JP2003308730A - Silver oxide fine particle composition, its manufacturing method, conductive composition, conductive film and its manufacturing method - Google Patents
Silver oxide fine particle composition, its manufacturing method, conductive composition, conductive film and its manufacturing methodInfo
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- JP2003308730A JP2003308730A JP2002113713A JP2002113713A JP2003308730A JP 2003308730 A JP2003308730 A JP 2003308730A JP 2002113713 A JP2002113713 A JP 2002113713A JP 2002113713 A JP2002113713 A JP 2002113713A JP 2003308730 A JP2003308730 A JP 2003308730A
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- Prior art keywords
- silver
- silver oxide
- conductive
- oxide fine
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導電性ペースト、
導電性塗料、導電性接着剤などとして用いられる酸化銀
微粒子組成物およびその製造方法、導電性組成物、これ
らを用いて形成された導電性被膜およびその形成方法に
関するものである。TECHNICAL FIELD The present invention relates to a conductive paste,
The present invention relates to a silver oxide fine particle composition used as a conductive paint, a conductive adhesive and the like, a method for producing the same, a conductive composition, a conductive film formed using these, and a method for forming the same.
【０００２】[0002]
【従来の技術】従来の導電性ペーストとしては、フレー
ク状の銀微粒子にアクリル樹脂、酢酸ビニル樹脂などの
熱可塑性樹脂、エポキシ樹脂、ポリエステル樹脂などの
熱硬化性樹脂などからなるバインダ、有機溶剤、硬化
剤、触媒などを添加し、混合して得られる銀ペーストが
代表的なものである。2. Description of the Related Art Conventional conductive pastes include flake-shaped fine silver particles, a binder made of a thermoplastic resin such as acrylic resin and vinyl acetate resin, a thermosetting resin such as epoxy resin and polyester resin, an organic solvent, A silver paste obtained by adding and mixing a curing agent, a catalyst, etc. is typical.
【０００３】この銀ペーストは、各種電子機器、電子部
品、電子回路などに対して導電性接着剤、導電性塗料な
どとして広く使用されている。また、この銀ペーストを
ポリエチレンテレフタレートフィルムなどのプラスチッ
クフィルム上にスクリーン印刷などにより印刷して、電
気回路を形成したフレキシブル回路基板もキーボード、
各種スイッチなどのプリント回路基板として用いられて
いる。This silver paste is widely used as a conductive adhesive, a conductive paint, etc. for various electronic devices, electronic parts, electronic circuits and the like. In addition, a flexible circuit board on which a plastic circuit such as a polyethylene terephthalate film is printed with this silver paste by screen printing to form an electric circuit is also a keyboard,
It is used as a printed circuit board for various switches.
【０００４】この銀ペーストの使用方法は、対象物に各
種塗布手段により塗布し、常温で乾燥するか、あるいは
１５０℃程度に加熱して、導電性被膜とすることで行な
われている。そして、このようにして得られた導電性被
膜の体積抵抗率は、製膜条件にもよるが、１０-4〜１０
-5Ω・ｃｍの範囲であり、金属銀の体積抵抗率１．６×
１０ -6Ω・ｃｍに比べて、１０〜１００倍の値となって
おり、金属銀の導電性にはとうてい及ばない値となって
いる。The method of using this silver paste depends on the object.
Apply by seed application means and dry at room temperature, or
Do this by heating to about 150 ° C to form a conductive film.
It is being appreciated. The conductive coating obtained in this way
The volume resistivity of the film depends on the film forming conditions, but is 10-Four-10
-FiveΩ · cm range, volume resistivity of metallic silver 1.6 ×
10 -610 to 100 times the value compared to Ω · cm
Which is far below the conductivity of metallic silver.
There is.
【０００５】[0005]
【発明が解決しようとする課題】このような従来の銀ペ
ーストからなる導電性被膜の導電性が低い理由として
は、この導電性被膜内では、銀微粒子同士が、その一部
のみで物理的に接触しており、しかも銀微粒子同士の接
触点が少なく、また、銀微粒子同士の接触点において接
触抵抗が生じことなどが挙げられる。さらに、銀微粒子
同士の間にバインダが存在し、このバインダが銀微粒子
同士の直接的な接触を阻害していることなども挙げられ
る。The reason why such a conductive coating made of a conventional silver paste has a low conductivity is because silver fine particles are physically present in the conductive coating only partially. It is mentioned that they are in contact with each other, and there are few contact points between the silver particles, and that contact resistance occurs at the contact points between the silver particles. Further, it is also possible that a binder exists between the silver fine particles and the binder prevents direct contact between the silver fine particles.
【０００６】このような銀ペーストの導電性の低さを改
善する方法として、銀ペーストを対象物に塗布した後、
８００℃程度に加熱してバインダを焼却、除去するとと
もに、銀微粒子を溶融して、銀微粒子が融着して一様に
連続した金属銀の被膜を形成する方法がある。このよう
にして得られた金属銀の被膜からなる導電性被膜の体積
抵抗率は、１０-6Ω・ｃｍ程度になり、金属銀のそれに
近い導電性を有するものとなる。しかし、このような金
属銀の被膜からなる導電性被膜では、対象物が高温加熱
に耐え得るガラス、セラミックス、琺瑯などの耐熱性材
料に限られるという欠点がある。As a method for improving the low conductivity of such a silver paste, after applying the silver paste to an object,
There is a method in which the binder is incinerated and removed by heating to about 800 ° C., the silver fine particles are melted, and the silver fine particles are fused to form a uniform and continuous coating film of metallic silver. The volume resistivity of the conductive coating film made of the metallic silver film thus obtained is about 10 −6 Ω · cm, and has a conductivity close to that of metallic silver. However, the conductive coating made of such a metallic silver coating has a drawback that the object is limited to heat-resistant materials such as glass, ceramics, enamel, etc. that can withstand high temperature heating.
【０００７】また、これとは別の試みとして、銀の微粒
子を使うことによる導電性被膜の低抵抗化の検討が行な
われている。ここで用いられる銀の微粒子とは、その粒
径が数〜数十ｎｍのものである。これを導電性ペースト
として使用して、対象物に塗布した後、加熱すると、こ
の銀の微粒子が比較的低温で融着して、銀の微粒子同士
の接点が増え、導電性被膜の導電性が向上する。そし
て、銀の微粒子の粒径が小さいほど、融着の起こる温度
も下がる傾向にあることが知られている。In addition, as another attempt, a study has been made to reduce the resistance of the conductive coating by using fine silver particles. The fine silver particles used herein have a particle diameter of several to several tens of nm. When this is used as a conductive paste and applied to an object and then heated, the silver fine particles are fused at a relatively low temperature, the number of contacts between the silver fine particles increases, and the conductivity of the conductive coating increases. improves. It is known that the smaller the particle size of silver fine particles, the lower the temperature at which fusion occurs.
