JP2003332630A - Light-emitting diode and led light - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode and an LED light requiring less manhours for their assembly, with their surfaces wholly homogeneous in brightness. <P>SOLUTION: A light-emitting diode (LED) 2 comprises a pair of lead frames 5a, 5b which are mounted with a light-emitting element 6 and supply power to the same, and a transparent epoxy resin 8 which encapsulates them. The part of the lead frames 5a, 5b encapsulated in the transparent epoxy resin 8 bends downward from near the position of the light-emitting element 6, and protrudes out of the transparent epoxy resin 8 below the element-mounted surface for minimizing the part encapsulated in the transparent epoxy resin 8. LED light 1 has a structure which is circular in shape, the LED 2 is mounted at the center of the circular plane, and the LED 2 is surrounded with reflecting surfaces 3a concentrically arranged like steps for the formation of a reflector 3. Light emitted by the light-emitting element 6 is reflected to the horizontal X-Y directions by a boundary with air (reflection surface) positioned in the vertical Z direction, and the reflected light is again reflected to the vertical Z direction by the reflecting surfaces 3a of the reflector 3. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode and an LED light applied as a lighting device and a display device in a wide range of fields such as tail lights and brake lights of automobiles, alarm lamps and signs for construction work.

[0002]

2. Description of the Related Art As an invention of a conventional LED light using a light emitting diode, there is a vehicle signal lamp described in, for example, Japanese Patent Laid-Open No. 2001-93312. This vehicular signal lamp includes a light source such as an LED, a first reflecting mirror which is arranged immediately above the light source and reflects emitted light directed upward from the light source into horizontal light, and the first reflecting mirror. And a second reflecting mirror that is arranged in a vertical direction and reflects the horizontal light from the first reflecting mirror as vertical light.

In the above structure, the light emitted from the light source is reflected in the horizontal direction by the first reflecting mirror, and the reflected light is reflected in the vertical direction by the second reflecting mirror, whereby the vehicular signal lamp. Light is emitted from.

[0004]

However, in the above-described conventional vehicular signal lamp which is the LED light, since the light source and the first reflecting mirror are separate bodies, the light emitted from the light source is the first. Therefore, it is necessary to assemble the reflecting surface of the first reflecting mirror so as to properly reflect in the horizontal direction, and there is a problem that the number of steps for assembling increases.

Further, since the first reflecting mirror is arranged directly above the light source, the light directly emitted from the light source is not blocked by the first reflecting mirror and is not emitted in the vertical direction. Therefore, there is a problem that a dark part is generated in the center.

The present invention has been made in view of the above points, and an object of the present invention is to provide a light emitting diode and an LED light which reduce the number of assembling steps and have uniform brightness over the entire surface.

[0007]

In order to solve the above problems, a light emitting diode of the present invention comprises a light emitting element for emitting light, a lead frame for mounting the light emitting element and supplying electric power to the element. A light-transmitting resin that seals the light-emitting element and the lead frame is provided, and the lead frame is in the vicinity of the mounting portion of the light-emitting element such that the portion sealed by the light-transmitting resin is as small as possible. Is bent downward from the mounting surface to form a shape protruding to the outside of the light transmissive resin.

Further, the light emitting diode of the present invention includes a light emitting element for emitting light, a lead frame for mounting the light emitting element and supplying electric power to the element, and an optical element for sealing the light emitting element and the lead frame. With permeable resin,
In the lead frame, a portion sealed with the light transmissive resin has a wide area for conducting and dispersing heat of the light emitting element in a wide range, and an elongated flat plate-shaped portion is connected to an edge of the wide area portion. It is characterized in that it has a shape, and that the elongated flat plate-shaped portion at the edge portion is bent below the mounting surface of the light emitting element and protrudes to the outside of the light transmissive resin.

Further, the lead frame is characterized by being formed of a material having a high thermal conductivity.

Further, the lead frame is provided in the light-transmissive resin and has a concave portion including a mounting position of the light emitting element, and a side surface of the concave portion reflects light emitted from the light emitting element upward. It is characterized in that it is formed at an angle.

Further, the lead frame is in the light-transmissive resin, has a shape in which a pattern in which the light-emitting element is mounted on the light-emitting element is inclined downward toward the periphery and repeats a pattern, and the rising side surface is formed. Is formed at an angle that reflects the light emitted from the light emitting element upward.

Further, the light-transmissive resin directs light emitted from the light emitting element in a horizontal direction parallel to the mounting surface at a boundary with air located above a surface facing the mounting surface of the light emitting element. It is characterized in that it is provided with a parabolic reflection surface that reflects light to the side and a side emission surface that externally emits the light reflected in the horizontal direction.

Further, the light-transmissive resin is characterized in that it has a flat surface which is an interface with air in a direction directly above the light emitting element.

Further, the light-transmissive resin surrounds the first light-transmissive resin that seals a part of the light-emitting element and the lead frame and the side surface of the first light-transmissive resin in contact with each other. It is characterized in that it is formed of a second light transmissive resin.

The LED light of the present invention is formed by mounting a light emitting element which emits light and sealing a lead frame for supplying electric power to the element and the light emitting element with a light transmissive resin. A light emitting diode having a shape in which a frame is bent from a vicinity of a mounting portion of the light emitting element downward of a mounting surface and protruding to the outside of the light transmissive resin; and a reflecting mirror for reflecting light emitted from the light emitting diode. It is characterized by having.

The LED light of the present invention is formed by mounting a light emitting element which emits light and sealing a lead frame for supplying electric power to the element and the light emitting element with a light transmissive resin. The frame has a wide area in the sealing portion that conducts and dissipates heat of the light emitting element over a wide range, and has a shape in which an elongated flat plate-shaped portion is connected to an edge of the wide area portion, and And a reflecting mirror that reflects light emitted from the light emitting diode, in which the elongated flat plate-shaped portion is bent downwardly of the mounting surface of the light emitting element and protrudes to the outside of the light transmissive resin. It is characterized by having and.

