JP2003318655A - Piezoelectric device, and cellular phone unit and electronic equipment utilizing the piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device that can make thin an entire thickness for reducing the height and at the same time, will not impair the operating quality, in a piezoelectric device where a piezoelectric vibration reed and other electronic components are accommodated into one package. <P>SOLUTION: In the piezoelectric device 10, a piezoelectric vibration reed 12 and an electronic component 13, connected to the piezoelectric vibration reed, are accommodated in the package 20, so that blocking is made by a lid body. The package has a plurality of internal spaces S3 and S4 provided in parallel, the piezoelectric vibration reed and the electronic component are separately accommodated in the internal spaces, and a support section 27 for maintaining the height of the lid body is provided at a wall section 24 for partitioning off the plurality of internal spaces at intervals. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a piezoelectric device in which a piezoelectric vibrating reed and an electronic component connected to the piezoelectric vibrating reed are housed in a package, and a portable telephone device and an electronic apparatus using such a piezoelectric device. Regarding

[0002]

2. Description of the Related Art Piezoelectric vibration in a package of a compact information device such as an HDD (hard disk drive), a mobile computer, or an IC card, or a mobile communication device such as a mobile phone, a car phone, or a paging system. A piezoelectric device containing a piece is often used.

In such a piezoelectric device, when another electronic component is connected to the piezoelectric vibrating reed housed in the package to form an oscillation circuit or the like, for example, the space inside the package has a multistage structure. The piezoelectric vibrating reed and an electronic component connected to the piezoelectric vibrating reed are housed in each stage.

[0004]

However, in the piezoelectric device having such a structure, the size in the thickness direction of the package increases because the space inside the package has a multi-stage structure. For this reason, it becomes an obstacle in promoting miniaturization of the above-mentioned various devices in which the piezoelectric device is incorporated.

Therefore, by adopting the structure shown in FIG. 6, the height of the piezoelectric device can be reduced. In the figure, the piezoelectric device 1 includes, for example, an internal space S1 and an internal space S2 that are horizontally arranged inside a ceramic package 2 and are separated from each other. The piezoelectric vibrating reed 5 is accommodated in the internal space S1, and the electronic components 6, 6 such as integrated circuits are accommodated in the internal space S2, which are connected by an electrode pattern (not shown). A metallic lid 4 is joined to the upper end opening 3 of the package 2 so as to cover the internal spaces S1 and S2.

In such a piezoelectric device 1, the piezoelectric vibrating piece 5 and the internal spaces S1 and S2 for housing the electronic component 6 are
Since they are formed in the package 2 so as to be divided in the horizontal direction, the size h1 of the entire piezoelectric device 1 in the thickness direction can be reduced, and the height of the piezoelectric device can be reduced. There is.

However, in the package 2,
As shown in the drawing, since the thickness is made as thin as possible, the distance between the metallic lid 4 and the components housed in the package 2, for example, the electronic components 6 and 6 is extremely close. Become. In addition, since the piezoelectric device 1 mounted on the circuit board is also affected by the stress variation, the distance also varies. For this reason, the capacitance of the lid body 4 may adversely affect the electronic component 6, resulting in malfunction.

According to the present invention, in the piezoelectric device in which the piezoelectric vibrating reed and the other electronic component are housed in one package, the overall thickness can be reduced to reduce the height, and the operation quality is not deteriorated. An object of the present invention is to provide a piezoelectric device and a mobile phone device and electronic equipment using the piezoelectric device.

[0009]

The above-mentioned object is defined in claim 1.
According to another aspect of the invention, there is provided a piezoelectric device in which a piezoelectric vibrating piece and an electronic component connected to the piezoelectric vibrating piece are housed in a package and are closed by a lid, wherein the packages are arranged in parallel. It has a plurality of internal spaces provided, the piezoelectric vibrating piece and the electronic component are separately housed in these internal spaces, and the wall portion partitioning the plurality of internal spaces, the This is achieved by a piezoelectric device, which is provided with a support for holding the height of the lid.

