JPH0579686B2 - - Google Patents

Description

[Detailed description of the invention]

(Industrial Application Field) The present invention relates to a polyphenylene oxide resin composition and a metal-clad laminate using the same. More specifically, this invention utilizes polyphenylene that is useful as wiring boards used in electrical equipment, electronic equipment, etc., and has low dielectric constant properties, as well as excellent adhesion and bleedability in multilayer boards, as well as flame retardancy. This invention relates to an oxide-based resin composition and a metal-clad laminate using the same. (Conventional technology) For wiring boards used in precision instruments, electronic computers, communication devices, etc., there are increasing demands for faster calculation processing, higher reliability, higher circuit density, and smaller size. In order to meet these demands, wiring boards are rapidly becoming more multi-layered and more precisely miniaturized. Conventionally, such wiring boards have been made of epoxy resin, polyimide resin, or
Fluorine resins, polybutadiene resins, and the like have been used as low dielectric constant resins, and efforts have been made to improve their properties. (Problems to be Solved by the Invention) However, such conventional resins have not been able to fully satisfy various characteristics required for high-density wiring boards. For example, as wiring density increases,
It is essential for resins used in multilayer wiring boards to have excellent adhesion and bleed properties, and to be flame retardant. However, conventional resins still have issues to be improved in terms of adhesion and bleeding properties. Further, since conventional resins are generally flammable, flame retardants are usually added to resins used for wiring boards in order to efficiently and reliably make them flame retardant. However, even if the resin itself has a low dielectric constant, adding a flame retardant increases the resin dielectric constant, making it impossible to support the high-speed signal processing required for measuring instruments and computer-related equipment. There is. For this reason, high-speed signal processing can be performed stably with a low dielectric constant, and it also has excellent adhesion and bleedability in multilayer boards, as well as excellent flame retardancy, making it possible to increase the density of multilayer wiring. There has been a strong desire to create a new resin composition for laminates that can be used as a laminate, and a laminate using the same. This invention was made to solve the problems of conventional laminates as described above, and it provides a resin composition that has a low dielectric constant, excellent adhesion and bleedability of multilayer boards, and is flame retardant. The purpose of the present invention is to provide a laminate using the same. (Means for Solving the Problems) The present invention solves the above problems by using polyphenylene oxide, triallyl isocyanurate prepolymer and/or triallyl cyanurate prepolymer, butadiene-based crosslinkable polymer, and Provided is a polyphenylene oxide resin composition for electrical laminates, which is characterized by containing triallyl isocyanurate and/or triallyl cyanurate.
The present invention also provides a flame retardant polyphenylene oxide resin composition comprising a flame retardant, or a flame retardant and a flame retardant aid. As a laminate using these resin compositions, the present invention is made by forming a sheet and/or prepreg from the above-mentioned polyphenylene oxide resin composition, and laminating and integrating this sheet/or prepreg with metal foil. The present invention also provides a polyphenylene oxide metal-clad laminate characterized by the following. The polyphenylene oxide used in the polyphenylene oxide resin composition of this invention is a resin that has a relatively high glass transition point, low dielectric constant, and low dielectric loss, and has attracted attention in recent years because it is inexpensive. This is what is being done. However, until now, it has been difficult to improve adhesion and bleed properties and to achieve flame retardancy when creating multiple layers, so it has not been possible to put this into practical use as a resin for high-density wiring boards. Nakatsuta. However, this invention includes a polyphenylene oxide resin composition containing a butadiene crosslinkable polymer, triallyl isocyanurate and/or triallyl cyanurate as a crosslinking monomer, together with a prepolymer of triallyl isocyanurate and/or triallyl cyanurate. By blending with triallyl cyanurate and further adding a flame retardant or flame retardant and flame retardant aid, it is possible to improve the adhesion and bleedability of multilayer wiring boards while maintaining its low dielectric property. This makes combustion possible. Furthermore,
The resin also has excellent properties such as heat resistance, chemical resistance, processability, and dimensional stability. For example, the polyphenylene oxide used in this invention has the following general formula (1).