The lead frame is made of a material having a high thermal conductivity.

Further, the lead frame is provided in the light-transmissive resin and has a concave portion including a mounting position of the light emitting element, and a side surface of the concave portion reflects light emitted from the light emitting element upward. It is characterized in that it is formed at an angle.

Further, the lead frame is in the light-transmissive resin, has a shape in which a pattern in which the light-emitting element is mounted is inclined downward toward the periphery and repeats a pattern, and has the rising side surface. Is formed at an angle that reflects the light emitted from the light emitting element upward.

Further, the light-transmissive resin causes the light emitted from the light emitting element to move in a horizontal direction parallel to the mounting surface at the boundary with the air located above the surface facing the mounting surface of the light emitting element. It is characterized in that it is provided with a parabolic reflection surface that reflects light to the side and a side emission surface that radiates the light reflected in the horizontal direction to the outside without spreading the light in the vertical direction.

Further, the light-transmissive resin is characterized by having a flat surface which is an interface with the air in a direction directly above the light emitting element.

The light-transmissive resin surrounds the first light-transmissive resin that seals a part of the light-emitting element and the lead frame, and a side surface of the first light-transmissive resin in abutment with each other. It is characterized in that it is formed of a second light transmissive resin.

In the present invention, the LED (Light Em
The itting diode) chip itself is called the "light emitting element",
"Light-emitting diode" refers to the entire light-emitting device including the optical device such as package resin or lens system equipped with LED chip.
Or it will be called "LED". Further, an illuminating device such as a vehicle-mounted light using an LED as a light source, a display device and the like will be referred to as an "LED light".

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1A is a plan view showing an overall structure of an LED light using an LED (light emitting diode) according to Embodiment 1 of the present invention, and FIG.
6A is a cross-sectional view taken along line AA, and FIG. 7C is an enlarged view of a portion P of FIG.

As shown in FIG. 1, LE of the first embodiment
The D light 1 has an LED 2 mounted with a light emitting element 6 as a light source mounted in the center of a disc-shaped body, and is surrounded by a reflecting mirror 3 having a concentric stepped reflecting surface 3a formed around the LED 2. It has a structure. Here, the central axis of the light emitting element 6 in the vertical direction is defined as the Z axis, the upper surface of the light emitting element 6 that intersects the Z axis is defined as the origin, and the horizontal X axis and the Y axis intersect at a right angle at this origin. There is. Also, LE
D2 integrally includes a first reflecting mirror that reflects light emitted from the light emitting element 6 as described later.
The above reflecting mirror 3 becomes the second reflecting mirror 3.

The second reflecting mirror 3 is formed of a transparent acrylic resin, and then aluminum vapor deposition is applied to the upper surface thereof to form the reflecting surface 3a. As shown in FIG. 1C, each reflecting surface 3a is inclined at about 45 degrees with respect to the XY plane.

Next, the structure of the LED 2 will be described with reference to FIGS.
Will be described with reference to. 2 is a cross-sectional view taken along the line AA showing the configuration of the LED 2 shown in FIG. 1, and FIG. 3 is a plan view showing the configuration of the LED 2 shown in FIG.

As shown in FIGS. 2 and 3, the LED 2 includes a pair of lead frames 5a and 5b arranged on the XY plane with a gap for insulation, and an elongated flat plate shape is bent into an L shape. The light emitting element 6 is mounted at the origin position of the lead frame 5a, the electrode on the upper surface of the light emitting element 6 and the tip of the lead frame 5b are bonded by the wire 7, and further, a part of each lead frame 5a, 5b, The light emitting element 6 and the wire 7 are formed by sealing with a transparent epoxy resin (light transmissive material) 8 having a flat and roughly cylindrical shape.

This LED 2 is characterized in that the light emitting element 6 is sealed with a transparent epoxy resin 8 (hereinafter, also simply referred to as resin 8) which will be a first reflecting mirror, which will be described later. The lead frame 5a on which the light emitting element 6 is mounted is bent at a right angle from the vicinity of the mounting portion of the light emitting element 6 to the outside of the transparent epoxy resin 8 by bending at a right angle from the vicinity of the mounting portion of the light emitting element 6 to form the lead. The purpose is to minimize the portion of the frame 5a that is embedded in the transparent epoxy resin 8. The other lead frame 5b has an elongated flat plate shape and is arranged in parallel with the portion of the lead frame 5b protruding outside the resin.

The light emitting element 6 is of a large current type (high output type) for the purpose of keeping the light emission intensity of the LED 2 at a predetermined value by reducing the number thereof as much as possible. For example, as shown in FIG. 4, on the N-type GaP substrate 101, the N-type AlInGaP clad layer 102, the multi-well active region 103, the P-type AlInGaP clad layer 104,
P-type GaP windows 105 are sequentially formed, and P
This window 10 on the type GaP window 105
AuZn contact 10 for ohmic contact with
An Al bonding pad (positive electrode) 107 is formed via the electrode 6, and an Au alloy electrode (negative electrode) 108 is further formed under the N-type GaP substrate 101.

The negative electrode 10 of the light emitting element 6 having such a structure
8 is mounted on the lead frame 5a, the positive electrode 107 and the tip of the lead frame 5b are bonded by the wire 7 as described above, and a predetermined voltage is applied between the electrodes 107 and 108. It emits light. This light emission is performed by confining carriers (electrons and holes) in the multi-well active region 103 in each of the clad layers 102 and 104, and by recombining the carriers in the multi-well active region 103. .

Since the light emitting element 6 is of a large current type, it generates a large amount of heat. Therefore, for example, as shown in FIG. 5, the pair of lead frames 120a and 120b are
Both are transparent epoxy resin 8 with the shape of an elongated flat plate
It is assumed to be a normal one that is horizontally opposed to and protrudes to the outside. In this case, the embedded portion from the mounting portion of the lead frame 120a where the light emitting element 6 is mounted to the outside of the resin 8 becomes longer. As described above, the longer the elongated flat plate-shaped embedded portion, the more difficult it is for the heat generated from the light emitting element 6 to be radiated to the outside of the resin 8, so that the light emitting element 6 becomes hot and the luminous intensity decreases. Further, heat is accumulated in the light emitting element 6 and the lead frame 120a to become high heat, and cracks are easily generated at the boundary with the transparent epoxy resin 8.

