JP2003318247A - Wafer transfer equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer transfer equipment by which a wafer is easily transferred between a wafer case that has superior portability and a size in which a plurality of the cases can be carried at a time and a normally used transportation wafer case, and a semiconductor wafer is not damaged at transferring without occupying a large space during storage. <P>SOLUTION: This equipment is for transferring a semiconductor wafer 12 housed in one wafer vessel to the other wafer vessel, and provided with a guide 13 wherein a guide groove 31 for the semiconductor wafer 12 to be transferred and an inter-groove end surface 32 are alternately provided with pitches of 1/4 inches, a first mounting part 14 on one side of the guide part 13 on which a first wafer vessel 16 is positioned, and a second mounting part 15 on the other side of the guide part 13 on which a second wafer vessel 17 is positioned. The semiconductor wafer 12 housed in one wafer vessel is moved in a direction parallel to a principal surface through the guide groove of the guide 13, to transfer to the other wafer vessel. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer device used for transferring, for example, a disk-shaped semiconductor wafer between wafer containers having different storage pitches.

[0002]

2. Description of the Related Art As is well known, a semiconductor wafer is sliced from a silicon single crystal ingot to a predetermined thickness in a wafer manufacturing factory, subjected to a predetermined process such as beveling and lapping, and then a predetermined wafer case for transportation. The chips are arranged and stored so that their principal surfaces face each other at a pitch, and are transported to a semiconductor factory or the like. Then, the semiconductor wafers stored in the wafer case for transportation are stored and further transferred, and the semiconductor wafers stored in the wafer case for transportation are transferred to the semiconductor device process in the factory.

A conventionally used wafer case for transportation has a structure in which a schematic side view is shown in FIG. 24 and a top view of a carrier is shown in FIG.
A wafer case 1 for transporting a semiconductor wafer of 25 mm is generally used for transporting 25 semiconductor wafers 1/4 inch (6.35 m).
A standard type is used in which the main surfaces are arranged so as to face each other at a predetermined storage pitch of m).

The structure thereof is as follows. That is, the wafer case 1 for transportation has a box shape in which the upper opening of the case body 3 is covered with the lid 4.
Its cross-sectional shape is square, width 270 mm, depth 270
mm and height 250 mm. In addition, a carrier 5 is detachably provided inside the carrier 5, and support grooves 6 are engraved in the carrier 5 at a pitch of 6.35 mm. It can be stored facing each other.

However, since the wafer case 1 for transportation has a large case size of 270 mm width × 270 mm depth × 250 mm height, the wafer case 1 for transportation occupies a large space during storage. However, a lot of storage space is required to store the semiconductor wafer 2 in the wafer case 1 for transportation. Since it is large and heavy when carried by a person, the pitch for accommodating the semiconductor wafers 2 is reduced to reduce the size of the case to enhance the accommodating efficiency and increase the number of items that can be carried at one time. It is considered that

The semiconductor wafer 2 is transferred from the standard wafer case 1 for transportation, which has a large storage pitch, to the wafer case in which the storage pitch of the semiconductor wafer 2 is reduced, and vice versa. In order to transfer the semiconductor wafers 2 from the wafer case with a small storage pitch to the case 1, the semiconductor wafers 2 should be transferred one by one with vacuum tweezers or metal tweezers, taking care not to scratch or drop them. It had to be posted, and it was troublesome and time-consuming.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above situation, and its object is not to occupy a large space during storage and to carry a plurality of carrying devices at a time. Easy transfer of wafers between possible-sized wafer cases with good portability and standard-used wafer cases for transportation, and semiconductor wafers may be flawed during transfer. An object of the present invention is to provide a wafer transfer device that does nothing.

[0008]

A wafer transfer device according to the present invention comprises a first wafer container capable of accommodating wafers at a first pitch with their principal surfaces facing each other;
The wafers to be stored in one wafer container are transferred to the other wafer container between the second wafer container that can store the wafers with their main surfaces facing each other at a second pitch of m (m is an integer). A device for mounting, wherein the guide part and the stopper part of the wafer to be transferred are alternately and
Guide members provided at a pitch of 1 and a first wafer container that positions the first wafer container at a predetermined position on one side of the guide members.
And a second mounting portion for positioning the second wafer container at a predetermined position on the other side of the guide member, and a wafer accommodated in one of the wafer containers is inserted through the guide portion of the guide member. It is characterized in that the wafer is moved in a direction parallel to the main surface and transferred to the other wafer container. Further, the wafer is transferred from one wafer container to the other wafer container in m times. When mounted, the second wafer container is characterized in that the wafers are transferred and received every (m-1), and the wafers can be stored at a first pitch with their main surfaces facing each other. A first wafer container,
A wafer to be stored in one wafer container and a second wafer container capable of storing wafers with their main surfaces facing each other at a second pitch that is ½ of the first pitch A device for transferring to a container, wherein guide parts and stopper parts of the wafer to be transferred are alternately provided at a first pitch, and the guide member is provided at a predetermined position on one side of the guide member. A first mounting portion for positioning the first wafer container and a second mounting portion for positioning the second wafer container at a predetermined position on the other side of the guide member, and a wafer to be stored in one of the wafer containers; It is characterized in that it is configured to be moved in a direction parallel to the main surface via the guide portion of the guide member and transferred to the other wafer container, and further, the wafer is transferred from one wafer container to the other wafer container. In wafer container When the wafers are transferred in batches, every other wafer is transferred in the second wafer container, and when the wafers are transferred in batches, the number of wafers is transferred. Is an odd number (2n + 1),
(N), (n + 1), and when the number of wafers is an even number (2n), it is characterized in that it is provided with a delivery mechanism for delivering it separately to (n) and (n). A guide groove is engraved on the guide member to form a guide portion, and an inter-groove end surface of the guide member formed by engraving the guide groove is used as a stopper portion.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

First, a first embodiment will be described with reference to FIGS. 1 is a vertical sectional view, FIG. 2 is a top view, FIG. 3 is a side view, FIG. 4 is a sectional view showing a guide groove of a guide member, and FIG. 5 is a supporting groove of a first container. 6 is a vertical sectional view of the second wafer case, FIG. 7 is a top view of the second container, and FIG. 8 is a sectional view showing a supporting groove of the wafer supporting member. 9 to 12
FIG. 9 is a diagram for explaining a semiconductor wafer transfer process from the first wafer container to the second wafer container by schematically showing each part, and FIG. 9 is a diagram for explaining the first process. FIG. 10 is a diagram for explaining the second step,
FIG. 11 is a diagram for explaining the third step, and FIG.
FIG. 13 is a diagram for explaining the fourth step, and FIGS. 13 to 16 explain the step of transferring the semiconductor wafer from the second wafer container to the first wafer container, schematically showing each part. FIG. 13 is a diagram for explaining the first step, FIG. 14 is a diagram for explaining the second step, and FIG. 15 is a diagram for explaining the third step. Is a figure,
FIG. 16 is a diagram for explaining the fourth step.