[R represents hydrogen or a hydrocarbon group having 1 to 3 carbon atoms, and each R may be the same or different. ] Examples thereof include poly(2,6-dimethyl-1,4-phenylene oxide), poly(3,5-dimethyl-1,4-phenylene oxide), etc. be able to. The molecular weight is not particularly limited, but preferred examples include those with a weight average molecular weight (Mw) of about 50,000 and a molecular weight distribution of Mw/Mn = 4.2 (Mn is number average molecular weight). can. In the case of such polyphenylene oxides, such as poly(2,6-dimethyl-1,4-phenylene oxide), 2,6-xylenol is oxidized with an oxygen-containing gas and methanol in the presence of a catalyst. It can be obtained by coupling reaction. Here, the catalyst may include a copper() compound, N,N'-di-tert-butylethylenediamine, butyldimethylamine, and hydrogen bromide. Furthermore, methanol can be used by adding 2 to 15% by weight of water to the reaction mixture system so that the total amount of methanol and water is 5 to 25% by weight as a polymerization solvent. Further, the prepolymer of triallyl isocyanurate (TAIC) or the prepolymer of triallyl cyanurate (TAC) to be blended into the composition of the present invention can be produced by solution polymerization or bulk polymerization. Solution polymerization has a milder reaction than bulk polymerization, and it is easier to adjust the molecular weight. This method involves dissolving triallyl isocyanurate monomer and/or triallyl cyanurate monomer in a solvent, mixing a radical initiator, reacting with stirring until an appropriate molecular weight is reached, and heating as necessary. Therefore, it can be implemented. At this time, it is preferable to carry out the reaction using a reflux vessel and in an atmosphere free of oxygen. The reaction atmosphere may be, for example, a nitrogen flowing atmosphere. In addition, as a solvent,
Benzene, toluene, xylene, methanol, ethanol, acetone, methyl ethyl ketone, heptane, carbon tetrachloride, dichloromethane, trichloroethylene, etc. can be used. As the radical initiator, any suitable radical initiator can be used, including conventionally known ones, such as benzoyl peroxide, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, and t-butyl peroxide. Examples include oxybenzoate and dicumyl peroxide. For example, the triallylisocyanurate prepolymer described above can be produced as follows. Example 1 11 g of benzoyl peroxide and 1087 g of benzene are added to 280 g of triallyl isocyanurate monomer, and the mixture is reacted for 6 hours while boiling under a nitrogen atmosphere using a reactor equipped with a stirrer and a reflux condenser. After benzene is recovered under reduced pressure, methanol is added, and the polymer is recovered and dried under reduced pressure. 139 g of polymer was obtained. The number average molecular weight is approximately 10,000. Example 2 Add 10 g of dicumyl peroxide and 527 g of toluene to 225 g of triallylisocyanurate, Example 1
A polymer is obtained in the same manner. The number average molecular weight is approx.
It is 4000. For example, the number average molecular weight of triallyl isocyanurate or triallyl cyanurate prepolymer that can be produced as described above is
It is preferable to set it to 10,000 or less. It should be noted that triallyl isocyanurate and triallyl cyanurate are chemically structurally isomers and exhibit substantially similar reactivity and polymer properties, so either one or both can be used. Examples of butadiene-based crosslinkable polymers include 1,2-polybutadiene, 1,4-polybutadiene, styrene-butadiene copolymer, modified 1,
Examples include 2-polybutadiene (malein-modified, acrylic-modified, epoxy-modified), rubbers, etc., and each can be used alone or in combination of two or more. The state of these polymers is
It may be elastomer or rubber. In addition, in this invention, triallyl isocyanurate and/or triallyl cyanurate are blended, but the triallyl isocyanurate and triallyl cyanurate are used to increase the network crosslinking (crosslinking) reactivity of the resin component during curing of the laminate. It is used as a crosslinking monomer which itself has polymerizability. In this invention, the blending of triallyl isocyanurate and/or triallyl cyanurate is essential, but similar compounds that can be used include, for example, ester acrylates, epoxy acrylates, urethane acrylates, ether Acrylates, melamine acrylates, alkyd acrylates, silicone acrylates and other polyfunctional monomers, ethylene glycol dimethacrylate, divinylbenzene, diallyl phthalate, vinyltoluene, ethylvinylbenzene,
Examples include monofunctional monomers such as styrene and paramethylstyrene, and polyfunctional epoxies, and each can be used alone or in combination of two or more. Blending these crosslinkable polymers and monomers improves film formability, crosslinkability, adhesion, heat resistance, and dielectric properties. Furthermore, a flame retardant or a flame retardant aid may be added to the composition of the present invention, but in this case, the flame retardant is usually a flame retardant aid. The dielectric constant of the polyphenylene oxide resin composition after adding
4.0 or less, and its flame retardancy is V-1 or V-0 based on the UL94 flame retardant test method.
It is preferable to use those that can be used. For example, a brominated diphenyl ether system having the following formula (2)