Therefore, in the first embodiment, the light emitting element 6
As shown in FIG. 2, the lead frame 5a on which is mounted is bent downward near the mounting portion of the light emitting element 6 and the embedded portion is reduced as much as possible to enhance heat dissipation to the outside, and The heat is prevented from being stored in the lead frame 120a as much as possible. If heat is not accumulated in this way, the lead frame 120a and the transparent epoxy resin 8
Cracks will not occur at the boundary between and. In addition, in order to enhance heat dissipation to the outside, the lead frame 5
A material such as a copper alloy having a high thermal conductivity was used for a and 5b.

As shown in FIGS. 2 and 3, the shape of the LED 2 is a flat and substantially cylindrical shape which is the shape of the transparent epoxy resin 8, and the central portion of the upper surface 9b (the portion directly above the light emitting element 6) is flat. The surface 9a is a flat surface 9a.
Then, as the first reflecting mirror 9, a part of a parabola in the X-axis direction having the origin of the light-emitting element 6 as a focal point is rotated around the Z-axis to form a substantially umbrella-shaped reflecting shape ( Therefore,
Not a paraboloid of revolution). Hereinafter, the shape of the reflecting surface of the first reflecting mirror 9 will be referred to as a reflecting shape.

Further, the diameter of the first reflecting mirror 9 is set to a size capable of almost totally reflecting the light emitted from the light emitting element 6 in the horizontal direction. Here, the size of the emitted light within the range of 20 degrees or more with respect to the Z axis reaches the upper surface 9b. Further, the side surface 10 of the LED 2 forms a part of a spherical surface centering on the light emitting element 6. The LED 2 having such a configuration is fixed to the center of the circular LED light 1.

Next, how the LED light 1 having such a configuration shines will be described with reference to FIGS. 1 and 2.

When a voltage is applied to the lead frames 5a and 5b of the LED 2 to cause the light emitting element 6 to emit light, of the light emitted from the light emitting element 6, the light directed in the Z direction directly above is transmitted from the flat surface 9a to the transparent epoxy. It passes through the resin 8 as it is, goes straight ahead, passes through a transparent front plate (not shown) which is covered on the LED light 1, and is emitted to the outside. In addition, the light emitting element 6
The light within the range of 20 degrees or more with respect to the Z-axis of the emitted light reaches the upper surface 9b as the first reflecting mirror 9, and all the light is totally reflected because the incident angle is large and the side surface 10 is formed. Head to. Here, since the upper surface 9b has the above-described reflection shape, all the light reflected by the upper surface 9b travels parallel to the XY plane.

Since the side surface 10 forms a part of a spherical surface centered on the light emitting element 6, the light traveling in parallel is
The light travels in parallel on the side surface 10 as it is, and is radiated in a substantially planar shape in the direction of 360 degrees around the Z axis. Further, the light that directly goes from the light emitting element 6 to the side surface 10 is emitted in the same direction without being refracted by the side surface 10.

Light emitted from the side surface 10, that is, the upper surface 9
The light directly emitted from the light emitting element 6 through the side surface 10 including the light reflected by b and traveling substantially parallel to the XY plane has an inclination of about 45 degrees of the second reflecting mirror 3. The light is reflected by the reflecting surface 3a that it has, travels almost vertically upward, and is emitted to the outside through a transparent front plate (not shown) at least within a range of 20 degrees or more from the XY plane. Note that the light described as “parallel” in the above is not perfectly parallel because of the size of the light-emitting element 6, but all the light is substantially parallel and at least within a range of 20 degrees from the Z axis. It will surely come in.

As described above, according to the LED light 1 of the first embodiment, the LED 2 used in the LED light 1 is
Since the light emitting element 6 which is the light source and the first reflecting mirror are formed as an integral structure, the light source and the first reflecting mirror are separate bodies as in the prior art, so that the number of assembling steps is not increased. . That is, the number of assembly steps of the LED 2 and the LED light 1 using the LED 2 can be reduced.

Further, since the first reflecting mirror 9 of the LED 2 has the flat surface 9a directly above the light emitting element 6, the light (vertical light) of the light emitted from the light emitting element 6 which goes directly upward is emitted from the flat surface 9a to the outside. Can be radiated to. Therefore, the entire irradiation surface composed of the flat surface 9a and the side surface 10 of the LED 2 can be irradiated, and even in the LED light 1 using this LED 2, the entire irradiation surface can be irradiated.

Further, by forming the flat surface 9a immediately above and curving from the peripheral edge of the flat surface 9a to the upper surface 9b, the first surface is formed.
The reflecting mirror 9 of can be made thinner. If curved without forming a plane directly above, the distance between the light emitting element 6 and the interface directly above this must be lengthened, so the first reflecting mirror 9
However, this point can be solved.

In the LED 2, the lead frame 5a on which the light emitting element 6 is mounted is bent downward near the mounting portion of the light emitting element 6 and protrudes to the outside of the transparent epoxy resin 8 to minimize the portion embedded in the resin 8. did. When the lead frame 5a is bent downward and protrudes to the outside of the resin 8 in this manner, the lower portion of the horizontal surface extending to the side surface around the light emitting element 6 mounting surface of the resin 8 is significantly larger than the upper portion of the horizontal surface. Since it is thin, the embedded portion is much smaller than the resin 8 protruding in the horizontal direction X. As a result, even if the light emitting element 6 is of a large current type and generates a large amount of heat, the heat of the light emitting element 6 is radiated to the outside in an extremely short distance, so that heat is not accumulated in the light emitting element 6 and the lead frame 120a, and Since the contact portion between the lead frame 120a and the resin 8 is reduced, it is possible to prevent the occurrence of cracks at the boundary between the lead frame 120a and the transparent epoxy resin 8.

