JP2004163914A - Manufacturing method of optical circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a high quality optical circuit board by a simple method. <P>SOLUTION: This is a method for manufacturing an optical circuit board equipped with an optical circuit 5 that is formed with clad layers 1, 2 and a core layer 3 and that has an optical deflecting element 4 that makes light deflection-exited or light deflection-incident . This manufacturing method is composed of a process for forming a first clad layer 1 on the surface of a support 7 on which an optical deflecting element forming die 6 is installed; a process for separating from the support 7 the first clad layer 1 on which the optical deflecting element 4 is formed on the surface by the forming die 6; a process for forming a core layer 3 having a refractive index higher than that of the first clad layer 1, on the surface where the optical deflecting element 4 of the first clad layer 1 is formed; and a process for forming, on the surface of the core layer 3, a second clad layer 2 having a refractive index lower than that of the core layer 3. <P>COPYRIGHT: (C)2004,JPO

Description

  The present invention relates to a method for manufacturing an optical circuit board having an optical deflection element.

An optical circuit board on which an electric circuit and an optical circuit are mixed is formed by directly laminating a clad layer, a core layer, and a clad layer, which form an optical circuit layer, directly on a substrate on which an electric circuit is provided, and further forming an electrolytic circuit on this. After stacking the cladding layer, core layer, and cladding layer to form an optical circuit layer on the temporary substrate, bonding the optical circuit layer to the electric circuit board, and peeling off the temporary substrate Further, it is manufactured by a method of stacking an electric circuit on a layer of an optical circuit by plating or the like (for example, see Patent Documents 1 and 2).
JP 2001-154049 A JP-A-2002-304953

  However, in the above method, the number of manufacturing steps is large, work is complicated, wiring accuracy of optical circuits and the like is poor, quality is difficult to maintain, and stable production of high-quality optical circuit boards is required. There was a problem that was difficult.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing an optical circuit board capable of manufacturing a high-quality optical circuit board by a simple method.

  The method for manufacturing an optical circuit board according to claim 1 of the present invention includes an optical circuit 5 having an optical deflecting element 4 formed of the cladding layers 1 and 2 and the core layer 3 for deflecting and emitting light or deflecting and entering light. Forming a first clad layer 1 on the surface of a support 7 provided with an optical deflecting element forming die 6; Separating the first clad layer 1 formed on the surface from the support 7, and providing a refractive index higher than that of the first clad layer 1 on the surface of the first clad layer 1 on which the light deflecting element 4 is formed. And a step of forming a second cladding layer 2 having a lower refractive index than the core layer 3 on the surface of the core layer 3.

  According to a second aspect of the present invention, in the first aspect, after the step of peeling the first cladding layer 1 formed on the surface of the light deflecting element 4 from the support 7, a light reflecting film is formed on the surface of the light deflecting element 4. 9 is formed.

  According to a third aspect of the present invention, in the first aspect, a light reflecting film 9 is provided on the surface of the light deflecting element forming die 6 of the support 7, and the light deflecting element 4 is formed on the surface by the light deflecting element forming die 6. The light reflecting film 9 is formed on the surface of the light deflecting element 4 by transferring the light reflecting film 9 when the first clad layer 1 is separated from the support 7.

  According to a fourth aspect of the present invention, when the light reflecting film 9 is formed on the surface of the light deflecting element 4 according to the second or third aspect, the guide mark 10 for alignment is formed on the surface of the first cladding layer 1. It is characterized by being formed by the reflection film 9.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, a guide mark forming die 11 is provided on the support 7, and the guide mark forming die 11 is used for positioning on the surface of the first cladding layer 1. It is characterized in that a guide mark 10 is formed.

  According to a sixth aspect of the present invention, in any one of the first to fifth aspects, a plurality of core layers 3 are provided at an optical deflecting element connecting portion where a plurality of optical deflecting elements 4 formed on the first cladding layer 1 communicate. It is characterized in that the core layer 3 is formed by patterning so as to intersect.

  The invention according to claim 7 is the invention according to any one of claims 1 to 6, wherein the plurality of light deflecting elements 4 having different protruding heights sequentially cross one core layer 3 along the longitudinal direction thereof. It is characterized in that the layer 3 is formed by patterning.

  According to the invention of claim 8, in any one of claims 1 to 7, a metal foil 12 is bonded to at least one surface of the first clad layer 1 and the second clad layer 2, and the metal foil 12 is processed. A step of forming the electric circuit 13 by using

  According to a ninth aspect of the present invention, in any one of the first to eighth aspects, a core layer having a higher refractive index than the first clad layer 1 is provided on the surface of the first clad layer 1 on the side where the light deflecting element 4 is formed. After the step of forming the light deflecting element 3, the surface of the core layer 3 is removed at a position corresponding to the light deflecting element 4, so that the tip of the light deflecting element 4 protrudes from the core layer 3. Are not located inside the inside of the.

  According to the method for manufacturing an optical circuit board according to claim 1 of the present invention, by forming the first clad layer on the surface of the support, it is possible to obtain the first clad layer in which the optical deflecting element is formed. An optical circuit can be manufactured by forming a core layer or a second clad layer on the first clad layer, and a high-quality optical circuit board can be manufactured by a simple method. You can do it.

  According to the second aspect of the present invention, the reflectance of the light deflecting element can be increased by the light reflecting film, and the efficiency of light input / output can be improved.

  According to the third aspect of the present invention, the process of forming the light reflecting film on the surface of the light deflecting element can be simplified, and the light reflecting film can be formed on the surface of the light deflecting element at an accurate position. You can do it.

  According to the invention of claim 4, patterning of a core layer and patterning of an electric circuit in a later step can be performed with high accuracy based on the guide mark. At the same time, guide marks can be formed, and the guide marks can be formed without increasing the number of steps.

  According to the invention of claim 5, patterning of a core layer and patterning of an electric circuit in a later step can be performed with high accuracy on the basis of the guide mark. At this time, guide marks can also be formed at the same time, and guide marks can be formed without increasing the number of steps.

  According to the invention of claim 6, one light deflecting element connecting portion is shared by a plurality of core layers, and an optical deflecting element can be provided in each core layer.

  According to the invention of claim 7, the input signal transmitted into the core layer can be sequentially deflected from the light deflecting element having a low protrusion height to the light deflecting element having a high protrusion, and can be output. The light can be separated into a plurality of outputs by a light deflection element.

  According to the eighth aspect of the present invention, the electric circuit can be formed by processing the metal foil to form the electric circuit, so that the conventional printed wiring board manufacturing technology can be used as it is. It is possible to manufacture a substrate in which an electric circuit is mixed with an optical circuit by the method.

  According to the ninth aspect of the present invention, it is possible to prevent an optical signal propagated in the core layer from leaking beyond the protruding tip of the optical deflecting element, deflect the light by the optical deflecting element and emit the light from the core layer. The emission efficiency can be increased.

  Hereinafter, the best mode for carrying out the present invention will be described.