In FIGS. 1 to 16, reference numeral 11 denotes a wafer transfer device used for transferring a semiconductor wafer 12 having a diameter of 200 mm, for example, a guide portion 13 and a first mounting portion provided on one side of the guide portion 13. 14 and a second mounting portion 15 provided on the other side of the guide portion 13, a first wafer container 16 is mounted on the first mounting portion 14, and a second mounting portion 15 is mounted on the second mounting portion 15. Is attached with the second wafer container 17.

The first wafer container 16 attached to the first attachment portion 14 is a carrier of a first wafer case (not shown) which has been conventionally used as a standard for transporting semiconductor wafers, and is a quarter inch thereof. Twenty-five semiconductor wafers 1 are placed in the support grooves 18 engraved at a pitch of (6.35 mm).
2 are arranged and housed at a predetermined housing pitch of 1/4 inch so that their main surfaces face each other.

The second wafer container 17 attached to the second attachment portion 15 has a predetermined storage pitch of 1/8 inch (3.175 mm) so that the semiconductor wafer 12 having a diameter of 200 mm can be carried and stored. The second wafer case 19 is arranged so that the main surfaces thereof face each other and accommodates 25 wafers. For example, a transparent substantially box-shaped case body 20 formed by molding polycarbonate resin.
In addition, a pair of wafer supporting members 21 are provided. The second wafer case 19 has a case body 20.
A substantially rectangular upper opening of the second wafer container 17 is covered with a transparent lid 22 having the same shape as that of the second wafer container 17, which is also formed by molding a polycarbonate resin, for example.

Further, the wafer supporting member 21 is a rectangular plate-like member which is curved in the longitudinal direction so as to follow the circumference of the semiconductor wafer 12, and the curved inner surface is provided with supporting grooves 23 at a pitch of 1/8 inch. It is set up. The attachment to the case body 20 is performed by engaging the lower end portion with the bank-like engaging portion 24 at the inner bottom portion of the case body 20 and projecting the locking piece 25 on the outer surface side of the upper portion.
Is locked to the locking pin 26 on the inner wall of the case body 20.

Further, the guide portion 13 is pivoted up and down as shown by an arrow A by pivotally supporting a base end portion 29a on one apex of two columns 28 standing on the base 27. If possible, the tip 29b is supported on the top of the other column 28 so as to be parallel to the upper surface of the base 27 when it is turned down, and the arm 29 is provided across the column 28. The upper guide member 30 is provided on the lower surface side. In addition,
The base 27 is provided so that the upper surface thereof is one side with respect to the horizontal plane H, for example, the side of the arm 29 in the lateral direction of the base end 29a, which is a downward inclined surface having an angle θ.

Further, the upper guide member 30 is provided with 25 upper guide grooves 31 which are downwardly opened and serve as upper guide portions of the semiconductor wafer 12 in a transverse direction of the arm 29 at a pitch of 1/4 inch. There is. By engraving the guide groove 31, the stopper portion of the semiconductor wafer 12 is formed on the inter-groove end surface 32 of the upper guide member 30. The guide groove 31 and the inter-groove end surface 32 have a groove width that allows the guide groove 31 to pass the semiconductor wafer 12, and conversely, the inter-groove end surface 32 has a dimension and shape that reliably blocks the passage of the semiconductor wafer 12. It is engraved as.

Further, the guide portion 13 is reciprocally movable as shown by an arrow B, so that the attached second wafer container 17 is positioned at the first position X1 and the second position X2, respectively. A lower guide member 34 is provided on the movable base 33 of the second mounting portion 15 that is capable of moving. Then, the lower guide member 34 is provided with 13 lower guide grooves 31 that are upwardly opened and serve as a lower guide portion of the semiconductor wafer 12 at a 1/4 inch pitch so as to face the upper guide grooves 31. ing. Similar to the upper guide member 30, by engraving the guide groove 31, the stopper portion of the semiconductor wafer 12 is also formed on the inter-groove end surface 32 of the lower guide member 34.

Then, the first wafer container 16 is attached to the first attaching portion 14, and the movable table 3 of the second attaching portion 15 is attached.
When the second wafer container 17 is attached to 3 and positioned at the first position X1 and the second position X2 respectively, the guide grooves 31 of the upper guide member 30 and the lower guide member 34 are The support groove 18 of the wafer container 16 and the support groove 21 of the second wafer container 17 are in communication with each other. The guide groove 31 of the lower guide member 34 and the support groove 18 of the first wafer container 16 are at the same height, and the support groove 21 of the second wafer container 17 is slightly lower than the lower guide member 34. The semiconductor wafer 12 is supported. In addition, since the support grooves 21 of the second wafer container 17 are engraved at a pitch of 1/8 inch, the support grooves 21 communicate with the guide grooves 31 every other one.

Further, the first mounting portion 14 for mounting the first wafer container 16 has a mounting base 3 fixed on a base 27.
5, the mounting base 35 is provided with a step portion 38 for positioning with the upper end flange 36 and the bottom portion 37 of the first wafer container 16, respectively, and a positioning member 39.

On the other hand, the second mounting portion 15 for mounting the second wafer container 17 has the hinge 40 on the base 27 and the first hinge 40.
The tilt table 41 is provided on the side of the mounting portion 14 of the tilt table 41, which can be rotated and oscillated as shown by an arrow C.
On the upper side, a movable base 33 is provided which is provided with two guide rails 42 and is movable as shown by an arrow B.

On the movable table 33, the second wafer container 1 is attached.
7 is attached, the positioning member 43 is positioned by abutting the bottom portion, and the guide groove 3 of the lower guide member 34.
A holding member 44 that holds the outer end portion of the support groove 23 of the second wafer container 17 is provided at a height position corresponding to 1, etc., and the second wafer container 17 is configured so that the semiconductor wafer 12 rolls in. It is attached to the movable table 33 so that it can be stored. When the movable table 33 is moved as indicated by the arrow B, the second wafer container 17 is moved to the first position X.
The lateral positioning members 45 and 46, which are located at the first position and the second position X2, respectively, are provided on the upper surface of the tilt table 41.