In other words, heat is accumulated in the transparent epoxy resin 8 to become high heat, and thermal expansion due to residual stress of the transparent epoxy resin 8 caused by this heat causes the light emitting element 6 and the lead frame 5a and the transparent epoxy resin 8 to be separated. It is possible to prevent the occurrence of cracks at the boundaries of the.

Further, since the lead frame 5a is made of a material having a high thermal conductivity, the heat dissipation is further enhanced, and the heat can be dissipated more efficiently.
It is possible to further prevent the occurrence of cracks.

Further, since the heat radiation property is greatly improved, there is an advantage that a large light output can be obtained because thermal saturation does not occur even when a large current is applied to the light emitting element 6, so that the thermal saturation is limited. A large light output can be obtained without receiving, and bright radiant light can be obtained.

In addition to this, the plan view of FIG. 6A and FIG.
In the LED 2a shown in the cross-sectional view of FIG. 5, the lead frame 122a, on which the light emitting element 6 is mounted, of the pair of lead frames 122a and 122b is arranged so that cracks do not occur at the boundary with the transparent epoxy resin 8. It has a wide area that can dissipate and dissipate the heat of a wide area, and forms an elongated flat plate shape that is connected to the edge of the large area portion. The elongated flat plate shape is bent downward at the edge portion to form a transparent epoxy. The portion embedded in the resin 8 may be minimized by protruding to the outside of the resin 8. In addition, in the example of FIG.
A pair of wide area portions are formed in a circular shape, but any shape such as a square or a triangle may be used as long as it has a wide area capable of dispersing heat.

In the LED 2a having such a structure,
Since the portion of the lead frame 122a on which the light emitting element 6 is mounted, which is sealed with the transparent epoxy resin 8, has a large area for conducting and dispersing the heat of the light emitting element 6 in a wide range,
Even if the light emitting element 6 is of a large current type and generates a large amount of heat, heat conducted from the light emitting element 6 directly to the transparent epoxy resin 8 and heat conducted from the light emitting element 6 to the transparent epoxy resin 8 through the lead frame 122a are The lead frame 122a having a large area can be dispersed over the entire lead frame 122a. In addition, since the heat of the large area is radiated to the outside in a short distance, the heat is not accumulated in the light emitting element 6 and the lead frame 120a, and the contact portion between the lead frame 120a and the resin 8 is reduced. Therefore, it is possible to prevent the generation of cracks due to heat at the boundary between the lead frame 120a and the transparent epoxy resin 8. Further, as shown in FIG. 6C, a plurality of fins 122c may be provided in the portion of the lead frame 122a protruding outside the transparent epoxy resin 8 to promote heat exchange. In this case, the heat of the lead frame 122a is quickly radiated to the outside of the transparent epoxy resin 8.

(Modification 1) As a first modification of the LED light 1, as shown in FIG. 7, in the LED 2b, the pair of lead frames 12b and 12c are recessed only around the light emitting element 6 and the third reflection is performed. Use as a mirror. However, it is assumed that the pair of lead frames 12b and 12c have the same planar shape as the lead frames 120a and 120b shown in FIG.

As a result, in the basic form of the LED 2 shown in FIG. 2, light is emitted only in the direction directly above the light emitting element 6, whereas light is emitted upward from the periphery of the light emitting element 6. Thus, it is possible to obtain the effect that the whole body looks like emitting light and the appearance is improved.

(Modification 2) As a second modification of the LED light 1, as shown in FIG. 8, in the LED 2c, a pair of lead frames 13a and 13b are half-etched or stamped to form a sawtooth shape as shown in the drawing. By providing the pattern, the light emitted obliquely downward from the light emitting element 6 may be reflected and the light emitted upward. However, a pair of lead frames 13a, 1
The planar shape of 3b is the same as the lead frame 120 shown in FIG.
a and 120b.

Thus, the lead frames 13a and 13b are
Modification 1 by forming a plurality of concentric reflecting mirrors on the
Similarly to the above, it is possible to make the whole body appear to emit light, and it is possible to improve the appearance. In this case, the transparent epoxy resin 8 and the lead frames 13a, 1
There is also an effect of reducing peeling defects by increasing the bonding area with 3b and making the bonding shape non-planar. Particularly, it is effective in the case of a large current type that generates a large amount of heat.

(Modification 3) As a third modification of the LED light 1, as shown in FIG. 9, in the LED 2d, the side surface shape of the sealed portion of the transparent epoxy resin 8 may be changed. The side surface 10 of the basic example is a part of a spherical shape centered on the light emitting element 6, and the light emitted from the light emitting element 6 is the side surface 1.
It was supposed to be incident almost perpendicularly to 0 and go straight. In the third modification, the side surface 14 forms a part of an ellipsoidal surface having the light emitting element 6 as one focal point,
The light emitted from the light emitting element 6 is refracted on the side surface 14 slightly downward with respect to the straight traveling direction. Therefore, even if the second reflecting mirror 3 having a stepped shape around the LED is moved to a lower position, the LED light has high external radiation efficiency. As a result, the LED light can be made thinner.

(Modification 4) As a fourth modification of the LED light 1, as shown in FIG.
The reflection on the upper surface 9b of the first reflecting mirror 9 to the side does not depend on the total reflection at the boundary surface between the transparent epoxy resin 8 and the air, but the upper surface 9b is plated with a metal reflective film 15 or the like.
May be attached. In this case, if the light emitting element 6 is flattened directly above, the light emitted right above will not be radiated to the outside. Therefore, a part of the parabola whose focal point is the light emitting element 6 up to the central portion of the upper surface 9b. The shape needs to be rotated around the Z axis.

