JP2003342311A - Resin composition, and prepreg, laminated sheet and multilayer printed circuit board prepared by using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition with low permittivity and dielectric loss tangent, providing a flame-retardant cured product, and a prepreg, a laminated sheet and a multilayer printed circuit board prepared by using it. <P>SOLUTION: The resin composition comprises a cross-liking component with a wt. average molecular wt. of 1,000 or less and having a multifunctional styrene group of formula 1 (wherein R is an optionally substituted hydrocarbon; R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each a H atom or a 1-6C hydrocarbon group; R<SP>5</SP>, R<SP>6</SP>, R<SP>7</SP>and R<SP>8</SP>are each a H atom or a 1-20C hydrocarbon group; and n is an integer of 2 or more) and a bromine compound, used for preparation of the prepreg, the laminated sheet and the multilayer printed circuit board. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed circuit board having a small dielectric loss for dealing with high frequency signals, a laminated board with a conductor, a prepreg, and a flame-retardant and low dielectric loss tangent resin composition used therefor. .

[0002]

2. Description of the Related Art In recent years, the signal band of information communication devices such as PHS and mobile phones and the CPU clock time of computers have reached the GHz band, and higher frequencies have been developed.

The dielectric loss of an electrical signal is proportional to the product of the square root of the dielectric constant of the insulator forming the circuit, the dielectric loss tangent and the frequency of the signal used. Therefore, the higher the frequency of the signal used, the larger the dielectric loss.

Since the dielectric loss attenuates the electric signal and impairs the reliability of the signal, it is necessary to select a material having a small dielectric constant and a small dielectric loss tangent for the insulator in order to suppress it.
Removal of polar groups from the molecular structure is effective for lowering the dielectric constant and lowering the dielectric loss tangent of the insulator. As such materials, fluororesins, curable polyolefins, cyanate ester resins, curable polyphenylene oxides, allyl-modified polyphenylene ethers, and polyetherimides modified with divinylbenzene or divinylnaphthalene have been proposed.

For example, polytetrafluoroethylene (P
Fluororesin typified by TFE) has a low dielectric constant and a low dielectric loss tangent and is used as a substrate material for handling high frequency signals. On the other hand, various non-fluorine-based resins having a low dielectric constant and a low dielectric loss tangent, which are soluble in an organic solvent and are easy to handle, have been studied.

For example, an example in which a glass cloth is impregnated with a diene polymer such as polybutadiene disclosed in JP-A-8-208856 and cured with a peroxide, is disclosed in JP-A-10-1583.
There is an example of a cyclic polyolefin in which an epoxy group is introduced into a norbornene-based addition type polymer disclosed in Japanese Patent No. 37 to impart curability.

Further, an example in which the cyanate ester, diene polymer and epoxy resin described in JP-A-11-124491 are heated to the B stage, JP-A-9-118.
There is an example of a modified resin composed of polyphenylene oxide, a diene-based polymer and triallyl isocyanate disclosed in Japanese Patent No. 759.

Further, there is an example of a resin composition composed of allylated polyphenylene ether, triallyl isocyanate and the like, which is disclosed in JP-A-9-246429.

Further, there is an example in which polyether imide and styrene, divinylbenzene or divinylnaphthalene described in JP-A-5-156159 are alloyed. Furthermore, examples of resin compositions composed of, for example, hydroquinone bis (vinylbenzyl) ether and novolac phenol resin synthesized by a Williamson reaction from a dihydroxy compound and chloromethylstyrene described in JP-A-5-78552 can be given.

On the other hand, it is essential for the above-mentioned insulating material to make it flame-retardant from the viewpoint of safety of applied products. Conventionally, the addition of flame retardants such as red phosphorus, phosphoric acid esters, nitrogen-containing compounds, halides, metal hydrates, metal oxides has been studied. For example, a compound of a nitrogen compound such as melamine, a polyol and an organic phosphate is used in combination.
There is an example of the 7442 publication.

Japanese Patent Application Laid-Open No. 9-10482 using a metal oxide
No. 1, JP-A 2000-using a metal hydrate and potassium titanate, and a phosphorus compound and a nitrogen-containing compound.
Japanese Patent No. 26553, JP-A-2000-58, which uses red phosphorus and a metal hydrate.
There is a publication of No. 00-106041.