According to the structure of claim 1, the internal space formed in the package is divided and arranged in parallel with the package. That is, by not overlapping a plurality of internal spaces in the height direction, the size in the thickness direction of the package is reduced and the height is reduced. Further, after accommodating the piezoelectric vibrating piece and the electronic component in each internal space of the package, the lid that closes the opening of the package has a predetermined capacitance,
If it is extremely close to the housing component, it will have an adverse electrical effect on the housing component. For this reason, a support portion is provided on the wall portion that partitions the plurality of internal spaces to hold the lid body so that the inner surface of the lid body is raised. As a result, the distance between the lid and the housing component is increased by the amount of the support provided, so that the influence of the capacity of the lid on the housing component can be eliminated. Here, the support may be separately provided on the upper end surface of the wall portion that partitions the plurality of internal spaces, or the height of the partition wall may be set higher than the height of the other upper end surface of the package. It may be provided integrally with the wall portion.

According to a second aspect of the present invention, in the structure of the first aspect, the supporting portion is constituted by a plurality of metal coating portions formed on the end portion of the partition wall. According to the configuration of claim 2, when the support portion is formed of a plurality of metal coating portions formed at the end portion of the partition wall, the metal coating portion used when the lid body is joined to the package is slightly formed. The supporting portion can be easily formed only by making various changes.

According to a third aspect of the present invention, in the configuration of the first or second aspect, the electronic component is an integrated circuit, and the internal space in which the integrated circuit is housed is a plurality of internal spaces. It is characterized in that it is formed to have a substantially circular or elliptical shape in a plan view. According to the configuration of claim 3, the internal space for accommodating the integrated circuit is formed into a substantially circular shape, an elliptical shape, an oval shape or the like in a plan view, and after the integrated circuit is flip-chip bonded to the internal space. When the resin is filled to support and fix the integrated circuit, the wraparound of the resin is made good inside the internal space, and the workability is improved. Further, the opening area can be reduced, and the contact area between the upper end surface of the package and the lid can be increased accordingly, so that the supporting strength is improved, and the lid flexes to be housed in the internal space. It is possible to prevent unnecessary access to the parts. Also,
Since the opening area can be reduced, the amount of resin used for filling can be the minimum required amount.

According to a fourth aspect of the present invention, in the structure according to any one of the first to third aspects, an electrode pattern is provided in the internal space in which the piezoelectric vibrating piece is housed, of the plurality of internal spaces. The electrode pattern is formed so as to avoid an area on the inner surface of the package facing the piezoelectric vibrating piece. According to the configuration of claim 4,
By not forming the electrode pattern in the region on the inner surface of the package that faces the piezoelectric vibrating piece, it is possible to prevent electrical capacitance fluctuation. Therefore, in this case, the area where the formation of the electrode pattern is avoided does not necessarily have to be the entire area of the inner surface of the package that faces the piezoelectric vibrating piece, and in particular, the area where the electrode pattern of the piezoelectric vibrating piece faces the excitation electrode is formed. By avoiding, it is possible to obtain a predetermined effect.

According to the invention of claim 5, the above object is to:
A piezoelectric device in which a piezoelectric vibrating piece and an electronic component connected to the piezoelectric vibrating piece are housed in a package and are closed by a lid body, wherein the package includes a plurality of internal parts arranged in parallel. Having a space, the piezoelectric vibrating piece and the electronic component are separately housed in these internal spaces, and a region corresponding to at least a part of the internal space of the lid that closes the package, This is achieved by the piezoelectric device being deformed so as to expand the volume of the internal space. According to the structure of claim 5, the internal space formed in the package is divided and arranged in parallel with the package. That is, by not overlapping a plurality of internal spaces in the height direction, the size in the thickness direction of the package is reduced and the height is reduced. After accommodating the piezoelectric vibrating piece or the electronic component in each internal space of the package, when the lid that closes the opening of the package has a predetermined electrostatic capacity and is extremely close to the accommodating component, the accommodating component may be damaged. It has an adverse electrical effect. Therefore, if the shape of the lid body is deformed such that the surface facing the housed component is offset to the outside in a region corresponding to at least a part of the internal spaces among the plurality of internal spaces, the lid Since the distance between the body and the housing component is increased, the influence of the capacity of the lid body on the housing component can be eliminated.

