JP2003338540A5 - - Google Patents
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- Publication number
- JP2003338540A5 JP2003338540A5 JP2002144447A JP2002144447A JP2003338540A5 JP 2003338540 A5 JP2003338540 A5 JP 2003338540A5 JP 2002144447 A JP2002144447 A JP 2002144447A JP 2002144447 A JP2002144447 A JP 2002144447A JP 2003338540 A5 JP2003338540 A5 JP 2003338540A5
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- manufacturing
- integrated circuit
- circuit device
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 32
- 238000004519 manufacturing process Methods 0.000 claims 23
- 239000000758 substrate Substances 0.000 claims 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- 238000007872 degassing Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 3
- 238000000059 patterning Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 238000004544 sputter deposition Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002144447A JP4344506B2 (ja) | 2002-05-20 | 2002-05-20 | 半導体集積回路装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002144447A JP4344506B2 (ja) | 2002-05-20 | 2002-05-20 | 半導体集積回路装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003338540A JP2003338540A (ja) | 2003-11-28 |
| JP2003338540A5 true JP2003338540A5 (https=) | 2005-09-22 |
| JP4344506B2 JP4344506B2 (ja) | 2009-10-14 |
Family
ID=29704118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002144447A Expired - Lifetime JP4344506B2 (ja) | 2002-05-20 | 2002-05-20 | 半導体集積回路装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4344506B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007081020A (ja) * | 2005-09-13 | 2007-03-29 | Denso Corp | 半導体装置の製造方法 |
| TW200814156A (en) | 2006-07-21 | 2008-03-16 | Toshiba Kk | Method for manufacturing semiconductor device and semiconductor device |
| JP5522979B2 (ja) * | 2009-06-16 | 2014-06-18 | 国立大学法人東北大学 | 成膜方法及び処理システム |
-
2002
- 2002-05-20 JP JP2002144447A patent/JP4344506B2/ja not_active Expired - Lifetime
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