【０００８】しかし、粒径が数〜数十ｎｍの銀微粒子
は、その量産性や安定性の問題から、一般の銀粉と比較
して非常に高価なものである。また、この銀微粒子は非
常に小さいために、その凝集作用が強い。特に、乾燥し
た状態では、凝集作用が顕著になり、一旦、乾燥させた
銀微粒子は、溶媒やバインダなどへの分散が困難である
ことから、乾燥させることができなかった。このような
ことから、粒径が数〜数十ｎｍの銀微粒子は、導電性ペ
ーストの材料としてはあまり普及していない。However, silver fine particles having a particle diameter of several to several tens nm are very expensive as compared with general silver powder due to problems of mass productivity and stability. Further, since the silver fine particles are very small, their aggregation action is strong. In particular, in the dried state, the aggregation effect becomes remarkable, and the once dried silver fine particles cannot be dried because it is difficult to disperse them in a solvent or a binder. For this reason, silver fine particles having a particle size of several to several tens nm are not widely used as a material for the conductive paste.
【０００９】さらに、熱によって、金属銀からなる導電
性被膜を形成する方法としては、酸化銀の還元反応を利
用したものが挙げられる。この形成方法は、加熱により
酸化銀中の酸素が還元されて放出され、銀化することを
利用したものである。この還元反応は、還元剤によって
促進させることができるが、酸化銀の粒径の影響を受け
易く、酸化銀の粒径が小さいほど低温で反応が起こるよ
うになる。Further, as a method of forming a conductive coating film made of metallic silver by heat, a method utilizing a reduction reaction of silver oxide can be mentioned. This forming method utilizes the fact that oxygen in silver oxide is reduced and released by heating and silver is formed. This reduction reaction can be promoted by a reducing agent, but it is easily affected by the grain size of silver oxide, and the smaller the grain size of silver oxide, the lower the reaction temperature.
【００１０】そして、この形成方法では、酸化銀の還元
と同時に、生成した銀同士が融着し合って連続した銀被
膜となり、この銀被膜は非常に導電性の高いものとな
る。このような酸化銀を用いた銀被膜の形成方法につい
ては、特願２００１−３９８４２５号で提案されている
が、酸化銀微粒子の製造方法およびその分散性について
は、詳しく示されていない。In this forming method, simultaneously with the reduction of silver oxide, the produced silver particles are fused together to form a continuous silver film, and this silver film has a very high conductivity. Japanese Patent Application No. 2001-398425 proposes a method for forming a silver coating using such silver oxide, but the method for producing fine silver oxide particles and the dispersibility thereof are not shown in detail.
【００１１】本発明は、前記事情に鑑みてなされたもの
で、低温で還元反応が起こるほど粒径が小さく、乾燥さ
せても溶媒やバインダ樹脂などへの分散性に優れた酸化
銀微粒子組成物およびその製造方法を提供することを課
題とする。また、この酸化銀微粒子組成物を使用して、
高温で製膜しなくとも、金属銀と同等の低体積抵抗率、
高導電性の導電性被膜が得られる導電性組成物、導電性
被膜およびその形成方法を提供することを課題とする。The present invention has been made in view of the above circumstances, and the silver oxide fine particle composition has a small particle size such that a reduction reaction occurs at a low temperature, and has excellent dispersibility in a solvent or a binder resin even when dried. Another object is to provide a method for producing the same. Further, using this silver oxide fine particle composition,
Low volume resistivity equivalent to metallic silver, even without film formation at high temperature,
An object of the present invention is to provide a conductive composition, a conductive coating and a method for forming the same, which can provide a highly conductive conductive coating.
【００１２】[0012]
【課題を解決するための手段】前記課題は、酸化銀微粒
子の表面が分散剤で被覆されてなり、平均粒径が０．０
１〜１０μｍの微粒子である酸化銀微粒子組成物によっ
て解決できる。上記酸化銀微粒子組成物が、バインダ樹
脂、溶媒、還元剤から選ばれる１種類以上に分散可能で
あることが好ましい。前記課題は、銀化合物と塩基性物
質を分散剤の存在下で反応させ、酸化銀微粒子組成物を
得る酸化銀微粒子組成物の製造方法によって解決でき
る。前記課題は、上記酸化銀微粒子組成物が、バインダ
樹脂、溶媒、還元剤から選ばれる１種類以上に分散され
てなる導電性組成物によって解決できる。前記課題は、
上記導電性組成物を対象物に塗布し、加熱する導電性被
膜の形成方法によって解決できる。前記課題は、上記導
電性被膜の形成方法で得られ、銀微粒子が互いに融着し
ている導電性被膜によって解決できる。[Means for Solving the Problems] The above-mentioned problem is that the surface of silver oxide fine particles is coated with a dispersant, and the average particle size is 0.0
The problem can be solved by using a silver oxide fine particle composition having fine particles of 1 to 10 μm. It is preferable that the silver oxide fine particle composition can be dispersed in one or more kinds selected from a binder resin, a solvent and a reducing agent. The above problems can be solved by a method for producing a silver oxide fine particle composition by reacting a silver compound and a basic substance in the presence of a dispersant to obtain a silver oxide fine particle composition. The above problem can be solved by a conductive composition in which the silver oxide fine particle composition is dispersed in one or more kinds selected from a binder resin, a solvent and a reducing agent. The problem is
This can be solved by a method of forming a conductive coating by applying the above-mentioned conductive composition to an object and heating it. The above problems can be solved by a conductive coating obtained by the above method for forming a conductive coating, in which silver particles are fused to each other.
【００１３】[0013]
【発明の実施の形態】以下、本発明を詳しく説明する。
本発明の酸化銀微粒子組成物は、酸化銀微粒子の表面の
全部または一部が分散剤で被覆されてなり、平均粒径が
０．０１〜１０μｍの微粒子である。この酸化銀微粒子
組成物の平均粒径が０．０１μｍ未満では、乾燥した状
態において、凝集作用が強くなることがあり、溶媒やバ
インダなどへの分散が困難となる場合がある。一方、酸
化銀微粒子組成物の平均粒径が１０μｍを超えると、低
温において酸化銀の還元反応が起こり難くなり、結果と
して、金属銀からなる導電性被膜を形成し難くなる。BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below.