According to a sixth aspect of the present invention, in the configuration of the fifth aspect, the electronic component is an integrated circuit, and an internal space for accommodating the integrated circuit among the plurality of internal spaces is substantially planar view. It is characterized in that it is formed in a circular or elliptical shape. According to the configuration of claim 6, it is possible to exhibit the same operation as described in claim 3.

According to a seventh aspect of the present invention, in the structure of the fifth or sixth aspect, an electrode pattern is provided in the internal space in which the piezoelectric vibrating piece is housed, of the plurality of internal spaces. The electrode pattern is formed so as to avoid an area on the inner surface of the package facing the piezoelectric vibrating piece. According to the configuration of claim 7,
The same effect as described in claim 4 can be exerted.

The above object is according to the invention of claim 8
What is claimed is: 1. A mobile phone device using a piezoelectric device in which a piezoelectric vibrating reed and an electronic component connected to the piezoelectric vibrating reed are housed in a package and are closed by a lid, wherein the packages are arranged in parallel. It has a plurality of internal spaces provided, the piezoelectric vibrating piece and the electronic component are separately housed in these internal spaces, and the wall portion partitioning the plurality of internal spaces, the By the mobile phone device, which is configured to obtain a control clock signal by the piezoelectric device provided with the support portion for holding the height of the lid,
To be achieved.

According to the invention of claim 9, the above object is to:
An electronic device using a piezoelectric device in which a piezoelectric vibrating piece and an electronic component connected to the piezoelectric vibrating piece are housed in a package and closed by a lid, wherein the packages are provided in parallel. Has a plurality of internal spaces in which the piezoelectric vibrating reed and the electronic component are separately housed, and the wall portion separating the plurality of internal spaces is provided with the lid. This is achieved by an electronic device that obtains a clock signal for control by a piezoelectric device provided with a support portion for holding the body height.

[0019]

1 and 2 show a first embodiment of a piezoelectric device of the present invention. FIG. 1 is a schematic plan view showing a transparent cover of a piezoelectric device 10. 2 is a sectional end view taken along the line AA of FIG. In these drawings, the piezoelectric device 10 shows an example in which a piezoelectric oscillator is configured, and the piezoelectric device 10 contains a piezoelectric vibrating piece 12 in a package 20. Package 20 is
For example, it is formed by stacking a plurality of substrates formed by molding aluminum oxide ceramic green sheets and then firing them.

In the illustrated case, as shown in FIG. 2, the package 20 has a second laminated substrate 22 laminated on a first laminated substrate 21 and a third laminated substrate 23 laminated thereon. Is formed. Of these laminated substrates, the first laminated substrate 21 has no holes, but the second laminated substrate 22 and the third laminated substrate 23 have internal spaces S3 and S4 shown in FIG. The material is removed so as to form holes corresponding to.

As a result, in FIG.
0 is a wall portion 2 formed of a part of the laminated substrates 22 and 23.
Two internal spaces S3 and S4 divided by 4 are provided in parallel. That is, the internal spaces S3 and S4 provided in the package 20 are arranged in the horizontal direction in FIG. 2 without overlapping in the vertical direction.
As a result, the size h2 of the piezoelectric device 10 in the thickness direction is
Has been made as small as possible to achieve a low profile.
The laminated substrate 22 and the laminated substrate 23 may be formed of a single substrate having a combined thickness.