Further, JP-A 6-1 using a halide.
There are many examples such as Japanese Patent Publication No. 06676.

[0013]

However, even in the case of a material made flame-retardant by using a material having a low dielectric constant and a low dielectric loss tangent as described above, the dielectric characteristics are not sufficient to support future high frequency equipment. .

The object of the present invention is to achieve flame retardancy without impairing the low dielectric constant and low dielectric loss tangent of a resin composition having a low dielectric loss tangent containing a polyfunctional styrene compound having excellent dielectric properties as compared with conventional materials. Another object of the present invention is to provide a flame-retardant resin composition.

Another object of the present invention is to provide a prepreg, a laminated board and a multilayer printed circuit board using the above resin composition.

[0016]

[Means for Solving the Problems] A cured product of a polyfunctional styrene compound has an extremely low dielectric constant and dielectric loss tangent, which are about 2.5 at a measurement frequency of 10 GHz and less than 0.002. Is.

As a result of various studies on flame retardants which impart flame retardancy to a cured product of a resin composition without impairing the above-mentioned properties, it was confirmed that flame retardancy can be imparted when a bromine compound is added to the composition. did. In particular, 1,2-bis (pentabromophenyl) ethane and 1,2-bis (tetrabromophthalimido) ethane have no polar group in the structure and have a high Br content, so the addition amount thereof is high. Even if it is small, the flame retardant effect is high and the effect on the dielectric constant is small.

By adding an antimony compound, the amount of the bromine compound added can be further reduced. The resin composition of the present invention can be processed into a prepreg, a laminated board and a multilayer printed circuit board.

Next, the resin composition of the present invention and its cured product will be described. The resin composition of the present invention has the formula [1]

[0020]

[Chemical 2] (In the formula, R represents a hydrocarbon which may have a substituent,
² , R ³ and R ⁴ are hydrogen atoms which may be different from each other or a hydrocarbon group having 1 to 6 carbon atoms, and R ⁵ , R ⁶ , R ⁷ and R ⁸ are hydrogen atoms which may be different from each other or a carbon atom having 1 to 6 carbon atoms. A resin containing a polyfunctional styrene group represented by 20 hydrocarbon groups and n representing an integer of 2 or more) and a crosslinking component having a weight average molecular weight of 1000 or less and containing a bromine compound. It is a composition.

The bromine compound is not particularly limited, but 1,2-bis (pentabromophenyl) ethane and 1,2-bis (tetrabromophthalimide) ethane having a high bromine content and a high flame retarding effect are preferable. The addition amount is preferably 1 to 30 parts by weight based on 100 parts by weight of the resin component in the composition, and sufficient flame retardancy can be obtained within this range.

When the amount of the bromine compound added is less than the above range, a sufficient flame retardant effect may not be obtained,
In addition, if the addition amount is larger than the above range, the dielectric properties deteriorate,
Problems such as deterioration of heat resistance may occur.

The addition amount of the bromine compound can be reduced by adding the antimony compound as the flame retardant aid. Examples of the antimony compound include antimony trioxide, antimony tetraoxide, antimony pentoxide, and sodium antimonate. The addition amount is 0.1-1
A range of 0 parts by weight is preferred. If the amount added is less than this range, the flame retardancy may not be improved, and if the amount is more than the range, the dielectric properties may deteriorate.

In the composition of the present invention, a film-forming property, strength, elongation and adhesiveness can be imparted to the resin composition by further adding a high molecular weight substance.

Examples of the high molecular weight polymer include butadiene, isoprene, styrene, methylstyrene, ethylstyrene, divinylbenzene, acrylic acid ester, acrylonitrile, N-phenylmaleimide and N-vinylphenylmaleimide, and a substituent group. Examples thereof include polyphenylene oxide which may have, and polyolefin having an alicyclic structure.

