portion 6a has a higher refractive index than the first resin layer 1 and the seventh resin layer 7.

In this way, as shown in FIG. 10B, after forming the high refractive index portion 6a in the sixth resin layer 6 in the shape of the optical wiring pattern, the sixth resin layer 6 of the seventh resin layer 7 was provided. The adhesive layer 23 is provided on the surface opposite to the side, and the adhesive 2 is provided on the surface of the printed wiring board 22 produced by providing the electric wiring 21.
By adhering at 3, it is laminated on the printed wiring board 22 as shown in FIG. After that, the metal layer 13 on the surface is subjected to printed wiring to form electric wiring 24 as shown in FIG. 10D, and further laser via processing or plating processing can be performed to connect the electric wirings 21 and 24. Is.

In FIG. 10D, the refractive index of the high refractive index portion 6a of the sixth resin layer 6 of the optical wiring pattern is the same as that of the low refractive index portion 6b of the sixth resin layer 6 and the sixth resin layer 6. Since the refractive index of the first resin layer 1 and the seventh resin layer 7 that are in direct contact with the layer 6 is larger than that of the sixth resin layer 6, the high refractive index portion 6a of the sixth resin layer 6 is the core layer 26 and the low refractive index portion of the sixth resin layer 6. 6b, the first resin layer 1 and the seventh resin layer 7 are clad layers 27 to form an optical waveguide, and the high refractive index portion 6a of the sixth resin layer 6 forms an optical wiring. It can be used as an opto-electric hybrid board in which the optical wiring by the high refractive index portion 6a of the resin layer 6 and the electric wirings 21 and 24 are laminated.

9 (b), (c), (d) and (e) show another embodiment, and FIG. 9 (b) is similar to the above description.
Flame-retardant adhesive layer 1 between the metal layer 13 and the resin layer
4 is provided, FIG. 9C is similar to the one described above, and a transparent cover film 15 is provided on the surface of the resin layer opposite to the metal layer 13, and FIG. 9D is the same as described above. In addition, the support 16 is releasably attached to the surface of the metal layer 13 opposite to the side where the resin layer is provided. In FIG. 9 (e), the metal layer 13 is attached to both surfaces of the support 16. The opto-electric hybrid board material is formed on both sides of the support 16.

FIG. 11 (a) shows an example of the embodiment of the invention of claim 6 in which the eighth resin layer 8 is laminated in direct contact with one surface of the first resin layer 1 and the eighth resin layer 8 is laminated. The ninth resin layer 9 is laminated in direct contact with the surface of the layer 8 opposite to the first resin layer 1, and the metal layer is further provided on the surface of the first resin layer 1 opposite to the side on which the eighth resin layer 8 is provided. It is formed by stacking 13.

As the first resin layer 1 and the metal layer 13, those described above can be used. The ninth resin layer 9 is made of a light transmissive resin, and preferably has the same refractive index as that of the first resin layer 1, and the same resin as the resin forming the first resin layer 1 is used. it can. Furthermore, the eighth resin layer 8 is made of a light transmissive resin whose refractive index changes by irradiation with active energy rays and whose refractive index decreases by irradiation with active energy rays. The same resin as the fourth resin layer 4 can be used as the resin whose refractive index is lowered by the irradiation of the active energy rays. In the resin forming the eighth resin layer 8, the portion not irradiated with the active energy ray is the first resin layer 1
It is also an essential condition that the resin that has a higher refractive index than the resin that forms the resin and the resin that forms the ninth resin layer 9.

In the case where a metal foil is used as the metal layer 13, the matte surface of this opto-electric hybrid board material is coated with a resin for forming the first resin layer 1 in the same manner as described above. The resin forming the eighth resin layer 8 is coated on one resin layer 1, and the ninth resin layer 9 is further formed on the resin.
It can be prepared by coating a resin forming a.

Next, a method of manufacturing an opto-electric hybrid board using the thus-obtained opto-electric hybrid board material will be described. First, as shown in FIG. 12A, the metal layer 13
The eighth resin layer 8 is irradiated with the active energy ray E from the opposite side through the ninth resin layer 9. The irradiation of the active energy ray is performed in a pattern opposite to the wiring pattern of the optical wiring, and the pattern irradiation of the active energy ray can be performed by, for example, mask exposure of ultraviolet rays, drawing exposure of laser, or the like. At this time, the refractive index of the portion of the eighth resin layer 8 which is not irradiated with the active energy rays does not change, but the refractive index of the portion which is irradiated with the active energy rays becomes low, and A high refractive index portion 8a of the non-irradiated portion and a low refractive index portion 8b of the irradiated portion are formed. Eighth resin layer 8
The high refractive index portion 8a has a higher refractive index than the first resin layer 1 and the ninth resin layer 9.

In this way, as shown in FIG. 12B, after the high refractive index portion 8a is formed in the eighth resin layer 8 in the shape of the optical wiring pattern, the eighth resin layer 8 of the ninth resin layer 9 is provided. The adhesive layer 23 is provided on the surface opposite to the side, and the adhesive 2 is provided on the surface of the printed wiring board 22 produced by providing the electric wiring 21.
By adhering at 3, it is laminated on the printed wiring board 22 as shown in FIG. After that, the metal layer 13 on the surface is subjected to printed wiring to form electric wirings 24 as shown in FIG. 12D, and further laser via processing or plating processing can be performed to connect the electric wirings 21 and 24. Is.

In FIG. 12D, the refractive index of the high refractive index portion 8a of the eighth resin layer 8 of the optical wiring pattern is the same as that of the low refractive index portion 8b of the eighth resin layer 8 and the eighth resin layer 8. Since the refractive index of the first resin layer 1 and the ninth resin layer 9 which are in direct contact with the layer 8 is larger than that of the eighth resin layer 8, the high refractive index portion 8a of the eighth resin layer 8 is the core layer 26 and the low refractive index portion of the eighth resin layer 8. 8b, the first resin layer 1 and the ninth resin layer 9 are clad layers 27 to form an optical waveguide, and the high refractive index portion 8a of the eighth resin layer 8 forms an optical wiring. It can be used as an opto-electric hybrid board in which the optical wiring by the high refractive index portion 8a of the resin layer 8 and the electric wirings 21 and 24 are laminated.

FIGS. 11 (b), (c), (d), and (e) show another embodiment, and FIG. 11 (b) shows between the metal layer 13 and the resin layer as described above. In FIG. 11 (c), a transparent cover film 15 is provided on the surface of the resin layer opposite to the metal layer 13, as in the above description. 11 (d), as described above, the support 16 is releasably attached to the surface of the metal layer 13 opposite to the side on which the resin layer is provided, and FIG. The metal layer 13 is stretched on both sides of the support 16 to form the opto-electric hybrid board material on both sides of the support 16.

