JP2003315974A - 露光マスクの作製方法および露光方法 - Google Patents

露光マスクの作製方法および露光方法

Info

Publication number
JP2003315974A
JP2003315974A JP2002117102A JP2002117102A JP2003315974A JP 2003315974 A JP2003315974 A JP 2003315974A JP 2002117102 A JP2002117102 A JP 2002117102A JP 2002117102 A JP2002117102 A JP 2002117102A JP 2003315974 A JP2003315974 A JP 2003315974A
Authority
JP
Japan
Prior art keywords
pattern
exposure
mask
phase
line width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002117102A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003315974A5 (https=
Inventor
Koji Kikuchi
晃司 菊地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2002117102A priority Critical patent/JP2003315974A/ja
Publication of JP2003315974A publication Critical patent/JP2003315974A/ja
Publication of JP2003315974A5 publication Critical patent/JP2003315974A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2002117102A 2002-04-19 2002-04-19 露光マスクの作製方法および露光方法 Pending JP2003315974A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002117102A JP2003315974A (ja) 2002-04-19 2002-04-19 露光マスクの作製方法および露光方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002117102A JP2003315974A (ja) 2002-04-19 2002-04-19 露光マスクの作製方法および露光方法

Publications (2)

Publication Number Publication Date
JP2003315974A true JP2003315974A (ja) 2003-11-06
JP2003315974A5 JP2003315974A5 (https=) 2005-09-08

Family

ID=29534408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002117102A Pending JP2003315974A (ja) 2002-04-19 2002-04-19 露光マスクの作製方法および露光方法

Country Status (1)

Country Link
JP (1) JP2003315974A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396617B2 (en) 2004-06-14 2008-07-08 Photronics, Inc. Photomask reticle having multiple versions of the same mask pattern with different biases
US7435533B2 (en) 2004-06-14 2008-10-14 Photronics, Inc. Method of forming a semiconductor layer using a photomask reticle having multiple versions of the same mask pattern with different biases
US9005848B2 (en) 2008-06-17 2015-04-14 Photronics, Inc. Photomask having a reduced field size and method of using the same
US9005849B2 (en) 2009-06-17 2015-04-14 Photronics, Inc. Photomask having a reduced field size and method of using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396617B2 (en) 2004-06-14 2008-07-08 Photronics, Inc. Photomask reticle having multiple versions of the same mask pattern with different biases
US7435533B2 (en) 2004-06-14 2008-10-14 Photronics, Inc. Method of forming a semiconductor layer using a photomask reticle having multiple versions of the same mask pattern with different biases
US9005848B2 (en) 2008-06-17 2015-04-14 Photronics, Inc. Photomask having a reduced field size and method of using the same
US9005849B2 (en) 2009-06-17 2015-04-14 Photronics, Inc. Photomask having a reduced field size and method of using the same

Similar Documents

Publication Publication Date Title
US7036108B2 (en) Full sized scattering bar alt-PSM technique for IC manufacturing in sub-resolution era
US7674563B2 (en) Pattern forming method and phase shift mask manufacturing method
US7659042B2 (en) Full phase shifting mask in damascene process
US8735050B2 (en) Integrated circuits and methods for fabricating integrated circuits using double patterning processes
US5442714A (en) Design rule checking method and a method of fabricating a phase shift mask
JP2010175733A (ja) パターンレイアウト作成方法
KR20120011902A (ko) 자동 생성 마스크 및 다중 마스킹 레이어 기술을 이용한 단일 ic 레이어의 패터닝 방법
KR100590360B1 (ko) 방사 패터닝 툴 그리고 방사 패터닝 툴을 형성하기 위한방법
US8003301B2 (en) Manufacturing method for semiconductor device
KR101218498B1 (ko) 노광용 마스크, 그 제조 방법 및 반도체 장치의 제조 방법
JP2005227666A (ja) マスクデータ補正方法と半導体装置の製造方法
US20120135341A1 (en) Method for double patterning lithography and photomask layout
CN1653388B (zh) 使用相移和辅助微细结构使半导体层形成图案
JP2003315974A (ja) 露光マスクの作製方法および露光方法
JP5050618B2 (ja) 多重露光技術用フォトマスクのパタンデータ作成方法
JP2000338647A (ja) 位相マスクおよびその作成方法
JP4580656B2 (ja) 二重露光フォトマスクおよび露光方法
JP4829742B2 (ja) 膜のパターニング方法及び露光用マスク
JPH0876355A (ja) ホトマスク、パタン形成方法及び半導体装置の製造方法
WO2009125529A1 (ja) マスクパターンの生成方法及びパターン形成方法
TW561312B (en) A phase shift mask
US9091923B2 (en) Contrast enhancing exposure system and method for use in semiconductor fabrication
Vandeweyer et al. Immersion lithography and double patterning in advanced microelectronics
JPH05333524A (ja) 位相シフトマスクおよびその製造方法
TW200407664A (en) Method of determiningmask feature and application thereof

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050310

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050310

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20071116

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071211

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080408