The amount of the above-mentioned polymer to be added is not particularly limited, but the crosslinking component is 5 to 95 parts by weight, and the polymer is 95 to 100 parts by weight.
A range of 5 parts by weight is preferred. Within this range, strength, elongation,
The composition can be adjusted according to the purpose such as improvement in adhesive strength. Particularly preferable ranges are 50 to 80 parts by weight of the cross-linking component and 50 to 20 parts by weight of the high molecular weight substance, whereby the solvent resistance is maintained even when the high molecular weight substance does not have a crosslinkable functional group. Be drunk

Further, by adding a curing catalyst capable of polymerizing styrene groups or a polymerization inhibitor capable of suppressing the polymerization of styrene groups to the resin composition of the present invention, the thermosetting efficiency is improved and the storage stability is improved. Can be improved.

The polyfunctional styrene compound used in the present invention can be cured without adding a curing catalyst.
By adding a curing catalyst, it is possible to accelerate the curing of the polyfunctional styrene compound. This allows curing at low temperatures.

The addition amount is preferably set in a range that does not affect the dielectric constant and the dielectric loss tangent, and the total amount of the resin components in the composition is 0.0005 to 100 parts by weight.
It is desirable to use 10 parts by weight.

The curing catalysts that generate cation or radical active species capable of initiating the polymerization of styrene groups by heat or light are shown below.

As the cationic polymerization initiator, BF ₄ , P
Examples thereof include diallyl iodonium salts, triallyl sulfonium salts and aliphatic sulfonium salts having F ₄ , AsF ₆ and SbF ₆ as counter anions. As such, Asahi Denka Kogyo SP-70, 172, CP-66, Nippon Soda CI-2855, 2823, Sanshin Chemical Industry SI-10.
Commercial products such as 0L and SI-150L can be used.

As the radical polymerization initiator, benzoin compounds such as benzoin and benzoinmethyl,
Acetophenone compounds such as acetophenone and 2,2-dimethoxy-2-phenylacetophenone, thioxanthone compounds such as thioxanthone and 2,4-diethylthioxanthone, 4,4′-diazidochalcone, 2,6-bis (4 Bisazide compounds such as'-azidobenzal) cyclohexanone and 4,4'-diazidobenzophenone, azobisisobutylnitrile, 2,
Azo compounds such as 2-azobispropane, m, m'-azoxystyrene and hydrazone, and 2,5-dimethyl-2,5-di (t-butylperoxy) hexane and 2,5-dimethyl- Examples include organic peroxides such as 2,5-di (t-butylperoxy) hexyne-3 and dicumyl peroxide.

In particular, it is desirable to add an organic peroxide or bisazide compound which can cause hydrogen abstraction of a compound having no functional group and bring about crosslinking between the crosslinking component and the high molecular weight compound.

The polymerization inhibitor functions to increase the storage stability of the composition of the present invention, and the addition amount thereof is preferably within a range that does not significantly impair the dielectric properties and the reactivity during curing. It is desirable to add 0.0005 to 5 parts by weight to 100 parts by weight of the total resin components in the composition. When the polymerization inhibitor is added within the above range, an unnecessary crosslinking reaction during storage can be suppressed, and no significant curing trouble is caused during curing.

Examples of such polymerization inhibitors include quinones such as hydroquinone, p-benzoquinone, chloranil, trimethylquinone and 4-t-butylpyrocatechol, and aromatic diols.

The composition of the present invention is used as a prepreg by impregnating an organic or inorganic cloth or nonwoven fabric and drying it. The base material of the prepreg is not particularly limited, and various glass cloths, glass non-woven fabrics, aramid non-woven fabrics, porous PTFE and the like can be used.

The prepreg is produced by immersing a cloth or a non-woven fabric, which is a base material, in a varnish produced by using the resin composition, and then drying it.
Drying conditions after impregnation depend on the resin composition, but when toluene is used as a solvent, for example, 80 to 130 ° C,
It is preferable to dry for about 30 to 90 minutes.

By laminating a conductor foil such as an electrolytic copper foil on the prepreg of the present invention and subjecting it to hot pressing, a laminate having a conductor layer on the surface is produced. The thickness of the copper foil is 12-36
About μm is preferable. The pressing conditions depend on the resin composition used, but for example, when polyphenylene ether is used as the high molecular weight substance, 150 to 240 ° C., 1
It is preferable to mold at 1-3 MPa for 1-3 hours.