On the rear side of the first wafer container 16 attached to the first attaching portion 14 on one side of the guide portion 13, the first wafer container 1 is reciprocated as shown by an arrow D.
A predetermined number within 6 such as about half of the number that can be stored 1
A delivery mechanism 47 for delivering the three semiconductor wafers 12 is provided. The delivery of the semiconductor wafer 12 from the inside of the first wafer container 16 is performed by causing the delivery mechanism 47 to be advanced into the inside from the bottom opening 48 of the first wafer container 16 and then retracting after the delivery. Has become. Further, the delivery mechanism 47 is movable in a direction parallel to the lateral direction of the arm 29, and when the second wafer container 17 is located at the first position X1, it is at a position corresponding thereto.
When the vehicle is located at the second position X2, it can be moved to the corresponding position.

Then, the wafer transfer device 11 configured as described above is used to store the wafer at a 1/4 inch pitch.
The transfer of the semiconductor wafer 12 between the wafer container 16 and the second wafer container 17 accommodated at the 1/8 inch pitch is as follows. First, all 25 semiconductor wafers 1
The transfer from the first wafer container 16 accommodating 2 to the empty second wafer container 17 will be described.

In the first step shown in FIG. 9, 25 semiconductor wafers 12 are supported on the mounting base 35 of the first mounting portion 14 provided on one side of the guide portion 13 of the wafer transfer device 11. The first wafer container 16 stored in 18 is attached, and the empty second wafer container 17 is attached on the movable table 33 of the second attachment portion 15 provided on the other side. And
The movable table 33 is located at the first position X1. As a result, the 25 semiconductor wafers 12 of the first wafer container 16 are positioned so as to face the guide grooves 31 of the upper guide member 30 and the lower guide member 34, and the support groove 23 is provided for the empty second wafer container 17. It is positioned so as to face the guide groove 31 every other pair. Since the base 27 is tilted by the tilt angle θ, the semiconductor wafer 12 of the first wafer container 16 is accommodated in one side of each of the support grooves 18 while being offset.

Next, in a second step shown in FIG. 10, the wafer delivery mechanism 47 is operated to extrude 13 sheets, which is about half of the semiconductor wafers 12 in the first wafer container 16, to guide the guide portion 13. Every other one is stored in the support groove 23 of the second wafer container 17 which faces the guide groove 31 through the groove 31. At this time, since the storage position of the second wafer container 17 is slightly lower than the first wafer container 16 and the guide portion 13, the semiconductor wafer 12 rolls and the semiconductor wafer 12 becomes the second wafer container 1.
It is stored in the inner part of container 7.

Next, in a third step shown in FIG. 11, the arm 29 is rotated about the base end 29a side so that the tip 29b is separated from the top of the column 28 by a predetermined distance, and the upper guide member 30 is rotated. Is higher than the second wafer container 17. After that, the movable table 33 is moved as shown by an arrow B, the second wafer container 17 is positioned at the second position X2, and the arm 29 is returned to the original position.

As a result, the supporting groove 23 of the second wafer container 17 in the empty state where the semiconductor wafer 12 is not housed in the previous second step is set to face the guide groove 31 of the guide portion 13. The semiconductor wafer 12 housed in the second wafer container 17 faces the inter-groove end surface 32 which is the stopper portion of the guide portion 13. The remaining 1 of the first wafer container 16 that was not extruded in the previous second step
The two semiconductor wafers 12 are still positioned so as to face the guide groove 31.

Next, in the fourth step shown in FIG. 12, the wafer delivery mechanism 47 is operated again to operate the first wafer container 16
The second twelve semiconductor wafers 12 in the middle are extruded to face the guide groove 31 through the guide groove 31 of the guide portion 13.
The wafer container 17 is stored in the empty support groove 23. At this time, the semiconductor wafer 12 rolls in the same manner and is housed in the inner part of the second wafer container 17. By this, the first
The total of 25 semiconductor wafers 12 stored in the wafer container 16 of 1/4 inch pitch are different from this.
The wafer can be easily transferred to the second wafer container 17 which is stored at a pitch of 1/8 inch in two steps.

Next, conversely, transfer from the second wafer container 17 accommodating all 25 semiconductor wafers 12 to the empty first wafer container 16 will be described.

In the first step shown in FIG. 13, 25 semiconductor wafers 12 are supported on the movable base 33 of the second mounting portion 15 provided on the other side of the guide portion 13 of the wafer transfer device 11. The second wafer container 17 accommodated in the groove 23 is attached, and the empty first wafer container 16 is attached to the attachment base 35 of the first attachment portion 14 provided on one side. Then, the movable table 33 is positioned at the first position X1.

As a result, the supporting groove 18 of the empty first wafer container 16 is positioned so as to face the guide groove 31 of the upper guide member 30 and the lower guide member 34. For the second wafer container 17, the stored 25 semiconductor wafers 12
Of these, every other 13 are positioned so as to face the guide groove 31, and the remaining 12 are positioned so as to face the inter-groove end surface 32 that is the stopper portion. Since the base 27 is tilted by the tilt angle θ, the semiconductor wafer 12 of the second wafer container 17 is tilted.
Is in a state of being accommodated in one side of each of the support grooves 23.

Next, in the second step shown in FIG. 14, the tilt base 41 is rotated by the hinge 40 as shown by the arrow C, and the second wafer container 17 is lifted upward to raise the first wafer container 16 in the second process. Higher than. As a result, the support groove 23 of the second wafer container 17 is tilted so that the outer end portion is on the lower side, and the semiconductor wafer 12 accommodated therein is rolled in the direction of the first wafer container 16. Then, the second wafer container 1
7 of the semiconductor wafers 12 facing the guide groove 31 of the guide portion 13 in 7 rolls, and the second wafer container 1 of the support grooves 18 of the first wafer container 16 rolls through the guide groove 31.
7 moves to the corresponding support groove 18 in the first position X1 in which it is located. The other twelve semiconductor wafers 12 in the second wafer container 17 are the upper and lower guide members 30,
It is blocked by the inter-groove end surface 32 of 31 and does not roll, but remains as it is.

Next, in a third step shown in FIG. 15, the tilting base 41 is returned to its original position, and the arm 29 is attached to the tip portion 29b.
So that the base 2 is separated from the top of the column 28 by a predetermined distance.
The upper guide member 30 is moved to the second
To a position higher than the wafer container 17. After that, the movable table 33 is moved as shown by the arrow B, the second wafer container 17 is positioned at the second position X2, and the arm 29 is moved.
To the original position. Thereby, the second wafer container 17
The twelve semiconductor wafers 12, which are left in the supporting groove 23 every other one, are set so as to face the guide groove 31 of the guide portion 13.