FIG. 13 (a) shows an example of the embodiment of the invention of claim 7 in which the eleventh resin layer 11 is laminated in direct contact with one surface of the tenth resin layer 10 and the tenth resin layer 11 is laminated. It is formed by laminating a metal layer 13 on the surface of the resin layer 10 opposite to the side on which the eleventh resin layer 11 is provided.

As the metal layer 13, the above-mentioned one can be used. The eleventh resin layer 11 is made of a light transmissive resin, and the same resin as the resin forming the first resin layer 1 can be used. Further, the tenth resin layer 10 is made of a light transmissive resin whose refractive index changes by irradiation with active energy rays and whose refractive index increases by irradiation with active energy rays. The same resin as the third resin layer 3 can be used as the resin whose refractive index is increased by the irradiation of active energy rays. The resin forming the tenth resin layer 10 has a higher refractive index in the portion irradiated with the active energy ray than in the portion not irradiated with the active energy ray and the resin forming the eleventh resin layer 11. Is also an essential condition.

This opto-electric hybrid board material is similar to that described above, and when a metal foil is used as the metal layer 13, the matte surface thereof is coated with a resin for forming the tenth resin layer 10, and Eleventh resin layer 11 on tenth resin layer 10
It can be prepared by coating a resin forming a.

Next, a method of manufacturing an opto-electric hybrid board using the thus-obtained opto-electric hybrid board material will be described. First, as shown in FIG. 14A, the metal layer 13
And the tenth resin layer 10 through the eleventh resin layer 11 from the opposite side.
The active energy ray E is irradiated to the. The irradiation of the active energy ray is performed in a pattern corresponding to the wiring pattern of the optical wiring, and the pattern irradiation of the active energy ray can be performed by, for example, mask exposure of ultraviolet rays, drawing exposure of laser, or the like. At this time, in the tenth resin layer 10,
Although the refractive index of the portion which is not irradiated with the active energy ray does not change, the refractive index of the portion which is irradiated with the active energy ray becomes high, and the tenth resin layer 10 is not irradiated with the high refractive index portion 10a of the irradiated portion. The low refractive index portion 10b of the portion is formed. The refractive index of the high refractive index portion 10a of the tenth resin layer 10 is higher than the refractive index of the eleventh resin layer 11.

Thus, as shown in FIG. 14B, the high refractive index portion 10a can be formed in the tenth resin layer 10 in the shape of the optical wiring pattern. Here, by adjusting the irradiation time and energy intensity of the active energy ray, the high refractive index portion 10a is formed only in the portion in contact with the eleventh resin layer 11 in the tenth resin layer 10, and the metal layer 13 is formed. It is better not to form up to the part that contacts with. After forming the high refractive index portion 10a in the optical wiring pattern shape on the tenth resin layer 10 as described above, the adhesive layer 23 is formed on the surface of the eleventh resin layer 11 opposite to the side where the tenth resin layer 10 is provided. 1 and by adhering to the surface of the printed wiring board 22 manufactured by providing the electric wiring 21 with the adhesive 23.
As shown in FIG. 4C, it is laminated on the printed wiring board 22.
After that, the metal layer 13 on the surface is processed by printed wiring to obtain the structure shown in FIG.
As shown in FIG. 4 (d), the electric wiring 24 is formed, and then laser via processing or plating processing can be performed to connect the electric wirings 21 and 24.

In FIG. 14D, the high refractive index portion 10a of the tenth resin layer 10 of the optical wiring pattern has a refractive index of
The low refractive index portion 10b of the tenth resin layer 10 and the tenth resin layer 10
Since the refractive index of the eleventh resin layer 11 directly in contact with the core layer 26 is higher than that of the eleventh resin layer 11,
The low refractive index portion 10b of the tenth resin layer 10 and the eleventh resin layer 11
Is a clad layer 27, and an optical wiring is formed by the high refractive index portion 11a of the eleventh resin layer 11, and an optical wiring is formed by the high refractive index portion 10a of the tenth resin layer 10. It can be used as an opto-electric hybrid board in which electrical wirings 21 and 24 are laminated.

FIGS. 13 (b), (c), (d) and (e) show another embodiment, and FIG. 13 (b) shows the space between the metal layer 13 and the resin layer, as described above. In FIG. 13 (c), a transparent cover film 15 is provided on the surface of the resin layer opposite to the metal layer 13, as in the above description. 13 (d), as described above, the support 16 is releasably attached to the surface of the metal layer 13 opposite to the side on which the resin layer is provided, and FIG. The metal layer 13 is stretched on both sides of the support 16 to form the opto-electric hybrid board material on both sides of the support 16.

FIG. 15 (a) shows an example of the embodiment of the invention of claim 8 in which the eleventh resin layer 11 is laminated in direct contact with one surface of the twelfth resin layer 12, and It is formed by laminating the metal layer 13 on the surface of the twelve resin layer 12 opposite to the side on which the eleventh resin layer 11 is provided.

As the eleventh resin layer 11 and the metal layer 13, those described above can be used. Also, the twelfth resin layer 1
2 has a refractive index changed by irradiation with active energy rays,
It is made of a light transmissive resin whose refractive index is lowered by irradiation with active energy rays. The same resin as the fourth resin layer 4 can be used as the resin whose refractive index is increased by irradiation with such active energy rays. The resin forming the twelfth resin layer 12 has a higher refractive index in the portion not irradiated with the active energy ray than in the portion irradiated with the active energy ray and the resin forming the eleventh resin layer 11. Is also an essential condition.

This opto-electric hybrid board material is similar to that described above, and when a metal foil is used as the metal layer 13, the matte surface thereof is coated with a resin forming the twelfth resin layer 12, and The twelfth resin layer 12 can be produced by coating the resin forming the eleventh resin layer 11.

Next, a method for manufacturing an opto-electric hybrid board using the thus obtained opto-electric hybrid board material will be described. First, as shown in FIG. 16A, the metal layer 13
And the twelfth resin layer 1 through the eleventh resin layer 11 from the opposite side.
2 is irradiated with an active energy ray E. The irradiation of the active energy ray is performed in a pattern opposite to the wiring pattern of the optical wiring, and the pattern irradiation of the active energy ray can be performed by, for example, mask exposure of ultraviolet rays, drawing exposure of laser, or the like. At this time, the refractive index of the portion of the twelfth resin layer 12 that is not irradiated with the active energy rays does not change, but the portion of the twelfth resin layer 12 that is irradiated with the active energy rays has a low refractive index. A high refractive index portion 12a of the non-irradiated portion and a low refractive index portion 12b of the irradiated portion are formed on the.

