JP2003327670A - Resin composition for sealing and electronic part sealed device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a resin composition for sealing having excellent flame retardance, moldability, and continuous production reliability, particularly without containing a halogen compound and antimony oxide, and to provide an electronic part sealed device. <P>SOLUTION: The halogen-free resin composition for sealing comprises (A) an epoxy resin, (B) a sulfur-containing phenolic resin having a sulfur content ratio of 3-15 wt.% in which sulfur is incorporated in a chemically bonded state into the entire phenolic resin or a part of the phenolic resin, and (C) an inorganic filler as the essential components, and the ratio of the sulfur-containing phenolic resin (B) is set at 1-30 wt.% based on the total amount of the resin composition, and simultaneously, that of the sulfur content is set at 0.03-4.2 wt.% based on the resin composition, and further that of the inorganic filler (C) is set at 60-95 wt.%. The electronic part sealed device is provided by sealing an electronic part with a cured product of this composition. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention has excellent flame retardancy without adding a halogen compound (compound containing a chlorine atom or a bromine atom) and antimony trioxide, and also has good moldability and reliability. The present invention relates to a resin composition for encapsulation and an electronic component encapsulation device which are excellent in heat resistance.

[0002]

2. Description of the Related Art In electronic component devices, it is common for the encapsulating resin to have flame retardancy, and halogen compounds (compounds containing chlorine atoms or bromine atoms) and metal oxides are used as flame retardant prescriptions. A flame retardant effect is exhibited by using either alone or in combination. Specifically, a combination of brominated epoxy resin and antimony trioxide is generally used. However, a halogen compound added to exhibit the flame-retardant effect of the encapsulating resin composition, particularly a brominated epoxy resin, and a metal oxide added to help the flame-retardant effect,
In particular, antimony trioxide has the drawback of reducing the reliability of the electronic component device. Not only that, but recently, adverse effects on the environment have been pointed out.

Therefore, there is a strong demand for the development of a sealing resin composition which is excellent in moldability and reliability and does not contain a halogen compound and a metal oxide. As an alternative material, a phosphorus-based flame retardant and a metal water are used. Examinations such as Japanese products are being widely promoted. However, most of the phosphorus-based flame retardants are coating-type phosphorus or phosphoric acid ester-based ones, and even if the flame-retardant effect is obtained, the phosphoric acid generated by hydrolysis does not improve the moisture resistance reliability of the electronic component sealing device. As a result, it becomes difficult to secure sufficient reliability. Moreover, not only sufficient moldability of the metal hydrate cannot be ensured, but also the deterioration of the moisture absorption characteristics caused by the deterioration of the reliability of the electronic component sealing device has a drawback.

Therefore, there has been a strong demand for the development of a sealing resin composition which does not contain a halogen compound and antimony trioxide and which is excellent in moldability, moisture resistance and reliability.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned drawbacks and meet the above-mentioned demands, and does not contain a halogen compound (a compound containing a chlorine atom or a bromine atom) and antimony trioxide. An object of the present invention is to provide a resin composition for encapsulation and an electronic component encapsulation device which impart sufficient flame retardancy and are excellent in moldability, continuous productivity and reliability of the encapsulation resin.

[0006]

Means for Solving the Problems As a result of intensive studies aimed at achieving the above-mentioned object, the present inventors have found that by adding a sulfur-containing phenol resin to a resin composition, and if necessary, The inventors have found that the addition of a phosphorus-based flame retardant improves the flame retardancy, moldability, continuous productivity, and reliability, and achieves the above object, and completed the present invention.

That is, the present invention relates to (A) epoxy resin,
(B) Sulfur content is 3 to 15% by weight, and the sulfur-containing phenol resin in which the contained sulfur component is chemically bonded to all or part of the phenol resin and (C) the inorganic filler are essential components. The sulfur-containing phenol resin of (B) is contained in a proportion of 1 to 30% by weight with respect to the entire resin composition, and the sulfur content with respect to the entire resin composition is 0.0.
The content of the inorganic filler (C) is 3 to 4.2% by weight, and the content of the inorganic filler (C) is 60 to 95% by weight with respect to the total amount of the resin composition. A characteristic sealing resin composition, and
An electronic component encapsulation device is characterized in that an electronic component is encapsulated with a cured product of this encapsulating resin composition.

The present invention will be described in detail below.

The epoxy resin (A) used in the present invention is not particularly limited in molecular structure and molecular weight as long as it is a compound having at least two epoxy groups in its molecule, and it is generally used as a sealing material. Can be widely included. For example, phenol novolac type,
Examples thereof include aromatic compounds such as biphenyl type and bisphenol A type, aliphatic compounds such as cyclohexane derivative, and epoxy resins represented by the following general formulas.