Next, in the fourth step shown in FIG. 16, the tilting base 41 is rotated by the hinge 40 as shown by the arrow C in the same manner as in the second step, and the second wafer container 17 is moved to the first step. The wafer container 16 is held at a position higher than the wafer container 16. As a result, the support groove 23 of the second wafer container 17 is inclined so that the outer end portion thereof is on the lower side, and the semiconductor wafer 1 stored therein is held.
2 rolls toward the first wafer container 16. Then, the remaining 12 semiconductor wafers 12 in the second wafer container 17
Rolls and moves through the guide groove 31 to the first wafer container 16
The support groove 18 is moved and stored in the support groove 18 on the corresponding side of the second position X2 where the second wafer container 17 is located. As a result, the second wafer container 17
A total of 25 semiconductor wafers 12 stored at a / 8 inch pitch are stored at a different 1/4 inch
The wafer container 16 can be easily transferred in two batches.

By carrying out the transfer as described above, the pitch from the first wafer container 16 for accommodating the semiconductor wafers 12 at the standard pitch of 1/4 inch (6.35 mm) in the related art is changed. It is easy to carry around with 1/2, easy to carry, and does not require space for storage 1/8 inch (3.1
The transfer of the semiconductor wafers 12 to the second wafer container 17 accommodated at a pitch of 75 mm) or the reverse transfer from the second wafer container 17 to the first wafer container 16 can be easily performed. It is possible to significantly reduce the risk that the semiconductor wafer 12 will be dropped or scratched during the transfer.

Next, a second embodiment will be described with reference to FIGS. 17 and 18 are views for schematically explaining each part of the semiconductor wafer transfer process from the first wafer container to the second wafer container, and FIG.
7 is a diagram for explaining the first step, and FIG. 18 is a diagram for explaining the second step. In addition, since the configuration of the guide member as the main part is different from that of the first embodiment, this embodiment will be described focusing on the transfer process, and the same parts as those of the first embodiment will be designated by the same reference numerals. The description is omitted.

The wafer transfer device 51 is provided with a guide portion 52 on a base (not shown), a first attachment portion 53 for attaching the first wafer container 16 on one side of the guide portion 52, and a second attachment portion on the other side. The second mounting portion 54 for mounting the wafer container 17 is provided. The guide portion 52 includes an upper guide member 55 having a guide groove 31 and a groove end surface 32 that open downward, and a lower guide member (not shown) that has a guide groove 31 and an inter groove end surface 32 that open upward symmetrically with the guide groove 31. The upper guide member 55 and the lower guide member are
Each of the 13 guide grooves 31 is engraved at a pitch of 1/4 inch.

Further, although not shown, the first mounting portion 53 is provided with a hinge on the base on the side of the second mounting portion 54 to rotate,
The tilting table is provided so that it can be raised and lowered so as to be tilted downward in the direction of the guide portion 52. Further, although not shown in the figure, a guide rail is provided on the inclined table and reciprocates in the arrangement direction of the guide grooves 31 of the guide portion 52 to move the attached first wafer container 16 to the first position Y1 and the second position. There is provided a movable table which is positioned at position Y2.

Similarly, although not shown, the second mounting portion 54 is provided with a hinge on the base on the side of the first mounting portion 53 and is rotated, so that the second mounting portion 54 oscillates so as to incline downward toward the guide portion 52. Equipped with a tilting table that makes it possible. Further, although not shown, a guide rail is provided on the inclined table and reciprocates in the arrangement direction of the guide grooves 31 of the guide portion 52 to move the attached second wafer container 17 to the first position Z1 and the second position. A movable base is provided to be positioned at the position Z2.

Then, the wafer transfer device 51 configured as described above is used to store the wafer at a 1/4 inch pitch.
The transfer of the semiconductor wafer 12 between the wafer container 16 and the second wafer container 17 accommodated at the 1/8 inch pitch is as follows. First, all 25 semiconductor wafers 1
The transfer from the first wafer container 16 accommodating 2 to the empty second wafer container 17 will be described.

In the first step shown in FIG. 17, 25 semiconductor wafers 12 are supported on the movable base of the first mounting portion 53 provided on one side of the guide portion 52 of the wafer transfer device 51. The first wafer container 16 housed in 18 is attached, and on the movable table of the second attachment portion 54 provided on the other side,
An empty second wafer container 17 is attached. And the first
The wafer container 16 of is located at the first position Y1;
The second wafer container 17 is located at the first position Z1.

As a result, of the 25 semiconductor wafers 12 housed in the first wafer container 16, 13 are positioned so as to face the guide grooves 31 of the upper guide member 55 and the lower guide member, and the other 12 wafers. The sheet faces the end surface where the guide groove 31 of the upper and lower guide members is not engraved. Further, the empty second wafer container 17 is positioned so that every other supporting groove 23 faces the guide groove 31.

Subsequently, the tilting base of the first mounting portion 53 is tilted downward in the direction of the guide portion 52. By the movement of the tilting table, the 13 semiconductor wafers 12 facing the guide groove 31 in the first wafer container 16 attached to the first attaching portion 53 roll in the guide groove 31 and move into the guide groove 31. Every other one is stored in the supporting groove 23 of the facing second wafer container 17. The other twelve wafers in the first wafer container 16 are blocked by the end surfaces of the upper and lower guide members where the guide grooves 31 are not formed, and remain in the first wafer container 16.

Next, in a second step shown in FIG. 18, the tilt table of the first mounting portion 53 is returned to its original position and the movable table is moved to move the first wafer container 16 to the second position Y2.
And the movable table of the second mounting portion 54 is moved to position the second wafer container 17 at the second position Z2. As a result, the twelve semiconductor wafers 12 remaining in the first wafer container 16 face the guide groove 31 of the guide portion 52, and the semiconductor wafer 12 is not stored in the empty state where the semiconductor wafer 12 was not stored in the previous first step. The support groove 23 of the second wafer container 17 is set so as to face the guide groove 31 of the guide portion 52. Further, the semiconductor wafer 12 housed in the second wafer container 17 is in a state of facing the inter-groove end surface 32 which is the stopper portion of the guide portion 52.

Then, the tilting base of the first mounting portion 53 is tilted again toward the guide portion 52 so as to be tilted downward. By the movement of the tilting table, the twelve semiconductor wafers 12 facing the guide groove 31 in the first wafer container 16 mounted on the first mounting portion 53 roll in the guide groove 31 and are guided to the guide groove 31. The remaining support groove 2 of the facing second wafer container 17
It is stored in 3. Thereby, the first wafer container 16
All the 25 semiconductor wafers 12 stored in the 1/4 inch pitch in the second wafer container 17 in which the semiconductor wafers 12 are stored in the 1/8 inch, which has a different pitch of 1/2,
It can be easily transferred in two batches.