A metal wiring material such as tungsten (W) or molybdenum (Mo) is used for the laminated substrate 21 in the internal space S3 of the package 20, which is a base exposed at the internal space S3 and forming the bottom. Electrode portions 31 and 31 which are screen-printed and plated with nickel (Ni) and gold (Au) are provided thereon. This electrode part 31,
Reference numeral 31 is connected to the outside and supplies a drive voltage. A conductive adhesive 3 is formed on each of the electrode portions 31, 31.
2, 32 are applied, one end which is the base of the piezoelectric vibrating reed 12 is placed on the conductive adhesives 32, 32, and the conductive adhesives 32, 32 are cured and joined. Further, the electrode portion 33 can be formed on the surface of the laminated substrate 21 corresponding to the tip side of the piezoelectric vibrating piece 12. And
By applying the adhesive 34 on the electrode portion 33, the piezoelectric vibrating reed 12
You may fix to the lower surface of the front-end | tip part of this.

The piezoelectric vibrating reed 12 is made of, for example, quartz, and piezoelectric materials such as lithium tantalate and lithium niobate can be used in addition to quartz. In the case of the present embodiment, the piezoelectric vibrating reed 12 is formed into a small size, and in order to obtain the required performance, for example, is an AT-cut crystal reed formed by forming a crystal material into a rectangular thin plate shape. Exciting electrodes 12a having the same shape are formed on the front surface and the back surface of the piezoelectric vibrating piece 12, respectively. The excitation electrode 12a is integrally connected to a lead-out electrode (not shown) formed at a location corresponding to the package-side electrode portions 31 and 31 described above, and a drive voltage is applied from the package-side electrode portions 31 and 31. Thus, the piezoelectric vibrating reed 12 is vibrated at a predetermined vibration frequency.

In the present embodiment, the other internal space S4 of the package 20, as shown in FIG.
The shape is almost circular, oval, or oval. Electronic components connected to the piezoelectric vibrating reed 12 are housed in the internal space S4. In this case, the piezoelectric device 10
Are configured to form a piezoelectric oscillator, and accommodate an integrated circuit 13 connected to the piezoelectric vibrating reed 12 via an electrode pattern described later. As shown in FIG. 2, the integrated circuit 13 is mounted on the electrode pattern 35 formed on the first laminated substrate 21 by flip-chip bonding using bumps formed in advance on the integrated circuit 13, for example. It After that, the internal space S4 is filled with the resin 13a and supported and fixed.

Therefore, if the internal space S4 is formed into a substantially circular shape, an elliptical shape, or an oval shape in a plan view, the resin 13a can be favorably wrapped around the internal space S4 to improve workability. . Moreover, since the area of the opening 20b of the internal space S4 can be reduced, the amount of resin used for filling can be set to the minimum required amount.

The lid 11 is joined to the open upper end of the package 20 via the brazing material 14,
It is sealed. The lid 11 is, for example, the package 20.
It is preferable to select a piezoelectric material having a linear expansion coefficient close to that of the piezoelectric material constituting the above. For example, the metal material can be formed of Kovar or 42 alloy. Further, the brazing material 14 is interposed between the upper end surface 20 a of the package 20 and the lid body 11, and the brazing material 14 is melted,
The package 20 and the lid 11 are joined together. Therefore, it is suitable that both the lid 11 and the metal coating portion (described later) provided on the upper end surface 20a of the package 20 have good bondability. That is, the brazing material 14 is interposed between the metal coating portion 25 and the lid body 11, which will be described later, and joins the lid body 11 and the package 20. As the brazing material 14, for example, silver brazing, Au—Sn, solder, Au brazing or the like can be used.

As shown in the enlarged view of the arrow in FIG. 2, a metal coating portion 27 as a support portion is formed on the upper end surface 24a of the wall portion 24 which is a part of the upper end surface of the package 20. ing. In consideration of joining with the brazing material 14, the metal coating portion is formed by forming a thin metal layer by the same metallization printing as that of the above-mentioned electrode portions 31, 31, or by a method such as plating or metal vapor deposition. Then, for example, the first layer 25 is provided on the entire joint portion of the upper end surface 20a of the package 20 including the upper end surface 24a of the wall portion 24 with the lid 11.
Only the upper end surface 24a of the wall portion 24 is formed in a plurality of layers more than other portions, and the second layer 26 is provided on the first layer 25.