Thus, as shown in FIG. 16B, the high refractive index portion 12a having the optical wiring pattern shape is formed on the twelfth resin layer 12.
After forming, the adhesive layer 23 is provided on the surface of the eleventh resin layer 11 opposite to the surface on which the twelfth resin layer 12 is provided, and
By bonding the surface of a printed wiring board 22 produced by providing the electric wiring 21 with an adhesive 23,
As shown in (c), it is laminated on the printed wiring board 22. After this, the metal layer 13 on the surface is processed by printed wiring to obtain the structure shown in FIG.
It is possible to connect the electric wirings 21 and 24 by forming the electric wiring 24 as shown in (d) and further performing laser via processing or plating processing. Here, as for the metal layer 13, the portion corresponding to the high refractive index portion 12a of the twelfth resin layer 12 is left, or the portion corresponding to the high refractive index portion 12a of the twelfth resin layer 12 is provided with the metal layer 13. It is preferable to form the electric wiring 24.

In FIG. 16D, the refractive index of the high refractive index portion 12a of the twelfth resin layer 12 of the optical wiring pattern is the same as that of the low refractive index portion 12b of the twelfth resin layer 12 or the tenth resin layer 12. The refractive index of the high refractive index portion 12a is larger than that of the eleventh resin layer 11 that is in direct contact with the two resin layer 12, and the high refractive index portion 12a reflects light.
Is in contact with the high refractive index portion 12 of the twelfth resin layer 12.
a is the core layer 26 and the low refractive index portion 12b of the twelfth resin layer 12
And the eleventh resin layer 11 becomes the clad layer 27 to form an optical waveguide, and the optical wiring is formed by the high refractive index portion 12a of the twelfth resin layer 12.
Optical wiring and electric wiring 21, 24 by the high refractive index portion 12a of
It can be used as an opto-electric hybrid board in which is laminated.

FIGS. 15 (b), (c), (d) and (e) show another embodiment, and FIG. 15 (b) shows between the metal layer 13 and the resin layer as described above. In FIG. 15 (c), a transparent cover film 15 is provided on the surface of the resin layer opposite to the metal layer 13, as in the above description. 15 (d), as described above, the support 16 is releasably attached to the surface of the metal layer 13 opposite to the side on which the resin layer is provided, and FIG. The metal layer 13 is stretched on both sides of the support 16 to form the opto-electric hybrid board material on both sides of the support 16.

[0081]

EXAMPLES Next, the present invention will be specifically described with reference to examples.

Example 1 A copper foil having a thickness of 35 μm (“MPGT” manufactured by Furukawa Electric Co., Ltd.) was used as the metal layer 13, and the transparent resin A was applied to the metal layer 13 by a roll transfer method to a coating thickness of 50 μm.
m, and was irradiated with a high pressure mercury lamp having a power of 2.5 J / cm ² to be cured to form a first resin layer 1. Next, a varnish of the photosensitive resin A is applied to a thickness of 80 μm and heated and dried to form a second resin layer 2 having a thickness of 40 ± 5 μm.
Was formed to prepare a material for an opto-electric hybrid board as shown in FIG.

As the transparent resin A, "Optodyne UV-3100" manufactured by Daikin Chemical Industries, Ltd. was used. This is a UV curable epoxy resin, and the refractive index after curing is 1.49.

As the varnish of the photosensitive resin A, 100 parts by mass of "EHPE-3150" manufactured by Daicel Chemical Industries, Ltd., 70 parts by mass of methyl ethyl ketone, 30 parts by mass of toluene, "Rodsil Photo" manufactured by Rhodia Japan Co., Ltd. A varnish consisting of 2 parts by weight of initiator 2074 "was used. The varnish is dried to remove the solvent, 10 J /
The cured resin cured by irradiation with a high pressure mercury lamp having a power of cm ² and then after-cured at 150 ° C. for 1 hour has a refractive index of 1.53.

The opto-electric hybrid board substrate material prepared as described above was cut into 6 cm squares, and the second resin layer 2 was coated with a mask having a width of 40 μm so as to allow light to pass therethrough.
A high-pressure mercury lamp with a power of J / cm ² was irradiated to expose, and heat treatment was performed at 120 ° C. for 30 minutes (see FIG. 2A). Next, by developing with toluene and clean through (a water-based detergent as a Freon substitute manufactured by Kao Corporation), the unexposed portion of the non-irradiated portion was removed, washed with water and dried (FIG. 2 (b)). reference). After that, the transparent resin A is applied so as to cover the linear second resin layer 2 with a coating thickness of 80 μm, and is irradiated with a high pressure mercury lamp with a power of 2.5 J / cm ² to cure the transparent resin layer. 20 is formed (see FIG. 2C), and the adhesive varnish A is further applied thereon to a thickness of 40 μm and dried at 150 ° C. to form the adhesive layer 23.
Was formed. And FR-5 type printed wiring board 2
2 through the adhesive layer 23 and vacuum-pressed at 170 ° C. to obtain an opto-electric hybrid board in which the core portion 26 of the optical wiring was formed by the linear second resin layer 2 (FIG. 2).
(See (d) and (e)).

Here, as the adhesive varnish A, "YDB500" (brominated epoxy resin) 9 manufactured by Tohto Kasei Co., Ltd. was used.
0 parts by mass, "YDCN-1211" manufactured by Tohto Kasei Co., Ltd.
(Cresol novolac type epoxy resin) 10 parts by mass,
3 parts by mass of dicyandiamide, "2E4" manufactured by Shikoku Kasei Co., Ltd.
A varnish consisting of 0.1 parts by mass of "MZ" (2 ethyl 4-methylimidazole), 30 parts by mass of methyl ethyl ketone, and 8 parts by mass of dimethylformamide was used.

With respect to the opto-electric hybrid board obtained as described above, both end surfaces orthogonal to the linear second resin layer 2 are polished so that the end surface of the second resin layer 2 forming the core portion of the optical wiring is When exposed, the near-infrared light with a wavelength of 850 μm was made incident through a multimode optical fiber with a core diameter of 50 μm from one end face, and the light emitted from the opposite end face was observed with a CCD camera. Was observed and it was confirmed that the optical interconnection was functioning. The peel strength of the copper foil forming the metal layer 13 was measured to be 6.9 N.
/ Cm (0.7 kg / cm).

Example 2 In Example 1, after forming the second resin layer 2, the surface of the second resin layer 2 had a thickness of 25 μm.
1 (c) by pressing the cover film 15 made of the transparent PET film of FIG.
The following materials for opto-electric hybrid boards were prepared. In this case, since the resin layer was not exposed, the handling property was excellent.

Then, except that the cover film 15 was peeled off after the exposure, and the development was carried out after the cover film 15 was exposed, the material for the opto-electric hybrid board was processed in the same manner as in Example 1 to obtain the opto-electric material. A mixed substrate was obtained.
When this opto-electric hybrid board was evaluated in the same manner as in Example 1, it was confirmed that the optical wiring functioned. The peel strength of the copper foil forming the metal layer 13 was measured and found to be 6.9 N / cm (0.7 kg / cm).