The silver oxide fine particle composition of the present invention is a fine particle in which the surface of the silver oxide fine particles is wholly or partially covered with a dispersant and has an average particle diameter of 0.01 to 10 μm. If the average particle size of this silver oxide fine particle composition is less than 0.01 μm, the cohesive action may become strong in the dried state, and it may be difficult to disperse it in a solvent, a binder or the like. On the other hand, when the average particle size of the silver oxide fine particle composition exceeds 10 μm, the reduction reaction of silver oxide is less likely to occur at low temperatures, and as a result, it is difficult to form the conductive coating film made of metallic silver.
【００１４】本発明で用いられる酸化銀微粒子は、硝酸
銀、過塩素酸銀、炭酸銀などの銀化合物と、水酸化ナト
リウム、水酸化カリウム、炭酸ナトリウムなどの塩基性
物質を反応させて得られた、平均粒径が０．０１〜１０
μｍであるものである。The fine silver oxide particles used in the present invention are obtained by reacting a silver compound such as silver nitrate, silver perchlorate or silver carbonate with a basic substance such as sodium hydroxide, potassium hydroxide or sodium carbonate. , The average particle size is 0.01 to 10
μm.
【００１５】本発明で用いられる分散剤としては、ヒド
ロキシプロピルセルロース、ポリビニルピロリドン、ポ
リビニルアルコールなどの他に、市販の分散剤として、
例えば、ディスパービック１６０、ディスパービック１
６１、ディスパービック１６２、ディスパービック１６
３、ディスパービック１６６、ディスパービック１７
０、ディスパービック１８０、ディスパービック１８
２、ディスパービック１８４、ディスパービック１９０
（以上、ビックケミー社製）、フローレンＴＧ−７２０
Ｗ、フローレンＴＧ−７３０Ｗ、フローレンＧ−７０
０、フローレンＤＯＰＡ−１７、フローレンＤＯＰＡ−
２２、フローレンＤＯＰＡ−１５８（以上、共栄社化学
社製）、チラバゾールＷ−０１、チラバゾールＷ−０２
（以上、太陽化学社製）、ソルスパース２００００、ソ
ルスパース２４０００、ソルスパース２６０００、ソル
スパース２７０００、ソルスパース２８０００（以上、
アビシア社製）、アジスパーＰＢ７１１、アジスパーＰ
Ｂ８１１、アジスパーＰＡ１１１、アジスパーＰＷ９１
１（以上、味の素社製）などの高分子系分散剤を用いる
ことができる。このような分散剤の使用量は、酸化銀微
粒子１００重量部に対して有効成分で０．１〜３００重
量部とし、好ましくは１〜１００重量部とする。As the dispersant used in the present invention, in addition to hydroxypropyl cellulose, polyvinylpyrrolidone, polyvinyl alcohol, etc., a commercially available dispersant may be used.
For example, Dispersevic 160, Dispersevic 1
61, Dispervik 162, Dispervik 16
3, Disperbic 166, Disperbic 17
0, Disperbic 180, Disperbic 18
2, Disperbic 184, Disperbic 190
(Above, made by Big Chemie), Floren TG-720
W, Floren TG-730W, Floren G-70
0, Floren DOPA-17, Floren DOPA-
22, Floren DOPA-158 (above, Kyoeisha Chemical Co., Ltd.), tirabazole W-01, tirabazole W-02
(All manufactured by Taiyo Kagaku Co., Ltd.), Sols Perth 20000, Sols Pers 24000, Sols Pers 26000, Sols Pers 27000, Sols Pers 28000 (or more,
Avisia), Azisper PB711, Azisper P
B811, Addisper PA111, Addisper PW91
Polymer dispersants such as 1 (above, manufactured by Ajinomoto Co., Inc.) can be used. The dispersant is used in an amount of 0.1 to 300 parts by weight, preferably 1 to 100 parts by weight, based on 100 parts by weight of the silver oxide fine particles as an active ingredient.
【００１６】本発明の酸化銀微粒子組成物は、乾燥した
状態でも、組成物同士が互いに凝集し難く、バインダ樹
脂や溶媒などに対する分散性に非常に優れた微粒子であ
る。また、この酸化銀微粒子組成物は、比較的低温で、
単に加熱するか、あるいは還元剤との共存下において加
熱することにより、容易に金属銀に還元されるの微粒子
である。そして、この還元反応時に生じる反応熱によっ
て、還元反応によって形成された金属銀微粒子が溶融
し、互いに融着して高導電性の金属銀の導電性被膜を形
成する。したがって、得られる導電性被膜は、金属銀と
同等の体積抵抗率および導電性を有するものとなる。さ
らに、本発明の酸化銀微粒子組成物は、溶媒がない状態
でも、組成物同士が凝集しないように、その表面の一部
または全部が分散剤によって被覆されている。よって、
本発明の酸化銀微粒子組成物は、乾燥させた後でも、新
たなバインダ樹脂、溶媒、還元剤、その他の各種添加剤
などに対して凝集せずに再分散させることが可能であ
る。なお、本発明の酸化銀微粒子組成物を再分散させる
方法は、特に限定されるものではなく、公知の分散法を
適宜用いることができる。The silver oxide fine particle composition of the present invention is a fine particle in which the compositions hardly aggregate with each other even in a dried state and the dispersibility in a binder resin or a solvent is excellent. Further, this silver oxide fine particle composition has a relatively low temperature,
The fine particles are easily reduced to metallic silver by simply heating or heating in the presence of a reducing agent. Then, the reaction heat generated during the reduction reaction melts the metal silver fine particles formed by the reduction reaction and fuses them to each other to form a conductive film of highly conductive metal silver. Therefore, the obtained conductive coating has the same volume resistivity and conductivity as metallic silver. Further, the silver oxide fine particle composition of the present invention has a part or all of its surface coated with a dispersant so that the compositions do not aggregate even in the absence of a solvent. Therefore,
Even after being dried, the silver oxide fine particle composition of the present invention can be re-dispersed in a new binder resin, solvent, reducing agent, and other various additives without agglomeration. The method of redispersing the silver oxide fine particle composition of the present invention is not particularly limited, and a known dispersion method can be appropriately used.