Wiring is performed on the conductor layers of the above-mentioned laminated board, a plurality of the conductor layers are laminated through the prepreg, and the layers are multilayered by hot pressing to produce a multilayer printed circuit board. The multilayer printed circuit board thus obtained has a low dielectric constant and a low dielectric loss tangent, and is flame retardant. That is, the multilayer printed circuit board has excellent transmission characteristics and safety.

[0040]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to Examples and
A comparative example will be described. In the description, “part” means “part by weight” unless otherwise specified.

Tables 1 and 2 show the compositions and characteristics of the examples of the present invention and comparative examples.

[0042]

[Table 1]

[Table 2] The names of reagents used in Examples and Comparative Examples, synthesis methods, varnish preparation methods, and cured product evaluation methods are described below.

(1) 1,2-bis (vinylphenyl)
Synthesis of ethane (called BVPE) BVPE was synthesized by a known method shown below. 500
5.36 g (220 mmol) of granular magnesium for Grignard reaction (manufactured by Kanto Kagaku Co., Ltd.) was placed in a ml three-necked flask, and a dropping funnel, a nitrogen introduction tube and a septum cap were attached. The whole system was heated and dehydrated with a dryer while stirring the magnesium particles with a stirrer under a nitrogen stream.

300 ml of dry tetrahydrofuran was taken in a syringe and injected through a septum cap. After cooling the solution to −5 ° C., 30.5 g of vinylbenzyl chloride (VBC, manufactured by Tokyo Kasei) using a dropping funnel (200
mmol) was added dropwise over about 4 hours. After the dropping is completed,
Stirring was continued at 0 ° C./20 hours. After completion of the reaction, the reaction solution was filtered to remove residual magnesium, and concentrated with an evaporator.

The concentrated solution was diluted with hexane to give 3.6%
It was washed once with an aqueous hydrochloric acid solution and three times with pure water, and then dehydrated with magnesium sulfate.

The dewatered solution was purified by passing through a short column of silica gel (Wako gel C300 manufactured by Wako Pure Chemical Industries) / hexane and vacuum dried to obtain BVPE. The obtained BVPE
Is a mixture of m-m body (liquid), m-p body (liquid) and p-p body (crystal), and the yield was 90%. ¹ H-N
When the structure was examined by MR, the value was in agreement with the literature value (6H-vinyl: α-2H, 6.7 ppm, β-
4H: 5.7, 5.2 ppm, 8H-aromatic:
7.1 to 7.35 ppm, 4H-methylene: 2.9 pp
m). This BVPE was used as a crosslinking component.

(2) Other reagents Polymers; PPE: made by Aldrich, poly-2,
6-Dimethyl-1,4-phenylene oxide flame retardant; SAYTEX 8010: manufactured by Albemarle Asano Co., Ltd.
1,2-Bis (pentabromophenyl) ethane SAYTEX BT-93: Albemarle Asano Co., Ltd.
1,2-bis (tetrabromophthalimide) ethane flame retardant aid; antimony trioxide: Kanto Kagaku curing catalyst; 25B: Nippon Oil & Fats 2,5-dimethyl-2,5-bis (t-butylper) (Oxy) hexyne-3 (3) Method for preparing varnish A predetermined amount of a high molecular weight substance, a cross-linking component, a bromine compound, antimony trioxide and chloroform are dissolved and dispersed by stirring for about 8 hours in a ball mill to prepare a resin composition. A varnish was prepared.

(4) Preparation of Resin Plate The above-mentioned varnish was applied to a PET film, dried, and then peeled off and put in a predetermined amount in a spacer made of polytetrafluoroethylene, and the film was put under vacuum through a polyimide film and a mirror plate. A cured resin plate was obtained by heating and pressurizing. Heating conditions are 120 ° C / 30 minutes, 150 ° C / 30 minutes, 180 ° C / 10
In 0 minutes, multi-stage heating with a pressing pressure of 1.5 MPa was performed.
The size of the resin plate was 70 mm × 70 mm × 1.5 mm.