Example 3 A copper foil was used as the metal layer 13 in the same manner as in Example 1, and the adhesive varnish A of 40 was applied to the metal layer 13.
The adhesive layer 14 was formed by applying a coating of a thickness of μm and drying at 150 ° C. After that, the first resin layer 1 and the second resin layer 2 were formed on the adhesive layer 14 in the same manner as in Example 1. By forming, a material for an opto-electric hybrid board as shown in FIG. 1 (b) was produced.

Then, the opto-electric hybrid board was obtained by subjecting the opto-electric hybrid board material to the same processing as in Example 1. When this opto-electric hybrid board was evaluated in the same manner as in Example 1, it was confirmed that the optical wiring functioned. Moreover, when the peel strength of the copper foil forming the metal layer 13 was measured, it was 9.8 N / cm (1.0 kg / c
m), and it was confirmed that the adhesive strength of the metal layer 13 was improved by the adhesive layer 14.

Example 4 A stainless plate was used as the support 16, and a shiny surface of copper foil was adhered to the surface of the stainless plate with a double-sided adhesive tape, so that the support 16 was covered with the metal layer 13. Then, by forming the first resin layer 1 and the second resin layer 2 on the surface of the metal layer 13 in the same manner as in Example 1, a material for an opto-electric hybrid board as shown in FIG. 1D was manufactured. In this case, since the thin metal layer 13 is reinforced by the rigid support 16, the handling property is excellent.

The opto-electric hybrid board material was processed in the same manner as in Example 1, and finally the support 16 was peeled off to obtain an opto-electric hybrid board. When this opto-electric hybrid board was evaluated in the same manner as in Example 1,
It was confirmed that the optical wiring was functioning. Also metal layer 1
When the peel strength of the copper foil forming No. 3 was measured, 6.
It was 9 N / cm (0.7 kg / cm).

(Example 5) The same copper foil as in Example 1 was used as the metal layer 13, a varnish of the photosensitive resin B was applied to the metal layer 13 by a roll transfer method to a thickness of 100 µm, and dried by heating to 5
By forming the fifth resin layer 5 having a thickness of 0 ± 5 μm,
A material for an opto-electric hybrid board as shown in FIG. 7A was produced.

As the photosensitive resin B, "Gracia PS-SR103" manufactured by Nippon Paint Co., Ltd. was used.
This is a polysilane resin having a thickness of 50 μm, a refractive index after curing (before UV exposure) of 1.64, and a refractive index after exposure of UV irradiation of 10 J / cm ² of 1.58 to 1 It changes to 0.62.

The opto-electric hybrid board substrate material prepared as described above was cut into a 6 cm square, and the fifth resin layer 5 was coated with a 10-th layer through a mask formed so that light was blocked in a linear shape having a width of 40 μm.
Irradiation with a high-pressure mercury lamp having a power of J / cm ² (see FIG. 8A) is performed to lower the refractive index of the exposed portion to make the exposed portion a low refractive index portion 5b, thereby exposing the unexposed portion. Was formed as the high refractive index portion 5a. (See FIG. 8B). Next, the transparent resin B is coated so as to cover the fifth resin layer 5.
To have a coating thickness of 40 μm, and heat-treated at 100 ° C. for 1 hour and further at 150 ° C. for 1 hour to be cured to form a transparent resin layer 20 (see FIG. 8C). Apply Varnish A to a thickness of 40 μm and apply 150
The adhesive layer 23 was formed by drying at ° C. And FR-5
Type printed wiring board 22 with an adhesive layer 23 interposed therebetween, and vacuum press molding at 170 ° C. to form a linear high refractive index portion 5a on the fifth resin layer 5 with a core portion 26 of the optical wiring.
Thus, an opto-electric hybrid board on which is formed is obtained (FIGS. 8D and 8E).
reference).

Here, as the transparent resin B, 100 parts by mass of "BPAF-DGE" (fluorinated bisphenol A type epoxy resin, epoxy equivalent 242) manufactured by Tohto Kasei Co., Ltd. and "B650 manufactured by Dainippon Ink and Chemicals Co., Ltd. (Methylhexahydrophthalic anhydride, acid anhydride equivalent 168) 66 parts by mass, "SA-102" manufactured by San-Apro Co., Ltd. (diazabicycloundecene octylate) 2 parts by mass of thermosetting epoxy resin Was used. This resin at 100 ℃ 1
When cured by heating for 1 hour at 150 ° C. for 1 hour, the refractive index after curing is 1.51.

With respect to the opto-electric hybrid board obtained as described above, both end surfaces of the fifth resin layer 5 orthogonal to the linear high refractive index layer 5a are polished to form a high refractive index forming a core portion of the optical wiring. The end surface of the refractive index layer 5a is exposed, and the wavelength of 850 μ is measured from one end surface.
m near-infrared light enters through a multimode optical fiber with a core diameter of 50 μm, and the light emitted from the opposite end face is C
When observed with a CD camera, it was observed that light was guided, and it was confirmed that the optical wiring functioned. The peel strength of the copper foil forming the metal layer 13 was measured and found to be 4.9 N / cm (0.5 kg / cm).

Example 6 In Example 5, after forming the fifth resin layer 5, a thickness of 25 μm was formed on the surface of the fifth resin layer 5.
7 (c) by pressing the cover film 15 made of the transparent PET film of FIG.
The following materials for opto-electric hybrid boards were prepared. In this case, since the resin layer was not exposed, the handling property was excellent.

Then, after exposing the cover film 15 from above, the cover film 15 is peeled off to remove the transparent resin layer 20.
The same procedure as in Example 5 was performed on the opto-electric hybrid board material except for forming the opto-electric hybrid board to obtain the opto-electric hybrid board. When this opto-electric hybrid board was evaluated in the same manner as in Example 1, it was confirmed that the optical wiring functioned. The peel strength of the copper foil forming the metal layer 13 was measured to be 4.9 N / cm (0.5 kg
/ Cm).

(Embodiment 7) As in Embodiment 5, a copper foil is used as the metal layer 13, and the adhesive varnish A of 40 is applied to the metal layer 13.
The adhesive layer 14 was formed by applying the coating solution to a thickness of μm and drying at 150 ° C. After that, the fifth resin layer 5 was formed on the adhesive layer 14 in the same manner as in Example 5. A material for an opto-electric hybrid board as shown in FIG. 7B was produced.

Then, this opto-electric hybrid board material was processed in the same manner as in Example 5 to obtain an opto-electric hybrid board. When this opto-electric hybrid board was evaluated in the same manner as in Example 1, it was confirmed that the optical wiring functioned. Further, the peel strength of the copper foil forming the metal layer 13 was measured and found to be 8.8 N / cm (0.9 kg / c
m), and it was confirmed that the adhesive strength of the metal layer 13 was improved by the adhesive layer 14.