(Fifth Modification) As a fifth modification of the LED light 1, as shown in FIG. 11, an LED 2f is formed in a substantially cylindrical shape having a diameter smaller than that of the basic first reflecting mirror 9. On the outer circumference of the reflecting mirror 9d, a separate annular reflecting mirror 9e is provided.
To form a first reflecting mirror 9f. When the first reflecting mirror 9f is formed, for example, the light emitting element 6 is mounted on the first resin molding die as described above, and the pair of lead frames 5a and 5b are wire-bonded.
(Or the lead frames 122a and 122b) are set, and the transparent epoxy resin 8a is poured and cured. The reflecting mirror 9d formed by this curing is set in the second resin sealing mold, and the transparent epoxy resin 8b is poured and cured to form the annular reflecting mirror 9e. In addition,
The annular reflecting mirror 9e may be formed by fitting it into the roughly cylindrical reflecting mirror 9d that is individually manufactured in advance.

The outer shape of the first reflecting mirror 9f thus formed is similar to that of the basic shape 9. Therefore, the annular reflecting mirror 9
The outer surface of e is shaped like a part of a spherical surface centered on the light emitting element 6 as in the basic form 9. In addition, the boundary between the substantially cylindrical reflecting mirror 9d and the annular reflecting mirror 9e is vertical as shown in this example, but as in the basic form 9, the boundary forms a part of a spherical surface centered on the light emitting element 6. Is also good.

According to such an LED 2f, the transparent epoxy resin for sealing the light emitting element 6, the bonding wire 7 and the pair of lead frames 5a and 5b is used as the first and second transparent epoxy resins.
Since the transparent epoxy resins 8a and 8b are separated from each other, the volume of each resin 8a and 8b becomes smaller than that of the basic type transparent epoxy resin 8 and the residual stress of each can be reduced. That is, the light emitting element 6 and the transparent epoxy resins 8a, 8 from the light emitting element 6 via the lead frame 5a.
Even if heat is conducted to b, each residual stress is small and individual, so that thermal expansion due to residual stress induced by heat can be reduced. Therefore, it is possible to prevent the occurrence of cracks at the boundary between the light emitting element 6 and the lead frame 5a and the transparent epoxy resin 8 due to the thermal expansion.

Furthermore, the LED 2b shown in FIGS.
Even if the configuration in which the transparent epoxy resin described in the fifth modification is divided into the first to second reflective mirrors is used to form the first reflecting mirror, the cracks can be similarly prevented.

(Modification 6) As a sixth modification of the LED light 1, as shown in (a) to (d) of FIG.
The second reflecting mirror 3a of the D light 1a can be made to have light emitting points scattered instead of making the whole of the second reflecting mirror 3a of the basic example shown in FIG. 1 substantially uniform. That is, as shown in FIG. 12A, the circular second reflecting mirror 3
12A, the distance from the LED 2 (or any of the LEDs 2b to 2f) to the reflecting surface 23a is divided into several types, as shown in FIGS. 12 (b), 12 (c), and 12 (d).
As a result, the positions where the reflected light is radiated are scattered in a circle when viewed from above, and there is an effect that it looks shiny and beautiful. In the sixth modified example, in each fan shape, L is formed by one reflecting surface 23a.
Since all the light from the ED2 must be reflected, the height of each reflecting surface 23a shown in FIGS. 12 (b) to 12 (d) is the same as the basic example of circular staircase reflection as shown in FIG. 12 (b). Mirror 3
Must be the same height as the total height h of.

(Modification 7) As a sixth modification of the LED light 1, as shown in FIGS. 13 (a) to 13 (c), LE is used.
By dividing the second reflecting mirror 3b of the D light 1b into a fan shape and changing the length of each, the shape of the second reflecting mirror 3b can be approximated to a square as one of polygons. That is, as shown in FIGS. 13 (b) and 13 (c), in the shortest fan shape, the reflective surface 26a is moved to the next reflective surface 2a.
When the length up to 6a is L, the length from the reflecting surface 26a to the next reflecting surface 26a is √2L in the longest fan shape deviated from the fan shape by 45 degrees. Thereby, as shown in FIG. 13A, the second reflecting mirror 3b having a substantially square shape can be formed.

For example, as an application of the basic type LED light 1, as shown in FIG. 14, the circular LED shown in FIG.
Cut light 1 into squares or parts of it and cut into pieces 11
Six pieces a, 11b, 11c, 11d, 11e, and 11f can be manufactured, and these can be combined as shown to form the integrated LED light 11 having a plurality of light emitting elements that cover a predetermined area. In this way, even when a plurality of square LED lights 11a, ...
If the LED light 1b shown in 1 is used, it is not necessary to cut the circular LED light 1b into a square shape, so that there is no decrease in external radiation efficiency and a brighter connected light can be obtained.
Further, when a substantially square LED is used as a light source instead of the roughly cylindrical LEDs 2 and 2b to 2f, there is also an advantage that the distance from each side surface of the LED to the reflecting mirror 26 becomes substantially equal over the entire circumference.

LED light 1b having such advantages
The vehicle lamp 11 that can be applied to, for example, a tail light or a brake light of an automobile as shown in FIG.
If 0 is formed, a brighter lamp can be formed. In the lamp 110, a stair-like pedestal 112 of three steps and two rows having different front positions in the direction indicated by the arrow Y1 is formed in a cover 111 having a hollow interior.
The LED light 1b is fixed to the front surface of 2, and the inner wall 111a of the cover 111 and the upper surface 112b and the side surface 112c of the pedestal 112 are formed by aluminum plating.

That is, since the entire inner surface of the cover 111 reflects light efficiently, the light emitted from the LED light 1b in all directions of the hemisphere is efficiently reflected, and a brighter lamp can be formed. The light emitted from the LED light 1b is also reflected on the side surface of the inner wall 111a of the cover 111 and the side surface 112c of the pedestal 112, so that the light is also emitted in the lateral direction indicated by the arrow X1. Therefore, if it is applied to a tail light or a brake light of an automobile, the visibility of light not only directly behind the automobile but also from the lateral direction can be improved.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. 16
It is a longitudinal cross-sectional view which shows the whole structure of LED used for the LED light which concerns on Embodiment 2 of this invention.

