JP2003303946A5 - - Google Patents

Claims (8)

A transparent substrate on which an extraction electrode having an element connection region and an external connection region is formed;
The element is formed such that a projecting connection electrode having a predetermined height is formed around the pixel portion on the element formation surface, and the element connection region of the extraction electrode and the connection electrode are electrically and mechanically connected. A solid-state imaging device mounted on the transparent substrate with the formation surface facing the transparent substrate;
A sealing member formed between the transparent substrate and the solid-state imaging element so as to surround the element connection region of the extraction electrode and the connection electrode, and hermetically sealing the element formation surface of the solid-state imaging element; A solid-state imaging device. The solid-state imaging device according to claim 1, wherein the element connection region of the extraction electrode and the connection electrode are directly joined and electrically and mechanically connected. The solid-state imaging device according to claim 1, wherein the connection electrode and the element connection region of the extraction electrode are joined by a conductive resin to be electrically and mechanically connected. The solid-state imaging device according to claim 1, wherein the seal member includes a spacer member having a diameter that can define a distance between the solid-state imaging element and the transparent substrate. A wiring for connecting to the extraction electrode is further formed on the transparent substrate, and further includes another electronic element mounted on the transparent substrate so as to be electrically and mechanically connected to the wiring. The solid-state imaging device according to claim 1. Production of a solid-state imaging device having a solid-state imaging device in which protruding connection electrodes having a predetermined height are formed around the pixel portion on the element-forming surface, and wherein the element-forming surface of the solid-state imaging device is hermetically sealed A method,
Forming an extraction electrode having an element connection region and an external connection region on a transparent substrate;
The element forming surface of the solid-state image sensor and the transparent substrate are opposed to each other, and a seal member surrounding the element connection region of the extraction electrode and the connection electrode is sandwiched between the transparent substrate and the solid-state image sensor. And mounting the solid-state imaging device on the transparent substrate so that the element connection region of the extraction electrode and the connection electrode are electrically and mechanically connected to each other. After the step of mounting the solid-state imaging device on the transparent substrate, the solid-state imaging is performed by electrically and mechanically connecting the external connection region of the extraction electrode and the connection terminal of the mounting substrate via a conductive wire. The manufacturing method of the solid-state imaging device according to claim 6, further comprising a step of attaching the transparent substrate on which an element is mounted on the mounting substrate. In the step of forming the extraction electrode on the transparent substrate, a wiring connected to the extraction electrode is further formed,
The method further includes a step of mounting another electronic device on the transparent substrate so as to be electrically and mechanically connected to the wiring before the step of mounting the solid-state imaging device on the transparent substrate. The manufacturing method of the solid-state imaging device of description.