(5) Preparation of prepreg As the prepreg, the above-mentioned varnish was made into glass cloth (manufactured by Nitto Boseki #
2116) and allowed to stand at room temperature for about 1 hour at 90 ° C for 60 hours.
It was made by drying for a minute.

(6) Preparation of Cured Prepreg In order to know the characteristics of the laminated plate, 10 sheets of the above prepreg were stacked and heated and pressed under vacuum to prepare a simulated substrate. Heating conditions are 120 ° C / 30 minutes, 150 ° C / 30
Min, 180 ° C./100 minutes, and a multi-stage heating with a pressing pressure of 1.5 MPa. The simulated board is 70 mm x 70 mm x 1.
It was set to 5 mm.

(7) Measurement of dielectric constant and dielectric loss tangent The dielectric constant and dielectric loss tangent are measured by the cavity resonator perturbation method (Agilent Technology, 8722ES type network analyzer, Kanto Electronics Application Development cavity resonator).
The value at 10 GHz was observed.

(8) Flame-retardant flame-retardant property is sample size 70 mm × 3 mm × 1.5 m
It carried out based on UL-94 standard using the sample of m, and observed the average burning time and the maximum burning time.

Comparative Example 1 Comparative Example 1 is a resin plate prepared from a resin composition containing no bromine compound.
Although it had excellent dielectric properties, it did not have flame retardancy because it contained no flame retardant.

Examples 1 to 3 In Examples 1 to 3, the bromine compound was added to the predetermined composition at various compounding ratios. It was found that the burning time was shortened as compared with Comparative Example 1 by adding SAYTEX 8010 which is a bromine compound. At this time, the dielectric constant was 2.51 to 2.53 and the dielectric loss tangent was 0.0028 to 0.003, which were low values. It was found that a flame-retardant resin composition having excellent dielectric properties was obtained in this way.

[Examples 4 to 6] In Examples 4 to 6, resin plates were prepared from compositions obtained by adding various amounts of bromine compounds to the resin composition of Comparative Example 1. SAYT which is a bromine compound
It was confirmed that flame retardancy was improved by adding EXBT-93. At this time, the dielectric constant is 2.52 to 2.5.
5, the dielectric loss tangent was a low value of 0.0026 to 0.0032. By this, it was found that a flame-retardant resin composition having excellent dielectric properties was obtained.

Example 7 Using the varnish of Example 1, a prepreg was produced. The prepared prepreg had a tack-free property. Ten prepregs were superposed and heated and pressed under vacuum to prepare a prepreg cured product.

The resin content of the cured product of this prepreg is 35w.
It was t%. When a flame retardancy test was conducted according to the UL-94 standard, it was found that an average burning time of 0.3 seconds and a maximum burning time of 0.4 seconds were obtained, and flame retardancy equivalent to V-0 was obtained. The dielectric constant is 3.12 and the dielectric loss tangent is 0.0041.
Met.

The resin composition used in this prepreg has excellent melt fluidity and can be suitably used as an interlayer adhesive for a multilayer printed circuit board.

[Example 8] Rough surfaces of electrolytic copper foil were attached to both surfaces of the prepreg of Example 7, and pressed and heated under vacuum to produce a double-sided copper-clad laminate. Heating condition is 120 ℃ / 30
Min, 150 ° C./30 min, 240 ° C./100 min, and press pressure 1.5 MPa.

The copper foil and prepreg showed good adhesion. This made it possible to fabricate a multilayer printed circuit board with low dielectric loss.

[Embodiment 9] FIG. 1 is a schematic cross-sectional view showing an example of a process for producing a multilayer printed circuit board according to the present invention.

In the step (A), a photoresist 3 (Hitachi Kasei Kogyo H, manufactured by Hitachi Chemical Co., Ltd.) was formed on one surface of a double-sided copper-clad laminate obtained by sticking electrolytic copper foils 2 on both surfaces of a resin substrate 1 obtained in the same manner as in Example 8.
S425) was laminated and the entire surface of the photoresist 3 was exposed.

Next, the photoresist 3 (HS4 manufactured by Hitachi Chemical Co., Ltd.) is formed on one surface on which the photoresist 3 is not attached.
25) was laminated to expose the test pattern, and the photoresist in the unexposed portion was developed with a 1% sodium carbonate solution.