That is, the upper end surface 20a of the package 20.
The metal coating layer is formed by forming at least more metal coating layers than the entire joint with the lid body 11, and the portion of the lid body 11 located above the second layer 26 is pushed upward in the drawing, whereby the metal coating The portion 27 is a support portion for keeping the height of the lid 11 higher than other areas. For example,
The first layer 25 and the second layer 26 can be metallized layers obtained by screen-printing a metal wiring material such as tungsten or molybdenum. Also, the first layer 25 may be nickel plated and the second layer may be gold plated. Also,
The entire upper surface 20a of the package 20 joined to the lid 11 is provided with, for example, tungsten plating and nickel plating as the first layer 25, and the upper surface 2 of the wall portion 24 is formed.
Alternatively, gold plating may be provided as the second layer 26 only on the portion 4a. That is, the support portion 27 provided on the upper end surface 24a of the wall portion 24 is not limited to two layers, and a covering portion made up of more metal layers may be provided.

As a result, the distance between the lid body 11 and the housing components housed in the internal space S3 and / or S4 of the package 20 is increased by the amount of the support body 27 provided, so that the static electricity existing on the lid body 11 side is reduced. By eliminating the adverse effect of the capacitance on the housing components, for example, the piezoelectric vibrating reed 12 and the integrated circuit 13,
This prevents malfunctions and the like. Here, the support 2
7 may be separately provided on the upper end surface 24a of the wall portion 24 as described above, or the height of the partition wall 24 may be made higher than the height of the other upper end surface 20a of the package 20. Then, even if it is provided integrally with the wall portion 24, it is possible to obtain the same effects as the above.

FIG. 3 is a plan view showing the upper surface of the laminated substrate 21 which is the lowermost substrate constituting the package 20.
As shown in the figure, an electrode pattern 35 is formed on the upper surface of the laminated substrate 21 in a region corresponding to the internal space S4. The electrode pattern 35 has a shape suitable for the positions of the bumps provided on the integrated circuit 13. Further, a part of the electrode pattern 35 has an internal space S.
It extends to the 3 side and is connected to the piezoelectric vibrating reed 12 side.

Electrode patterns 36, 36, 36 connected to the above-mentioned electrode portions 32, 32 and electrode portion 33 are provided in a region corresponding to the internal space S3 on the upper surface of the laminated substrate 21. In particular, this electrode pattern 36, 36, 36
Are routed along the peripheral edge of the internal space S3, so that they are formed so as to avoid the region facing the piezoelectric vibrating piece 12 shown in FIG. 1, particularly the region facing the excitation electrode 12a. Therefore, the electrode patterns 36, 36, 36 on the laminated substrate 21 side, and particularly the excitation electrode 1 of the piezoelectric vibrating reed 12 are formed.
Since 2a and the inner bottom surface of the package 20 are close to each other when the package 20 has a low profile, the capacitances of the 2a and It is possible to effectively prevent the occurrence of electrical capacity fluctuation.

Therefore, in this case, in the laminated substrate 21, the area where the formation of the electrode patterns 36, 36, 36 is avoided does not necessarily have to be the entire area facing the piezoelectric vibrating piece 12, and in particular, the piezoelectric vibrating piece 12 is not necessary. Excitation electrode 12
The above effect can be obtained by avoiding the formation of the electrode patterns 36, 36, 36 in the region facing a.

FIG. 4 is a central longitudinal cut end view showing a second embodiment of the present invention. Piezoelectric device 40 of FIG.
In the above description, since the parts denoted by the same reference numerals as those of the piezoelectric device 10 according to the first embodiment have the same configuration, duplicate description will be omitted and different points will be mainly described.

The piezoelectric device 40 of the second embodiment
Does not form a support portion on the wall portion 24 like the piezoelectric device 10, but changes the structure of the lid body 41 to obtain the same effect. That is, the piezoelectric device 40 accommodates the piezoelectric vibrating reed 12 and the electronic circuit 13 connected to the piezoelectric vibrating reed 12 in the package 20, for example, the integrated circuit 13, and is closed by the lid 41.