  FIG. 1 shows an example of an embodiment of the present invention. A deflection element molding die 6 is provided on a surface of a support 7. The deflecting element molding die 6 is formed in a concave shape corresponding to the convex shape of the deflecting element 4. When the deflecting element 4 is formed as a mirror 4a having a triangular cross section, the deflecting element 4 is formed as a groove having a triangular cross section. When formed as the diffraction grating 4b, the deflection element molding die 6 is formed as a plurality of concave and convex grooves. The material of the support 7 is arbitrary such as metal such as aluminum and SUS, plastics and glass, but it is desired that the mirror 4a and the diffraction grating 4b as the deflecting element 4 to be formed have as little surface roughness as possible. Therefore, a material that can provide a mirror surface and is easy to process is preferable. Further, the deflecting element forming die 6 does not need to exactly match the shape of the deflecting element 4 obtained in the final stage, and it is sufficient that the deflecting element forming die 6 be formed in a base shape.

  First, as shown in FIG. 1A, a light-transmissive resin 20 is poured into and supplied to the surface of the support 7 on which the deflecting element molding die 6 is provided, and is cured to form the first clad layer 1. To form As the resin 20 forming the first cladding layer 1, any resin such as a photocurable resin, a thermosetting resin, and a resin cured by a catalyst can be used. For example, an acrylic resin, an epoxy resin, Examples thereof include a polyimide resin and a silicon resin. Among these, those having high transparency and heat resistance are desirable. Before the resin is poured into the surface of the support 7, it is desirable to perform a release treatment on the surface of the support 7 in order to prevent the release from becoming difficult. Although not particularly limited, for example, when the resin is an epoxy resin, it is effective to release the surface of the support 7 with a fluorine-based resin.

  As described above, the first clad layer 1 in which the deflecting element 4 which protrudes as an elongated ridge on the surface is formed by the deflecting element forming die 6 by pouring and curing the light transmitting resin on the surface of the support 7. Is what you can do. The deflecting element 4 formed on the first cladding layer 1 may be a prism or the like, in addition to the above-described mirror 4a and diffraction grating 4b, for coupling guided light in the optical circuit 5 and spatial light outside the optical circuit 5. Alternatively, the optical circuit 5 can be formed of any material that can deflect light and emit the light, or can deflect light into the optical circuit 5. Then, by peeling the first clad layer 1 from the surface of the support 7, it is possible to obtain the first clad layer 1 having the light deflecting element 4 formed on the surface as shown in FIG. .

  Next, as shown in FIG. 1C and FIG. 2A, a light-transmitting resin 21 is poured into the surface of the first cladding layer 1 on which the light deflecting element 4 is formed, and supplied. By patterning by irradiating light L as described above, the core layer 3 is formed in a wiring pattern shape as shown in FIG. 2B. The patterning for forming the core layer 3 will be described later in detail, but the core layer 3 is formed of a resin having a higher refractive index of light than the first cladding layer 1. The light deflecting element 4 formed on the first cladding layer 1 is disposed so as to bite into the core layer 3.

  Then, by forming the second cladding layer 2 on the core layer 3 so as to cover the core layer 3, the core layer 3 as shown in FIG. 1 (e) and FIG. An optical circuit board A sandwiched between the layer 1 and the second cladding layer 2 can be obtained. The second cladding layer 2 is formed of a resin having a lower refractive index of light than the core layer 3 and can be formed of the same resin as the first cladding layer 1. A method of laminating the second clad layer 2 by using a film-like resin such as a film or a polyethylene film and superimposing the resin on the core layer 3 and temporarily melting the resin is also possible. Use is also possible.

  In the optical circuit board A obtained as described above, the optical circuit 5 is formed by using the core layer 3 having the pattern between the first and second cladding layers 1 and 2 as an optical waveguide. Light can be guided along the inside. The light guided in the optical circuit 5 is reflected or diffracted by the light deflecting element 4 disposed so as to bite into the core layer 3, and its traveling direction is deflected by 90 °. Alternatively, the light is emitted to the outside through the first cladding layer 1. Light incident from the outside through the second cladding layer 2 or the first cladding layer 1 is reflected or diffracted by the optical deflecting element 4 so that its traveling direction is deflected by 90 °, and is incident on the optical circuit 5. It is designed to be guided.

  FIG. 3 shows an example of another embodiment of the present invention. In this embodiment, light is applied to the surface of the support 7 on which the deflecting element molding die 6 is provided as shown in FIG. When the transparent resin 20 is supplied to form the first cladding layer 1, before or after the curing of the resin 20, as shown in FIG. The second support 8 is overlapped and adhered to the surface opposite to the surface 7. If the second support 8 is overlapped before the resin is cured, the second support 8 can be bonded to the resin of the first cladding layer 1 by the adhesive force of the resin itself. The second support 8 is formed of a rigid flat plate having relatively high rigidity, and may be formed of glass, plastic such as polycarbonate, acrylic resin, or the like. Assuming that heat is applied at the time of forming the first cladding layer 1, it is desirable to use a material having high heat resistance, and polycarbonate has heat resistance up to 140 ° C. and glass has heat resistance up to approximately 1000 ° C. depending on the material. Is preferred. Further, as the second support 8, a metal foil-clad insulating resin substrate used as a substrate of an electric printed circuit board can be used. The metal foil is generally a copper foil, but is not limited to this. This metal foil can be used for forming the electric circuit 13 as described later.

  As described above, when the resin 20 is supplied to the surface of the support 7 and the second support 8 is adhered when the first clad layer 1 is formed, the resin 20 of the first clad layer 1 is supported by the second support. It can be protected by the body 8, and handling properties such as handling properties are improved. In particular, even when the resin 20 poured onto the support 7 is still in a liquid state before being cured, the liquid resin 20 can be held between the support 7 and the second support 8. And so on, and the handleability is improved. Further, since the first clad layer 1 can be reinforced by the second support 8, when the first clad layer 1 is formed and then separated from the support 7 as shown in FIG. It is possible to prevent the layer 1 from being damaged due to stretching or deformation. The second support 8 may be held until the final stage of forming the core layer 3 on the first cladding layer 1 or forming the second cladding layer 2, or may reduce thermal stress. Therefore, it may be peeled off at an appropriate stage.

  Here, when a photocurable resin is used as the resin for forming the first cladding layer 1, the photocurable resin is poured into the surface of the support 7 and supplied, and then exposed to light to cure the photocurable resin. In forming the first cladding layer 1 by this, the exposure is usually performed on the photocurable resin poured onto the support 7. However, at this time, if the support 7 is formed of a light-transmitting material such as transparent glass or transparent plastic, the photocurable resin 22 is poured onto the support 7 as shown in FIG. Thereafter, it becomes possible to perform exposure by irradiating the photo-curable resin 22 with the light L through the support 7, and the direction of exposure becomes free, the degree of freedom of the exposure process is improved, and the productivity is improved. Can be enhanced. Further, the handling property (handling property) in a state where the liquid photocurable resin 22 before exposure is on the support 7 is improved.

  When the photocurable resin 22 is poured into the surface of the support 7 and supplied, and then the second support 8 is bonded onto the photocurable resin 22 as shown in FIG. If a material formed of a light-transmitting material such as transparent glass or transparent plastic is used as 8, light L can be applied to the photocurable resin 22 through the second support 8 to perform exposure. In this case, the direction of exposure is free, the degree of freedom of the exposure process is improved, and the productivity can be increased.

  Here, when the light deflecting element 4 is formed as a mirror 4a, the reflectance of the mirror 4a is determined by the difference between the refractive index of the resin of the core layer 3 and the refractive index of the resin of the first cladding layer 1 and the refractive index of the core layer 3. It is determined by the angle of the surface of the mirror 4a with respect to the longitudinal direction. By further forming the light reflecting film 9 on the surface of the light deflecting element 4, the light reflectance of the mirror 4a can be increased, and the reliability of the light deflecting element 4 can be improved. Can be enhanced. The light reflecting film 9 may be made of any material that can reflect light, such as aluminum, silver, and gold, as long as it can be formed into a thin film, but a gold thin film is most suitable for obtaining high light reflectance. I have. The light reflection film 9 can be formed by any process such as vapor deposition, plating, and printing using a paste.