【００１７】次に、本発明の酸化銀微粒子組成物の製造
方法について説明する。本発明の酸化銀微粒子組成物の
製造方法は、溶媒に分散または溶解した銀化合物と、溶
媒に分散または溶解した塩基性物質を、分散剤の存在下
で反応させて、この反応液をそのままの状態とするか、
または洗浄した後、溶媒を除去することにより、酸化銀
微粒子の表面の一部または全部が分散剤で被覆された、
平均粒径が０．０１〜１０μｍの酸化銀微粒子組成物が
得られるものである。具体的な例としては、硝酸銀水溶
液に分散剤を添加しておき、水酸化ナトリウム水溶液
を、この硝酸銀水溶液に滴下することにより、本発明の
酸化銀微粒子組成物を得る。本発明の酸化銀微粒子組成
物の製造方法において、銀化合物または塩基性物質を、
分散または溶解させる分散媒の溶媒としては、水、メタ
ノール、エタノール、プロパノール、セカンダリーブチ
ルアルコール（ＳＢＡ）などのアルコール類、イソホロ
ン、テルピネオール、エチレングリコールモノブチルエ
ーテル、ブチルセロソルブアセテートなどの有機溶媒が
用いられる。Next, a method for producing the silver oxide fine particle composition of the present invention will be described. The method for producing a silver oxide fine particle composition of the present invention comprises reacting a silver compound dispersed or dissolved in a solvent and a basic substance dispersed or dissolved in a solvent in the presence of a dispersant, and leaving the reaction solution as it is. State or
Alternatively, after washing, by removing the solvent, a part or all of the surface of the silver oxide fine particles is coated with a dispersant,
It is possible to obtain a silver oxide fine particle composition having an average particle diameter of 0.01 to 10 μm. As a specific example, a dispersant is added to a silver nitrate aqueous solution, and a sodium hydroxide aqueous solution is added dropwise to the silver nitrate aqueous solution to obtain the silver oxide fine particle composition of the present invention. In the method for producing a silver oxide fine particle composition of the present invention, a silver compound or a basic substance,
As the solvent of the dispersion medium to be dispersed or dissolved, water, alcohols such as methanol, ethanol, propanol, and secondary butyl alcohol (SBA), and organic solvents such as isophorone, terpineol, ethylene glycol monobutyl ether, and butyl cellosolve acetate are used.
【００１８】本発明の酸化銀微粒子組成物の製造方法に
あっては、銀化合物または塩基性物質に分散剤を添加し
ておくことにより、銀化合物または塩基性物質の反応に
よって生成する酸化銀微粒子が凝集するのを防止し、微
粒子状の酸化銀微粒子組成物を得ることができる。ま
た、銀化合物および／または塩基性物質の種類、これら
の物質の濃度、反応温度、反応時間などの各種条件、分
散剤の種類および量などを適宜設定することによって、
目的とする粒径を有する酸化銀微粒子組成物を得ること
ができる。In the method for producing a silver oxide fine particle composition of the present invention, a silver oxide fine particle produced by a reaction of a silver compound or a basic substance by adding a dispersant to the silver compound or the basic substance. Can be prevented from aggregating, and a fine particle silver oxide fine particle composition can be obtained. In addition, by appropriately setting the types of silver compounds and / or basic substances, the concentrations of these substances, various conditions such as reaction temperature and reaction time, and the type and amount of dispersant,
It is possible to obtain a silver oxide fine particle composition having a target particle size.
【００１９】次に、本発明の導電性組成物について説明
する。本発明の導電性組成物は、上記の本発明の酸化銀
微粒子組成物が、バインダ樹脂、溶媒、還元剤から選ば
れる１種類以上に、ほぼ均一に分散されてなるものであ
る。Next, the conductive composition of the present invention will be described. The conductive composition of the present invention comprises the above-mentioned silver oxide fine particle composition of the present invention dispersed almost uniformly in one or more kinds selected from a binder resin, a solvent and a reducing agent.
【００２０】本発明の導電性組成物の第1の実施形態
は、上記の本発明の酸化銀微粒子組成物が、バインダ樹
脂および／または溶媒に分散されてなるものである。こ
の実施形態の導電性組成物を構成するバインダ樹脂とし
ては、アクリル樹脂、ビニル樹脂、ポリエステル樹脂、
ウレタン樹脂、フェノール樹脂、エポキシ樹脂などや、
これらのモノマーが挙げられる。また、この実施形態の
導電性組成物を構成する溶媒としては、上記本発明の酸
化銀微粒子組成物の製造方法で用いられるものと同様の
ものが挙げられる。The first embodiment of the conductive composition of the present invention is one in which the silver oxide fine particle composition of the present invention is dispersed in a binder resin and / or a solvent. The binder resin constituting the conductive composition of this embodiment, acrylic resin, vinyl resin, polyester resin,
Urethane resin, phenol resin, epoxy resin, etc.,
These monomers may be mentioned. Further, as the solvent constituting the conductive composition of this embodiment, the same solvents as those used in the method for producing a silver oxide fine particle composition of the present invention can be mentioned.
【００２１】この実施形態の導電性組成物は、対象物に
塗布または印刷し、これを単に加熱するだけで、導電性
被膜を形成することができるものである。導電性組成物
を構成する酸化銀微粒子組成物の粒径が１μｍ以下であ
れば、加熱温度１８０〜２００℃、加熱時間１０秒〜１
２０分程度で、導電性被膜を形成することができる。The conductive composition of this embodiment is capable of forming a conductive coating by coating or printing on an object and simply heating it. If the particle size of the silver oxide fine particle composition constituting the conductive composition is 1 μm or less, the heating temperature is 180 to 200 ° C., and the heating time is 10 seconds to 1
The conductive film can be formed in about 20 minutes.
【００２２】さらに、この実施形態の導電性組成物は、
種々の方法で対象物に塗布または印刷することができ、
そのときの適切な粘度は製膜条件により異なる。例え
ば、スクリーン印刷の場合には、３０〜３００ポイズ程
度の粘度が好ましい。このときの粘度は、バインダ樹脂
および／または溶媒の種類、バインダ樹脂および／また
は溶媒の酸化銀微粒子組成物に対する添加量を変えるこ
とで調整することができる。Further, the conductive composition of this embodiment is
Can be applied or printed on objects in various ways,
The appropriate viscosity at that time depends on the film forming conditions. For example, in the case of screen printing, a viscosity of about 30 to 300 poise is preferable. The viscosity at this time can be adjusted by changing the kind of the binder resin and / or the solvent and the addition amount of the binder resin and / or the solvent to the silver oxide fine particle composition.