[0010]

[Chemical 1] (However, in the formula, R ¹ and R ² are a hydrogen atom or an alkyl group,
n represents an integer of 1 or more, respectively)

[Chemical 2] (However, in the formula, R represents a hydrogen atom or a methyl group.) These epoxy resins can be used alone or in combination of two or more kinds.

The (B) sulfur content used in the present invention is 3 to 1.
In the sulfur-containing phenolic resin of 5% by weight, the contained sulfur may be present in any of the phenolic resin structures. However, the compound of the preferred embodiment of the present invention is represented by the following general formula.

[0012]

[Chemical 3] (However, in the formula, n represents an integer of 1 or more.) Further, the sulfur content of 3 to 15% by weight is used as a non-sulfur-containing phenol resin which is used in combination and mixed, as a novolac type,
Phenolic resins such as a polyfunctional skeleton, an aralkyl type, and a dicyclopentadiene type may be mentioned, which may be used alone or
A mixture of more than one type can be used. The mixing ratio of the sulfur-containing phenol resin (B) having a sulfur content of 3 to 15% by weight is the same as the epoxy group (a) of the epoxy resin (A) and the phenolic hydroxyl group (b) of the sulfur-containing phenol resin (B) described above. The value of the equivalent ratio (a) / (b) of is preferably in the range of 0.1 to 10. If the equivalent ratio is less than 0.1 or more than 10, the moisture resistance, heat resistance, molding workability, and electrical properties of the cured product deteriorate, which is not preferable in any case. Therefore, it is preferable to limit it to the above range.

Examples of the inorganic filler (C) used in the present invention include silica powder, alumina powder, silicon nitride powder, aluminum nitride powder, titanium oxide, glass fiber, whiskers, etc., which may be used alone or in combination of two or more. It can be mixed and used. (C) The blending ratio of the inorganic filler is
It is desirable to contain the resin composition in an amount of 60 to 95% by weight based on the whole resin composition. If the proportion is less than 60% by weight, the heat resistance and reliability will be poor, and if it exceeds 95% by weight, the bulkiness will be large and the moldability will be poor, making it unsuitable for practical use.

The blending ratio of the inorganic filler (C) is 87 to 95% by weight based on the whole resin composition, and the blending ratio of the sulfur-containing phenol resin of (B) is 1 to the whole resin composition. It is particularly preferably 7% by weight. Also,
The blending ratio of the inorganic filler (C) is 60 to 87% by weight with respect to the entire resin composition, and the blending ratio of the sulfur-containing phenol resin of (B) is 7 to 7 with respect to the entire resin composition.
When it is 30% by weight, it is preferable to include (D) an organic phosphorus flame retardant.

As the organic phosphorus flame retardant (D) which is optionally used, those containing an aromatic ring are desirable, and examples thereof include phenoxycyclophosphazene and condensed aromatic phosphate ester. The mixing ratio of the organic phosphorus flame retardant is
It is desirable to contain the resin composition in an amount of 0.5 to 10% by weight based on the whole resin composition. If the proportion is less than 0.5% by weight, it is difficult to obtain the flame retardant effect, and if it exceeds 10% by weight, phosphoric acid generated by hydrolysis is generated even if the flame retardant effect is obtained. This causes a decrease in moisture resistance reliability, and sufficient reliability cannot be secured.

The encapsulating resin composition of the present invention contains the above-mentioned (A) epoxy resin, (B) sulfur-containing phenol resin and (C) inorganic filler as essential components, but does not meet the object of the present invention. To the extent that it does not occur, and if necessary, for example, release agents such as natural waxes, synthetic waxes and esters, stress-reducing components such as elastomers, coloring agents such as carbon black, inorganic fillers such as silane coupling agents. Agents, various curing accelerators that accelerate the curing reaction of epoxy resin and phenol resin, inorganic flame retardants such as magnesium hydroxide, zinc borate, aluminum hydroxide, molybdenum oxide, etc. are appropriately added and blended. be able to.

As a general method for preparing the encapsulating resin composition of the present invention as a molding material, the above-mentioned epoxy resin, sulfur-containing phenol resin having a sulfur content of 3 to 15% by weight, inorganic filler, After mixing the other components and mixing them sufficiently evenly with a mixer, etc., they are further melt-mixed with a hot roll or mixed with a kneader, then cooled and solidified, and crushed to an appropriate size to form a molding material. can do. When the molding material thus obtained is applied to sealing, coating, insulation, etc. of electronic parts or electric parts such as semiconductor devices, excellent properties and reliability can be imparted.