(Example 8) A stainless plate was used as the support 16, and a shiny surface of copper foil was adhered to the surface of the stainless plate with a double-sided adhesive tape to form a metal layer 13 on the support 16. Then, the fifth resin layer 5 was formed on the surface of the metal layer 13 in the same manner as in Example 5 to fabricate the opto-electric hybrid board material as shown in FIG. 7D. In this case, the thin metal layer 13 is a rigid support 16
Since it was reinforced with, the handling property was excellent.

The opto-electric hybrid board material was processed in the same manner as in Example 1, and the support 16 was finally peeled off to obtain an opto-electric hybrid board. When this opto-electric hybrid board was evaluated in the same manner as in Example 1,
It was confirmed that the optical wiring was functioning. Also metal layer 1
When the peel strength of the copper foil forming 3 was measured, 4.
It was 9 N / cm (0.5 kg / cm).

(Example 9) The same copper foil as in Example 1 was used as the metal layer 13, a varnish of the photosensitive resin B was applied to the metal layer 13 by a roll transfer method to a thickness of 100 µm, and dried by heating to 5
A twelfth resin layer 12 having a thickness of 0 ± 5 μm is formed, and a transparent resin B is further applied onto the twelfth resin layer 12 to a thickness of 50 μm by a roll transfer method, followed by heat treatment at 100 ° C. for 1 hour and further at 150 ° C. for 1 hour. The eleventh resin layer 11 was formed by curing, and the opto-electric hybrid board material as shown in FIG.

The opto-electric hybrid board material produced as described above was cut into 6 cm squares, and 10 J / cm ² was applied to the twelfth resin layer 12 through a mask produced so that light was blocked in a line of 40 μm width. By exposing by irradiating a high-pressure mercury lamp of power (see FIG. 16 (a)), the refractive index of the exposed portion is lowered, and the exposed portion is made into the low refractive index portion 12b.
The unexposed portion was formed as the high refractive index portion 12a. (Fig. 1
6 (b)). Next, the adhesive varnish A was applied to the surface of the eleventh resin layer 11 in a thickness of 40 μm and dried at 150 ° C. to form the adhesive layer 23. Then, it is laminated on the FR-5 type printed wiring board 22 with the adhesive layer 23 interposed therebetween, and the temperature is 170 ° C.
By vacuum press molding with a twelfth resin layer 12
An opto-electric hybrid board in which the core portion 26 of the optical wiring was formed by the linear high refractive index portion 12a was obtained (see FIGS. 16C and 16D).

With respect to the opto-electric hybrid board obtained as described above, both end faces of the twelfth resin layer 12 orthogonal to the linear high refractive index layer 12a are polished to form a core portion for optical wiring. When one end face of the refractive index layer 12a is exposed, near-infrared light with a wavelength of 850 μm is made incident through a multimode optical fiber with a core diameter of 50 μm, and light emitted from the opposite end face is observed with a CCD camera. Was observed to be guided, and it was confirmed that the optical wiring functioned. Moreover, when the peel strength of the copper foil forming the metal layer 13 was measured, it was 4.9 N / cm (0.5 kg / cm).
Met.

(Example 10) A cover film made of a transparent PET film having a thickness of 25 µm on the surface of the eleventh resin layer 11 after forming the twelfth resin layer 12 and the eleventh resin layer 11 in Example 9. The material for opto-electric hybrid board as shown in FIG. 15C was manufactured by pressing 15 with a roll and adhering it. In this case, since the resin layer was not exposed, the handling property was excellent.

Then, the same processing as in Example 9 is performed on the opto-electric hybrid board material material except that the cover film 15 is peeled off after the exposure from above the cover film 15 to form the adhesive layer 23. As a result, an opto-electric hybrid board was obtained. Example 1 of this opto-electric hybrid board
When the same evaluation as above was performed, it was confirmed that the optical wiring was functioning. Moreover, when the peel strength of the copper foil forming the metal layer 13 was measured, it was 4.9 N / cm (0.5 k
g / cm).

(Embodiment 11) A stainless steel plate is used as a support 16
The shiny side of the copper foil is adhered to the surface of the stainless steel plate with a double-sided adhesive tape to obtain the support 16
A metal layer 13 was placed on the surface. Then, a twelfth resin layer 12 and an eleventh resin layer 11 are formed on the surface of the metal layer 13 in the same manner as in Example 9 to produce a material for an opto-electric hybrid board as shown in FIG. did. In this case, since the thin metal layer 13 is reinforced by the rigid support 16,
It was excellent in handleability.

Then, the opto-electric hybrid board material was processed in the same manner as in Example 1, and finally the support 16 was peeled off to obtain an opto-electric hybrid board. When this opto-electric hybrid board was evaluated in the same manner as in Example 1,
It was confirmed that the optical wiring was functioning. Also metal layer 1
When the peel strength of the copper foil forming 3 was measured, 4.
It was 9 N / cm (0.5 kg / cm).

Example 12 The same copper foil as in Example 1 was used as the metal layer 13, the transparent resin A was applied to the metal layer 13 by the roll transfer method to a thickness of 50 μm, and a high pressure of 2.5 J / cm ² was applied. The first resin layer 1 was formed by irradiating a mercury lamp to cure it. Next, varnish of photosensitive resin B
It is applied to a thickness of 0 μm and dried by heating to form an eighth resin layer 8 having a thickness of 40 ± 5 μm. Further, a varnish of transparent resin B is applied to the thickness of 50 μm by a roll transfer method, and the varnish is applied at 100 ° C.
The ninth resin layer 9 was formed by heating and curing at 150 ° C. for 1 hour, and a material for an opto-electric hybrid board as shown in FIG. 11A was produced.

The opto-electric hybrid board material prepared as described above was cut into a 6 cm square, and the eighth resin layer 8 was coated with a mask having a width of 40 μm so as to block light.
Exposure is performed by irradiating a high-pressure mercury lamp with a power of J / cm ² (see FIG. 12 (a)) to reduce the refractive index of the exposed portion,
By making the exposed portion the low refractive index portion 8b, the unexposed portion was formed as the high refractive index portion 8a. (Fig. 12 (b)
reference). Next, the adhesive varnish A is applied to the surface of the ninth resin layer 9 to a thickness of 40 μm and dried at 150 ° C. to form the adhesive layer 23.
Was formed. And FR-5 type printed wiring board 2
2 through the adhesive layer 23 and vacuum-pressed at 170 ° C. to form the optical-electrical hybrid substrate in which the core portion 26 of the optical wiring is formed on the eighth resin layer 8 by the linear high refractive index portion 8a. Was obtained (see FIGS. 12 (c) and 12 (d)).