As shown in FIG. 16, L of the second embodiment
In the ED 31, the light emitting element 6 is mounted on the tip of the lead frame 5a of the pair of lead frames 5a and 5b,
The electrode on the upper surface of the light emitting element 6 and the tip of the lead frame 5b are bonded by a wire 7 to make an electrical connection. These lead frames 5a, 5 as an electric system
The tip of b, the light emitting element 6, and the wire 7 are sealed with a transparent epoxy resin 36 as a light transmissive material. The outer shape of the transparent epoxy resin 36 has a shape in which the upper half of a sphere centering on the light emitting element 6 is cut into a conical shape. In this case, the light emitted from the light emitting element 6 is totally reflected by the upper surface 32 serving as the first reflecting mirror, but the reflected light corresponds to the light emitted from the reflection point of the light emitting element 6 on the upper surface 32. The light is not condensed light but is emitted from the side surface 37 with a divergence angle. Therefore, the circular step-shaped reflecting mirror as the second reflecting mirror that reflects these lights upward is also required to be longer in the Z direction than the LED 2 of the first embodiment described above.

However, such a simple conical reflecting surface 32 can be used when a relatively wide light distribution is acceptable as the LED light, or when an extremely thin LED light is not required.

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 17 is a vertical sectional view showing the overall configuration of the LED light according to the third embodiment of the present invention.

As shown in FIG. 17, the LED light 40 according to the third embodiment of the present invention includes a pair of lead frames 5a,
The light emitting element 6 is mounted on the tip of the lead frame 5a of the lead frame 5b, and the electrode on the upper surface of the light emitting element 6 and the tip of the lead frame 5b are bonded by a wire 7 for electrical connection. The tips of the lead frames 5a and 5b as the electric system, the light emitting element 6, and the wire 7 are sealed with a transparent epoxy resin 36. The shape of this transparent epoxy resin 36 is a normal columnar shape, and therefore the upper surface of the transparent epoxy resin 36 cannot serve as the first reflecting mirror. Instead, a circular optical body 38 formed of a transparent acrylic resin and having a shape like an umbrella is attached to the upper surface of the transparent epoxy resin 36 via a light transmissive material 37. The upper surface 39 of the optical body 38 has a shape obtained by rotating a part of a parabola whose focal point is the light emitting element 34 and whose axis of symmetry is the X axis direction, around the Z axis.

Further, the lower surface 41 of the optical body 38 has a circular staircase shape with a step of about 45 degrees in order to replace the circular staircase shape reflection mirror 3 of the first embodiment as the second reflection mirror. Has become. Further, aluminum vapor deposition 42 is formed on the lower surface 41, and overcoating (not shown) is performed thereon to protect the aluminum vapor deposition film. In the third embodiment, it is possible to increase the degree of freedom of the overcoat after forming the evaporation mirror surface. That is, the overcoat may be colored and the thickness is not limited.

The LED light 40 having the above structure is
When a predetermined voltage is applied to the pair of lead frames 5a and 5b, the light emitting element 6 emits light, and there is nothing to block the light heading directly above, so go straight ahead and set a transparent front plate (not shown). It is transmitted and released to the outside. Further, the light emitted obliquely from the upper side to the side passes through the light transmissive material 37 and enters the optical body 38, and the light striking the upper surface 39 as the first reflecting mirror is totally reflected. , The upper surface 39 is the light emitting element 6
Since a part of the parabola having the focal point is rotated around the Z axis, the parabola is reflected in the side surface direction substantially parallel to the XY plane. Then, it is reflected upward by the circular staircase-shaped reflecting mirror 41 as a second reflecting mirror substantially parallel to the Z-axis and transmitted from the upper surface 39 through the front plate to be radiated to the outside. Optical body 3
The light that has entered 8 and directly hits the circular staircase-shaped reflecting mirror 41 is also radiated upward.

In this way, it is possible to illuminate a large area with a single light emitting element with a good appearance by using an ordinary cylindrical LED, while taking advantage of the characteristic feature of the LED such as thinness, and high external radiation efficiency. Will be an LED light.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG.
(A) is a plan view showing an overall configuration of an LED light using an LED according to Embodiment 4 of the present invention, and (b) is (a).
FIG.

As shown in FIG. 18, L of the fourth embodiment
The lower surface 83 of the ED light 80 is a step-like reflecting surface as a second reflecting mirror, and a cylindrical space 84 is formed at the center.
Optical body 81 molded from transparent acrylic resin provided with
And the above-described LED 2 fixed in the central space 84. That is, in the LED 2, the light emitting element 6 and the like are sealed with a transparent epoxy resin, and the upper surface thereof is a parabolic surface 9b as a first reflecting mirror.
The light emitted from the light emitting element 6 and reflected in the side surface direction on the upper surface 9b is reflected upward on the lower surface 83 of the optical body 81, passes through a transparent front plate (not shown), and is radiated to the outside.

Here, the light emitted directly from the upper portion of the side surface 10 of the LED 2 (without being reflected by the upper surface 9b) is reflected upward in the above-described LED light 1 in order to follow the route indicated by the chain double-dashed line. However, in the present LED light 80, it is reflected by the horizontal upper surface 82 of the optical body 81 as shown by the broken line, and further reflected upward by the lower surface 83 for effective use. . As a result, the LED light is thin and has high external radiation efficiency. Further, since the light incident on the space 84 is refracted in a direction having a large angle with respect to the Z axis, the brightness of the peripheral portion when viewed from above in FIG. 18A is improved.

In the above-described first to fourth embodiments of the present invention, the transparent epoxy resin is mainly used as the light transmissive material for sealing the light emitting element, but other light transmissive materials may be used. Also, as the second reflecting mirror, or the first
Although a transparent acrylic resin is used as the optical body that also serves as the second reflection mirror and the second reflection mirror, other materials such as other transparent synthetic resins can be used. Furthermore, LE
The configuration, shape, quantity, material, size, connection relationship, etc. of the other parts of the D light are not limited to those in the first to fourth embodiments.