The electronic component sealing device of the present invention can be easily manufactured by sealing an electronic component using the sealing resin obtained as described above. The most common sealing method is a low-pressure transfer molding method, but sealing by injection molding, compression molding, casting or the like is also possible. The resin composition for encapsulation is heated and cured during encapsulation, and finally an electronic component encapsulation device encapsulating with the cured product of this composition is obtained. Curing by heating
It is desirable to heat it to 150 ° C. or higher to cure it. The electronic component to be sealed is not particularly limited to, for example, an integrated circuit, a large scale integrated circuit, a transistor, a thyristor and a diode.

[0019]

In the encapsulating resin composition and the electronic component encapsulating apparatus of the present invention, the intended characteristics can be obtained by using a predetermined amount of the sulfur-containing phenol resin as the resin component. That is, the sulfur-containing phenol resin having a sulfur content of 3 to 15% by weight or more imparts excellent flame retardancy to the resin composition while maintaining sufficient moldability, and an organophosphorus-based resin added as necessary. The amount of flame retardant added can be reduced. The stability of the compound can improve reliability in the electronic component sealing device.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples. In the following examples and comparative examples, “%” means “% by weight”.

Example 1 ESCN-195XL, a cresol novolac type epoxy resin (trade name, manufactured by Sumitomo Chemical Co., Ltd.)
Epoxy equivalent of 200) 7%, sulfur-containing phenolic resin YLH (manufactured by Japan Epoxy Co. Ltd., trade name, phenol equivalent 109) 4%, 88% silica powder with an average particle size of 20 μm, carnauba wax 0. 5
% And imidazole C11Z (manufactured by Shikoku Kasei Co., Ltd.) 0.5% and mixed at room temperature, and further 90 to 95
The mixture was kneaded at 0 ° C. and cooled and pulverized to produce a molding material.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. This molded product was tested for flammability and high-temperature storage property. The results are shown in Table 1.

Example 2 Biphenyl type epoxy resin YX4
000 (manufactured by Japan Epoxy Co., Ltd., trade name, epoxy equivalent 195) 5%, YLH (manufactured by Japan Epoxy Co., Ltd., trade name, as a sulfur-containing phenol resin shown in the chemical formula 3).
Phenol equivalent 109) 2.5%, 92% silica powder having an average particle size of 20 μm, 0.5% carnauba wax and 0.5% imidazole C11Z (manufactured by Shikoku Kasei Co., Ltd.) and mixed at room temperature, Further, the mixture was kneaded at 90 to 95 ° C. and cooled and ground to produce a molding material.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. This molded product was tested for flammability and high-temperature storage property. The results are shown in Table 1.

Example 3 ESCN-195XL, a cresol novolac type epoxy resin (manufactured by Sumitomo Chemical Co., Ltd., trade name,
Epoxy equivalent 200) 10%, YLH (trade name of Japan Epoxy Co., Ltd., phenol equivalent 109) as the sulfur-containing phenol resin shown in Chemical Formula 3 and novolac type phenol resin BRG-556 (trade name of Showa High Polymer Co., Ltd., phenol) Equivalent 105) premixed in a weight ratio of 4/6, 5% of the mixture, phenoxycyclophosphazene S
P-134 (Otsuka Chemical Co., Ltd., trade name) 0.5%, silica powder 84% with an average particle size of 20 μm, carnauba wax 0.
5% and 0.5% of imidazole C11Z (manufactured by Shikoku Kasei Co., Ltd.) are mixed and mixed at room temperature, and further 90-95.
The mixture was kneaded at 0 ° C. and cooled and pulverized to produce a molding material.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. This molded product was tested for flammability and high-temperature storage property. The results are shown in Table 1.

Comparative Example 1 ESCN-195XL, a cresol novolac type epoxy resin (trade name, manufactured by Sumitomo Chemical Co., Ltd.)
Epoxy equivalent 200) 7%, novolac type phenol resin BRG-556 (manufactured by Showa Polymer Co., Ltd., trade name, phenol equivalent 105) 4%, 88% silica powder having an average particle diameter of 20 μm, carnauba wax 0.5% Further, 0.5% of imidazole C11Z (trade name, manufactured by Shikoku Kasei Co., Ltd.) was mixed and mixed at room temperature, further kneaded at 90 to 95 ° C., and cooled and ground to produce a molding material.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. This molded product was tested for flammability and high-temperature storage property. The results are shown in Table 1.