[Chemical formula] (wherein R represents hydrogen, an aromatic group or an aliphatic group), or a brominated polycarbonate system having the following formula (3),

[Formula, R represents hydrogen, an aromatic group or an aliphatic group], or a brominated bisphenol system having the following formula (4),

[Chemical formula] (wherein R ₁ and R ₂ are each hydrogen, an aromatic group, an aliphatic group, or the following formula
Indicates any group. <>-O-CH ₂ -CH=CH ₂ <>-O-CO-CH=CH ₂

[Formula] <>-O-CH ₂ -CH ₂ -O-CO-CH=CH ₂

[ka]

[Formula] Furthermore, a brominated cyanuric acid compound having the following formula (5) can be exemplified as a flame retardant.

[Chemical formula] These flame retardants may be used alone or in combination. If necessary, a flame retardant aid may be used in combination with such a flame retardant to provide a synergistic effect on flame retardation. As the flame retardant aid in this case, for example, antimony oxide (antimony trioxide, antimony pentoxide), zirconium oxide, sodium antimonate, etc. can be used. These flame retardant aids may be used alone or in combination. Flame retardant aids may be used alone or in combination as flame retardants. In addition, when using these flame retardant aids,
It is preferable to use it by dispersing it in an organic solvent for ease of handling. Prepolymers of triallyl isocyanurate and/or triallyl cyanurate, butadiene-based crosslinkable polymers, triallyl isocyanurate and/or triallyl cyanurate as crosslinkable monomers, flame retardants or flame retardants and flame retardants as described above When blending the auxiliary agent into the polyphenylene oxide, an initiator can also be used. As the initiator, the following two types can be selected depending on whether the polyphenylene oxide resin composition is of an ultraviolet curing type or a thermosetting type, but the initiator is of course not limited to these. Examples of ultraviolet curing photoinitiators (that is, those that generate radicals when exposed to ultraviolet rays) include benzoin, benzyl, allyldiazonium fluoroborate, benzyl methyl ketal, 2,2-diethoxyacetophenone, benzoyl isobutyl ether, p-tert-butyltrichloroacetophenone, benzyl(o-ethoxycarbonyl)-
α-Monoxime, biacetyl-acetophenone, benzophenone, Michler's ketone, tetramethylthiuram sulfide, azobisisobutyronitrile, and the like can be used. In addition, examples of thermosetting initiators (that is, those that generate radicals by heat) include dicumyl peroxide, tert-butylcumyl peroxide, benzoyl peroxide, di-tert-butyl peroxide, 2,5-dimethyl -2,5-
di-(tert-butylperoxy)hexyne-3,
2,5-dimethyl-2,5-di-(tert-butylperoxy)hexane, α,α′-bis(tert-butylperoxy-m-isopropyl)benzene [1,4(or 1,3)- peroxides such as bis(tert-butylperoxyisopropyl)benzene], 1-hydroxycyclohexyl phenyl edone, 2-hydroxy-2-methyl-1-
Phenyl-propan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 2-chlorothioxanthone, methylbezoylformate, 4,4-bisdimethylaminobenzo Phenone (Michler's ketone), benzoin methyl ether, methyl-O-
Benzoyl benzoate, α-acyloxime ester, Biscumil manufactured by NOF Corporation, etc. can be used. These initiators may be used alone or in combination of two or more. Further, an initiator using ultraviolet rays and an initiator using heat may be used in combination. The above polyphenylene oxide, triallyl isocyanurate and/or triallyl cyanurate prepolymer, butadiene crosslinkable polymer, triallyl isocyanurate and/or triallyl cyanurate as a crosslinkable monomer, and flame retardant. Or, the blending ratio of the flame retardant, flame retardant aid, reaction initiator, etc. is usually preferably 5 to 95% by weight of polyphenylene oxide, 1 to 95% by weight of triallyl isocyanurate and/or triallyl cyanurate prepolymer. %, crosslinkable polymer and crosslinkable monomer, each from 1 to 95
% by weight, flame retardant from 1 to 90% by weight, and flame retardant aid from 1 to 50% by weight. Further, the blending ratio of the reaction initiator is preferably 0 to 10% by weight. Of course, these blending ratios can be determined depending on the dielectric constant and resin properties required for the resin composition. As described above, the polyphenylene oxide resin composition of the present invention contains polyphenylene oxide, triallyl isocyanurate and/or triallyl cyanurate prepolymer, butadiene-based crosslinkable polymer, and trilyl as a crosslinkable monomer. It contains allyl isocyanurate and/or triallyl cyanurate, as well as flame retardants, flame retardant aids, reaction initiators, etc., but its properties such as dielectric constant can be improved by blending various inorganic fillers. It may be changed. Examples of such inorganic fillers include titanium oxide ceramics,