With respect to the opto-electric hybrid board obtained as described above, both end surfaces of the eighth resin layer 8 orthogonal to the linear high refractive index layer 8a are polished to form a high refractive index forming a core portion of the optical wiring. The end surface of the refractive index layer 8a is exposed, and the wavelength of 850 μ is measured from one end surface.
m near-infrared light enters through a multimode optical fiber with a core diameter of 50 μm, and the light emitted from the opposite end face is C
When observed with a CD camera, it was observed that light was guided, and it was confirmed that the optical wiring functioned. The peel strength of the copper foil forming the metal layer 13 was measured and found to be 6.9 N / cm (0.7 kg / cm).

Example 13 Using the same copper foil as in Example 1 as the metal layer 13, the transparent resin B was applied to the metal layer 13 by the roll transfer method to a thickness of 50 μm, and the temperature was 100 ° C. for 1 hour and further 150 ° C. The first resin layer 1 was formed by heating and curing for 1 hour. Also, transparent PE with a thickness of 25 μm
The ninth resin layer 9 was formed by applying the transparent resin B to the cover film 15 made of a T film in a thickness of 50 μm by the roll transfer method, and heating and curing at 100 ° C. for 1 hour and further at 150 ° C. for 1 hour. . Then, the eighth resin layer 8 formed into a film having a thickness of 40 μm by casting the photosensitive resin C is used as the first resin layer 1 and the ninth resin layer 9.
11 by sandwiching it between
The opto-electric hybrid board material as shown in (c) was prepared.

Here, as the photosensitive resin C, 35 parts by mass of "Iupilon Z" (polycarbonate resin, refractive index 1.59) manufactured by Mitsubishi Gas Chemical Co., Inc., 20 parts by mass of methyl acrylate, 1 part by mass of benzoin ethyl ether are used. A varnish prepared by dissolving 0.04 parts by mass of hydroquinone in tetrahydrofuran was used. Thickness 4 of this photosensitive resin C
The 0 μm cured resin has a refractive index of 1.53. Then, after irradiating this with a high pressure mercury lamp having a power of ³ J / cm ² , the refractive index after exposure to 95 ° C. for 12 hours in vacuum was 1.55 to 1.58 in the exposed portion and 1.585 in the unexposed portion. ~ 1.5
It is 9.

The opto-electric hybrid board substrate material prepared as described above was cut into a 6 cm square, and a mask prepared so that light was blocked into a line having a width of 40 μm was brought into contact with the surface of the cover film 15 and the mask was passed through the mask. Eight resin layer 8
Was irradiated with a high pressure mercury lamp having a power of ³ J / cm ² (see FIG. 12A). Then, after leaving it for 1 hour, in a vacuum of 267 Pa (2 Torr), it takes 12 hours in 95 hours.
Heated for hours. By performing the exposure and the heat treatment in this manner, the exposed portion has a lower refractive index than the unexposed portion, and the unexposed portion is formed as the high refractive index portion 8a and the exposed portion is formed as the low refractive index portion 8b (Fig. 12 (b)).

Next, after peeling off the cover film 15,
The adhesive varnish A was applied to the surface of the ninth resin layer 9 to a thickness of 40 μm and dried at 150 ° C. to form the adhesive layer 23. Then, the adhesive layer 2 is formed on the FR-5 type printed wiring board 22.
3, and vacuum press molding was performed at 170 ° C. to obtain an opto-electric hybrid board in which the core portion 26 of the optical wiring was formed by the linear high refractive index portion 8a in the eighth resin layer 8 (FIG. 1
2 (c) (d)).

With respect to the opto-electric hybrid board obtained as described above, both end faces of the eighth resin layer 8 orthogonal to the linear high refractive index layer 8a are polished to form a high refractive index forming a core portion of the optical wiring. The end surface of the refractive index layer 8a is exposed, and the wavelength of 850 μ is measured from one end surface.
m near-infrared light enters through a multimode optical fiber with a core diameter of 50 μm, and the light emitted from the opposite end face is C
When observed with a CD camera, it was observed that light was guided, and it was confirmed that the optical wiring functioned. Further, the peel strength of the copper foil forming the metal layer 13 was measured and found to be 7.8 N / cm (0.8 kg / cm).

[0120]

As described above, the opto-electric hybrid board material according to claim 1 of the present invention is provided with a first resin layer made of a light transmissive resin and in contact with the first resin layer. The solubility of the solvent is changed by the irradiation of and the refractive index is higher than the resin forming the first resin layer, or the refractive index is higher than the resin forming the first resin layer by the irradiation of active energy rays. Since the second resin layer and the metal layer provided on the surface of the first resin layer opposite to the second resin layer are provided, the second resin layer is irradiated with active energy rays to be developed, The two resin layers can form the core layer of the optical waveguide and the first resin layer can form the clad layer of the optical waveguide, and the electric wiring can be formed by the printed wiring processing of the metal layer. And electrical wiring on the same board It be one that can, using the printed wiring board manufacturing conventional techniques, in which is possible to produce high-quality optical-electric hybrid board by a simple method.

The opto-electric hybrid board material according to claim 2 of the present invention is provided in contact with the first resin layer made of a light-transmissive resin, and has a refractive index when irradiated with active energy rays. A changed portion, and a portion irradiated with active energy rays, a third resin layer made of a light-transmitting resin having a higher refractive index than the resin forming the portion not irradiated with active energy rays and the first resin layer, Since the third resin layer is provided with a metal layer provided on the surface opposite to the third resin layer, by irradiating the third resin layer with an active energy ray, the optical waveguide of the optical waveguide is irradiated at the irradiation portion of the third resin layer. The core layer can form a clad layer with the non-irradiated portion of the third resin layer and the first resin layer, and can form electric wiring by printed wiring processing of the metal layer. Mixed electrical wiring on the same board Be one that can Rukoto, using printed wiring board manufacturing conventional techniques, in which is possible to produce high-quality optical-electric hybrid board by a simple method.

The opto-electric hybrid board material according to claim 3 of the present invention is provided in contact with the first resin layer made of a light-transmissive resin and the first resin layer, and has a refractive index when irradiated with active energy rays. Change, and the portion irradiated with active energy rays has a lower refractive index than the portion not irradiated with active energy rays, and the portion not irradiated with active energy rays is more than the resin forming the first resin layer. Since a fourth resin layer made of a light-transmitting resin having a high refractive index and a metal layer provided on the surface of the first resin layer opposite to the fourth resin layer are provided, active energy rays are applied to the fourth resin layer. By irradiating, the core layer of the optical waveguide can be formed in the non-irradiated portion of the fourth resin layer, and the clad layer can be formed in the irradiated portion of the fourth resin layer and the first resin layer, and the printed wiring of the metal layer can be processed. Shape electrical wiring with In addition, the optical wiring and the electrical wiring can be mixedly mounted on the same substrate, and the conventional printed wiring board manufacturing technology is used, and a high-quality optical / electrical hybrid substrate is manufactured by a simple method. It is possible to produce.