Comparative Example 2 ESCN-195XL, a cresol novolac type epoxy resin (trade name, manufactured by Sumitomo Chemical Co., Ltd.)
Epoxy equivalent 200) 7%, novolac type phenol resin BRG-556 (manufactured by Showa Polymer Co., Ltd., trade name, phenol equivalent 105) 5%, brominated epoxy resin AER8
028 (Nippon Kayaku Co., Ltd., trade name) 1%, average particle size 20μ
m silica powder 85%, antimony trioxide 1%, carnauba wax 0.5% and imidazole C11Z (manufactured by Shikoku Kasei Co., Ltd.) 0.5% are mixed and mixed at room temperature, and further at 90 to 95 ° C. The mixture was kneaded and cooled and ground to produce a molding material.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. This molded product was tested for flammability and high-temperature storage property. The results are shown in Table 1.

Comparative Example 3 Cresol novolac type epoxy resin ESCN-195XL (Sumitomo Chemical Co., Ltd., trade name, epoxy equivalent 200) was added to 7.5%, and novolac type phenol resin BRG-556 (Showa Polymer Co., Ltd., trade name). , Phenol equivalent 105) 4%, silica powder 87% with an average particle size of 20 μm, carnauba wax 0.5%, imidazole C11Z (manufactured by Shikoku Kasei Co., Ltd.) 0.5% and phenoxycyclophosphazene SP-134 (Otsuka). Chemical company, trade name) 0.5% mixed and mixed at room temperature, then 9
The mixture was kneaded at 0 to 95 ° C., cooled and pulverized to produce a molding material.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. This molded product was tested for flammability and high-temperature storage property. The results are shown in Table 1.

[0033]

[Table 1] * 1: 120 × 12 × 0.
A molded product of 8 mm was prepared, and after post-curing at 175 ° C. for 8 hours, a flammability test was performed based on the UL-94V flame resistance test standard.

* 2: A silicon chip (test element) having two aluminum wirings formed by using a molding material is used as a normal 42
After bonding to an alloy frame and transfer molding at 170 ° C. for 4 minutes, post-curing was performed at 170 ° C. for 4 hours. The 20 molded products thus obtained were preliminarily prepared at 30 ° C. and 60
%, 100 hours of moisture absorption, and then immersed in a solder bath at 250 ° C. for 10 seconds. After that, a high temperature storage test at 200 ° C. was performed, and an open / short aluminum wiring was evaluated as a defective molded product.

[0035]

As is apparent from the above description and Table 1, the encapsulating resin composition and the electronic component encapsulating apparatus of the present invention have excellent combustion resistance and guarantee high temperature storage reliability. did it.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/31 (72) Inventor Haruomi Hosokawa 5-14-25 Ryoke, Kawaguchi City, Saitama Toshiba Chemical Co., Ltd. Kawaguchi Factory F-term (reference) 4J002 CD041 CD051 CD061 CN012 DE136 DE146 DF016 DJ006 DJ016 DL006 EW047 EW157 FA046 FA066 FD016 FD090 FD137 FD150 FD160 GQ00 4J036 AB01 AB07 AD07 AD01 AD07 AD21 AD07 AD21 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD08 AD07 AD08 AD08 AD08 AD07 AD08 AD08 AD08 AD08 AD07 AD07 AD08 AD07 AD08 AD07 AD08 AD07 AD08 AD07 AD07 AD07 AD08 AD07 AD07 AD08 AD11

Claims (5)

[Claims] 1. A sulfur-containing phenol resin in which (A) an epoxy resin and (B) a sulfur content is 3 to 15% by weight, and a sulfur component contained is chemically incorporated into all or a part of the phenol resin. And (C) an inorganic filler as an essential component, the sulfur-containing phenol resin of (B) is contained in an amount of 1 to 30% by weight based on the entire resin composition, and the sulfur content of the entire resin composition is 0. 03-4.2% by weight
And a halogen-free encapsulating resin containing the inorganic filler (C) in a proportion of 60 to 95% by weight with respect to the entire resin composition. Composition. 2. The inorganic filler (C) in a proportion of 87 to 95% by weight based on the entire resin composition, and the sulfur-containing phenol resin (B) in a proportion of 1 to 7 based on the entire resin composition. The encapsulating resin composition according to claim 1, which is contained in a weight percentage. 3. The inorganic filler (C) in a proportion of 60 to 87% by weight based on the entire resin composition, and the sulfur-containing phenol resin (B) in a proportion of 7 to 30 based on the entire resin composition.
The resin composition for encapsulation according to claim 1, wherein the organic phosphorus flame retardant (D) is contained in an amount of 0.5 to 10% by weight when contained in an amount of 0.5% by weight. 4. The encapsulating resin composition according to claim 3, wherein the organic phosphorus flame retardant (D) is a phosphazene compound. 5. An electronic component encapsulating device, which is obtained by encapsulating an electronic component with the cured product of the encapsulating resin composition according to any one of claims 1 to 4.