This package 20 has two internal spaces S3 and S4 arranged in parallel, as in the first embodiment.
The piezoelectric vibrating reed 12 is housed in the internal space S3, and the integrated circuit 13 is housed in the internal space S4. In this case, the lid 41 has a region 42 corresponding to the internal space S3.
Then, the region 43 corresponding to the internal space S4 is deformed. The deforming portions 42 and 43 are both deformed to be convex outward so as to expand the volume of the corresponding internal spaces S3, S4.

As a result, also in this embodiment, the internal spaces S3 and S4 formed in the package 20 are divided and arranged in parallel with the package 20. Therefore, by not overlapping a plurality of internal spaces in the height direction, the lid body 41 is deformed to the outside, which is larger than that in the first embodiment, but the size in the thickness direction h3 of the package is reduced. And can achieve a low profile. In FIG. 4, the lid 41 is deformed at two places, that is, a region 42 corresponding to the internal space S3 and a region 43 corresponding to the internal space S4, but either one may be deformed.

Further, as shown in FIG. 4, the shape of the lid 41 is such that the parts 42, 4 facing the housed parts are located.
Since 3 is deformed so as to be offset to the outside, the distance between the lid 41 and the piezoelectric vibrating reed 12 and the integrated circuit 13 which are the housing components is increased, and the electrostatic capacitance on the lid 41 side is stored in the housing component. It is possible to eliminate the adverse effect on.

FIG. 5 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the piezoelectric device according to the above-described embodiment of the present invention. In the figure, a microphone 308 for receiving the voice of the sender and a speaker 309 for outputting the received content as a voice are provided, and further, an integrated circuit or the like as a control unit connected to a modulation and demodulation unit of a transmission / reception signal. Controller 30
1 is provided. The controller 301 includes an information input / output unit 302 including an LCD as an image display unit, operation keys for inputting information, and the like, in addition to modulation and demodulation of transmission / reception signals,
The information storage means 303 including a RAM and a ROM is controlled. Therefore, the piezoelectric device 10 or the piezoelectric device 40 is attached to the controller 301, and the output frequency of the piezoelectric device 10 or the piezoelectric device 40 is adjusted by a predetermined frequency dividing circuit (not shown) or the like built in the controller 301. It is supposed to be used as.

The controller 301 is further connected to a temperature-compensated crystal oscillator (TCXO) 305, and the temperature-compensated crystal oscillator 305 is connected to a transmitter 307 and a receiver 306. As a result, even if the basic clock from the controller 301 changes when the environmental temperature changes,
The transmitter 3 is modified by the temperature-compensated crystal oscillator 305.
07 and the receiving unit 306.

As described above, by using the piezoelectric device 10 or the piezoelectric device 40 according to the above-described embodiment in an electronic apparatus such as the mobile phone device 300 having the control unit, the operation quality is kept low and the low quality is maintained. It is possible to reduce the mounting space by reducing the height.

The present invention is not limited to the above embodiments.
The configurations of the respective embodiments can be appropriately combined or omitted, and can be combined with other configurations not shown. The piezoelectric device of the present invention can be applied regardless of its name, such as a piezoelectric oscillator, a piezoelectric vibrator, and a filter, as long as it includes a piezoelectric vibrating piece and an electronic component connected to the piezoelectric vibrating piece in the package. Further, in each of the above-described embodiments, the package 20 has two internal spaces S.
Although the example in which 3 and S4 are formed has been described, three or more internal spaces may be formed in parallel.

[0042]

As described above, according to the present invention, in a piezoelectric device in which a piezoelectric vibrating reed and another electronic component are housed in one package, the overall thickness can be reduced to achieve a low profile. It is possible to provide a piezoelectric device that does not impair the operation quality, and a mobile phone device and an electronic apparatus that use the piezoelectric device.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a first embodiment of a piezoelectric device of the present invention, showing a state of the inside with a transparent cover.

2 is a sectional view taken along line AA of FIG.

3 is a schematic plan view of a lowermost laminated substrate of the package of the piezoelectric device shown in FIG.