Examples include the use of barium titanate ceramics, lead titanate ceramics, strontium titanate ceramics, calcium titanate ceramics, lead zirconate ceramics, etc. singly or in combination. The polyphenylene oxide resin composition of the present invention and its flame retardant composition as described above are usually dissolved and dispersed in a solvent and mixed. In this case, the amount of solvent used is preferably such that the polyphenylene oxide resin composition is in a 5 to 50% by weight solution (or the solid content of the resin is in the range of 10 to 13% by weight based on the solvent). As the solvent, halogenated hydrocarbons such as trichloroethylene, trichloroethane, chloroform, methylene chloride, and chlorobenzene, aromatic hydrocarbons such as benzene, toluene, and xylene, acetone, and carbon tetrachloride can be used, and trichloroethylene is particularly preferred. Illustrated as an example. These can be used alone or in a mixture of two or more. Next, to explain the polyphenylene oxide-based laminate of the present invention, a sheet is formed from the polyphenylene oxide-based resin composition as described above, or a prepreg is formed by impregnating this with a base material, and If necessary, core materials etc. are manufactured from these sheets and prepregs, and then
It can be manufactured by laminating and integrating it with other base materials, sheets, prepregs, metal foils, etc. according to conventional methods. Of course, multilayer board molding is also possible. For example, a casting method can be used to form the sheet. This casting method is a method in which a resin mixed with a solvent is formed into a thin layer by casting or coating, and then the solvent is removed to form a cured product. According to the casting method, a cured product can be obtained at a low temperature without using the costly calendar method. To explain this casting method specifically, a polyphenylene oxide resin composition mixed with a solvent is placed on a mirror-treated iron plate or a carrier film for casting, etc. with , 5-500)
A sheet is obtained by casting (or coating) to a thickness of about μm and thoroughly drying to remove the solvent. The carrier film for casting is not particularly limited in type, but may include polyethylene terephthalate (hereinafter abbreviated as "PET") film, polyethylene film, polypropylene film, polyester film, polyimide film, etc. that are insoluble in the above solvents. Preferably, those subjected to mold release treatment are preferable. Drying is performed by air drying or hot air drying. In this case, the upper limit of the temperature range should be lower than the boiling point of the solvent or lower than the heat-resistant temperature of the carrier film for casting (if drying is performed on the carrier film for casting). preferable. The lower limit should be determined based on drying time and processability. For example, when trichlorethylene is used as a solvent and PET film is used as a carrier film for casting, the temperature range is from room temperature to about 80°C. preferable. Note that when the temperature is increased within this range, the drying time can be shortened. When manufacturing prepreg by impregnating a base material with a polyphenylene oxide resin composition,
Generally, the following methods can be used. That is, for example, the base material is immersed (dipped) in a solvent dispersion of the polyphenylene oxide resin composition to impregnate and adhere the polyphenylene oxide resin composition to the base material. Next, the solvent is removed by drying or the like, or semi-cured to obtain the B stage. The amount of the polyphenylene oxide resin composition impregnated in this case is not particularly limited, but is preferably 30 to 80% by weight. The base material can be a resin-impregnated cloth such as glass cloth, aramid cloth, polyester cloth, or nylon cloth, a pine-like material made of these materials and/or a fibrous material such as nonwoven fabric, kraft paper, linter paper, etc. Paper can also be used, and furthermore, it is not limited to these. As the metal foil for circuit formation used in forming the metal-clad laminate, a wide variety of metal foils that are used for ordinary wiring boards can be used. For example, metal foil such as copper foil or aluminum foil can be used. In this case, it is preferable that the metal foil has a smooth adhesive surface and good conductivity in order to improve the characteristics of the printed wiring board. Such metal foil can be processed into a desired conductor by a subtractive method. Further, it can also be processed into a desired conductor (circuit, electrode, etc.) by vapor deposition or an additive method (full additive method, semi-additive method). As a method for manufacturing a laminate using a core material, sheet, or prepreg manufactured from a polyphenylene oxide resin composition, the following method can be used, for example. In other words, a predetermined number of appropriately dried sheets and/or prepregs are combined to achieve a predetermined design thickness, metal foil for forming wiring is also laminated as needed, and resin is formed by heating and compressing the sheets and/or prepregs. are melted and bonded to each other in combinations such as sheets to each other, sheets to prepreg or core material, prepregs to each other, sheets and metal foil, prepreg and metal foil, etc. to form a laminate. Further, a multi-layered laminate is formed. Strong adhesion is obtained by this fusion, but even stronger adhesion can be obtained if the heating at this time causes a crosslinking reaction by the reaction initiator. Crosslinking reactions include photocrosslinking such as ultraviolet irradiation,
This can be done by thermal crosslinking, radiation irradiation, etc.