【００２３】また、本発明の導電性組成物の第２の実施
形態は、上記の本発明の酸化銀微粒子組成物が、還元剤
に分散されてなるものである。この実施形態の導電性組
成物を構成する還元剤としては、酸化銀微粒子組成物中
の酸化銀を還元するもので、還元反応後の副生成物が気
体や揮発性の高い液体となり、生成した導電性被膜内に
残留しないものが好ましい。このような還元剤の具体的
な例としては、エチレングリコール、ホルマリン、ヒド
ラジン、アスコルビン酸、各種アルコールなどが挙げら
れる。これらの還元剤は、液体であれば溶媒としても用
いることができ、このような例としては、エチレングリ
コールなどが挙げられる。In a second embodiment of the conductive composition of the present invention, the silver oxide fine particle composition of the present invention is dispersed in a reducing agent. The reducing agent that constitutes the conductive composition of this embodiment is one that reduces the silver oxide in the silver oxide fine particle composition, and the by-product after the reduction reaction becomes a gas or a highly volatile liquid and is generated. Those that do not remain in the conductive coating are preferred. Specific examples of such a reducing agent include ethylene glycol, formalin, hydrazine, ascorbic acid, and various alcohols. These reducing agents can also be used as a solvent as long as they are liquid, and examples thereof include ethylene glycol.
【００２４】このような還元剤の中には、還元力が高い
ものがある。そこで、還元力が高い還元剤を用いる場合
は、導電性組成物を対象物に塗布または印刷する直前
に、導電性組成物に還元剤を添加する。このようにすれ
ば、導電性組成物の保管中や、塗布または印刷の間に、
導電性組成物内で還元反応が起こるのを大幅に抑えるこ
とができる。これにより、導電性組成物の貯蔵安定性を
改善することができ、また、安定した導電性を有する導
電性被膜を形成することができる。Some of such reducing agents have high reducing power. Therefore, when a reducing agent having a high reducing power is used, the reducing agent is added to the conductive composition immediately before applying or printing the conductive composition on an object. In this way, during storage of the conductive composition, or during application or printing,
It is possible to significantly suppress the reduction reaction from occurring in the conductive composition. Thereby, the storage stability of the conductive composition can be improved, and a conductive coating film having stable conductivity can be formed.
【００２５】この実施形態の導電性組成物は、還元剤を
添加することでより低い温度で還元反応が進み、導電性
被膜を形成できる。この例で用いられる酸化銀微粒子組
成物の平均粒径は、小さいものに限定する必要がなく、
０．０１〜１０μｍの範囲であれば特に支障はない。こ
の実施形態の導電性組成物は、還元剤の存在により、１
μｍ以上の粒子でも還元反応がスムーズに進行し、導電
性被膜を容易に形成することができる。In the conductive composition of this embodiment, the reduction reaction proceeds at a lower temperature by adding a reducing agent, and a conductive film can be formed. The average particle size of the silver oxide fine particle composition used in this example need not be limited to a small one,
If it is in the range of 0.01 to 10 μm, there is no particular problem. Due to the presence of the reducing agent, the conductive composition of this embodiment has a
Even with particles having a size of μm or more, the reduction reaction proceeds smoothly, and a conductive film can be easily formed.
【００２６】この実施形態の導電性組成物の粘度は、製
膜条件によって異なるが、例えば、スクリーン印刷の場
合には、３０〜３００ポイズ程度が好ましい。また、こ
の実施形態の導電性組成物を用いて導電性被膜を形成す
るには、この導電性組成物を対象物に適宜の手段で塗布
した後、単に加熱するだけでよい。加熱温度は、還元剤
の存在により第1の実施形態よりも低くてよく、加熱温
度１４０〜１６０℃、加熱時間１０秒〜１２０分程度
で、導電性被膜を形成することができる。The viscosity of the conductive composition of this embodiment varies depending on the film forming conditions, but in the case of screen printing, it is preferably about 30 to 300 poise. In order to form a conductive coating film using the conductive composition of this embodiment, the conductive composition may be applied to an object by an appropriate means and then simply heated. The heating temperature may be lower than that in the first embodiment due to the presence of the reducing agent, and the conductive film can be formed at a heating temperature of 140 to 160 ° C. and a heating time of about 10 seconds to 120 minutes.
【００２７】なお、本発明の導電性組成物は、上記第１
および第２の実施形態に限定されるものではなく、バイ
ンダ樹脂、溶媒または還元剤から選択される２種類以上
が併用されていてもよい。また、本発明の導電性組成物
を用いて、導電性被膜を形成する際には、いずれの場合
においても、対象物の表面を清浄にしておかなければな
らない。The electrically conductive composition of the present invention has the above first composition.
It is not limited to the second embodiment, and two or more kinds selected from a binder resin, a solvent or a reducing agent may be used in combination. In addition, when forming a conductive film using the conductive composition of the present invention, the surface of the object must be cleaned in any case.
【００２８】次に、本発明の導電性被膜について説明す
る。本発明の導電性被膜は、上述のように、本発明の導
電性組成物を対象物に塗布し、加熱することによって、
酸化銀微粒子組成物中の酸化銀微粒子が還元され、還元
された金属銀微粒子が互いに融着して、一様に連続した
金属銀の薄膜に形成されたものである。Next, the conductive film of the present invention will be described. The conductive coating of the present invention, as described above, by applying the conductive composition of the present invention to an object, by heating,
The silver oxide fine particles in the silver oxide fine particle composition are reduced, and the reduced metal silver fine particles are fused to each other to form a uniformly continuous thin film of metal silver.
【００２９】本発明の導電性被膜の体積抵抗率は、３〜
８×１０-6Ω・ｃｍの範囲の値を示し、金属銀の体積抵
抗率と同オーダーである。このように、本発明の導電性
被膜は、体積抵抗率が極めて低いので、導電性被膜の厚
みを極めて薄くしても高い導電性を得ることができる。
例えば、体積抵抗率５×１０-5Ω・ｃｍの銀ペーストを
使用して、厚さ５０μｍの電気回路を要求される場合、
本発明の導電性被膜を用いれば、体積抵抗率３×１０-6
Ω・ｃｍ、厚さ３μｍの電気回路を形成することができ
る。The volume resistivity of the conductive film of the present invention is 3 to.
It shows a value in the range of 8 × 10 −6 Ω · cm, which is on the same order as the volume resistivity of metallic silver. As described above, since the conductive coating film of the present invention has an extremely low volume resistivity, high conductivity can be obtained even if the thickness of the conductive coating film is extremely thin.
For example, when a silver paste having a volume resistivity of 5 × 10 −5 Ω · cm is used and an electric circuit having a thickness of 50 μm is required,
When the conductive coating film of the present invention is used, the volume resistivity is 3 × 10 −6.
An electric circuit having an Ω · cm and a thickness of 3 μm can be formed.