[0077]

As described above, according to the present invention,
The light emitting diode includes a light emitting element that emits light, a lead frame that mounts the light emitting element and supplies power to the element, and a light transmissive resin that seals the light emitting element and the lead frame. The resin is a reflection surface that is an interface with the air located above the light emitting element, reflects the light emitted from the light emitting element in the horizontal direction (the side emission surface direction of the light transmissive resin), and reflects the reflected light. The side emission surface radiates to the outside without spreading in the vertical direction, and further, the light transmissive resin has a flat surface which is an interface with air in a direction directly above the light emitting element.

That is, in the light emitting diode, since the light emitting element which is the light source and the reflecting mirror are formed as an integrated structure, the light source and the reflecting mirror (reflection surface) are separate bodies as in the conventional case. There will be no increase in the number of assembly steps. That is, the number of assembling steps of the light emitting diode and the LED light using the light emitting diode can be reduced.

Further, since the reflecting mirror of the light emitting diode has the flat surface directly above the light emitting element, the light (vertical light) of the light emitted from the light emitting element which goes directly upward can be emitted from the flat surface to the outside. Therefore, the entire irradiation surface of the light emitting diode can be irradiated, and L
Even the ED light can irradiate the entire irradiation surface.

Further, the lead frame is bent downward from the mounting surface of the light emitting element from the vicinity of the mounting portion of the light emitting element so as to protrude to the outside of the light transmitting resin so that the portion sealed with the light transmitting resin is reduced as much as possible. It was configured to have a shape.

When the lead frame is bent downward and protrudes to the outside of the light transmissive resin in this manner, the portion of the light transmissive resin below the horizontal plane that extends around the light emitting element mounting surface to the side surface is above the horizontal plane. Since it is much thinner than the portion, the sealing portion is much smaller than the resin protruding in the horizontal direction. As a result, the heat of the light emitting element is radiated to the outside in an extremely short distance, so that the heat is not accumulated in the light emitting element and the lead frame, and the contact portion between the lead frame and the resin is reduced. It is possible to prevent the occurrence of cracks at the boundary with the resin.

Further, the lead frame is sealed with a light-transmissive resin, and has a large area for conducting and dispersing the heat of the light emitting element over a wide area. And the elongated flat plate-shaped portion is bent downward at the edge of the light emitting element mounting surface and protrudes to the outside of the light transmissive resin.

Thus, the heat conducted from the light emitting element directly to the light transmissive resin and the heat conducted from the light emitting element to the light transmissive resin via the lead frame can be dispersed over the entire wide lead frame. . In addition to this,
Since the heat of the large area is radiated to the outside in a short distance, the heat is not accumulated in the light emitting element and the lead frame, and it is possible to prevent cracks from being generated at the boundary between the lead frame and the resin.

[Brief description of drawings]

FIG. 1A is an LED according to a first embodiment of the present invention.
It is a top view which shows the whole structure of the LED light using (light emitting diode), (b) is an AA sectional view of (a), (c) is an enlarged view of P part of (b).

FIG. 2 is a vertical cross-sectional view of an LED which is a light source of the LED light according to the first embodiment.

FIG. 3 is a plan view showing the configuration of the LED according to the first embodiment.

FIG. 4 is a sectional view showing a configuration of a light emitting element used for the LED according to the first embodiment.

FIG. 5 is a vertical cross-sectional view of the LED when the lead frame is horizontally projected.

FIG. 6A is a plan view of the LED according to the first embodiment in which a lead frame having a wide area is used,
(B) is a longitudinal sectional view of (a), and (c) is a view in which fins are provided in (b).

FIG. 7 is a vertical cross-sectional view showing a first modification of the LED, which is the light source of the LED light according to the first embodiment.

FIG. 8 is a vertical cross-sectional view showing a second modification of the LED that is the light source of the LED light according to the first embodiment.

FIG. 9 is an explanatory diagram showing a third modification of the LED, which is the light source of the LED light according to the first embodiment.

FIG. 10 is a partially enlarged view showing a fourth modified example of the LED light according to the first embodiment.

FIG. 11 is a vertical cross-sectional view showing a fifth modification of the LED, which is the light source of the LED light according to the first embodiment.

12A is a plan view showing a fifth modification of the LED light according to the first embodiment, FIG. 12B is a sectional view taken along line BB of FIG. 12A, and FIG. C sectional drawing, (d) is DD sectional drawing of (a).

13A is a plan view showing a sixth modification of the LED light according to Embodiment 1, FIG. 13B is a sectional view taken along line EE of FIG. 13A, and FIG. It is a -F sectional view.

FIG. 14 is a plan view showing a structure in which the periphery of the LED light according to the first embodiment is cut into a rectangle, and a plurality of pieces are combined to cover a certain range.

FIG. 15 is a perspective view showing a structure of a vehicular lamp formed by combining a plurality of LED lights according to a sixth modification.

FIG. 16 is a vertical cross-sectional view showing the overall configuration of an LED used in the LED light according to the second embodiment of the present invention.

FIG. 17 is a vertical cross-sectional view showing the overall configuration of the LED light according to the third embodiment of the present invention.

FIG. 18 (a) is an LED according to a fourth embodiment of the present invention.
The top view which shows the whole structure of a light, (b) is G- of (a)
It is a G sectional view.