  FIG. 6 shows an example of a method for forming the light reflecting film 9 on the surface of the light deflecting element 4. First, as shown in FIG. 6A, the light deflecting element 4 corresponds to the light deflecting element 4 (mirror 4a) on which the light reflecting film 9 is formed after the first cladding layer 1 formed on the surface is peeled off from the support 7. Then, a mask 24 having holes 23 is arranged on the first cladding layer 1 and metal particles are caused to fly as shown by arrows in FIG. By passing through the hole 23, a metal can be deposited on the surface of the light deflecting element 4 to form the light reflecting film 9 as shown in FIG. 6C. After the light reflecting film 9 is formed on the surface of the light deflecting element 4 as described above, a resin 21 for forming the core layer 3 is poured into the surface of the first cladding layer 1 and supplied as shown in FIG. Can be finished into an optical circuit board in the same manner as in FIG.

  FIG. 7 shows another example of a method for forming the light reflecting film 9 on the surface of the light deflecting element 4. In this case, first, a light reflecting film 9 is provided on the surface of the light deflecting element molding die 6 of the support 7. When the light reflecting film 9 is provided on the light deflecting element forming die 6 of the support 7, an electrically insulating film 26 is formed on a portion of the surface of the support 7 other than the light deflecting element forming die 6 as shown in FIG. Then, the surface of the optical deflection element forming die 6 can be selectively electroplated by applying a current to the support 7 formed of a conductor such as a metal and immersing the support in the plating bath. Since the light deflecting element molding die 6 is formed in a concave shape, it is difficult to form the light reflection film 9 on the surface of the light deflecting element molding die 6, but if the electrolytic plating is performed, the concave light deflecting element molding is performed. This makes it easy to form the light reflection film 9 on the surface of the mold 6 with a uniform thickness. After the light reflecting film 9 is provided on the surface of the light deflecting element molding die 6 of the support 7 as described above, the light transmissive film 9 is provided on the surface of the support 7 on which the deflection element molding die 6 is provided as shown in FIG. The first clad layer 1 is formed by supplying and curing the resin 20 of FIG. Then, the first cladding layer 1 is peeled from the surface of the support 7 to obtain the first cladding layer 1 having the light deflecting element 4 formed on the surface thereof by the light deflecting element forming die 6 as shown in FIG. 7C. At this time, the light reflecting film 9 is transferred from the surface of the light deflecting element forming die 6, and the light reflecting film 9 is formed on the surface of the light deflecting element 4. Thereafter, as in the case of FIG. 1, a light transmissive resin 21 is supplied to the surface of the first cladding layer 1 on which the light deflecting element 4 is formed as shown in FIG. By patterning, a core layer 3 is formed as shown in FIG. 7E, and further a second cladding layer 2 covering the core layer 3 is formed, thereby forming a core layer 3 as shown in FIG. 3 is sandwiched between the first clad layer 1 and the second clad layer 2 to obtain an optical circuit board A.

  Here, the light deflecting element 4 is formed to be elongated and continuous, and a plurality of core layers 3 are provided so as to intersect the light deflecting element 4. When the light reflecting film 9 is formed on the surface of the light deflecting element 4 as described above, the light reflecting film 9 may be formed over the entire length of the light deflecting element 4. It is preferable to form it only in the portion where the core layers 3 intersect with each other. That is, as shown in FIG. 8A, after the first cladding layer 1 having the light deflecting element 4 formed on the surface is peeled off from the support 7, metal is vapor-deposited in the same manner as in FIG. As shown in (b), the light reflection film 9 is formed only on the portion of the surface of the light deflection element 4 where the core layer 3 is to be formed. Then, the core layer 3 is patterned and provided so as to intersect with the light deflecting element 4 at the portion where the light reflecting film 9 is formed, as shown in FIG. The light reflecting layer 9 can be formed only in the portion 3, and can prevent light from leaking from the core layer 3 at the intersection of the core layer 3 and the light deflecting element 4. is there.

  Next, a step of patterning and forming the core layer 3 will be described. As the resin of the core layer 3 formed on the surface of the first clad layer 1 on which the light deflecting element 4 has been formed, it is necessary to select a resin having a high transmittance, regardless of whether it is organic or inorganic. It is desirable to select in consideration of the adhesiveness to the cladding layers 1 and 2 and the patterning property. Considering that the core layer 3 is covered with the second clad layer 2 in the final stage, the adhesiveness may be relatively moderate as a condition, but the patterning property may affect the transmission loss of the optical waveguide. Elements.

  Various patterning processes are possible, but the patterning can be performed by using a resin whose refractive index changes by light as a material of the core layer 3 and selectively exposing the resin. Examples of the resin whose refractive index is changed by light include polymethylphenylsilane called "polysilane" and a composite resin containing a photopolymerizable monomer in an acrylic resin called "Polyguide" developed by DuPont. A film or the like can be used.

  FIG. 9 shows an example of a method of forming the core layer 3 using a resin whose refractive index changes with light. First, FIG. 9A shows the surface of the first cladding layer 1 on which the light deflecting element 4 is formed. As shown in FIG. 9B, a resin 28 whose refractive index is changed by light is applied and supplied. Then, as shown in FIG. The resin 28 is partially exposed through a portion where the light transmitting portion 29 is provided by irradiating light L from above. Alternatively, as shown in FIG. 9C, the resin 28 is partially exposed by scanning with the laser light La oscillated from the laser oscillator 31. By partially exposing the resin 28 in this manner, the refractive index of the exposed portion of the resin 28 changes. Here, if a resin whose refractive index increases by light is used as the resin 28, the core layer 3 can be formed by patterning the exposed portion of the resin 28, and the resin 28 has a refractive index by light. By using a material having a reduced value, the core layer 3 can be formed by patterning the unexposed portion of the resin 28. As described above, when using a resin whose refractive index is reduced by light as the resin 28, it is necessary to use a resin whose original refractive index is higher than that of the first and second cladding layers 1 and 2. Thus, the pattern shape of the core layer 3 can be formed by the exposure pattern, and the degree of freedom in forming the core layer 3 is improved. Then, after forming the core layer 3 having a wiring pattern shape as shown in FIG. 9D, the second clad layer 2 is formed on the core layer 3 as shown in FIG. Can be obtained. 9A, 9B, and 9C are front views, and FIGS. 9D and 9E are side views.