In step (B), sulfuric acid 5% and hydrogen peroxide 5%
% Of the etching solution to remove the exposed copper foil by etching to form a conductor wiring on one surface of the double-sided copper-clad laminate.

In step (C), the remaining photoresist 3 was removed with a 3% sodium hydroxide solution to obtain a wiring board having wiring on one surface. Two wiring boards were produced in the same manner.

In step (D), the prepreg 4 of Example 8 is sandwiched between the wiring-side surfaces of the two wiring boards and heated under vacuum.
Pressure was applied to form multiple layers. Heating conditions are 120 ° C / 30 minutes, 1
50 ° C / 30 minutes, 240 ° C / 100 minutes, press pressure 1.
It was a multi-stage heating of 5 MPa.

In step (E), photoresist 3 (HS425 manufactured by Hitachi Chemical Co., Ltd.) is laminated on the exterior copper on both sides of the produced multilayer board to expose a test pattern, and the photoresist in the unexposed portion is exposed to a 1% sodium carbonate solution. Developed.

In step (F), sulfuric acid 5% and hydrogen peroxide 5%
% Of the exposed copper foil by etching, and the remaining photoresist was removed with a 3% sodium hydroxide solution to form the exterior wiring 6.

In the step (G), the inner layer wiring 5 and the outer wiring 6
A through hole 7 for connecting the above was formed by drilling.

In step (H), the wiring board was dipped in a colloidal solution of the plating catalyst to deposit the plating catalyst 8 inside the through holes 7 and on the surface of the board.

In step (I), after the plating catalyst 8 is activated, electroless plating (CUST200 manufactured by Hitachi Chemical Co., Ltd.) is performed.
0), a seed film 9 of about 1 μm was provided.

In step (J), a photoresist (HN920 manufactured by Hitachi Chemical Co., Ltd.) was laminated on both surfaces of the wiring board.

In step (K), the through hole 7 and the end of the wiring board were masked, exposed, and developed with 3% sodium carbonate to provide the opening 10.

In step (L), the electrode 1 is attached to the end of the wiring board.
No. 1 was provided, and plated copper 12 was formed to a thickness of about 18 μm in the through hole 7 portion by electrolytic plating.

In step (M), the electrode portion 11 was cut and removed, and the remaining photoresist was removed with a 5% sodium hydroxide aqueous solution.

In the step (N), sulfuric acid 5% and hydrogen peroxide 5
The wiring board was dipped in an etching solution of 1% and etched by about 1 μm, and the seed film 9 was removed to obtain a multilayer printed circuit board. The obtained multilayer printed circuit board had a low dielectric constant, a low dielectric loss tangent, and high flame retardancy.

[0077]

According to the present invention, a resin composition which has a low dielectric constant and a low dielectric loss tangent and gives a flame-retardant cured product can be obtained. The resin composition is suitable as an insulating material for high-frequency electric parts, and is suitable for use in prepregs for multi-layer printed circuit boards for high-frequency signals.
When it is used for a laminated board, an excellent effect that low dielectric loss and flame retardancy are compatible can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of a manufacturing process of a multilayer printed circuit board according to the present invention.

[Explanation of symbols]