【００３０】また、本発明の導電性被膜を形成する酸化
銀微粒子の平均粒径が０．０１〜１０μｍであるから、
本発明の導電性被膜からなる電気回路の線幅を１０μｍ
以下とすることができる。しかも、この電気回路自体の
導電性が極めて高いので、上述のように電気回路の厚み
を厚くする必要もない。よって、電気回路の形成が容易
である上に、電気回路自体の可撓性も高くなる。Further, since the silver oxide fine particles forming the conductive film of the present invention have an average particle diameter of 0.01 to 10 μm,
The line width of the electric circuit made of the conductive film of the present invention is 10 μm.
It can be: Moreover, since the electric circuit itself has extremely high conductivity, it is not necessary to increase the thickness of the electric circuit as described above. Therefore, the electric circuit can be easily formed, and the flexibility of the electric circuit itself is increased.
【００３１】さらに、本発明の導電性被膜は、対象物に
塗布され、加熱されて形成されるが、この導電性被膜の
対象物側の面は、金属銀の光沢に富む鏡面を呈するもの
となる。特に、対象物の表面が平滑な面（鏡面）であれ
ば、対象物から剥離した導電性被膜の対象物側の面は、
反射率の高い鏡として、家庭用、工業用などの用途に使
用でき、例えばレーザー装置の共振器の反射鏡などに使
用することができる。Further, the conductive coating of the present invention is formed by applying it to an object and heating it. The surface of the conductive coating on the object side has a mirror surface which is rich in metallic silver. Become. In particular, if the surface of the object is a smooth surface (mirror surface), the surface of the conductive coating separated from the object on the object side is
As a mirror having a high reflectance, it can be used for domestic and industrial uses, and can be used, for example, as a reflector of a resonator of a laser device.
【００３２】そして、本発明の導電性被膜の形成におけ
る加熱温度は１８０〜２００℃程度、あるいは１４０〜
１６０℃程度で十分である。したがって、本発明の導電
性被膜は、耐熱性の低いプラスチックフィルムなどの対
象物にも適用でき、高導電性を有する導電性被膜を形成
することができるとともに、対象物が熱劣化することも
ない。The heating temperature for forming the conductive film of the present invention is about 180 to 200 ° C., or 140 to 200 ° C.
About 160 ° C is sufficient. Therefore, the conductive coating film of the present invention can be applied to an object such as a plastic film having a low heat resistance, can form a conductive coating film having high conductivity, and the object does not deteriorate due to heat. .
【００３３】以下、具体的な実施例を示して、本発明の
効果を明かにする。
（実施例１）イオン交換水５０ｍｌに硝酸銀１０．０ｇ
を溶解し、さらに、これに分散剤としてヒドロキシプロ
ピルセルロース２．５ｇを添加した水溶液に、攪拌しな
がら２Ｍ水酸化ナトリウム水溶液を２９．５ｍｌ滴下
し、攪拌を１０〜３０分続けて、酸化銀微粒子の懸濁液
を調製した。この懸濁液中の酸化銀微粒子の粒径を、粒
径測定器（商品名；マイクロトラックＵＰＡ１５０、日
機装社製）で測定したところ、その平均粒径は０．３５
μｍであった。次いで、この酸化銀微粒子の懸濁液を濾
過して、回収した酸化銀微粒子をメタノールで２〜５回
洗浄し、余分なイオン類を除去した。次いで、これを熱
風乾燥炉にて、温度５０℃で、５時間乾燥させて、表面
が分散剤で被覆された酸化銀微粒子組成物を得た。次い
で、この酸化銀微粒子組成物１．０ｇをセカンダリーブ
チルアルコール（ＳＢＡ）０．５ｇに分散させて、ペー
スト状の導電性組成物を製造した。この導電性組成物中
の酸化銀微粒子組成物の粒径を粒径測定器にて測定した
ところ、その平均粒径は、懸濁液中の酸化銀微粒子の平
均粒径と同じであった。このことから、導電性組成物中
で、酸化銀微粒子組成物は凝集しておらず、分散性が良
好であることが確認された。次いで、この導電性組成物
１．０ｇに、還元剤としてエチレングリコールを０．５
ｇ添加した後、厚さ０．１ｍｍのポリエチレンテレフタ
レートフィルムの表面に、スクリーン印刷により、厚さ
５〜１０μｍの電気回路パターンを形成した後、これを
オーブン中で、温度１５０℃で、３０分〜３時間加熱し
て、導電性被膜を形成した。得られた導電性被膜の体積
抵抗率は、３〜６×１０-6Ω・ｃｍであった。さらに、
この導電性被膜の表面を走査型電子顕微鏡で観察したと
ころ、酸化銀を還元して生成した銀微粒子同士が融着接
合していることが確認された。Hereinafter, the effects of the present invention will be clarified by showing concrete examples. (Example 1) 10.0 g of silver nitrate in 50 ml of ion-exchanged water
2M sodium hydroxide aqueous solution was added dropwise to the aqueous solution prepared by dissolving 2.5 g of hydroxypropyl cellulose as a dispersant while stirring, and the stirring was continued for 10 to 30 minutes to obtain silver oxide fine particles. A suspension of was prepared. The particle size of silver oxide fine particles in this suspension was measured with a particle size measuring device (trade name: Microtrac UPA150, manufactured by Nikkiso Co., Ltd.), and the average particle size was 0.35.
was μm. Next, this silver oxide fine particle suspension was filtered, and the recovered silver oxide fine particles were washed with methanol 2 to 5 times to remove excess ions. Then, this was dried in a hot air drying oven at a temperature of 50 ° C. for 5 hours to obtain a silver oxide fine particle composition having a surface coated with a dispersant. Next, 1.0 g of this silver oxide fine particle composition was dispersed in 0.5 g of secondary butyl alcohol (SBA) to produce a paste-like conductive composition. When the particle size of the silver oxide fine particle composition in this conductive composition was measured by a particle size measuring device, the average particle size was the same as the average particle size of the silver oxide fine particles in the suspension. From this, it was confirmed that the silver oxide fine particle composition did not aggregate in the conductive composition, and the dispersibility was good. Next, 0.5 g of ethylene glycol as a reducing agent was added to 1.0 g of this conductive composition.
After adding g, an electric circuit pattern having a thickness of 5 to 10 μm was formed by screen printing on the surface of a polyethylene terephthalate film having a thickness of 0.1 mm, and then this was placed in an oven at a temperature of 150 ° C. for 30 minutes to The conductive coating was formed by heating for 3 hours. The volume resistivity of the obtained conductive coating was 3 to 6 × 10 −6 Ω · cm. further,
When the surface of this conductive film was observed with a scanning electron microscope, it was confirmed that the silver particles produced by reducing silver oxide were fusion-bonded to each other.