  When the resin can be selectively removed by an etching process such as reactive ion etching (RIE), an unnecessary portion of the resin can be removed to form the core layer 3 in a wiring pattern shape. It is. Furthermore, when using a photocurable resin such as a photocurable acrylic resin, an epoxy resin, a polyimide resin, or a silicon resin, which is cured by light, by exposing the wiring pattern shape and removing an unexposed portion, the wiring pattern shape is reduced. The core layer 3 can be formed. FIG. 10 shows an example of a method of forming the core layer 3 using a photocurable resin. As in the case of FIG. 10A, a photo-curable resin 32 is applied and supplied. Then, as shown in FIG. 10B, a mask 30 provided with a light-transmitting portion 29 is arranged on the photo-curable resin 32. Then, light L is irradiated from above the mask 30 to partially expose the photo-curable resin 32 through the portion where the light transmitting portion 29 is provided. Alternatively, as shown in FIG. 10C, the photocurable resin 32 is partially exposed by scanning the laser beam La oscillated from the laser oscillator 31. By partially exposing the photocurable resin 32 in this manner, the exposed portions can be photocured and the unexposed portions can remain uncured. Therefore, the uncured and uncured portion of the photocurable resin 32 can be dissolved with a developer and washed off to remove. Alternatively, when the photo-curable resin 32 is liquid, an unexposed liquid portion can be washed away and removed. Thus, the core layer 3 is formed as shown in FIG. 10D by removing the uncured portion of the photocurable resin 32 and leaving the exposed portion of the photocurable resin 32 in a wiring pattern shape. Is what you can do. As described above, the pattern shape of the core layer 3 can be formed by the exposure pattern, and the degree of freedom of the formation of the core layer 3 is improved. Thus, after the core layer 3 is formed in the wiring pattern shape, The optical circuit board A can be obtained by forming the second clad layer 2 covering the core layer 3 as shown in FIG. 10A, 10B, and 10C are front views, and FIGS. 10D and 10E are side views.

  In forming the core layer 3 by patterning on the first cladding layer 1 as described above, in the embodiment shown in FIG. 11, the plurality of light deflecting elements 4 of the first cladding layer 1 communicate with each other. The light deflecting element 4 is formed so as to form a continuous light deflecting element connecting portion 4A having a long dimension, and the plurality of core layers 3 intersect with one continuous light deflecting element connecting portion 4A. It is. FIG. 11B is a side view of FIG. As described above, by crossing the plurality of core layers 3 with one light deflecting element connecting portion 4A, the type of the light deflecting element 4 for deflecting and emitting or deflecting and incident light can be shared by the plurality of core layers 3. This can improve the productivity as compared with the case where the light deflecting element 4 is formed for each core layer 3.

  In the embodiment shown in FIG. 12, when forming the core layer 3 by patterning on the first cladding layer 1, a plurality of light deflecting elements 4 are crossed on one core layer 3 along its longitudinal direction. It is made to let. The plurality of light deflecting elements 4 crossing the core layer 3 are formed so as to have different heights so that the height becomes higher in the direction in which light is transmitted to the core layer 3 forming the optical circuit 5. . Therefore, in the optical circuit board A of this embodiment, the light transmitted through the core layer 3 forming the optical circuit 5 is partially deflected by the light deflector 4 a having the lowest height, and The light is emitted to the outside, the other light passes through the light deflecting element 4a, is partially deflected by the next light deflecting element 4a, and is emitted to the outside of the optical circuit 5. Can be deflected by the light deflecting element 4a having the next higher height and emitted to the outside of the optical circuit 5, and is input to the core layer 3 forming the optical circuit 5. Light can be output from a plurality of locations. If there are three light deflecting elements 4 in one core layer 3 as shown in FIG. 12, signal transmission is possible as one input and three outputs, and more than one light deflecting element 4 is provided in one core layer 3. For example, signal transmission is possible as one input and multiple outputs. When the light deflecting element 4 is formed by the diffraction grating 4b, the division ratio of the output power can be adjusted by adjusting the coupling length of the grating. When the light deflecting element 4 is formed by the mirror 4a, a one-to-many connection is made, and the height of the mirror 4a is increased in order, and the height is adjusted to output an optical signal equally. It is possible to do.

  Here, after forming the first cladding layer 1 having the surface on which the light deflecting element 4 is formed as in the above embodiments, the surface of the first cladding layer 1 is treated with a plasma of at least a gas containing oxygen. Is preferred. After the first cladding layer 1 is thus treated with the oxygen gas plasma, the formation of the light reflecting film 9 and the formation of the core layer 3 are performed, whereby the adhesion of the light reflecting film 9 to the light deflecting element 4 and the first The adhesiveness of the core layer 3 to the one clad layer 1 can be enhanced, and peeling of the light reflecting film 9 and the core layer 3 can be prevented.

  When forming the core layer 3 on the surface of the first cladding layer 1 as in each of the above-described embodiments, for example, the first optical deflection element 4 as shown in FIG. After the clad layer 1 is formed, a light-transmissive resin 21 is supplied to the surface of the first clad layer 1 as shown in FIG. 13 (b), and FIG. 9 (a) (b) and FIGS. 13), the core layer 3 can be formed so as to intersect the light deflecting element 4 as shown in FIG. At this time, when the resin 21 is supplied to the surface of the first cladding layer 1, the resin 21 easily rises in the portion of the optical deflection element 4 protruding from the surface of the first cladding layer 1. When the resin 21 is applied to the surface by spin coating, swelling of the resin 21 is likely to occur. Therefore, in the portion of the light deflecting element 4, as shown in FIG. 13B, the thickness of the resin 21 is larger than the protruding height of the light deflecting element 4, and the thickness of the core layer 3 formed by patterning from the resin 21. 13C, the portion intersecting with the light deflecting element 4 is thicker than the protruding height of the light deflecting element 4 as shown in FIG. 13C, and the projecting tip of the light deflecting element 4 is located inside the surface of the core layer 3. The protruding tip of the light deflecting element 4 is covered with the raised portion 3 a of the core layer 3. When the protruding tip of the light deflecting element 4 is positioned within the thickness of the core layer 3 as described above, light transmitted through the core layer 3 as indicated by an arrow a in FIG. The light is deflected by 90 ° by the element 4 and is emitted to the outside as indicated by the arrow b. A part of the light indicated by the arrow a exceeds the tip of the light deflecting element 4 and rises in the core layer 3 as indicated by the arrow c. 3a, the light leaks to the rear of the light deflecting element 4 and the emission efficiency is reduced.

  Therefore, in this case, the protruding portion 3a formed by protruding at the portion where the core layer 3 intersects with the light deflecting element 4 is removed by performing processing such as cutting or polishing, and the light deflected as shown in FIG. It is preferable that the projecting tip of the element 4 is not located within the thickness of the core layer 3 from the surface of the core layer 3. In this manner, the light deflecting element 4 is not positioned within the thickness of the core layer 3 so that the projecting tip of the light deflecting element 4 matches the surface of the core layer 3 or the projecting tip of the light deflecting element 4 is 14B, all the light transmitted as indicated by the arrow a in the core layer 3 is deflected by 90 ° by the light deflecting element 4 as shown in FIG. The light is emitted to the outside as indicated by the arrow, and the light emission efficiency can be increased. Note that, as shown in FIG. 12, this embodiment is not applied to a structure in which the projecting height of the light deflecting element 4 is formed lower than the thickness of the core layer 3 so as to enable one input and multiple outputs. Needless to say.

  FIG. 15 shows an example of a process for forming the optical circuit board A manufactured as described above as an optical / electric hybrid board on which an electric circuit is mounted. The optical circuit board A was manufactured as described above. Thereafter, the metal foil 12 is bonded to the surfaces of the first clad layer 1 and the second clad layer 2 of the optical circuit board A. The metal foil 12 may be adhered to one of the first clad layer 1 and the second clad layer 2, or may be adhered to both the first clad layer 1 and the second clad layer 2. Good. As the metal foil 12, a copper foil, an aluminum foil, or the like can be used. As shown in FIG. 15A, the metal foil 12 is provided on the outer surface of the first clad layer 1 or the second clad layer 2 via the prepreg 34. The metal foil 12 is adhered to the surface of the first clad layer 1 or the second clad layer 2 by the insulating adhesive layer 35 of the prepreg 34 as shown in FIG. Can be done. If the refractive index of the insulating adhesive layer 35 is lower than the refractive index of the core layer 3, the insulating adhesive layer 35 can be formed so as to also serve as the second clad layer 2.