Note that such adhesion may be performed using an adhesive in combination. The combination of sheets, prepregs, and core materials used together is not particularly limited, but it is preferable to use vertically symmetrical combinations to prevent warping during secondary processing (etching, etc.) after molding. Further, it is preferable to combine the sheet so that it is placed on the adhesive interface with the metal foil, since this increases the adhesion force. The temperature during heat pressing depends on the combination of metal foil and sheet or prepreg, but for example,
Since the heat fusion properties of the sheet can be used to bond the metal foil and the sheet, it is preferable that the lamination and pressing temperature is higher than the glass transition point of the sheet, for example in the temperature range of about 160 to 300°C. In addition, when crosslinking the polyphenylene oxide resin composition of the present invention by placing it in a dryer and heating it, the crosslinking reaction depends on the reaction temperature of the initiator, etc. Preferably, the heating time is selected depending on the type of initiator.
For example, the temperature is 150 to 300°C and the time is about 10 to 60 minutes. The clamping pressure can be, for example, about 30 to 80 kg/cm ² . In the above-described heat-pressing process, a predetermined number of sheets and/or prepregs may be heated and laminated in advance, metal foil may be superimposed on one or both sides of the sheets, and heat-pressing may be performed again. . (Function) The resin composition of the present invention has the excellent heat resistance, dimensional stability, chemical resistance, and low dielectric constant that polyphenylene oxide resin compositions have, and also has excellent adhesion during multilayer board molding. It has excellent bleedability and flame retardancy. Therefore, a laminate using the polyphenylene oxide resin composition of the present invention can be easily processed with high precision, is suitable for high-speed signal processing, and can realize high-density multilayering. EXAMPLES Next, Examples will be shown and the polyphenylene oxide resin composition of the present invention and a metal-clad laminate using the same will be explained in more detail. (Example) Example 1 (A) Production of flame-retardant polyphenylene oxide resin composition 30% by weight of polyphenylene oxide (GE PPO) and styrene-butadiene copolymer (Asahi Kasei Corporation) were placed in a reactor equipped with a pressure reduction device. ; Solprene T406)
4% by weight, triallyl isocyanurate (Nippon Kasei Co., Ltd.; TAIC) 35% by weight, polytriallyl isocyanurate 4.5% by weight, flame retardant GX-6145
(Daiichi Kogyo Seiyaku) 20% by weight and 5% by weight of antimony pentoxide as a flame retardant aid, and further added toluene and stirred thoroughly until a homogeneous solution was obtained.
Defoaming is performed to obtain a flame retardant polyphenylene oxide resin composition. (B) Molding of laminate Next, the obtained flame-retardant polyphenylene oxide resin composition is coated onto a PET film using a coating machine to a thickness of 500 μm. After drying this at 50°C for about 10 minutes, the formed film was released from the PET film and dried at 120°C for an additional 30 minutes to completely remove toluene and produce a crude flame-retardant polyphenylene oxide resin. A sheet consisting of was obtained. The thickness of this sheet is approx.
It was 150 μm. Stack 4 of these sheets and heat at 190℃ for 50℃.
The sheet is heated and pressed for 30 minutes at a pressure of Kg/cm ² to completely cure the sheet, and as shown in FIG. 1, a laminate is produced by laminating and integrating four sheets 1. A metal foil is laminated on this to obtain a metal-clad laminate. Further, as shown in FIG. 2, a metal-clad laminate can also be obtained by manufacturing prepreg 2 and laminating metal foil 3 thereon. The resulting laminate was evaluated for dielectric constant, dielectric loss tangent, solder heat resistance, copper foil peel strength, flame retardance, and the like. The results are shown in Table 1, and these characteristics were extremely good. Examples 2 to 9 Various resin compositions were produced in the same manner as in Example 1, using the formulations of flame-retardant polyphenylene oxide resin compositions as shown in Table 1. Furthermore, a laminate was similarly produced using the resin composition. The physical properties of the obtained laminate were similarly evaluated in terms of dielectric constant, dielectric loss tangent, solder heat resistance, copper foil peel strength, flame retardance, etc. The results are also shown in Table 1. As is clear from the comparison with the comparative example described below, the characteristics of the laminate of the present invention were very good. Comparative Example 1 A resin composition as shown in Table 1 was produced in the same manner as in Example 1 without adding polytriallyl isocyanurate, a flame retardant, and a flame retardant aid. Furthermore, a laminate was produced using the resin composition, and its physical properties were evaluated. It was inferior to the Examples in terms of properties such as adhesion and flame retardancy.