【００３４】（実施例２）イオン交換水５０ｍｌに硝酸
銀１０．０ｇを溶解し、さらに、これに分散剤としてデ
ィスパービック１９０（ビックケミー社製）６．２５ｇ
を添加した水溶液に、攪拌しながら２Ｍ水酸化ナトリウ
ム水溶液を２９．５ｍｌ滴下し、攪拌を１０〜３０分続
けて、酸化銀微粒子の懸濁液を調製した。この懸濁液中
の酸化銀微粒子の粒径を、粒径測定器（商品名；マイク
ロトラックＵＰＡ１５０、日機装社製）で測定したとこ
ろ、その平均粒径は０．２１μｍであった。次いで、こ
の酸化銀微粒子の懸濁液を、メタノールで２〜５回洗浄
し、余分なイオン類を除去した。次いで、これを熱風乾
燥炉にて、温度５０℃で、５時間乾燥させて、酸化銀微
粒子組成物を得た。次いで、この酸化銀微粒子組成物
１．０ｇをセカンダリーブチルアルコール（ＳＢＡ）
０．５ｇに分散させて、ペースト状の導電性組成物を製
造した。この導電性組成物中の酸化銀微粒子組成物の粒
径を粒径測定器にて測定したところ、その平均粒径は、
懸濁液中の酸化銀微粒子の平均粒径と同じであった。こ
のことから、導電性組成物中で、酸化銀微粒子組成物は
凝集しておらず、分散性が良好であることが確認され
た。次いで、この導電性組成物１．０ｇに、還元剤とし
てエチレングリコールを０．５ｇ添加した後、厚さ０．
１ｍｍのポリエチレンテレフタレートフィルムの表面
に、スクリーン印刷により、厚さ５〜１０μｍの電気回
路パターンを形成した後、これをオーブン中で、温度１
５０℃で、３０分〜３時間加熱して、導電性被膜を形成
した。得られた導電性被膜の体積抵抗率は、３〜６×１
０-6Ω・ｃｍであった。さらに、この導電性被膜の表面
を走査型電子顕微鏡で観察したところ、酸化銀を還元し
て生成した銀微粒子同士が融着接合していることが確認
された。Example 2 10.0 g of silver nitrate was dissolved in 50 ml of ion-exchanged water, and 6.25 g of Disperbic 190 (manufactured by BYK Chemie) was added as a dispersant.
29.5 ml of a 2M sodium hydroxide aqueous solution was added dropwise to the aqueous solution added with stirring, and stirring was continued for 10 to 30 minutes to prepare a suspension of silver oxide fine particles. When the particle size of the silver oxide fine particles in this suspension was measured with a particle size measuring device (trade name: Microtrac UPA150, manufactured by Nikkiso Co., Ltd.), the average particle size was 0.21 μm. Next, this silver oxide fine particle suspension was washed with methanol 2 to 5 times to remove excess ions. Then, this was dried in a hot air drying oven at a temperature of 50 ° C. for 5 hours to obtain a silver oxide fine particle composition. Then, 1.0 g of this silver oxide fine particle composition was added to secondary butyl alcohol (SBA).
It was dispersed in 0.5 g to produce a paste-like conductive composition. When the particle size of the silver oxide fine particle composition in this conductive composition was measured with a particle size measuring device, the average particle size was
It was the same as the average particle size of the fine silver oxide particles in the suspension. From this, it was confirmed that the silver oxide fine particle composition did not aggregate in the conductive composition, and the dispersibility was good. Next, 0.5 g of ethylene glycol as a reducing agent was added to 1.0 g of this conductive composition, and then the thickness was adjusted to 0.
An electric circuit pattern having a thickness of 5 to 10 μm was formed by screen printing on the surface of a 1 mm polyethylene terephthalate film, and then this was placed in an oven at a temperature of 1 μm.
By heating at 50 ° C. for 30 minutes to 3 hours, a conductive film was formed. The volume resistivity of the obtained conductive coating is 3 to 6 × 1.
It was 0 −6 Ω · cm. Furthermore, when the surface of this conductive film was observed with a scanning electron microscope, it was confirmed that the silver fine particles produced by reducing silver oxide were fusion-bonded to each other.
【００３５】（比較例）比較のため、市販の銀ペースト
（商品名；ＦＡ−３５３、藤倉化成社製）を用意し、こ
れを厚さ０．１ｍｍのポリエチレンテレフタレートフィ
ルムの表面に、スクリーン印刷により、厚さ５〜１０μ
ｍの電気回路パターンを形成した後、これをオーブン中
で、温度１５０℃で、３０分加熱して、導電性被膜を形
成した。得られた導電性被膜の体積抵抗率は、４×１０
-5Ω・ｃｍであった。さらに、この導電性被膜の表面を
走査型電子顕微鏡で観察したところ、銀フレーク同士が
単に接触している状態であることが確認された。(Comparative Example) For comparison, a commercially available silver paste (trade name: FA-353, manufactured by Fujikura Kasei Co., Ltd.) was prepared and screen-printed on the surface of a polyethylene terephthalate film having a thickness of 0.1 mm. , Thickness 5-10μ
After forming the electric circuit pattern of m, this was heated in an oven at a temperature of 150 ° C. for 30 minutes to form a conductive film. The volume resistivity of the obtained conductive coating is 4 × 10.
It was −5 Ω · cm. Furthermore, when the surface of this conductive coating was observed with a scanning electron microscope, it was confirmed that the silver flakes were simply in contact with each other.
【００３６】[0036]
【発明の効果】以上説明したように、本発明の酸化銀微
粒子組成物は、酸化銀微粒子の表面が分散剤で被覆され
てなり、平均粒径が０．０１〜１０μｍの微粒子である
から、乾燥した状態でも、組成物同士が互いに凝集し難
く、バインダ樹脂や溶媒などに対する分散性に非常に優
れた微粒子である。また、この酸化銀微粒子組成物は、
比較的低温で、単に加熱するか、あるいは還元剤との共
存下において加熱することにより、容易に金属銀に還元
される。そして、この還元反応時に生じる反応熱によっ
て、還元反応によって形成された金属銀微粒子が溶融
し、互いに融着して高導電性の金属銀の導電性被膜を形
成することができる。したがって、得られる導電性被膜
は、金属銀と同等の体積抵抗率および導電性を有するも
のとなる。As described above, in the silver oxide fine particle composition of the present invention, the surface of the silver oxide fine particles is coated with a dispersant, and the average particle diameter is 0.01 to 10 μm. Even in a dried state, the compositions are hard to aggregate with each other, and the particles are very excellent in dispersibility in a binder resin, a solvent and the like. Further, this silver oxide fine particle composition,
It can be easily reduced to metallic silver by simply heating at a relatively low temperature or by heating in the presence of a reducing agent. Then, the reaction heat generated during the reduction reaction melts the metal silver fine particles formed by the reduction reaction and fuses them to each other to form a conductive film of highly conductive metal silver. Therefore, the obtained conductive coating has the same volume resistivity and conductivity as metallic silver.