[Explanation of symbols]

1,1a, 1b, 21,24,31,40,80 LE
D light 2, 2a, 2b, 2c, 2d, 2e, 2f LED (light emitting diode) 3, 3a, 3b, 23, 26, 41, 83 Second reflecting mirror 5a, 5b, 7, 12b, 12c, 13a, 13b, 3
3a, 33b, 35, 120a, 120b, 122a,
122b Electric system (lead frame and bonding wire) 6,34,85 Light emitting element 8,8a, 8b, 36 Transparent epoxy resin (light transmissive material) 9,9f, 15,32,39 First reflecting mirror 9d General column Reflective mirror 9e Ring-shaped reflective mirror 12b, 12c, 13a, 13b Third reflective mirror 15 Metal surface 38, 81 Optical body 101 N-type GaP substrate 102 N-type AlInGaP clad layer 103 Multi-well active region 104 P-type AlInGaP clad layer 105 P-type GaP window 106 AuZn contact 107 Al bonding pad (positive electrode) 108 Au alloy electrode (negative electrode) 110 Vehicle lamp 111 Cover 111a Cover inner wall 112 Pedestal 112b Pedestal upper surface 112c Pedestal side surface

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) F21Y 101: 02 F21Q 1/00 G N (72) Inventor Toshinori Takahashi Ochiai character Nagahata, Kasuga-cho, Nishikasugai-gun, Aichi prefecture No. 1 F term in Toyoda Gosei Co., Ltd. (reference) 3K080 AA01 AA14 AB01 BA07 BB02 BC02 BC09 5F041 AA06 AA33 CA37 DA17 DA22 DA25 DA26 DA44 DA57 FF11

Claims (16)

[Claims] 1. A light-emitting element that emits light, a lead frame that mounts the light-emitting element and supplies electric power to the element, and a light-transmissive resin that seals the light-emitting element and the lead frame. The lead frame has a shape that is bent from the vicinity of the mounting portion of the light emitting element downward to the mounting surface and protrudes to the outside of the light transmissive resin so that the portion sealed with the light transmissive resin is minimized. A light emitting diode characterized by comprising: 2. A light emitting element that emits light, a lead frame that mounts the light emitting element and supplies power to the element, and a light transmissive resin that seals the light emitting element and the lead frame, In the lead frame, a portion sealed with the light transmissive resin has a wide area for conducting and dispersing heat of the light emitting element in a wide range, and an elongated flat plate-shaped portion is connected to an edge of the wide area portion. 2. A light emitting diode, wherein the light emitting diode has a shape, and the elongated flat plate-shaped portion is bent to a lower side of a mounting surface of the light emitting element and protrudes to the outside of the light transmissive resin at the edge portion. 3. The light emitting diode according to claim 1, wherein the lead frame is made of a material having high thermal conductivity. 4. The lead frame has a recess in the light-transmissive resin including a mounting position of the light emitting element, and a side surface of the recess reflects light emitted from the light emitting element upward. The light emitting diode according to claim 2, wherein the light emitting diode is formed at an angle. 5. The lead frame is in the light-transmissive resin, has a shape that repeats a pattern that rises downward from the mounting position of the light-emitting element toward the periphery and rises, and the side surface of the rising side. The light emitting diode according to claim 2 or 3, wherein the light emitting diode is formed at an angle that reflects the light emitted from the light emitting element upward. 6. The light-transmissive resin is configured so that light emitted from the light-emitting element is directed in a horizontal direction parallel to the mounting surface at a boundary with air located above a surface facing the mounting surface of the light-emitting element. The light emitting diode according to claim 1, further comprising: a parabolic reflection surface that reflects light to a side surface, and a side emission surface that externally emits the light reflected in the horizontal direction. 7. The light emitting diode according to claim 6, wherein the light transmissive resin has a flat surface which is an interface with air in a direction directly above the light emitting element. 8. The light-transmissive resin is in contact with and surrounds a side surface of the first light-transmissive resin that seals a part of the light emitting element and the lead frame. The light emitting diode according to claim 6 or 7, wherein the light emitting diode is formed of a second light transmissive resin. 9. A light emitting element which emits light is mounted, and a lead frame for supplying electric power to the element and the light emitting element are sealed with a light transmissive resin, and the lead frame is mounted with the light emitting element. It is characterized by comprising: a light emitting diode that is bent downward from the vicinity of the mounting surface toward the mounting surface and protrudes to the outside of the light transmissive resin; and a reflecting mirror that reflects light emitted from the light emitting diode. LED light. 10. A light emitting element that emits light is mounted, and a lead frame for supplying electric power to the element and the light emitting element are sealed with a light transmissive resin, and the lead frame is the sealed portion. And has a wide area that conducts and dissipates heat of the light emitting device in a wide range, and has a shape in which an elongated flat plate-shaped portion is connected to an edge of the wide area portion, and the elongated flat plate shape is formed at the edge portion. A light emitting diode having a shape in which a portion is bent downward to a mounting surface of the light emitting element and protruding to the outside of the light transmissive resin; and a reflecting mirror for reflecting light emitted from the light emitting diode. LED light. 11. The LED light according to claim 9, wherein the lead frame is made of a material having high thermal conductivity. 12. The lead frame has a recess in the light-transmissive resin, including a mounting position of the light emitting element, and a side surface of the recess reflects upward light emitted from the light emitting element. The LED light according to claim 10 or 11, wherein the LED light is formed at an angle. 13. The lead frame is in the light-transmissive resin, has a shape that repeats a pattern that rises downward from the mounting position of the light-emitting element toward the surroundings, and has the rising side surface. The LED light according to claim 10, wherein the LED light is formed at an angle that reflects the light emitted from the light emitting element upward. 14. The light-transmissive resin causes the light emitted from the light emitting element to move in a horizontal direction parallel to the mounting surface at a boundary with air located above a surface facing the mounting surface of the light emitting element. 14. A parabolic reflection surface that reflects light to a side surface and a side emission surface that radiates the light reflected in the horizontal direction to the outside without spreading the light in the vertical direction. The LED light described in. 15. The LED light according to claim 14, wherein the light transmissive resin has a flat surface which is an interface with air in a direction directly above the light emitting element. 16. The light transmissive resin surrounds a side surface of the first light transmissive resin that abuts a side surface of the first light transmissive resin that seals a part of the light emitting element and the lead frame. The LED according to claim 14 or 15, wherein the LED is formed of a second light transmissive resin.
Light.