FIG. 4 is a cut end view showing a second embodiment of the piezoelectric device of the present invention.

FIG. 5 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the piezoelectric device according to each embodiment of the present invention.

FIG. 6 is a schematic cut end view showing an example of a conventional piezoelectric device.

[Explanation of symbols]

10, 40 ... Piezoelectric device, 11 ... Lid, 12
... Piezoelectric vibrating piece, 13 ... Integrated circuit (electronic component),
24 ... Wall part, 27 ... Support part, 36 ... Electrode pattern.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shinji Haba             Seiko, 3-3-3 Yamato, Suwa City, Nagano Prefecture             -In Epson Corporation F-term (reference) 5J079 AA04 BA43 BA44 HA06 HA09                       HA28 HA29 HA30                 5J108 BB01 BB02 DD02 EE03 EE07                       EE18 GG03 GG09 GG15 GG16                       JJ04

Claims (9)

[Claims] 1. A piezoelectric device in which a piezoelectric vibrating reed and an electronic component connected to the piezoelectric vibrating reed are housed in a package and are closed by a lid, wherein the packages are provided in parallel. Has a plurality of internal spaces, the piezoelectric vibrating reed and the electronic component are separately housed in these internal spaces, and the wall portion separating the plurality of internal spaces is provided with the lid. A piezoelectric device, comprising a support portion for holding the body height. 2. The piezoelectric device according to claim 1, wherein the support portion is formed of a plurality of metal coating portions formed on an end portion of the partition wall. 3. The electronic component is an integrated circuit, and an internal space for accommodating the integrated circuit among the plurality of internal spaces is formed to be substantially circular or elliptical in a plan view. The piezoelectric device according to claim 1, wherein the piezoelectric device is a piezoelectric device. 4. An electrode pattern is provided in an internal space in which the piezoelectric vibrating piece is housed, among the plurality of internal spaces, and the electrode pattern is provided on an inner surface of the package facing the piezoelectric vibrating piece. The piezoelectric device according to claim 1, wherein the piezoelectric device is formed so as to avoid the region. 5. A piezoelectric device in which a piezoelectric vibrating reed and an electronic component connected to the piezoelectric vibrating reed are housed in a package and closed by a lid, wherein the packages are provided in parallel. And a plurality of internal spaces in which the piezoelectric vibrating piece and the electronic component are separately housed, and at least a part of the internal space of the lid that closes the package. A piezoelectric device, wherein the corresponding region is deformed so as to expand the volume of the internal space. 6. The electronic component is an integrated circuit, and of the plurality of internal spaces, the internal space in which the integrated circuit is housed is formed to be substantially circular or elliptical in plan view. The piezoelectric device according to claim 5, wherein: 7. An electrode pattern is provided in an internal space for accommodating the piezoelectric vibrating piece among the plurality of internal spaces, and the electrode pattern is provided on an inner surface of the package facing the piezoelectric vibrating piece. The piezoelectric device according to claim 5, wherein the piezoelectric device is formed so as to avoid the region. 8. A mobile phone device using a piezoelectric device in which a piezoelectric vibrating reed and an electronic component connected to the piezoelectric vibrating reed are housed in a package and closed by a lid. Has a plurality of internal spaces arranged in parallel, the piezoelectric vibrating piece and the electronic component are separately housed in these internal spaces, and the walls partitioning the plurality of internal spaces. The portable telephone device is characterized in that a clock signal for control is obtained by a piezoelectric device provided with a support portion for holding the height of the lid in the portion. 9. An electronic apparatus using a piezoelectric device in which a piezoelectric vibrating reed and an electronic component connected to the piezoelectric vibrating reed are housed in a package and closed by a lid, the package comprising: A wall portion that has a plurality of internal spaces that are provided in parallel, in which the piezoelectric vibrating reed and the electronic component are separately housed, and that partitions the plurality of internal spaces. The electronic device is characterized in that a clock signal for control is obtained by a piezoelectric device provided with a support portion for holding the height of the lid.