Next, conversely, transfer from the second wafer container 17 accommodating all 25 semiconductor wafers 12 to the empty first wafer container 16 will be described. Note that the transfer is substantially the same as the above-mentioned transfer and the difference in the moving direction of the semiconductor wafer 12 is opposite, and therefore the description will be made without being shown.

First, in the first step, the wafer transfer device 51
First mounting portion 53 provided on one side of the guide portion 52 of the
Mount an empty first wafer container 16 on the movable table of
Further, the second wafer container 17 in which 25 semiconductor wafers 12 are housed in the support groove 18 is mounted on the movable table of the second mounting portion 54 provided on the other side. Then, the first wafer container 16 is positioned at the first position Y1 and
The wafer container 17 of is positioned at the first position Z1.

As a result, the 13 support grooves 18 on one end side of the first wafer container 16 which is vacant become the guide portion 52.
Of the second wafer container 1 positioned so as to face the guide groove 31 of
25 semiconductor wafers 12 stored for 7
Of these, every other 13 sheets are positioned so as to face the guide groove 31. Further, the other twelve semiconductor wafers 12 housed in the second wafer container 17 face the inter-groove end surface 32 which is the stopper portion of the guide portion 52.

Subsequently, the tilting base of the second mounting portion 54 is tilted downward in the direction of the guide portion 52. By the movement of the tilting table, the 13 semiconductor wafers 12 facing the guide groove 31 in the second wafer container 17 mounted on the second mounting portion 54 roll in the guide groove 31 and move to the guide groove 31. It is housed in the support groove 18 of the first wafer container 16 which faces. The twelve semiconductor wafers 12 facing the inter-groove end face 32 of the second wafer container 17 are blocked by the inter-groove end face 32 and remain without rolling.

Next, in the second step, the movable base of the first mounting portion 53 is moved to position the first wafer container 16 at the second position Y2, and the second mounting portion 54 is inclined. The table is returned to its original position and the movable table is moved to position the second wafer container 17 at the second position Z2. As a result, the twelve support grooves 18 on the other end side of the first wafer container 16 in the empty state where the semiconductor wafer 12 is not accommodated in the previous first step are the guide grooves 31 of the guide portion 52.
The 12 semiconductor wafers 12 which are positioned so as to face the second wafer container 17 and are left in the second wafer container 17 are set so as to face the guide groove 31 of the guide portion 52.

Then, the tilting base of the second mounting portion 54 is tilted again toward the guide portion 52 so as to be tilted downward. Due to the movement of the tilt table, the remaining portion 1 facing the guide groove 31 in the second wafer container 17 attached to the second attachment portion 54
Two semiconductor wafers 12 roll in the guide groove 31,
The first wafer container 16 facing the guide groove 31 is housed in the remaining support groove 18 of the first wafer container 16. As a result, all the 25 semiconductor wafers 12 stored in the second wafer container 17 at a 1/8 inch pitch have a pitch of 1/4 which is different from this.
It can be easily transferred to the first wafer container 16 which is stored in inches in two batches.

As a result, also in this embodiment, the same effect as that of the first embodiment can be obtained.

Next, a third embodiment will be described with reference to FIGS. FIG. 19 and FIG. 20 are diagrams for explaining the step of transferring a semiconductor wafer from the first wafer container to the second wafer container by schematically showing each part, and FIG.
9 is a diagram for explaining the first step, and FIG. 20 is a diagram for explaining the second step. In addition, since the configuration of the guide member as the main part is different from that of the first embodiment, this embodiment will be described focusing on the transfer process, and the same parts as those of the first embodiment will be designated by the same reference numerals. The description is omitted.

The wafer transfer device 61 is provided with a guide portion 62 on a base (not shown), one side of the guide portion 62 for attaching the first wafer container 16 to the first attaching portion 63, and the other side for the second attaching portion 63. The second mounting portion 64 for mounting the wafer container 17 is provided. The guide portion 62 includes an upper guide member 65 having a guide groove 31 opening downward and an inter-groove end surface 32, and a lower guide member not shown having the guide groove 31 and inter-groove end surface 32 opening upward symmetrically with the guide groove 31. The upper guide member 65 and the lower guide member,
A stopper 66 having a width of 1/4 inch is formed in each of the intermediate portions, and 1/4 is formed on one side in the groove arrangement direction.
12 at inch pitch, 13 on the other side in the groove arrangement direction,
A total of 25 guide grooves 31 are engraved.

Further, although not shown, the first mounting portion 63 is provided with a hinge on the base on the side of the second mounting portion 64 to rotate,
The tilting table is provided so that it can be raised and lowered so as to be tilted downward in the direction of the guide portion 62. Further, although not shown in the figure, a guide rail is provided on the inclined table and reciprocates in the arrangement direction of the guide grooves 31 of the guide portion 62 to move the attached first wafer container 16 to the first position S1 and the second position. There is provided a movable table which is positioned at the position S2.

Similarly, although not shown, the second mounting portion 64 is provided with a hinge on the base on the side of the first mounting portion 63 and is rotated, so that the second mounting portion 64 oscillates so as to incline downward toward the guide portion 62. Equipped with a tilting table that makes it possible. Further, although not shown, a guide rail is provided on the inclined table and reciprocates in the arrangement direction of the guide grooves 31 of the guide portion 62 to move the attached second wafer container 17 to the first position T1 and the second position. A movable table is provided to be positioned at the position T2.

Then, using the wafer transfer device 61 configured as described above, the first 1-inch accommodating unit is used.
The transfer of the semiconductor wafer 12 between the wafer container 16 and the second wafer container 17 accommodated at the 1/8 inch pitch is as follows. First, all 25 semiconductor wafers 1
The transfer from the first wafer container 16 accommodating 2 to the empty second wafer container 17 will be described.

In the first step shown in FIG. 19, 25 semiconductor wafers 12 are supported on the movable table of the first mounting portion 63 provided on one side of the guide portion 62 of the wafer transfer device 61. The first wafer container 16 housed in 18 is attached, and on the movable table of the second attachment portion 64 provided on the other side,
An empty second wafer container 17 is attached. And the first
The wafer container 16 of is positioned at the first position S1,
The second wafer container 17 is located at the first position T1.

As a result, of the 25 semiconductor wafers 12 stored in the first wafer container 16, one stored in the central support groove 18 faces the stopper 66, and the other 24 are both guides. The members are located so as to face the corresponding guide grooves 31 on one side and the other side in the groove arrangement direction of the member. Further, with respect to the empty second wafer container 17, the support grooves 23 are positioned so as to face every other one of the guide grooves 31 on one side in the groove arrangement direction.

