JPH04239535A - Resin composition for laminated plate - Google Patents

Abstract

PURPOSE:To obtain the title resin composition containing a specific thermosetting resin, capable of providing a laminated plate having small dielectric constant and dielectric dissipation factor and excellent heat resistance and suitable for production of printed circuit board to which high frequency characteristics are required. CONSTITUTION:The objective resin composition containing a thermosetting resin obtained by subjecting a compound expressed by formula I (R is H 1-3C alkyl or alkenyl), etc., to radical polymerization or ion polymerization and expressed by formula II and further, as necessary, bending the resultant thermosetting resin with an epoxy resin such as bisphenol A type glycidyl ether, a curing agent such as aromatic amine based curing agent or a flame retardant such as antimony oxide.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermosetting resin composition for producing electrically insulating laminates suitable for use in the high frequency range.

0002

[Prior Art] Conventionally, a predetermined number of prepregs obtained by impregnating and drying a sheet-like base material such as a glass woven cloth with an epoxy resin or polyimide resin are stacked, and then the laminates are heated and pressed to form a laminate, which is used as a printed wiring board. Used as an insulating substrate. Since its dielectric constant is as large as 4.9 to 5.1, the capacitance of the printed wiring board is large, making it unsuitable for applications that handle high frequencies.

Printed wiring boards used in high frequency ranges are required to have low dielectric constants and dielectric loss tangents, and heat-resistant thermoplastic resins such as polyphenylene oxide are used for such applications. However, since it is a thermoplastic resin, it has insufficient heat resistance and poor dimensional stability during the soldering process.

0004

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition suitable for producing a laminate having good heat resistance and dielectric properties.

[0005]

[Means for Solving the Problems] In order to solve the above problems, the resin composition for laminates according to the present invention contains a thermosetting resin represented by the following (Formula 1) as a resin component. Features.

[0006]

[Case 2]

In the formula, R in the main chain and R bonded to the benzene ring may be the same or different. The prepregs obtained by impregnating a sheet-like base material with this resin composition and drying are stacked and molded under heat and pressure to form a laminate.

[0008]

[Operation] The compound represented by the formula (1) can be obtained by radical polymerization or ionic polymerization of the compound represented by the following formula (2). Polystyrene, which is a nonpolar polymer, is a material with a low water absorption rate and a small dielectric constant and dielectric loss tangent. However, the resin component according to the present invention is a polystyrene-based resin in which glycidyl ether groups coexist, so the dielectric constant is low. , it is possible to form a laminate with a small dielectric loss tangent and excellent heat resistance.

[0009]

[Chemical formula 3]

0010

EXAMPLES When the compound represented by formula 2 is polymerized, it may be copolymerized with a vinyl monomer such as styrene, butadiene, or isoprene.

The resin component represented by formula 1 may be used in combination with other epoxy resins such as bisphenol A type glycidyl ether, phenol novolac type glycidyl ether, and cresol novolac type glycidyl ether. The curing agent is aromatic amine type, dicyandiamide, phenol resin type, etc. As the phenolic resin, tertiary butylphenol novolac resin, cresol novolac resin, polyp-vinylphenol resin, etc. are preferably used. In order to impart flame retardancy to the produced laminate, a flame retardant such as a halogen-containing organic compound or antimony oxide may be added to the resin composition. In addition, fillers, colorants, etc. may be added as appropriate.

Examples 1-2 p-isopropenyl glycidyl ether was reacted with hydrogenated iodine/iodine as a polymerization initiator at -40°C.
The polymerization reaction was carried out for a period of time. Then, a polymer A having a molecular weight of 3000 was obtained. Polymer A, phenol novolak resin (curing agent), tetrabromobisphenol A (flame retardant)
, 2-ethyl-4-ethylimidazole (hardening accelerator)
A resin composition blended in the proportions shown in Table 1 was dissolved in methyl ethyl ketone to prepare a resin varnish.

A glass woven fabric was impregnated with the above resin varnish and dried to produce a prepreg having a resin content of 42% by weight. Eight sheets of this prepreg were stacked, electrolytic copper foil with a thickness of 35μ was placed on both surfaces, and
A copper-clad laminate having a thickness of 1.6 mm was obtained by heat-pressing molding for 0 minutes. Its characteristics are also shown in Table 1.

Example 3 A glass nonwoven fabric was impregnated with the resin varnish used in Example 1.
It was dried to produce a prepreg with a resin content of 88% by weight. The glass woven fabric prepreg used in Example 1 was stacked one by one on both sides of these three prepregs, and electrolytic copper foil with a thickness of 35μ was placed on both surfaces, followed by heating and pressure molding in the same manner as in Example 1. As a result, a copper-clad laminate having a thickness of 1.6 mm was obtained. Its characteristics are also shown in Table 1.

Example 4 α-Methystyryl glycidyl ether was reacted with iodine hydride/iodine as a polymerization initiator at -40°C.
The polymerization reaction was carried out for a period of time. Then, a polymer B having a molecular weight of 3,500 was obtained. Polymer B, phenol novolak resin (
A resin composition containing a curing agent) and 2-ethyl-4-ethylimidazole (curing accelerator) in the proportions shown in Table 1 was dissolved in methyl ethyl ketone to prepare a resin varnish.

A glass woven fabric was impregnated with the above resin varnish and dried to produce a prepreg having a resin content of 42% by weight. Eight sheets of this prepreg were stacked, electrolytic copper foils with a thickness of 35 μm were placed on both surfaces, and hot and pressure molded in the same manner as in Example 1 to obtain a copper-clad laminate with a thickness of 1.6 mm. Its characteristics are also shown in Table 1.

Conventional Example 1 Epoxy resin (epoxy equivalent: 500, manufactured by Yuka Ciel E)
p-1001) 80 parts by weight, cresol novolak epoxy resin (epoxy equivalent: 210, YDCN manufactured by Toto Kasei)
-704) 20 parts by weight, dicyandiamide 4 parts by weight, 2
A resin varnish was prepared by dissolving 0.2 parts by weight of -ethyl 4-methylimidazole in methyl ethyl ketone. Using this resin varnish, heat and pressure molding was carried out in the same manner as in Example 1 to obtain a copper-clad laminate having a thickness of 1.6 mm. Its characteristics are also shown in Table 1.

Conventional Example 2 A glass woven cloth was impregnated with a resin varnish prepared by dissolving modified polyphenylene oxide in trichlorethylene, and dried.
A prepreg with a resin content of 42% by weight was produced. below,
A copper-clad laminate having a thickness of 1.6 mm was obtained by heat-pressing molding in the same manner as in Example 1. Its characteristics are also shown in Table 1.

[0019]

[Table 1]

The method of characteristic testing in Table 1 is as follows. Copper foil peel strength: Compliant with JIS-C-6481 Solder heat resistance: Float the laminate in a solder bath at 280°C and measure the time until blistering occurs on the surface Flame retardancy: Compliant with UL-94

[0021]

As described above, by using the resin composition of the present invention, it is possible to mold a laminate having a small dielectric constant and a small dielectric loss tangent and excellent heat resistance. It is suitable for manufacturing printed wiring boards that handle high frequency characteristics.

Claims (1)

[Claims] 1. A resin composition for a laminate comprising a thermosetting resin represented by the formula (1) as a resin component. [Chemical formula 1]