【００３７】本発明の導電性組成物は、上記酸化銀微粒
子組成物が、バインダ樹脂、溶媒、還元剤から選ばれる
１種類以上に分散されてなるものであるから、対象物に
塗布または印刷し、これを単に加熱するだけで、導電性
被膜を形成することができるものである。特に、還元剤
が添加されたものは、より低い温度で還元反応が進み、
導電性被膜を形成することができる。The conductive composition of the present invention comprises the above-mentioned silver oxide fine particle composition dispersed in one or more kinds selected from a binder resin, a solvent and a reducing agent, and therefore is applied or printed on an object. The conductive coating can be formed by simply heating this. In particular, in the case where the reducing agent is added, the reduction reaction proceeds at a lower temperature,
A conductive coating can be formed.
【００３８】本発明の導電性被膜は、上記導電性組成物
を対象物に塗布し、加熱することにより、銀微粒子が互
いに融着しているものであるから、体積抵抗率は、３〜
８×１０-6Ω・ｃｍの範囲の値を示し、金属銀の体積抵
抗率と同オーダーとなる。また、体積抵抗率が極めて低
いので、導電性被膜の厚みを極めて薄くしても高い導電
性を得ることができる。さらに、この導電性被膜からな
る電気回路は、その線幅を十分に細くすることができ、
その厚みを厚くするも必要がない。したがって、電気回
路の形成が容易である上に、電気回路自体の可撓性も高
くなる。そして、その導電性被膜の形成は、比較的低い
温度での加熱でなされるので、対称物として耐熱性の低
いプラスチックなどを用いることができる。The electroconductive coating film of the present invention has the volume resistivity of 3 to since the fine silver particles are fused to each other by applying the electroconductive composition to an object and heating it.
It shows a value in the range of 8 × 10 −6 Ω · cm, which is on the same order as the volume resistivity of metallic silver. Further, since the volume resistivity is extremely low, high conductivity can be obtained even if the thickness of the conductive coating is extremely thin. Furthermore, the electric circuit made of this conductive film can have a sufficiently narrow line width,
It is not necessary to increase the thickness. Therefore, it is easy to form the electric circuit and the flexibility of the electric circuit itself is increased. Since the conductive coating is formed by heating at a relatively low temperature, it is possible to use a plastic having low heat resistance as a symmetrical material.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｂ 5/14 Ｈ０１Ｂ 5/14 Ｚ 13/00 ５０３ 13/00 ５０３Ｃ (72)発明者 小野 朗伸 東京都江東区木場一丁目５番１号 株式会 社フジクラ内 (72)発明者 本多 俊之 埼玉県北葛飾郡鷲宮桜田５丁目13番地１号 藤倉化成株式会社開発研究所内 (72)発明者 岡本 航司 埼玉県北葛飾郡鷲宮桜田５丁目13番地１号 藤倉化成株式会社開発研究所内 (72)発明者 伊藤 雅史 埼玉県北葛飾郡鷲宮桜田５丁目13番地１号 藤倉化成株式会社開発研究所内 Ｆターム(参考） 4J002 AA001 BA001 BG001 CC031 CC101 CD001 CF001 CK021 DE096 FB266 FD116 GH01 GJ01 GQ02 5G301 CA11 CD04 DA23 DA42 DD02 DD03 5G307 GA02 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H01B 5/14 H01B 5/14 Z 13/00 503 13/00 503C (72) Inventor Akinobu Ono Tokyo 1-5-1 Kiba, Koto-ku, Fujikura Stock Company (72) Inventor Toshiyuki Honda 5-13-1 Sakurada, Washinomiya, Kita Katsushika-gun, Saitama Fujikura Kasei Co., Ltd. Development Lab (72) Inventor Koji Okamoto Saitama Fujikura Chemical Co., Ltd., 5-13-1, Washinomiya Sakurada, Kita Katsushika-gun, Japan (72) Inventor Masafumi Ito 5-13-1, Sakurada, Washinomiya, Kita-Katsushika-gun, Saitama Prefecture F-term (Reference) 4J002 AA001 BA001 BG001 CC031 CC101 CD001 CF001 CK021 DE096 FB266 FD116 GH01 GJ01 GQ02 5G301 CA11 CD04 DA23 DA42 DD02 DD03 5G307 GA02
Claims (6)
てなり、平均粒径が０．０１〜１０μｍの微粒子である
ことを特徴とする酸化銀微粒子組成物。1. A silver oxide fine particle composition, characterized in that the surface of silver oxide fine particles is coated with a dispersant and has an average particle diameter of 0.01 to 10 μm.
バインダ樹脂、溶媒、還元剤から選ばれる１種類以上に
分散可能であることを特徴とする酸化銀微粒子組成物。2. The silver oxide fine particle composition according to claim 1,
A silver oxide fine particle composition which can be dispersed in one or more kinds selected from a binder resin, a solvent and a reducing agent.
で反応させ、酸化銀微粒子組成物を得ることを特徴とす
る酸化銀微粒子組成物の製造方法。3. A method for producing a silver oxide fine particle composition, which comprises reacting a silver compound and a basic substance in the presence of a dispersant to obtain a silver oxide fine particle composition.
化銀微粒子組成物が、バインダ樹脂、溶媒、還元剤から
選ばれる１種類以上に分散されてなることを特徴とする
導電性組成物。4. A conductive composition comprising the silver oxide fine particle composition according to claim 1 dispersed in one or more kinds selected from a binder resin, a solvent and a reducing agent. .
塗布し、加熱することを特徴とする導電性被膜の形成方
法。5. A method for forming a conductive film, which comprises applying the conductive composition according to claim 4 to an object and heating the object.
得られ、銀微粒子が互いに融着していることを特徴とす
る導電性被膜。6. A conductive coating film obtained by the method for forming a conductive coating film according to claim 5, wherein the silver fine particles are fused to each other.
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| JP2002113713A JP4090778B2 (en) | 2002-04-16 | 2002-04-16 | Silver oxide fine particle composition and method for producing the same, conductive composition, conductive film and method for forming the same |
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| JP2006314913A (en) * | 2005-05-12 | 2006-11-24 | Fujikura Ltd | Conductive film, its production method, and flexible wiring substrate |
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