Subsequently, the tilting base of the first mounting portion 63 is tilted downward in the direction of the guide portion 62. By the movement of the tilting table, the twelve semiconductor wafers 12 facing the twelve guide grooves 31 on one side in the groove arrangement direction in the first wafer container 16 attached to the first attaching portion 63 are moved inside the guide groove 31. Every other roll is stored in the support groove 23 of the second wafer container 17 facing the guide groove 31. Also the first
The other thirteen wafers in the wafer container 16 are blocked by the inter-groove end faces 32 of the upper and lower guide members, and remain in the first wafer container 16.

Next, in a second step shown in FIG. 20, the tilt table of the first mounting portion 63 is returned to its original position and the movable table is moved to move the first wafer container 16 to the second position S2.
And the movable table of the second mounting portion 64 is moved to position the second wafer container 17 at the second position T2. As a result, the 13 semiconductor wafers 12 remaining in the first wafer container 16 face the 13 guide grooves 31 on the other side of the guide portion 62 in the groove arrangement direction, and the semiconductor wafers 12 are formed in the previous first step. The support groove 23 of the second wafer container 17 in an empty state which has not been housed is likewise guided by the guide portion 6.
It is set so as to face the 13 guide grooves 31 on the other side of the groove arrangement direction 2. The semiconductor wafer 12 housed in the second wafer container 17 faces the inter-groove end surface 32 which is the stopper portion of the guide portion 62.

Next, the tilting base of the first mounting portion 63 is tilted again toward the guide portion 62 so as to be tilted downward. By the movement of the tilting table, the 13 semiconductor wafers 12 facing the guide groove 31 in the first wafer container 16 attached to the first attaching portion 63 roll in the guide groove 31 to be guided to the guide groove 31. The remaining support groove 2 of the facing second wafer container 17
It is stored in 3. Thereby, the first wafer container 16
All the 25 semiconductor wafers 12 stored in the 1/4 inch pitch in the second wafer container 17 in which the semiconductor wafers 12 are stored in the 1/8 inch, which has a different pitch of 1/2,
It can be easily transferred in two batches.

On the contrary, transfer of the second wafer container 17 accommodating all 25 semiconductor wafers 12 to the empty first wafer container 16 will be described. Note that the transfer is substantially the same as the above-mentioned transfer and the difference in the moving direction of the semiconductor wafer 12 is opposite, and therefore the description will be made without being shown.

First, in the first step, the wafer transfer device 61
First mounting portion 63 provided on one side of the guide portion 62 of
Mount an empty first wafer container 16 on the movable table of
Further, the second wafer container 17 in which 25 semiconductor wafers 12 are housed in the support groove 18 is attached on the movable table of the second attachment portion 64 provided on the other side. Then, the first wafer container 16 is positioned at the first position S1, and the second wafer container 16
The wafer container 17 of is positioned at the first position T1.

As a result, the twelve support grooves 18 on one side of the empty first wafer container 16 are connected to the guide portion 62.
Of the 25 semiconductor wafers 12 that are positioned so as to face the 12 guide grooves 31 on one side in the groove arrangement direction, and every other 12 of the 25 semiconductor wafers 12 stored in the second wafer container 17 are arranged on one side in the groove arrangement direction. It is located so as to face the twelve guide grooves 31 on the side. In addition, the other 1 stored in the second wafer container 17
The two semiconductor wafers 12 face the inter-groove end surface 32 which is the stopper portion of the guide portion 62.

Then, the tilting base of the second mounting portion 64 is tilted downward in the direction of the guide portion 62. By the movement of the tilting table, the 13 semiconductor wafers 12 facing the guide groove 31 in the second wafer container 17 attached to the second attachment portion 64 roll in the guide groove 31 and are guided to the guide groove 31. It is housed in the support groove 18 of the first wafer container 16 which faces. The twelve semiconductor wafers 12 facing the inter-groove end face 32 of the second wafer container 17 are blocked by the inter-groove end face 32 and remain without rolling.

Next, in the second step, the movable table of the first mounting portion 63 is moved to position the first wafer container 16 at the second position S2, and the second mounting portion 54 is tilted. The table is returned to its original position and the movable table is moved to position the second wafer container 17 at the second position T2. As a result, the thirteen support grooves 18 on the other end side of the empty first wafer container 16 in which the semiconductor wafer 12 is not stored in the previous first step are formed on the other side in the groove arrangement direction of the guide portion 62. The twelve semiconductor wafers 12 which are positioned so as to face the guide grooves 31 on the side 13 and remain in the second wafer container 17
Are set so as to face the guide groove 31 of the guide portion 62.

Then, the tilt base of the second mounting portion 64 is tilted again toward the guide portion 62 so as to be tilted downward. Due to the movement of the tilt table, the remaining portion 1 facing the guide groove 31 in the second wafer container 17 attached to the second attachment portion 64
The three semiconductor wafers 12 roll in the guide groove 31,
It is housed in the remaining support groove 18 of the first wafer container 16 which faces the 13 guide grooves 31 on the other side in the groove arrangement direction. As a result, all the 25 semiconductor wafers 12 stored in the second wafer container 17 at the 1/8 inch pitch are stored in the first wafer container 16 which is stored at the different pitch of 1/4 inch, It can be easily transferred in two batches.

As a result, also in this embodiment, the same effect as that of the first embodiment can be obtained.

In each of the above embodiments, 25
The odd number of semiconductor wafers 12 is used as the first wafer container 1
6. The case where the wafers are housed in the second wafer container 17 and transferred between the two wafer containers has been described, but the same effect can be obtained in the case of an even number of wafers.

In each of the above embodiments, the first
1 of the second wafer container 17 to the wafer container 16 of
Although the semiconductor wafers 12 are housed at the pitch of 2, the substantially same effect can be obtained even when the semiconductor wafers 12 are arranged at the pitch of 1 / m (where m is an integer).
2 can be transferred by m operations without transferring them one by one. That is, for example, the first wafer container that stores 12 semiconductor wafers 12 at a pitch of 1/4 inch and the same 12 semiconductor wafers 12 at a pitch of 1/12 inch that is 1/3 of the pitch. Second
The case where the wafer is transferred to another wafer container will be described.