The opto-electric hybrid board material according to claim 4 of the present invention is provided in the fifth resin layer and the fifth resin layer made of a light-transmissive resin whose refractive index changes by irradiation with active energy rays. By irradiating the fifth resin layer with an active energy ray, the core layer of the optical waveguide is formed on one of the irradiated portion and the non-irradiated portion of the fifth resin layer, and the cladding layer is formed on the other side. In addition to being able to form an electric wiring by processing a printed wiring of a metal layer, the optical wiring and the electric wiring can be mixedly mounted on the same substrate. By using the technology, it becomes possible to produce a high-quality opto-electric hybrid board by a simple method.

The material for an opto-electric hybrid board according to claim 5 of the present invention comprises a first resin layer made of a light-transmissive resin, a sixth resin layer provided in contact with the first resin layer, and a sixth resin layer. A seventh resin layer made of a light-transmitting resin provided in contact with the surface of the resin layer opposite to the first resin layer, and a metal layer provided on the surface of the first resin layer opposite to the sixth resin layer. And a sixth resin layer,
The refractive index is changed by irradiation with active energy rays, and the portion irradiated with active energy rays is the portion not irradiated with active energy rays and the resin forming the first resin layer and the resin forming the seventh resin layer. Since it is made of a light-transmitting resin having a higher refractive index, by irradiating the sixth resin layer with active energy rays, the core layer of the optical waveguide and the non-irradiation of the sixth resin layer are irradiated at the irradiated portion of the sixth resin layer. A clad layer can be formed from the part, the first resin layer, and the seventh resin layer, and electric wiring can be formed by printed wiring processing of the metal layer. Optical wiring and electric wiring can be formed on the same substrate. It is possible to mix and mount, and it becomes possible to produce a high-quality opto-electric hybrid board by a simple method by using a conventional printed wiring board manufacturing technique.

The material for opto-electric hybrid board according to claim 6 of the present invention comprises a first resin layer made of a light transmissive resin, an eighth resin layer provided in contact with the first resin layer, and an eighth resin layer. A ninth resin layer made of a light-transmitting resin provided in contact with the surface of the resin layer opposite to the first resin layer, and a metal layer provided on the surface of the first resin layer opposite to the eighth resin layer. And the eighth resin layer,
The refractive index changes by the irradiation of the active energy ray, and the portion irradiated with the active energy ray has a lower refractive index than the portion not irradiated with the active energy ray,
Since the portion not irradiated with the active energy ray is made of a light-transmitting resin having a higher refractive index than the resin forming the first resin layer and the resin forming the ninth resin layer, the active energy is applied to the eighth resin layer. By irradiating the line, the core layer of the optical waveguide can be formed in the non-irradiated portion of the eighth resin layer, and the cladding layer can be formed in the irradiated portion of the eighth resin layer and the first resin layer and the ninth resin layer. In addition, it is possible to form electric wiring by printed wiring processing of a metal layer, and to mix optical wiring and electric wiring on the same substrate, using conventional printed wiring board manufacturing technology. The high-quality opto-electric hybrid board can be produced by a simple method.

The material for an opto-electric hybrid board according to claim 7 of the present invention comprises a tenth resin layer, an eleventh resin layer made of a light-transmitting resin provided in contact with the tenth resin layer, A tenth resin layer is provided with a metal layer provided on the surface opposite to the eleventh resin layer, and the tenth resin layer has a refractive index changed by irradiation with an active energy ray and is irradiated with an active energy ray. Since the portion is made of a light transmissive resin having a higher refractive index than the portion not irradiated with the active energy ray and the resin forming the eleventh resin layer, the tenth resin layer is irradiated with the active energy ray. Thereby, the core layer of the optical waveguide can be formed in the irradiated portion of the tenth resin layer, and the clad layer can be formed in the irradiated portion of the tenth resin layer and the eleventh resin layer.
Electric wiring can be formed by printed wiring processing of a metal layer, and optical wiring and electric wiring can be mixedly mounted on the same substrate, using a conventional printed wiring board manufacturing technique, It is possible to produce a high-quality opto-electric hybrid board by a simple method.

The material for opto-electric hybrid board according to claim 8 of the present invention comprises a twelfth resin layer and an eleventh resin layer made of a light-transmitting resin provided in contact with the twelfth resin layer. , A metal layer provided on the surface of the twelfth resin layer opposite to the eleventh resin layer, the twelfth resin layer having a refractive index changed by irradiation with active energy rays, and having active energy rays. The part of the resin that is not irradiated with active energy rays has a lower refractive index than that of the resin that forms the eleventh resin layer, and the part that is not irradiated with active energy rays has a higher refractive index. Since the twelfth resin layer is irradiated with an active energy ray, the core layer of the optical waveguide is formed in the non-irradiated portion of the twelfth resin layer, and the twelfth resin layer irradiated portion and the twelfth resin layer. Eleven resin layers can form the clad layer Both of them are capable of forming electrical wiring by printed wiring processing of a metal layer, and optical wiring and electrical wiring can be mixedly mounted on the same substrate, using conventional printed wiring board manufacturing technology. Thus, it becomes possible to produce a high-quality opto-electric hybrid board by a simple method.

Further, in the invention of claim 9 according to any one of claims 1 to 8, since an adhesive layer is provided between the metal layer and the resin layer adjacent to the metal layer, the adhesion of the electric wiring formed by the metal layer The strength can be increased and the reliability of the electric wiring can be increased.

Further, the invention of claim 10 relates to claims 1 to 9.
In any of the above, since the transparent cover film is provided on the surface opposite to the metal layer, the resin layer can be protected by the cover film, and the handling property when handling the opto-electric hybrid board material is improved. is there.

Further, the invention of claim 11 relates to claims 1 to 1.
In any of 0, since the metal layer and a peelable support are laminated on the surface of the metal layer opposite to the resin layer,
The metal layer can be reinforced with a support, and the handling property is improved when the resin layer is provided on the surface of the metal layer.

[Brief description of drawings]

FIG. 1 shows an embodiment of an opto-electric hybrid board material according to the present invention, in which (a) to (e) are cross-sectional views, respectively.

FIG. 2 is a diagram showing a process of manufacturing an opto-electric hybrid board from the above-mentioned opto-electric hybrid board material, and (a) to (e) are cross-sectional views, respectively.

FIG. 3 shows another embodiment of the opto-electric hybrid board material according to the present invention, in which (a) to (e) are sectional views, respectively.

FIG. 4 is a diagram showing a step of manufacturing an opto-electric hybrid board from the above-mentioned opto-electric hybrid board material, wherein (a) to (e) are cross-sectional views, respectively.

FIG. 5 shows another embodiment of the opto-electric hybrid board material according to the present invention, in which (a) to (e) are cross-sectional views, respectively.

FIG. 6 is a diagram showing a step in manufacturing an opto-electric hybrid board from the above-mentioned opto-electric hybrid board material, and (a) to (e) are cross-sectional views, respectively.