  Then, the metal foil 12 is processed according to a general printed wiring board manufacturing process to form the electric circuit 13. That is, a photosensitive resist (not shown) is applied to the surface of the metal foil 12, exposed through a mask 37 provided with a light-transmitting portion 36 in a pattern corresponding to the electric circuit 13, developed, and then developed. By etching and patterning, the electric circuit 13 can be formed as shown in FIG. In this way, it is possible to obtain an optical / electrical hybrid board in which the optical circuit 5 and the electric circuit 13 by the core layer 3 are mixed.

  Here, in the opto-electric hybrid board, the optical signal of the optical circuit 5 and the electric signal of the electric circuit 13 are generally converted mutually, and in a scene of relatively short distance transmission and signal processing, the electric signal is converted. In a situation where a signal is used and transmission is performed over a relatively long distance, an optical signal is often used properly. An optical-to-electrical conversion element such as a surface emitting diode (VCSEL) or a photodiode (PD) is used for conversion between an optical signal and an electric signal. It is necessary to mount the optical-to-electrical conversion element on this connection part. In order to accurately couple the optical circuit 5 and the electric circuit 13 at the optical deflecting element 4 in this manner, it is necessary to form the optical circuit 5 and the electric circuit 13 while aligning them. In order to align the circuit 13, it is desirable to form the guide mark 10 and then form the optical circuit 5 and the electric circuit 13 with reference to the guide mark 10.

  FIG. 16 shows an example of a method of forming the guide mark 10. As in the case of FIG. 6, when forming the light reflecting film 9 on the surface of the light deflecting element 4 of the first cladding layer 1, At the same time, guide marks 10 for alignment are formed on the surface of the first cladding layer 1 by the light reflecting film 9. That is, as shown in FIG. 16A, in the mask 24 in which the holes 23 are provided corresponding to the light deflecting elements 4 on which the light reflecting film 9 is provided, holes 39 are also provided in the positions where the guide marks 10 are formed. is there. Then, the mask 24 is disposed on the first cladding layer 1 and vacuum evaporation or the like is performed to deposit metal on the surface of the light deflecting element 4 through the holes 23 of the mask 24 to form the light reflection film 9. At the same time, the guide mark 10 can be formed by depositing a metal on the surface of the first cladding layer 1 through the hole 39.

  FIG. 17 shows another example of a method for forming the guide mark 10. When the first clad layer 1 is formed on the support 7, the position of the guide mark 10 is adjusted at the same time on the surface of the first clad layer 1. The guide mark 10 is formed. That is, in addition to the light deflecting element forming die 6, a guide mark forming die 11 is formed on the surface of the support 7 by a convex portion or the like, and as shown in FIG. Is supplied and cured to form the first cladding layer 1, and the first cladding layer 1 is peeled off from the support member 7, as shown in FIG. The first clad layer 1 formed on the surface with the guide mark 10 as a concave portion can be obtained by the mark forming die 11.

  As described above, the guide mark 10 and the light deflecting element 4 formed on the first cladding layer 1 have a fixed relationship to each other. Therefore, a mark is formed at a position corresponding to the guide mark 10 on a mask 30 for patterning and forming the core layer 3 as shown in FIG. 9B or FIG. By positioning the mask 30 in accordance with the above, it becomes possible to form the core layer 3 that intersects the optical deflecting element 4 at an accurate position. Similarly, a mark is formed at a position corresponding to the guide mark 10 on the mask 37 as shown in FIG. 15B for patterning and forming the electric circuit 13, and the mark is aligned with the guide mark 10. By performing the above positioning, it is possible to form an electric circuit 13 that intersects the light deflecting element 4 at an accurate position. In this way, the optical circuit 5 composed of the core layer 3 and the electric circuit 13 can be aligned with the guide mark 10 as a reference. The optical circuit 5 and the electric circuit 13 can be easily mounted so that the optical circuit 5 and the electric circuit 13 can be accurately coupled.

  Here, the light reflecting film 9 is formed on the surface of the light deflecting element 4 provided integrally with the first cladding layer 1 as described above, or the guide mark 10 is formed on the first cladding layer 1 with the light reflecting film 9. In this case, it is preferable to form a film containing chromium on the surface of the portion where the light reflection film 9 is formed, and then form the light reflection film 9 and the guide marks 10 thereon. That is, as shown in FIG. 18A, after the first cladding layer 1 having the light deflecting element 4 formed on the surface thereof is peeled off from the support 7, a hole 23 corresponding to the light deflecting element 4 for applying the light reflecting film 9 is formed. 18B, a mask 24 having holes 39 corresponding to locations where the guide marks 10 are to be formed is disposed on the first cladding layer 1 as shown in FIG. By performing the vapor deposition, as shown in FIG. 18C, the chromium film 41 is formed on the surface of the light deflecting element 4 through the hole 23 of the mask 24 and the surface of the first cladding layer 1 is formed through the hole 39. Thus, a chromium film 41 is formed. Next, as shown in FIG. 18C, the same mask 24 is used as it is and disposed on the first cladding layer 1, and a metal such as gold is vacuum-deposited to form a mask as shown in FIG. The light reflecting film 9 can be formed on the surface of the chromium film 41 by depositing the light on the surface of the chromium film 41 through the holes 23 and the first cladding layer 1 can be deposited on the surface of the first cladding layer 1 by the holes 39. The guide mark 10 can be formed. By forming the film 41 containing chromium as a base of the light reflecting film 9 and the guide mark 10 in this manner, the adhesion of the light reflecting film 9 and the guide mark 10 can be improved, and the light reflecting film 9 and the guide mark 10 can be improved. The mark 10 can be prevented from peeling off.

  Next, the present invention will be described specifically with reference to examples.