1 ... Resin substrate, 2 ... Electrolytic copper foil, 3 ... Photoresist, 4
... prepreg, 5 ... inner layer wiring, 6 ... outer layer wiring, 7 ... through hole, 8 ... plating catalyst, 9 ... seed film, 10 ... open hole portion,
11 ... Electrode, 12 ... Plated copper.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C08J 5/24 CET C08J 5/24 CET 4J100 C08K 3/18 C08K 3/18 5/03 5/03 5 / 3417 5/3417 C08L 101/00 C08L 101/00 H05K 1/03 610 H05K 1/03 610H (72) Inventor Shinji Yamada 7-1 Omika-cho, Hitachi City, Ibaraki Prefecture Hitachi Ltd. 72) Inventor Keiro Ishikawa 7-1, 1-1 Omika-cho, Hitachi City, Ibaraki Hitachi Ltd. Hitachi Research Laboratory (72) Inventor Akio Takahashi 7-1-1, Omika-cho, Hitachi City, Ibaraki Hitachi Hitachi Research Laboratory (72) Inventor Yoshihiro Nakamura 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Works (72) Inventor Hanawa Meitoku 1500 Ogawa Oita, Shimodate, Ibaraki Pref.Hitachi Kasei Kogyo Co., Ltd. Shimodate Business Office (72) Inventor Toshiyuki Iijima 1500 Ogawa, Shimodate, Ibaraki Shitadate Co., Ltd. AB29 AD02 AD05 AD09 AE02 AE07 AF02 AF14 AF15 AF20 AF27 AF29 AG03 AG16 AH21 AK05 AK13 4F100 AA29B AB17 AB33 AH05B AK02B AK08B AK12B AK25B AK27 GB JJ86 CG CABJ CA01B01 CA05B01 CA01B01B01 BA01 BA15 BA10 BA10 BA10 BA02 BA03 BA10 BA02 BA03 BA10 YY00B 4J002 AC021 BB171 BC011 BC021 BC081 BG041 BG101 BH021 CH071 CM052 DE128 DE188 EA046 EB119 EB137 EC049 EE0 PA0 PA0 PA0 PA0 PA6 PA6 PA6 PA6 PA6 PA6 PA6 PA6 PA6 PA06 PA06 PA06 PA06 PA06 FD 216 176 176 AA17 AA18 AA45 AA49 AA57 AA68 AA69 BA07 DB06 DB11 DB12 DB15 DB19 DB29 GA06 4J100 AB15P CA01 FA03 FA17 JA44

Claims (11)

[Claims] 1. Formula 1 (In the formula, R represents a hydrocarbon which may have a substituent,
² , R ³ and R ⁴ are hydrogen atoms which may be different from each other or a hydrocarbon group having 1 to 6 carbon atoms, and R ⁵ , R ⁶ , R ⁷ and R ⁸ are hydrogen atoms which may be different from each other or a carbon atom having 1 to 6 carbon atoms. A resin containing a polyfunctional styrene group represented by 20 hydrocarbon groups and n representing an integer of 2 or more) and a crosslinking component having a weight average molecular weight of 1000 or less and containing a bromine compound. Composition. 2. The resin composition according to claim 1, wherein the resin composition contains a high molecular weight material. 3. A polymer comprising at least one of butadiene, isoprene, styrene, methylstyrene, ethylstyrene, divinylbenzene, acrylic acid ester, acrylonitrile, N-phenylmaleimide and N-vinylphenylmaleimide, wherein the high molecular weight polymer is a substituted compound. A polyphenylene oxide which may have a group, or
A polyolefin resin having an alicyclic structure.
The composition according to. 4. The resin composition according to claim 1, wherein the resin composition contains an antimony compound. 5. The resin composition according to claim 4, wherein the antimony compound is antimony trioxide, antimony tetraoxide, antimony pentaoxide or sodium antimonate. 6. The resin composition according to claim 1, wherein the resin composition contains a curing catalyst capable of polymerizing a styrene group or a polymerization inhibitor capable of suppressing the polymerization of the styrene group. 7. The total amount of resin components in the resin composition is 1
The amount of the bromine compound added is 1 to 3 parts by weight.
0 parts by weight, the addition amount of the antimony compound is 0.1 to 10 parts by weight, the addition amount of the curing catalyst is 0.0005 to 10 parts by weight, and the addition amount of the polymerization inhibitor is 0.0005 to 5 parts by weight. The resin composition according to claim 1. 8. The resin composition according to claim 1, wherein the bromide is 1,2-bis (pentabromophenyl) ethane or 1,2-bis (tetrabromophthalimido) ethane. 9. An organic or inorganic cloth or nonwoven fabric is impregnated with the resin composition according to any one of claims 1 to 8,
A prepreg characterized by being dried. 10. A laminate comprising a prepreg according to claim 9 or a cured product of the prepreg, wherein a conductor layer is provided on at least one surface of the prepreg. 11. The conductor layer of the laminated plate according to claim 10 is subjected to wiring processing, and then the laminated plate is laminated with a prepreg.
A multi-layer printed circuit board characterized by being laminated and bonded together.