FIG. 7 shows another embodiment of the material for an opto-electric hybrid board according to the present invention, in which (a) to (e) are cross-sectional views, respectively.

FIG. 8 is a diagram showing a process of manufacturing an opto-electric hybrid board from the above-mentioned opto-electric hybrid board material, wherein (a) to (e) are cross-sectional views, respectively.

FIG. 9 shows another embodiment of the material for an opto-electric hybrid board according to the present invention, in which (a) to (e) are sectional views, respectively.

FIG. 10 is a diagram showing a step in manufacturing an opto-electric hybrid board from the above-mentioned opto-electric hybrid board material, and FIGS.

FIG. 11 shows another embodiment of the opto-electric hybrid board material according to the present invention, in which (a) to (e) are cross-sectional views, respectively.

FIG. 12 is a diagram showing a step in manufacturing an opto-electric hybrid board from the above-mentioned opto-electric hybrid board material, and (a) to (d) are cross-sectional views, respectively.

FIG. 13 shows another embodiment of the opto-electric hybrid board material according to the present invention, in which (a) to (e) are sectional views, respectively.

FIG. 14 is a diagram showing a step of manufacturing an opto-electric hybrid board from the above-mentioned opto-electric hybrid board material, and (a) to (d) are cross-sectional views, respectively.

FIG. 15 shows another embodiment of the opto-electric hybrid board material according to the present invention, and (a) to (e) are cross-sectional views, respectively.

FIG. 16 is a diagram showing a step of manufacturing an opto-electric hybrid board from the above-mentioned opto-electric hybrid board material, and (a) to (d) are cross-sectional views, respectively.

[Explanation of symbols]

1 First resin layer 2 Second resin layer 3 Third resin layer 4th resin layer 5 Fifth resin layer 6 sixth resin layer 7 Seventh resin layer 8 Eighth resin layer 9 Ninth resin layer 10 Tenth resin layer 11 Eleventh resin layer 12 Twelfth resin layer 13 metal layers 14 Adhesive layer 15 cover film 16 Support

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Asahi Matsushima             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Yukio Matsushita             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Hideo Nakanishi             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Shinji Hashimoto             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Tomoaki Nemoto             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Hiroyuki Yagyu             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Kasai Yuoi             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company F term (reference) 2H047 KA04 PA02 PA21 PA24 QA05                 5E338 AA02 AA16 BB63 CC10 EE32

Claims (11)

[Claims] 1. A first resin layer made of a light-transmissive resin, and a solvent which is provided in contact with the first resin layer and whose solvent solubility is changed by irradiation with an active energy ray and which is refracted from a resin forming the first resin layer. Of a light-transmissive resin having a high refractive index or a refractive index higher than that of the resin forming the first resin layer by irradiation with active energy rays, and a second resin layer on the side opposite to the second resin layer of the first resin layer. A material for an opto-electric hybrid board, comprising a metal layer provided on the surface. 2. A first resin layer made of a light-transmissive resin, and a portion which is provided in contact with the first resin layer, has a refractive index changed by irradiation with active energy rays, and is irradiated with active energy rays, A portion of the first resin layer opposite to the third resin layer and a third resin layer made of a light-transmitting resin having a higher refractive index than the resin forming the first resin layer and the portion not irradiated with active energy rays. A material for an opto-electric hybrid board, comprising: 3. A first resin layer made of a light-transmissive resin, provided in contact with the first resin layer, the refractive index changes by irradiation with active energy rays, and the portion irradiated with active energy rays is active. The refractive index is lower than that of the portion not irradiated with energy rays, and the portion not irradiated with active energy rays is a fourth resin layer made of a light-transmitting resin having a higher refractive index than the resin forming the first resin layer. A material for an opto-electric hybrid board, comprising: a metal layer provided on a surface of the first resin layer opposite to the fourth resin layer. 4. An optoelectric device comprising a fifth resin layer made of a light-transmissive resin whose refractive index changes by irradiation with active energy rays, and a metal layer provided on the fifth resin layer. Material for mixed board. 5. A first resin layer made of a light-transmitting resin, a sixth resin layer provided in contact with the first resin layer, and a surface of the sixth resin layer opposite to the first resin layer. A seventh resin layer made of a light-transmitting resin provided, and a metal layer provided on the surface of the first resin layer opposite to the sixth resin layer, wherein the sixth resin layer is irradiated with active energy rays. Changes the refractive index,
And the portion irradiated with the active energy ray is made of a light-transmissive resin having a higher refractive index than the portion not irradiated with the active energy ray and the resin forming the first resin layer and the resin forming the seventh resin layer. A material for an opto-electric hybrid board, which is characterized in that 6. A first resin layer made of a light-transmitting resin, an eighth resin layer provided in contact with the first resin layer, and a surface of the eighth resin layer opposite to the first resin layer. The ninth resin layer made of a light-transmitting resin provided, and a metal layer provided on the surface of the first resin layer opposite to the eighth resin layer, wherein the eighth resin layer is irradiated with active energy rays. Changes the refractive index,
And the portion irradiated with active energy rays has a lower refractive index than the portion not irradiated with active energy rays, and the portion not irradiated with active energy rays is a resin and a ninth resin layer forming the first resin layer. A material for an opto-electric hybrid board, which is made of a light transmissive resin having a higher refractive index than the resin forming the. 7. A tenth resin layer, an eleventh resin layer made of a light-transmitting resin provided in contact with the tenth resin layer, and a surface of the tenth resin layer opposite to the eleventh resin layer. A metal layer provided, the tenth resin layer has a refractive index changed by irradiation with active energy rays, and a portion irradiated with active energy rays is a portion not irradiated with active energy rays and a tenth portion. (1) A material for an opto-electric hybrid board, which is made of a light transmissive resin having a higher refractive index than the resin forming the resin layer. 8. A twelfth resin layer, an eleventh resin layer made of a light-transmitting resin provided in contact with the twelfth resin layer, and a side of the twelfth resin layer opposite to the eleventh resin layer. And a metal layer provided on the surface of the twelfth resin layer, wherein the twelfth resin layer has a refractive index changed by irradiation with active energy rays, and a portion irradiated with active energy rays is a portion not irradiated with active energy rays. An opto-electric hybrid board, which has a lower refractive index and is made of a light-transmissive resin having a higher refractive index than the resin forming the eleventh resin layer in the portion not irradiated with active energy rays. Materials. 9. The adhesive layer is provided between the metal layer and the resin layer adjacent to the metal layer, and the adhesive layer is provided between the metal layer and the resin layer.
The material for an opto-electric hybrid board according to any one of 1. 10. The material for an opto-electric hybrid board according to claim 1, further comprising a transparent cover film on the surface opposite to the metal layer. 11. The opto-electric hybrid board according to claim 1, wherein a support that can be peeled from the metal layer is laminated on the surface of the metal layer opposite to the resin layer. Materials.