(Example 1)
19, two light deflecting element molding dies 6 each having a V groove having a length of 30 mm and formed in a right isosceles triangular cross section having a depth of 40 μm and an opening width of 80 μm are provided on the surface of the support 7 at a distance of 50 mm. A plate made of iron (STAVAX) having the shape of (1) was used. A dike wall is formed around the support 7 on the surface on which the light deflecting element molding die 6 is provided, and an ultraviolet curing epoxy resin “OC3514” manufactured by EMI (US) is used as a resin for the cladding layer (refractive index: 1.50 (wavelength: 589 nm). )) Is poured onto the support 7 in an environment of 20 ° C., spin-coated at 300 rpm for 10 seconds and 700 rpm for 60 seconds, and a 2 mm-thick glass plate is adhered as the second support 8, and then the cladding layer is formed. The first clad layer 1 was formed by irradiating the resin for use with an ultraviolet ray with an exposure amount of 2500 mJ (＠wavelength: 365 nm) from a super-high pressure mercury lamp and curing the resin. Thus, the first clad layer 1 on which the light deflecting element 4 was formed by the light deflecting element forming die 6 was peeled off from the support 7. (See FIGS. 1 (a) and (b) and FIGS. 5 (a) and 5 (b))
Next, a light reflecting film 9 is provided on the light deflecting element 4 (mirror 4 a) of the first cladding layer 1 by depositing gold with a thickness of 1700 ° through the mask 24, and a guide mark is formed on the surface of the first cladding layer 1. 10 were provided. (See FIGS. 16A and 16B)
Thereafter, an ultraviolet-curable liquid epoxy resin "OC3553" (refractive index: 1.52 (wavelength: 589 nm), manufactured by EMI, USA) is poured as a resin for the core layer in the environment of 20 ° C. onto the first cladding layer 1. , And spin coated at 1400 rpm. Then, five light-transmitting portions 29 for forming a core layer having a width of 40 μm are formed in parallel at a pitch of 1 mm, and the alignment with the guide marks 10 is performed using an emulsion mask 30 having a light-transmitting portion for visually recognizing the guide marks. The mask 30 was placed on the resin for the core layer, and the resin for the core layer was projected and exposed to ultraviolet light at an exposure amount of 2500 mJ through the mask 30 by an ultra-high pressure mercury lamp. Next, after performing a heat treatment at 100 ° C. for 30 minutes, using a two-fold diluted solution of “Clinthru” manufactured by Kao Corporation as a developing solution, cleaning by ultrasonic cleaning for 45 seconds, and further using ion-exchanged water, The core layer 3 was formed by patterning by washing with sonication for 30 seconds and performing development. Each of the core layers 3 was formed so as to intersect with the light deflecting element 4. (See FIGS. 10B and 10D)
Finally, the above-mentioned cladding layer resin “OC3514” is poured from above the core layer 3, spin-coated at 700 rpm, and then irradiated with ultraviolet light at an exposure amount of 2500 mJ from an ultra-high pressure mercury lamp to cure the second cladding layer. 2 (approximately 60 μm in thickness from the bottom surface of the core layer 3 and approximately 20 μm in thickness from the top of the core layer 3), an optical circuit board A was obtained. (Refer to FIG. 1E and FIG. 10E)
In the optical circuit board A thus obtained, of the pair of light deflecting elements 4 with the light reflecting film 9, the light deflecting element 4 on one input side from the outside of the second cladding layer 2 has a wavelength of 670 nm. A test was conducted to make the light of the semiconductor laser incident, to guide the light inside the core layer 3 and to emit the light from the light deflecting element 4 on the other output side. Has been confirmed to be taking place.

(Example 2)
As shown in FIG. 20, the support 7 is formed in the shape of a right-angled isosceles triangle having a depth of 40 μm, 10 μm, 13 μm, 20 μm, 40 μm and an opening width of 80 μm, 20 μm, 26 μm, 40 μm, 80 μm in order from the left. Five optical deflection element molding dies 6 each having a V-shaped groove having a length of 30 mm and provided on the surface at intervals of 10 mm were used. Otherwise, an optical circuit board was obtained in the same manner as in Example 1. (See Fig. 12)
In the optical circuit board obtained in this way, the light of the semiconductor laser having a wavelength of 670 nm is applied to the light deflecting element 4 formed from the light deflecting element forming die 6 on the left end of the support 7 in FIG. A test was performed to check whether light was emitted from the other four light deflecting elements 4 while being guided from the outside of the core layer 3 and that light was emitted from the other four light deflecting elements 4. It was confirmed that this was being done.

(Example 3)
As the second support 8, a FR-4 type copper-clad laminate (“R1766” manufactured by Matsushita Electric Works, the inner copper foil is removed by etching) is used, and a prepreg (manufactured by Matsushita Electric Works, Ltd.) is placed on the second support 8. “R1766”, the refractive index of the cured resin 1.59 (＠wavelength 589 nm) is superimposed, and the support 7 used in Example 1 is further superimposed on the surface on the side where the light deflection element molding die 6 is provided. This was heated and pressed at a maximum temperature of 170 ° C. and a maximum pressure of 2.03 MPa (20 kg / cm ² ) to form a first clad layer 1 with a cured prepreg layer. Thereafter, the first clad layer 1 was peeled off from the support 7, and a light reflecting film 9 and a guide mark 10 were provided on the first clad layer 1 in the same manner as in Example 1.

Next, using "Polysilane PS-SR104" manufactured by Nippon Paint Co., Ltd. as a resin for the core layer, it was poured onto the first cladding layer 1, spin-coated at 1000 rpm for 30 seconds, and heated at 120 ° C for 10 minutes to remove the solvent. To form a film having a thickness of 40 μm. Then, using the same mask 30 as in Example 1, the mask 30 is arranged on the resin for the core layer while being aligned with the guide mark 10, and the resin for the core layer is exposed to ultraviolet light by an ultra-high pressure mercury lamp through the mask 30. Exposure was performed at an amount of 2500 mJ (＠wavelength 365 nm). By exposing in this manner, a region to be the core layer 3 having a refractive index of 1.645 (＠ wavelength 589 nm) and a region surrounding the core layer 3 to be a clad layer having a refractive index of 1.46 (＠ wavelength 589 nm). Was formed. (See FIGS. 9B and 9D)
With respect to this, out of the pair of light deflecting elements 4 with the light reflecting film 9, light of a semiconductor laser having a wavelength of 670 nm is made incident on one of the light deflecting elements 4 on the input side and the other light deflecting element on the output side. When a test was performed to confirm the emission of light from the optical circuits 4, it was confirmed that optical input and output were performed in all the optical circuits 5.

Next, the same prepreg and copper foil as described above are overlaid on the core layer 3, and heated and pressed at a maximum temperature of 170 ° C. and a maximum pressure of 2.03 MPa (20 kg / cm ² ). By forming the layer 2, a substrate for an optical / electrical hybrid substrate in which copper foils were laminated on both surfaces was obtained. (See FIG. 15B)
(Example 4)
After forming the first cladding layer 1 and providing the light reflecting film 9 and the guide mark 10 on the first cladding layer 1 in the same manner as in Example 1, the above-mentioned "polysilane PS-SR104" was first used as a core layer resin. The solution was poured onto the cladding layer 1 and spin-coated at 1000 rpm for 30 seconds, and heated at 120 ° C. for 10 minutes to remove the solvent to form a film having a thickness of 40 μm. Then, using the same mask 30 as in Example 1, the mask 30 is arranged on the resin for the core layer while being aligned with the guide mark 10, and the resin for the core layer is exposed to ultraviolet light by an ultra-high pressure mercury lamp through the mask 30. Exposure was performed at an amount of 2500 mJ (＠wavelength 365 nm). By exposing in this manner, a region to be the core layer 3 having a refractive index of 1.645 (＠ wavelength 589 nm) and a region surrounding the core layer 3 to be a clad layer having a refractive index of 1.46 (＠ wavelength 589 nm). Was formed. Thereafter, the second clad layer 2 was formed on the core layer 3 in the same manner as in Example 1 to obtain an optical circuit board A. (See FIGS. 9B, 9D, and 9E)
In the optical circuit board A thus obtained, the light of the semiconductor laser having a wavelength of 670 nm is made incident on one of the input-side optical deflecting elements 4 of the pair of optical deflecting elements 4 with the light reflecting film 9. When a test was performed to confirm emission of light from the other light deflection element 4 on the output side, it was confirmed that light input / output was performed in all the optical circuits 5.