The fourth embodiment will be described below with reference to FIGS.
Will be described. 21 to 23 are diagrams for explaining the step of transferring the semiconductor wafer from the first wafer container to the second wafer container, schematically showing each part, and FIG.
1 is a diagram for explaining the first step, FIG. 22 is a diagram for explaining the second step, and FIG. 23 is a diagram for explaining the third step. The number of semiconductor wafers 12 stored in the first wafer container and the second wafer container,
Although the storage pitch and the like are different from those of the first embodiment and the configuration of the guide member, which is the main part, is different from that of the first embodiment, the configuration is similar to that of the first embodiment. Parts that are the same as those in FIG. 1 are given the same reference numerals, and corresponding parts are given the same reference numerals and x is not described, and the transfer process will be mainly described.

The wafer transfer device 11x is provided with a guide portion 13x on a base (not shown), and a first wafer container for accommodating twelve semiconductor wafers 12 at a pitch of 1/4 inch on one side of the guide portion 13x. A first mounting portion 14x for mounting 16x and a second mounting portion 15x for mounting a second wafer container 17x for storing 12 semiconductor wafers 12 at a pitch of 1/12 inch are provided on the other side. The guide portion 13x includes an upper guide member 30x having a guide groove 31 opening downward and an inter-groove end surface 32x, and a lower guide member not shown having the guide groove 31 opening upward and an inter-groove end surface 32x. Member 30x
Twelve guide grooves 31 are formed on the lower guide member and the lower guide member at a pitch of 1/4 inch.

The first mounting portion 14x is provided with a mounting base on a base (not shown), and the second mounting portion 15x is provided with a hinge (not shown) on the base on the side of the first mounting portion 14x. It is provided with an inclining base which is pivotable and can be raised and lowered so as to be inclined downward in the guide portion 13x direction. Further, although not shown, a guide rail is provided on the slanted base to guide the guide portion 13x.
There is provided a movable table that reciprocates in the arrangement direction of the guide grooves 31 to position the attached second wafer container 17x at the first position W1, the second position W2, and the third position W3.

Then, using the wafer transfer device 11x configured as described above, a first wafer container 16x which is housed at a 1/4 inch pitch and a second wafer container 17x which is housed at a 1/12 inch pitch are used. Semiconductor wafer 12 between
The transfer is as follows. First, the transfer from the first wafer container 16x, which stores all 12 semiconductor wafers 12, to the empty second wafer container 17x will be described.

In the first step shown in FIG. 21, 12 semiconductor wafers 12 are stored on the mounting base of the first mounting portion 14x provided on one side of the guide portion 13x of the wafer transfer device 11x. The wafer container 16x is attached, and the empty second wafer container 1 is attached to the movable table provided on the second attachment portion 15x on the other side.
Attach 7x. Then, the second wafer container 17x attached to the movable table is positioned at the first position W1. As a result, the twelve semiconductor wafers 12 of the first wafer container 16x are positioned so as to face the guide grooves 31 of the upper guide member 30x and the lower guide member, and two support grooves are provided for the empty second wafer container 17x. It is positioned so as to face the guide groove 31.

Subsequently, a wafer delivery mechanism (not shown) is operated to extrude four sheets, which is 1/3 of the semiconductor wafer 12 in the first wafer container 16x, and the second wafer facing the guide groove 31 via the guide groove 31. 2 in the support groove of the wafer container 17x
Store every other piece.

Next, in a second step shown in FIG. 22, the second wafer container 17x is moved to the second position W2 on the other side of the guide groove 31, and is supported in an empty state in which the semiconductor wafer 12 is not housed. A part of the groove is positioned so as to face the guide groove 31. Then, the wafer delivery mechanism is activated again,
Four semiconductor wafers 12 out of the remaining eight wafers in the first wafer container 16x are extruded, and are inserted into the guide grooves 31 among the remaining eight empty support grooves in the second wafer container 17x through the guide grooves 31. It is stored in four facing each other.

Next, in the third step shown in FIG. 23, the second wafer container 17x is moved to the third position W3 on the other side of the guide groove 31, and the semiconductor wafer 12 is not stored in the empty position 4. The book support groove is positioned so as to face the guide groove 31. Then, the wafer delivery mechanism is activated again,
The remaining four semiconductor wafers 12 in the first wafer container 16x
Of the second wafer container 17 through the guide groove 31.
Stored in the empty support groove of x, the transfer of all 12 semiconductor wafers 12 from the first wafer container 16x to the second wafer container 17x with a storage pitch of 1/3 thereof is performed three times. Completed by operation.

On the contrary, the transfer of the semiconductor wafer 12 from the second wafer container 17x to the first wafer container 16x is similarly performed as follows although not shown.

That is, in the first step, the semiconductor wafer 1
The second wafer container 17x accommodating twelve 2 is positioned at the first position W1 on the other side of the guide groove 31 of the guide portion 13x of the wafer transfer device 11x, and the empty first wafer container 16x is moved to the guide portion. It is located on one side of the guide groove 31 of 13x. As a result, the second wafer container 17x
Four of every two semiconductor wafers 12 face the guide groove 31, and the remaining eight wafers are positioned so as to face the inter-groove end face 32x, and support grooves (not shown) for the empty first wafer container 16x are formed. ) Faces the guide groove 31.

Then, the tilting base of the second mounting portion 15x is tilted downward in the guide portion 13x direction. By the movement of the tilting table, the guide groove 31 in the second wafer container 17x mounted on the second mounting portion 15x is exposed 4
A single semiconductor wafer 12 rolls in the guide groove 31 and is housed in the support groove of the first wafer container 16x facing the guide groove 31. The inter-groove end surface 3 of the second wafer container 17x
The eight semiconductor wafers 12 facing 2x are shielded by the inter-groove end faces 32x and remain without rolling.

Next, in the second step, the second mounting portion 15x
Then, the tilt table is returned to its original position and the movable table is moved to position the second wafer container 17x at the second position W2. As a result, the remaining 8 wafers remained in the second wafer container 17x.
Four of the semiconductor wafers 12 are set so as to face the guide groove 31 of the guide portion 13x, and the remaining four wafers are positioned so as to face the inter-groove end surface 32x. Then again the second
The tilting base of the mounting portion 15x is tilted downward in the guide portion 13x direction. By the movement of this tilt table,
The second wafer container 17 attached to the second attachment portion 15x
The four semiconductor wafers 12 facing the guide groove 31 in x are
It rolls in the guide groove 31 and is housed in the support groove of the first wafer container 16 x facing the guide groove 31. The four semiconductor wafers 12 facing the inter-groove end surface 32x of the second wafer container 17x are blocked by the inter-groove end surface 32x and remain as they are without rolling.