【table】

[Table] Examples 10 to 18 (A) Production of polyphenylene oxide-based resin composition Polyphenylene oxide (GE PPO), polyallylisocyanurate and/or polytriallyl cyanurate,
Toluene (Hani Chemical) is added to the crosslinkable polymer, crosslinkable monomer, flame retardant, flame retardant aid, etc., and stirred thoroughly until a homogeneous solution is obtained.
The polyphenylene oxide resin composition shown in Table 2 is obtained by defoaming. (B) Molding of a laminate Next, a glass cloth was impregnated with the obtained polyphenylene oxide resin composition using an impregnation device, and dried at 110°C for about 7 minutes to remove toluene and reduce the resin content. Produce 60% prepreg. Four sheets of this prepreg were stacked together, and electrolytic copper foil with a thickness of 18 μm was stacked on both sides, and heated at 200℃.
Pressing was carried out for 30 minutes at a pressure of 50 kg/cm ² to produce a metal-clad laminate made by laminating and integrating four prepregs 2 and two copper foils 3 as shown in FIG. The properties of the obtained laminate were evaluated in the same manner as in Example 1. Excellent results as shown in Table 2 were obtained. (C) Forming of multi-layer board In addition, the metal-clad laminate thus obtained can be multi-layer formed and subjected to treatments such as etching, through-hole processing, and other plating using conventional methods to put it into practical use4-10. Produce a multilayer board of layers. When this multilayer board was used as a wiring board for a high-speed signal processing circuit, signal delays were suppressed and good results were obtained. varnish stability,
Bleedability, moldability, interlayer adhesion, oven heat resistance, through-hole reliability, etc. were also evaluated. The results are shown in Table 2. All had good multilayer board properties. Comparative Examples 2 to 8 Polyphenylene oxide resin compositions were manufactured using the resin composition formulations shown in Table 2. Further, a metal-clad laminate was created using the resin composition, and its physical properties were measured in the same manner as in Examples 10-18. As shown in Table 2, the flame retardance as well as the adhesion and bleed properties of the multilayer board were poor.

【table】

【table】

[Table] (Note) Prepolymer: polytriallyl isocyanurate and/or polytriallyl cyanurate (effect of the invention) Prepolymer of triallyl isocyanurate and/or triallyl cyanurate, crosslinkable By blending polymers and their crosslinking monomers, flame retardants, flame retardants and flame retardant aids, and optionally reaction initiators, we create products with excellent heat resistance, dimensional stability, chemical resistance, and processability. To obtain a resin composition for a laminated board which has a good, low dielectric constant, good adhesion of a multilayer board, good bleedability, and excellent flame retardancy. Therefore, a laminate formed using the polyphenylene oxide resin composition of the present invention can be processed with high precision as a wiring board, and has excellent heat resistance and
It has excellent flame retardancy in addition to chemical resistance, and also has good dielectric properties, making it advantageous as a high-density multilayer wiring board for high-speed signal processing.

[Brief explanation of the drawing]

FIGS. 1 and 2 are cross-sectional views showing embodiments of the laminate of the present invention, respectively. 1...sheet, 2...prepreg, 3...metal foil.

Claims (1)

[Claims] 1. It is characterized by being blended with polyphenylene oxide, triallyl isocyanurate prepolymer and/or triallyl cyanurate prepolymer, butadiene-based crosslinkable polymer, and triallyl isocyanurate and/or triallyl cyanurate. A polyphenylene oxide resin composition for electrical laminates.