(Example 5)
As the support 7, two light deflecting element molding dies 6 each having a V-groove having a length of 1 mm and formed in a shape of a right-angled isosceles triangle with a cross section of 40 μm in depth and an opening width of 80 μm are provided on the surface at a distance of 50 mm and have a diameter of 1 mm. A plate made of iron (STAVAX) shown in FIG. 21 and provided with a guide mark forming die 11 composed of a cylindrical concave portion having a depth of 40 μm was used. The first clad layer 1 is formed by pouring and curing the resin for the clad layer on the surface of the support 7 in the same manner as in the first embodiment, and the light deflecting element 4 is formed by the light deflecting element forming die 6 and the guide is formed. The first clad layer 1 on which the guide mark 10 was formed by the mark forming die 11 was peeled off from the support 7. (See FIGS. 17A and 17B)
Next, without forming the light reflecting film 9, a resin for a core layer is applied on the first cladding layer 1 in the same manner as in the first embodiment, and the guide mark 10 is formed using the same mask 30 as in the first embodiment. The mask 30 was placed on the resin for the core layer while aligning with the above, and the core layer 3 was formed by patterning by performing exposure and development in the same manner as in Example 1. Then, in the same manner as in Example 1, the second clad layer 2 was formed on the core layer 3 to obtain an optical circuit board.

  In the optical circuit board thus obtained, the light of the semiconductor laser having a wavelength of 670 nm is made incident on one of the pair of optical deflecting elements 4 on the input side of the optical deflecting element 4 and the other output side of the optical deflecting element 4 A test for confirming emission of light from the element 4 was performed, and it was confirmed that light input / output was performed.

(Example 6)
19, two light deflecting element molding dies 6 each having a V groove having a length of 30 mm and formed in a right isosceles triangular cross section having a depth of 40 μm and an opening width of 80 μm are provided on the surface of the support 7 at a distance of 50 mm. Was used. Then, in the same manner as in Example 1, a resin for a cladding layer is applied on the support 7, and an FR-4 type copper-clad laminate (“R1766” manufactured by Matsushita Electric Works, The copper foil was removed by etching). Next, the first clad layer 1 was formed by irradiating the resin for the clad layer with ultraviolet rays at an exposure amount of 2500 mJ (＠ wavelength 365 nm) through the support 7 and using an ultrahigh-pressure mercury lamp and curing the resin. (See FIGS. 4A and 4B)
Thereafter, in the same manner as in Example 1, an optical circuit board was obtained by forming the light reflecting film 9 and the guide marks 10, patterning the core layer 3, and forming the second cladding layer 2. The optical input / output of this optical circuit board was confirmed in the same manner as in Example 1.

Next, a copper foil is laminated on the surface of the optical circuit board opposite to the second support 8 via a FR-4 type prepreg, and at a maximum temperature of 170 ° C. and a maximum pressure of 2.03 MPa (20 kg / cm ² ). The copper foil was laminated by heating and pressing. Then, an electric circuit is formed by performing laser via processing, copper foil patterning, and plating with reference to the guide mark 10, and furthermore, by mounting an optical-electrical conversion element (VCSEL or PD), an optical-electrical hybrid is mounted. A substrate was obtained.

(Example 7)
A 62.5 mm × 30 mm × 9.9 mm stainless steel support 7 was mixed with 1 volume part of “CYTOP CTL-107M” manufactured by Asahi Glass Co., Ltd. and 74 volume parts of “Fluorinert FC-77” manufactured by Sumitomo 3M Limited. After being immersed in a liquid and treated with an ultrasonic cleaner for 3 minutes, it is pulled up from the mixed solution and dried at 100 ° C. for 2 minutes and at 180 ° C. for 2 minutes, so that an insulating coating of fluororesin is formed on the surface of the support 7. No. 26 was formed. Next, the surface of the support 4 was cut with a diamond bite, and the light deflecting element molding die 6 consisting of a V-groove having a length of 30 mm formed in a right-angled isosceles triangular cross section having a depth of 40 μm and an opening width of 80 μm was cut into a 50 mm Are provided on the surface with a space between them. Then, a gold plating bath was prepared with an 8 g / L solution of gold plating solution “Temper Resist EX” manufactured by Japan High Purity Chemical Co., Ltd., containing gold potassium cyanide and citric acid as main components, and the support 7 was placed vertically on the gold plating bath. A cathode was connected to the support, and a 10 mm × 10 mm platinum electrode was provided at a position of the support 7 facing the light deflecting element molding die 6 and connected to the anode. Thereafter, while the gold plating solution is forcibly stirred by a pump, electroplating is performed for 38 seconds at a temperature of 70 ° C. and a current density of 0.5 A / dm ² , thereby plating the surface of the optical deflection element molding die 6 with gold. To form a light reflection film 9. At this time, since the portion of the surface of the support 7 other than the light deflection element molding die 6 was covered with the insulating film 26, the gold plating did not adhere. The thickness of the light reflecting film 9 formed by gold plating on the surface of the light deflecting element molding die 6 was about 0.17 μm when measured by a fluorescent X-ray film thickness meter. (See FIGS. 7A and 7B)
Thereafter, in the same manner as in Example 1, the first clad layer 1 is formed using the support body 7, the core layer 3 and the second clad layer 2 are formed to obtain an optical circuit board. Was. In the optical circuit board thus obtained, the light of the semiconductor laser having a wavelength of 670 nm is made incident on one of the pair of optical deflecting elements 4 on the input side of the optical deflecting element 4, and the other output side of the optical deflecting element 4 is deflected. A test for confirming emission of light from the element 4 was performed, and it was confirmed that light input / output was performed.

(Example 8)
After forming the first cladding layer 1 in the same manner as in Example 1, the entire surface of the first cladding layer 1 was treated with plasma using a mixed gas of oxygen and nitrogen as a plasma medium gas. Next, by depositing gold with a thickness of 1700 ° through the mask 24, the light reflecting film 9 is provided only on the portion of the first cladding layer 1 that intersects the core layer 3 of the light deflecting element 4 (mirror 4a). A guide mark 10 was provided on the surface of one clad layer 1. (See FIGS. 16A and 16B and FIG. 8)
Thereafter, the formation of the core layer 3 and the formation of the second clad layer 2 were performed in the same manner as in Example 1 to obtain an optical circuit board. In the optical circuit board thus obtained, the light of the semiconductor laser having a wavelength of 670 nm is made incident on one of the pair of optical deflecting elements 4 on the input side of the optical deflecting element 4, and the other output side of the optical deflecting element 4 is deflected. A test for confirming emission of light from the element 4 was performed, and it was confirmed that light input / output was performed.