Next, in the third step, the second mounting portion 15x
Then, the tilt table is returned to the original position and the movable table is moved to position the second wafer container 17x at the third position W3. As a result, the remaining 4 in the second wafer container 17x
The semiconductor wafer 12 is the guide groove 3 of the guide portion 13x.
Set to face 1. Then, the tilting base of the second mounting portion 15x is again tilted so as to be tilted downward in the guide portion 13x direction. Due to the movement of the tilting table, the remaining four semiconductor wafers 12 facing the guide groove 31 in the second wafer container 17x attached to the second attaching portion 15x roll in the guide groove 31 and the guide groove 31. The first wafer container 16x facing the above. As a result, all twelve semiconductor wafers 12 housed in the second wafer container 17x can be easily transferred to the first wafer container 16x by three operations.

As a result, also in this embodiment, the same effect as that of the first embodiment can be obtained.

In the fourth embodiment described above,
The case of transferring between the first wafer container 16x and the second wafer container 17x that accommodates the 12 even numbered semiconductor wafers 12 has been described, but the same effect can be obtained even when the number is odd. .

[0087]

As is clear from the above description, according to the present invention, a wafer which does not occupy a large space during storage and which can be carried in a plurality at a time and has a good portability. Wafers can be easily transferred between the case and a standard wafer case for transportation, and it is possible to prevent the semiconductor wafer from being damaged during transfer. Play.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing a first embodiment of the present invention.

FIG. 2 is a top view showing the first embodiment of the present invention.

FIG. 3 is a side view showing the first embodiment of the present invention.

FIG. 4 is a sectional view showing a guide groove of the guide member according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a support groove of the first container according to the first embodiment of the present invention.

FIG. 6 is a vertical cross-sectional view of a second wafer case according to the first embodiment of the present invention.

FIG. 7 is a top view of the second container according to the first embodiment of the present invention.

FIG. 8 is a sectional view of a supporting groove of the wafer supporting member according to the first embodiment of the present invention.

FIG. 9 is a diagram for explaining a first step of transferring a semiconductor wafer from the first wafer container to the second wafer container in the first embodiment of the present invention.

FIG. 10 is a diagram for explaining a second step of transferring a semiconductor wafer from the first wafer container to the second wafer container in the first embodiment of the present invention.

FIG. 11 is a diagram for explaining a third step of transferring semiconductor wafers from the first wafer container to the second wafer container in the first embodiment of the present invention.

FIG. 12 is a diagram for explaining a fourth step of transferring the semiconductor wafer from the first wafer container to the second wafer container in the first embodiment of the present invention.

FIG. 13 is a diagram for explaining a first step of transferring a semiconductor wafer from the second wafer container to the first wafer container in the first embodiment of the present invention.

FIG. 14 is a diagram for explaining the second step of transferring the semiconductor wafer from the second wafer container to the first wafer container in the first embodiment of the present invention.

FIG. 15 is a diagram for explaining a third step of transferring the semiconductor wafer from the second wafer container to the first wafer container in the first embodiment of the present invention.

FIG. 16 is a diagram for explaining a fourth step of transferring the semiconductor wafer from the second wafer container to the first wafer container in the first embodiment of the present invention.

FIG. 17 is a diagram for explaining a first step of transferring a semiconductor wafer from the first wafer container to the second wafer container in the second embodiment of the present invention.

FIG. 18 is a diagram for explaining a second step of transferring a semiconductor wafer from the first wafer container to the second wafer container in the second embodiment of the present invention.

FIG. 19 is a view for explaining the first step of transferring the semiconductor wafer from the first wafer container to the second wafer container in the third embodiment of the present invention.

FIG. 20 is a view for explaining the second step of transferring the semiconductor wafer from the first wafer container to the second wafer container in the third embodiment of the present invention.

FIG. 21 is a view for explaining the first step of transferring the semiconductor wafer from the first wafer container to the second wafer container in the fourth embodiment of the present invention.

FIG. 22 is a view for explaining the second step of transferring the semiconductor wafer from the first wafer container to the second wafer container in the fourth embodiment of the present invention.

FIG. 23 is a diagram for explaining a third step of transferring semiconductor wafers from the first wafer container to the second wafer container in the fourth embodiment of the present invention.

FIG. 24 is a schematic side view of a transportation wafer case according to the related art.

FIG. 25 is a top view of a carrier in a conventional transportation wafer case.

[Explanation of symbols]

12 ... Semiconductor wafer 13 ... Guide section 14 ... First mounting portion 15 ... Second mounting portion 16 ... First wafer container 17 ... Second wafer container 31 ... Guide groove 32 ... End face between grooves

Claims (6)

[Claims] 1. A first wafer container capable of storing wafers at a first pitch with their principal surfaces facing each other, and a second pitch which is 1 / m (m is an integer) of the first pitch. A device for transferring a wafer to be accommodated in one wafer container to another wafer container between a second wafer container capable of accommodating wafers with their main surfaces facing each other, and to transfer the wafers to the other wafer container. Guide members in which guide portions and stopper portions are alternately provided at a first pitch, a first mounting portion for positioning the first wafer container at a predetermined position on one side of the guide member, and the guide A second mounting portion for positioning the second wafer container at a predetermined position on the other side of the member,
A wafer transfer device, characterized in that a wafer accommodated in one wafer container is moved in a direction parallel to a main surface via a guide portion of the guide member and transferred to the other wafer container. 2. When transferring a wafer from one wafer container to the other wafer container in m times, the second wafer container transfers and receives the wafer every (m-1). The wafer transfer device according to claim 1. 3. A first wafer container capable of accommodating wafers at a first pitch with their principal surfaces facing each other, and a wafer at a second pitch that is ½ of the first pitch. Is a device for transferring a wafer to be stored in one wafer container to the other wafer container between a second wafer container that can be accommodated by facing each other, and a guide portion and a stopper portion of the wafer to be transferred. Alternating with each other and at a first pitch, a first mounting portion for positioning the first wafer container at a predetermined position on one side of the guide member, and a predetermined side for the other side of the guide member. A second mounting portion that positions the second wafer container at a position, and moves the wafer to be stored in one of the wafer containers in a direction parallel to the main surface via the guide portion of the guide member. Configured to transfer to wafer container A wafer transfer device characterized in that 4. When transferring a wafer from one wafer container to the other wafer container in two steps, every other wafer is transferred in the second wafer container. 3. The wafer transfer device described in 3. 5. When transferring wafers in two steps, if the number of wafers is an odd number (2n + 1), (n), (n + 1)
If the number of wafers is even (2n), (n),
4. The wafer transfer device according to claim 3, further comprising a delivery mechanism for delivering the wafer in a divided manner into (n). 6. The guide member is formed with a guide groove to form a guide portion, and the inter-groove end surface of the guide member formed by the formation of the guide groove is used as a stopper portion. 3. The wafer transfer device described in 3.