(Example 9)
As the support 7, two light deflecting element molding dies 6 each having a V-groove having a length of 30 mm and formed in an isosceles triangular cross section having a depth of 40 μm and an opening width of 80 μm and having a vertex angle of 45 ° are provided on the surface at a distance of 50 mm. Further, an iron (STAVAX) plate having the shape shown in FIG. 19 was used. A dike wall is formed around the support 7 on the surface where the light deflecting element molding die 6 is provided, and an ultraviolet curing epoxy resin “OC3505” manufactured by EMI (US) (refractive index 1.523 (＠ wavelength 589 nm)) is used as a resin for the cladding layer. )) Is poured onto the support 7 in an environment of 20 ° C., and a glass plate having a thickness of 2 mm is adhered thereon as the second support 8, and then the resin for the cladding layer is applied from the side of the second support 8. The first cladding layer 1 was formed by irradiating an ultraviolet ray with an exposure amount of 2500 mJ (＠wavelength 365 nm) from an ultrahigh pressure mercury lamp and curing the same. Thus, the first clad layer 1 on which the light deflecting element 4 was formed by the light deflecting element forming die 6 was peeled off from the support 7. (See FIGS. 3 (a), (b), (c) and FIGS. 5 (a), (b))
Next, by performing vapor deposition through the mask 24, chromium is first deposited on the surface of the first cladding layer 1 only at a portion where the first cladding layer 1 intersects with the core layer 3 of the light deflecting element 4 (mirror 4a). The light reflecting film 9 and the guide mark 10 were provided by depositing gold and then depositing gold to a thickness of 1700 °. (See FIGS. 18 (b), (c), (d) and FIG. 8 (b))
Thereafter, an ultraviolet curable liquid epoxy resin "OC3505" (refractive index: 1.523 (wavelength: 589 nm)) manufactured by U.S. EMI is poured into the first cladding layer 1 as a resin for the core layer in an environment of 20C. , At 1600 rpm. Then, five light-transmitting portions 29 for forming a core layer having a width of 40 μm are formed in parallel at a pitch of 1 mm, and the alignment with the guide marks 10 is performed using an emulsion mask 30 having a light-transmitting portion for visually recognizing the guide marks. The mask 30 was placed on the resin for the core layer, and the resin for the core layer was projected and exposed to ultraviolet light at an exposure amount of 2500 mJ through the mask 30 by an ultra-high pressure mercury lamp. Next, after a heat treatment at 90 ° C. for 10 minutes, the mixture is washed for 10 seconds by ultrasonic washing using a mixed solution of isopropyl alcohol and acetone as a developing solution, and further washed with running water using ion-exchanged water. The core layer 3 was formed by patterning by repeatedly performing development for removing the resin in the unexposed portions. Each of the core layers 3 was formed so as to intersect with the light deflecting element 4. (See FIGS. 10 (b) (d) and 8 (c))
When the height (thickness) of the intersection of the core layer 3 and the light deflecting element 4 formed in this way and the height of the light deflecting element 4 were measured, the former was 43 μm and the latter was 38 μm. Since the height of the intersection of the layer 3 and the light deflecting element 4 is greater, the surface of the intersection of the core layer 3 and the light deflecting element 4 was polished to correct the height of this part to 38 μm. (See FIGS. 13C and 13D)
Finally, the above-mentioned clad layer resin “OC3505” is poured from above the core layer 3, spin-coated at 700 rpm, and then irradiated with ultraviolet light at an exposure amount of 2500 mJ from an ultra-high pressure mercury lamp to cure the second clad layer. 2 was formed, and an optical circuit board A was obtained. (Refer to FIG. 1E and FIG. 10E)
In the optical circuit board A thus obtained, of the pair of light deflecting elements 4 with the light reflecting film 9, the light deflecting element 4 on one input side from the outside of the second cladding layer 2 has a wavelength of 670 nm. A test was conducted in which light from a semiconductor laser was made incident, guided in the core layer 3 and light emitted from the light deflection element 4 on the other output side was confirmed. It was confirmed that light input / output was performed. As described above, the surface of the core layer 3 at the intersection with the light deflecting element 4 is polished to match the height of the portion of the light deflecting element 4 where the light reflecting film 9 is formed. It was confirmed that the emission intensity of the light from the light deflecting element was high, and the leakage of light to the rear of the light deflecting element 4 was significantly reduced.

1 shows an example of an embodiment of the present invention, and (a) to (e) are cross-sectional views. (A), (b) and (c) are side views of FIGS. 1 (c), (d) and (e), respectively. 1 illustrates an example of an embodiment of the present invention, and (a) to (c) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) and (b) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) and (b) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) to (d) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) to (f) are cross-sectional views. 1 shows an embodiment of the present invention, and (a) to (c) are perspective views. 1 shows an example of an embodiment of the present invention, and (a) to (e) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) to (e) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) and (b) are cross-sectional views. FIG. 1 is a cross-sectional view illustrating an example of an embodiment of the present invention. 1 shows an example of an embodiment of the present invention, and (a) to (d) are cross-sectional views. Fig. 3 shows the same operation as above, and (a) and (b) are cross-sectional views. 1 illustrates an example of an embodiment of the present invention, and (a) to (c) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) and (b) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) and (b) are cross-sectional views. 1 shows an example of an embodiment of the present invention, and (a) to (d) are cross-sectional views. It is a perspective view showing an example of a support used in an example. It is a perspective view showing an example of a support used in an example. It is a perspective view showing an example of a support used in an example.

Explanation of reference numerals

REFERENCE SIGNS LIST 1 first cladding layer 2 second cladding layer 3 core layer 4 optical deflecting element 5 optical circuit 6 optical deflecting element molding die 7 support 8 second support 9 light reflection film 10 guide mark 11 guide mark molding die 12 metal Foil 13 electric circuit

Claims (9)

  A method for manufacturing an optical circuit board provided with an optical circuit having an optical deflection element formed of a cladding layer and a core layer and deflecting and emitting light or deflecting and entering light, comprising: a support provided with an optical deflection element forming die. Forming a first cladding layer on the surface of the first, a step of peeling the first cladding layer having the light deflection element formed on the surface thereof from the support with an optical deflection element molding die, A step of forming a core layer having a higher refractive index than the first clad layer on the surface on which the deflection element is formed, and a step of forming a second clad layer having a lower refractive index than the core layer on the surface of the core layer And a method of manufacturing an optical circuit board.   The method according to claim 1, further comprising, after the step of peeling the first clad layer formed on the surface of the light deflecting element from the support, a step of forming a light reflecting film on the surface of the light deflecting element. A method for manufacturing an optical circuit board.   A light reflecting film is provided on the surface of the light deflecting element molding die of the support, and the light reflecting film is transferred when the first deflection layer formed on the surface of the light deflecting element is separated from the support by the light deflecting element molding die. 2. The method according to claim 1, wherein a light reflecting film is formed on the surface of the light deflecting element.   4. The light according to claim 2, wherein a guide mark for positioning is formed on the surface of the first cladding layer with the light reflecting film when the light reflecting film is formed on the surface of the light deflecting element. Circuit board manufacturing method.   The light according to any one of claims 1 to 4, wherein a guide mark forming die is provided on the support, and a guide mark for positioning is formed on the surface of the first cladding layer by the guide mark forming die. Circuit board manufacturing method.   The core layer is formed by patterning such that a plurality of core layers intersect an optical deflecting element connecting portion where a plurality of optical deflecting elements formed in the first clad layer communicate with each other. 6. The method for manufacturing an optical circuit board according to any one of claims 1 to 5.   7. The core layer is formed by patterning a single core layer so that a plurality of light deflecting elements having different protruding heights in order in the longitudinal direction intersect with each other. 3. The method for manufacturing an optical circuit board according to claim 1.   8. The method according to claim 1, further comprising a step of bonding a metal foil to at least one surface of the first cladding layer and the second cladding layer, and processing the metal foil to form an electric circuit. 3. The method for manufacturing an optical circuit board according to claim 1.   After the step of forming a core layer having a higher refractive index than the first clad layer on the surface of the first clad layer on which the light deflecting element is formed, the surface layer portion of the core layer is formed at a position corresponding to the light deflecting element. 9. The optical circuit board according to claim 1, wherein the removing process is performed so that the protruding tip of the optical deflecting element is not located inside the core layer from the surface of the core layer. Manufacturing method.

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